Panasonic TX-R32LX86K Service manual

TX-R32LX86K
LH76 Chassis
ORDER NO. MTV0801645CE
LCD TV

Specifications

Power Source : Power Consumption
Average Use 148 W Standby condition 0.3 W
Display panel
Aspect Ratio 16:9 Visible screen size 698 mm (W) × 393 mm (H) (No. of pixels) 1,049,088 (1,366 (W) × 768 (H))
Sound
Speaker 160 mm × 42 mm × 2 pcs, 8 Ω Audio Output 20 W (10 W + 10 W), 10% THD Headphones M3 (3.5 mm) stereo mini Jack × 1
PC signals VGA, SVGA, XGA
Receiving Systems / Band name SYSTEMS FUNCTIONS
C 220-240 V, 50/60 Hz
SXGA ...... (compressed)
Horizontal scanning frequency 31 - 69 kHz Vertical scanning frequency 59 - 86 Hz
———————————————————————————————————————
1 PAL B, G, H 2 PAL I Reception 3 PAL D, K 4 SECAM B, G 5 SECAM D, K 6 SECAM K1 7 NTSC M (NTSC 3.58 / 4.5 MHz)
———————————————————————————————————————
of broadcast
transmission and
playback from
video cassette tape
recorders.
© 2008 Matsushita Electric Industrial Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
TX-R32LX86K
8 NTSC 4.43 / 5.5 MHz Playback from 9 NTSC 4.43 / 6.0 MHz
special VCR’s or DVD.
10 NTSC 4.43 / 6.5 MHz 11 NTSC 3.58 / 5.5 MHz 12 NTSC 3.58 / 6.0 MHz 13 NTSC 3.58 / 6.5 MHz 14 SECAM I
———————————————————————————————————————
15 PAL 60 Hz / 5.5 MHz Playback from 16 PAL 60 Hz / 6.0 MHz 17 PAL 60 Hz / 6.5 MHz
Special Disc Players
and Special VCR’s or DVD.
Aerial - Rear VHF / UHF Operation Conditions Temperature : 0°C - 35°C
Humidity : 20% -- 80% RH (non-condensing)
Connection Terminals :
AV1 AUDIO L-R RCA PIN Type × 2 0.5 V[rms] Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω )
COMPONENT Y 1.0 V[p-p] (including synchronization)
PB/CB,PR/C
R
±0.35 V[p-p]
AV2 AUDIO L-R RCA PIN Type × 2 0.5 V[rms] Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω )
COMPONENT Y 1.0 V[p-p] (including synchronization)
PB/CB,PR/C
R
±0.35 V[p-p]
AV3 AUDIO L-R RCA PIN Type × 2 0.5 V[rms] Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω )
S VIDEO Mini DIN 4-pin Y: 1.0 V[p-p] (75 Ω) C: 0.286 V[p-p] (75 Ω ) AV4 AUDIO L-R RCA PIN Type × 2 0.5 V[rms] Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω )
S VIDEO Mini DIN 4-pin Y: 1.0 V[p-p] (75 Ω) C: 0.286 V[p-p] (75 Ω ) Others HDMI 1/2 Input TYPE A Connectors ! This TV supports “HDAVI Control 3”
function.
PC Input HIGH-DENSITY D-SUB 15 PIN R, G, B / 0.7 V[p-p] (75 Ω )
HD, VD / TTL LEVEL 2.0-5.0 V[rms] (high impedance)
Card Slot SD CARD slot × 1 Monitor AUDIO L-R RCA PIN Type × 2 0.5 V[rms] (high impedance) Output VIDEO RCA PIN Type × 1 1.0 V[p-p] (75Ω )
Dimensions (W × H × D) 821 mm × 580 mm × 225 mm (With TV Stand)
821 mm × 539 mm × 98 mm (TV only)
Mass 18.0 kg Net (With TV Stand)
15.5 kg Net (TV only)
Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
2
TX-R32LX86K
CONTENTS
Page Page
1 Safety Precautions 4
1.1. General Guidelines
1.2. Touch-Current Check
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 3 About Lead Free Solder (PbF) 4 Self Check Function
4.1. Self Check
4.2. Power LED Blinking Timing Chart
5 Chassis Board
5.1. Chassis Installation
6 Location of Lead Wiring
6.1. Wire Dressing
6.2. Wire Dressing and Connections
7 Disassembly for Service
7.1. AC Code dressing for 2-Pin
7.2. AC Code dressing for 3-Pin
7.3. Chassis Rail Installation
7.4. VESA Bracket Installation
7.5. Pedestal Assembly Preparation
7.6. LED Panel Installation
7.7. LCD Panel Assembly Installation
10
10 12
13
13 13 14 15 16 19 20
7.8. EMI Installation 4 4
5 6 7
7 7
9
9
7.9. Control Panel Installation
7.10. Back Cover Installation
8 Adjustment
8.1. Voltage Chart of A Board
8.2. Voltage Chart of P board
8.3. DVCO Adjustment
9 Conductor Views
9.1. A-Board
9.2. A-Board
10 Schem atic Diagram
10.1. Schematic Diagram Notes
10.2. A Board
10.3. K Board
10.4. P Board
10.5. S Board
10.6. V Board
11 Parts Location & Mechanical Replacement Parts List
11.1. Parts Location
12 Packi ng Exploded View 13 Repla ceme nt Parts List
13.1. Electrical Replacement Parts List
21 23 24
25
25 25 25
26
26 27
28
28 29 80 81 88 89
93
93
94 95
96
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TX-R32LX86K

1 Safety Precautions

1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such as a water pipe as shown in Figure 1.
3. Use the Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part and measure the voltage at each point.
5. The potential at any point (touch current) expressed as voltage U For AC: U For DC: U
= 35 V (peak) and U2= 0.35 V (peak);
1
= 1.0 V,
1
and U2, do not exceed the following values:
1
NOTE : The limit value of U The limit value U
6. Should a measurement be out of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.
= 0.35 V (peak) for AC and U1= 1.0 V for DC correspond to the values 0.7 mA (peak) AC and 2.0 mA DC.
2
= 35 V (peak) for AC correspond to the value 70 mA (peak) AC for frequencies greater than 100 kHz.
1
4
TX-R32LX86K
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field­effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminium foil to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it (most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
Caution: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices (otherwise harmless motions such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).
5
TX-R32LX86K

3 About Lead Free Solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead Solder and PbF will refer to Lead Free Solder. The Lead Free Solder (PbF) used in our manufacturing process and discussed below is (Sn+Ag+Cu). Those are Tin (Sn), Silver (Ag) and Copper (Cu), although other types are available.
This model uses PbF in its manufacture due to environmental conservation issues. For service and repair work, we would suggest the use of PbF as well, although Pb may be used.
PCBs manufactured using lead-free will have the “PbF within a leaf Symbol” stamped on their back.
Caution
PbF has a higher melting point than that of standard solder. Typically the melting point is 50 ~ 70°F (30~40°C) higher. Please use a high temperature soldering iron and set it to 700 20°F (370 10°C).
PbF will tend to splash when heated too high (about 1100°F or 600°C). If you must use Pb solder, please completely remove all of the PbF on the pins or solder area before applying Pb. If this is
not practical, be sure to heat the PbF until it melts, before applying Pb.
After applying PbF to double layered boards, please check the component side for excess solder which may flow onto the opposite side (see Figure 2).
Figure 2
Suggested PbF
There are several kinds of PbF available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper) and Sn+Zn+Bi (tin, zinc, bismuth) solders can also be used.
Figure 3
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TX-R32LX86K

4 Self Check Function

4.1. Self Check
1. Self Check is used to automatically check the bus lines and hexadecimal codes of the TV set.
2. To get into the Self Check mode, press the “DOWN” button on the customer’s controls at the front of the set, at the same time pressing the “MENU” button on the remote control. The screen that will show is represented by Figure 4.
3. Press both “OFF TIMER” button on the remote control and “DOWN” key button on the control panel.
Figure 4
4.2. Power LED Blinking Timing Chart
1. Subject Information of LED blinking timing chart.
2. Contents When an abonormality has occurred in the unit, the protection circuit operates and resets to standby mode. At this time, the
defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.
7
TX-R32LX86K
8

5 Chassis Board

5.1. Chassis Installation
1. Put the chassis frame on the LCD and fix it with screws (No. 21~22, 31~36).
2. Put the A-pcb, P-pcb on the chassis frame and fix them with screws (No. 1~15).
3. Insert the clampers to the chassis frame.
4. Insert the side AV bracket from the side position of the A-pcb and fix it with a screw (No. 23).
Refer to the parts list to confirm the PCB No.
TX-R32LX86K
9
TX-R32LX86K

6 Location of Lead Wiring

6.1. Wire Dressing
10
TX-R32LX86K
11
TX-R32LX86K
6.2. Wire Dressing and Connections
CONNECTION 1 2 3 4 5 6 7 8 9 10 11 1 CN 2 ~ P 2 2 A2~P4 3 A1~P3 4 CN 2 ~ A 6 5 G1~A4 6 G2~A5 7 V1~A7 8 A 12 ~ SPEAKER (L) 9 A 12 ~ SPEAKER (R)
10 P1~SW2
12

7 Disassembly for Service

7.1. AC Code dressing for 2-Pin
TX-R32LX86K
7.2. AC Code dressing for 3-Pin
13
TX-R32LX86K
7.3. Chassis Rail Installation
1. Put on the bottom mounting and fix with 4 screws. Tightening torque should be 100 N cm - 130 N cm (10 kgf cm to 13 kgf cm).
2. Stick sponges at chassis rails no.1 and no.3.
3. Fix 3 pieces of chassis frames and fix 4 screws to the bottom and top mountings. Tightening torque should be 100 N cm - 130 N cm (10 kgf cm to 13 kgf cm).
14
7.4. VESA Bracket Installation
1. Stick 2 pieces of felt on each part of the VESA bracket.
2. Fix 4 screws to VESA bracket. Tightening torque should be 100 Ncm to 130 Ncm (10 kgf cm to 13 kgf cm).
3. Slot pedestal assembly and fix 4 screws to cabinet. Tightening torque should be 100 Ncm to 130 Ncm (10 kgf cm to 13 kgf cm).
TX-R32LX86K
15
TX-R32LX86K
7.5. Pedestal Assembly Preparation
7.5.1. Pedestal Assembly 1
7.5.1.1. Pedestal Rotation Base
16
7.5.1.2. Pedestal Stand Base
TX-R32LX86K
7.5.1.3. Pedestal Stand Cover
17
TX-R32LX86K
7.5.2. Pedestal Assembly 2
18
7.6. LED Panel Installation
1. Insert V-PCB Board and LED Panel to cabinet and fix them with 2 screws.
TX-R32LX86K
19
TX-R32LX86K
7.7. LCD Panel Assembly Installation
20
7.8. EMI Installation
7.8.1. EMI 1
Assembly Order:
1. Stick felts on top of LCD panel.
2. Insert LVDS into T-connecter.
3. Stick tape to fix LVDS.
4. Stick the gaskets on LCD panel.
5. Stick the sponges on LCD panel.
TX-R32LX86K
21
TX-R32LX86K
7.8.2. EMI 2
Assembly Contents:
1. Insert LVDS into T-connecter.
2. Stick tape to fix LVDS.
3. Stick the gaskets on LCD panel.
22
7.9. Control Panel Installation
1. Assemble K-PCB, Control Button, Control Panel and fix them with screws.
2. Assembled Control Panel is fixed to CAB with screws.
TX-R32LX86K
23
TX-R32LX86K
7.10. Back Cover Installation
24

8 Adjustment

8.1. Voltage Chart of A Board
Power Supply Name Measurement Point Specification (V)
SUB1.8V TP5602 1.76 - 1.85 SUB1.2V TP5601 1.22 - 1.27 SUB3.3V TP5600 3.19 - 3.39
DVDDIO3.3V/TVDD3.3V TP4531 3.23 - 3.37
HQ3.3V TP5433 3.18 - 3.47
HQVD1.2V TP5412 1.19 - 1.26
8.2. Voltage Chart of P board
Power Supply Name Measurement Point Normal condition (V) Normal condition (V)
SOUND_VCC TP7050 17.0 - 20.5 < 3.0
BT-30V TP7060 28.5 - 31.5 < 3.0 SUB_5V TP7059 4.9 - 5.3 < 1.0 SUB_9V TP7055 8.8 - 9.4 < 1.0
DTV_12V TP7057 11.6 - 12.4 < 1.0
PANEL_12V TP7058 11.6 - 12.4 < 2.0
5VS TP7061 4.8 - 5.2 4.8 - 5.2 STB_5V TP7062 4.8 - 5.2 4.8 - 5.2 SUB_6V TP7064 5.7 - 6.5 < 1.0
V+ - V- TP7025 - TP7026 370 - 395 no care
12V TP7070 11.6 - 12.4 < 3.0
TX-R32LX86K
8.3. DVCO Adjustment
Measuring instrument Instrument name Connect to Remarks
1. Remote control composite output device
Adjust Procedure Remarks
<DVCO Adjustment> AVI
1. PAL/fp = 4.43361875 MHz Receive the colour bar pattern at AVI composite video. *Signal generator : PAL/fp = 4.43361875 MHz (ref.)
2. Service 1 Go to “DVCO” under Service 1 by pressing “FA” + “4” on the remote control.
3. Perform automatic adjustment of DVCO using the blue key. (About 3 sec.) *DVCO (START) The display colour of DVCO shows as black (START) red (under adjustment) black (completion)
AVI AV input terminal
RF/PAL
[Another method]
Receive the PAL colour bar
pattern at RF.
EEPROM Address of DVCO Adjustment value 238 ~ 239
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TX-R32LX86K

9 Conductor Views

9.1. A-Board
A-Board (A Side) TNPH0729
26
9.2. A-Board
A-Board (B Side) TNPH0729
TX-R32LX86K
27
TX-R32LX86K

10 Schematic Diagram

10.1. Schematic Diagram Notes
Notes :
1. Resistor Unit of resistance is OHM [Ω] (K = 1 000, M = 1 000 000).
2. Capacitor Unit of capacitance is µF unless otherwise noted.
3. Coil Unit of inductance is µF unless otherwise noted.
4. Test Point
: Test Point position
5. Earth Symbol
: Chassis Earth (Cold) : Line Earth (Hot)
6. Voltage Measurement Voltage is measured using DC voltmeter. Conditions of the measurement are the following :
Power Source....................AC AUTO 110-240 V, 50/60 Hz
Receiving Signal................Colour Bar signal (RF)
All customer’s controls.......Maximum positions
7. Number in red circle indicates waveform number. (See waveform pattern table)
8. When an arrow mark (
9. Indicates the major signal flow: Video
) is found, connection is easily found from the direction of the arrow.
Audio
10. This schematic diagram is the latest at the time of printing and subject to change without notice.
Remarks :
1. The Power Circuit contains a circuit area which uses a separate power supply to isolate the earth connection. The circuit is defined by HOT and COLD indications in the schematic diagram. Take the following precautions: All circuits, except the Power Circuit are cold. Precautions: a. Do not touch the hot part or the hot and cold parts at the same time or you may be shocked. b. Do not short-circuit the hot and cold circuits or a fuse may blow and parts may break. c. Do not connect an instrument such as an oscilloscope to the hot and cold circuits simultaneously or a fuse may blow.
Connect the earth of instruments to the earth connection of the circuit being measured.
d. Make sure to disconnect the power plug before removing the chassis.
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10.2. A Board
10.2.1. A Board - Sheet : 001 (1 / 6)
TX-R32LX86K
<1A>
<2A>
<3A>
<4A>
<5A>
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<6A>
TX-R32LX86K
10.2.2. A Board - Sheet : 001 (2 / 6)
<1A>
<2A>
<3A>
<4A>
<5A>
<1B>
<2B>
<3B>
<4B>
<5B>
<6A>
<6B>
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