1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the
wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3.When conducting repairs andservicing, donot twist the Fasten connectors but plugthemstraight in or unplug themstraightout.
4.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated ordamaged by the short circuit.
5.After servicing,see to it thatall the protective devices such as insulation barriers, insulationpapers shields are properlyinstalled.
6.After servicing, make the followingleakagecurrent checks to prevent the customerfrom being exposedto shock hazards.
1.2.Touch-Current Check
1.Plug the AC cord directly into the AC outlet. Donot use an isolation transformer for this check.
2.Connect a measuring network for touch currents betweeneach exposed metallic part on theset anda good earth groundsuch as a water pipe, as shownin Figure 1.
3.Use Leakage Current Tester (Simpson 228orequivalent) to measure the potential across the measuring network.
4.Check each exposedmetallic part, andmeasure the voltage at each point.
5.Reservethe AC plug in the AC outlet and repeat each ofthe above measure.
6.The potential at any point (TOUCH CURRENT) expressedasvoltage U
For a. c.: U1 =35V (peak) and U2 = 0.35V (peak);
For d. c.: U
Note:
The limit value of U
mA d. c.The limit value U
7.In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should berepaired andrechecked beforeit is returnedto the customer.
=1.0 V,
1
= 0.35 V (peak) for a. c. and U1= 1.0V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
2
= 35V (peak) for a. c. correspond tothevalue 70mA (peak) a. c. for frequencies greater than 100kHz.
1
and U2, does not exceedthefollowing values:
1
Figure 1
3
2Warning
2.1.Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor [chip] components. Thefollowing techniques should be used to help reducethe incidence of component damagecaused by electrostatic discharge(ESD).
1.Immediately before handling any semiconductor component orsemiconductor-equippedassembly, drain off any ESDon yourbody bytouching a known earth ground. Alternatively,obtainand wear a commercially available discharging ESD wrist strap,which should be removedfor potential shock reasons prior to applying power to the unit under test.
2.After removingan electricalassembly equipped with ES devices, place the assemblyon a conductive surface such as alumi-num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Useonly a grounded-tip solderingiron tosolder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classifiedas [anti-static (ESD protected)] cangenerate electrical chargesufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Mostreplacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-ble conductivematerial).
7.Immediately before removing the protective material fromtheleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.
Caution
Besurenopower is appliedto the chassis or circuit, and observe all other safety precautions.
8.Minimize bodilymotions when handling unpackaged replacement ES devices. (Otherwise ham lessmotion such as the brush-ing together of your clothes fabric or the lifting ofyour footfroma carpeted floor can generate static electricity (ESD) sufficientto damage an ES device).
4
2.2.About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solderin it's manufacture due to environmental conservation issues. For service and repair work, we'dsuggest the use of Pb freesolder as well, althoughPb solder may beused.
PCBs manufactured using leadfree solder will have the PbF within a leaf SymbolPbFstamped on the back of PCB.
Caution
•Pb free solder has a higher melting pointthan standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher. Pleaseuse a high temperature solderingiron and set it to 700 ± 20°F (370 ± 10 °C).
•Pb free solder will tend tosplash when heatedtoo high (about 1100 °F or 600°C).If you must use Pb solder, please completely remove all of the Pb free solder on thepins or solder area before applying Pb sol-der. If this is not practical, be sure to heat the Pbfree solder until it melts, before applying Pb solder.
•After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto theopposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. Thisproduct uses Sn+Ag+Cu (tin, silver, copper) solder. How-ever, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder canalso be used.
5
3Service Navigation
3.1.PCB Layout
Board NameFunctionBoard NameFunction
P(MAIN)Power Supply
Non serviceable.P(MAIN)-Board should be exchange for service.
P(SUS)Power Supply
Non serviceable.P(SUS)-Board should be exchange for service.
P(SUB)Power Supply
Non serviceableP(SUB)-Board should be exchange for service.
AMain AV input, processingSDScan out (Lower)
KRemote receiver, Power LED, C.A.T.S sensor
SPower Switch
V3D Eyewear transmitter
AUDIO L - RRCA PIN Type × 20.5 V [rms]COMPONENTY1.0 V [p-p] (including synchronisation)
, PR/C
P
B/CB
AV2 Input
AUDIO L - RRCA PIN Type × 20.5 V [rms]VIDEORCA PIN Type × 11.0 V [p-p] (75 Ω)
AV3 Input
AUDIO L - RRCA PIN Type × 2 0.5 V [rms]VIDEORCA PIN Type × 1 1.0 V [p-p] (75 Ω)
Audio Output
AUDIO L - RRCA PIN Type × 20.5 V [rms] (high impedance)
Others
HDMI1 - 4 Input TYPE A Connectors• This TV supports "HDAVI control 5" function.
PC InputHIGH-DENSITY D-SUB 15PIN R / G / B: 0.7 V [p-p] (75 Ω)
DIGITAL AUDIO OUTPCM / Dolby Digital / DTS, Fiber optic
Card slotSD Card slot × 1
USB 1/2/3USB 2.0 TYPE A Connectors DC 5 V, Max. 500 mA
ETHERNET10BASE-T / 100BASE-TX
R
± 0.35 V [p-p]
HD / VD: TTL Level 2.0 - 5.0 V [p-p] (high impedance)
8
Dimensions (W × H × D)1,570 mm × 994 mm × 400 mm (With Pedestal)
1,570 mm × 956 mm × 60 mm (TV only)
Mass63.0 kg Net (With Pedestal)
Q 3D Eyewear
Lens typeLiquid Crystal Shutter
Usage temperature range0 °C - 40 °CCharging power supplyDC 5 V (supplied by USB terminal of a Panasonic TV)BatteryLithium-ion polymer rechargeable battery
Viewing range*2Transmitter for 3D Eyewear
MaterialsMain body: Resin
Dimensions (W× H × D)170.1 mm × 41.2 mm × 169.8 mmMassApprox. 38 g Net
*1 Operation time/charging time
•The battery deteriorates after repeated use, and the operation timeeventually becomes short. Thefigures above are at shipping from thefactory,and are not a guarantee of performance.
*2 Viewing range
•The location of the 3D Eyewear transmitter differs depending on the model of television.
•There are differences in the viewing range of the 3D Eyewear among individuals.
•The 3D Eyewear may not operate correctly at the outside of the viewing range.
*1 The frequency and channel differ depending on the country.*2 802.11b/g/n CH1-CH11 only use for North America, Canada and Taiwan.*3 Transfer rates are theoretical values; however, actual communication rate will vary according to communication environment or connectedequipment.
Note
•Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.
9
5Technical Descriptions
5.1.Specification of KEY for CI Plus, DTCP-IP, WIDEVINE and One-to-One
5.1.1.General information:
1. EEPROM (IC8902) for spare parts has the seed of KEY for each.
2.The final KEY data will be generated by Peaks IC (IC8000) when SELF CHECK was done and are stored in both Peaks IC(IC8000) and EEPROM (IC8902).Three KEY are not generated for all models.The necessary KEY are only generatedand stored depend onthe feature of models.
5.1.2.Replacement of ICs:
When Peaks IC (IC8000) is replaced,EEPROM (IC8902) should be also replacedwithnew one the same time.When EEPROM (IC8902) is replaced, Peaks IC(IC8000) is not necessary to be replaced the same time.After the replacement of IC, SELF CHECK should be done togenerate the finalKEY data.How toSELF CHECK: While pressing [VOLUME ( - )] button on the main unit, press [MENU] buttonon the remote control for morethan 3 seconds.TVwill be forced to the factory shipment setting after this SELFCHECK.
5.1.3.Model and Keys:
Model No.Keys
One-to-oneWIDEVINE
TH-P65VT30D/G/K/M/P/S-
10
6Service Mode
6.1.How to enter into Service Mode
6.1.1.Purpose
After exchange parts, check and adjust the contents of adjustment mode.
While pressing [VOLUME ( - )] button of themain unit, press [i] button of the remote control three times within 2 seconds.
Note:
ServiceMode can not be enteredwhen 3D signal input.Input 2D signal to enter Service Mode.
6.1.2.Key command
[1] button...Main items Selectionin forward direction [2] button...Main items Selection in reverse direction [3] button...Sub items Selection in forward direction[4] button...Sub items Selection in reverse direction [RED] button...AllSubitems Selection in reverse direction [GREEN] button...All Sub items Selection in forward direction[VOL] button...Value of sub items change inforward direction( + ), inreversedirection ( - )
6.1.3.How to exit
Switch off the power with the [POWER] buttonon the main unit or the [POWER] buttonon the remotecontrol.
11
6.1.4.Contents of adjustment mode
• Value is shown as a hexadecimal number.
• Preset value differs depending on models.
• After entering the adjustment mode, take note of the value in each item before starting adjustment.
BootROMSTBY-SET00EMERGENCYONY/C Delay0OPT 110110000OPT 211100110OPT 300001001OPT 400000000EDID-CLKMIDMIRROR00 (See Option-Mirror)
AMR-SELECTOFFVSUSLOWSee Vsus selectionAGINGALL WHITEBuilt-in test patterns can be
ALL BLUE WITH WHITE OUTSIDE FRAME
ALL GREEN
ALL RED
LOW STEP WHITE
LOW STEP BLUE
LOW STEP GREEN
LOW STEP RED
WHITE DIAGONAL STRIPE
RED DIAGONAL STRIPE
GREEN DIAGONAL STRIPE
BLUE DIAGONAL STRIPE
A-ZONE & B-ZONE
1% WINDOW
COLOR BAR
9 POINTS BRIGHT MEASURE
2 DOT OUTSIDE FRAME
ALL BLUE
DOUBLE FIXED 1% WINDOW
VERTICAL LINE SCROLL
ON/OFF OR WHITE
R/G/B/W ROTATION
HALF FIXED ALL WHITE
ALL WHITE WITH COUNT DISPLAYSRV-TOOL00See Service tool mode
displayed.
12
6.2.Option - Mirror
Picture can be reversed left and right or up and down.
00 : Default (Normal picture is displayed)
01 : Picture is reversed left and right.
02 : Picture is reversed up and down.
Hint : If the defective symptom (e.g. Vertical bar or Horizontalbar) is movedby selection of this mirror, the possible causeis inA-board.
6.3.Service tool mode
6.3.1.How to access
1.Select [SRV-TOOL] in Service Mode.
2.Press [OK] button on the remote control.
6.3.2.Display of SOS History
SOS History (Number of LED blinking) indication.Fromleft side; Last SOS, before Last, three occurrence before, 2nd occurrence after shipment, 1st occurrence after shipment.This indication will be cleared by [Self-check indicationand forced tofactory shipment setting].
6.3.3.POWER ON Time, Count
Note : To display TIME/COUNT menu, highlight position, then press MUTE for 3 sec.Time : Cumulative power on time, indicated hour : minute by decimalCount : Number of ON times by decimal
Note : This indication will not be cleared by either of the self-checks or any other command.
6.3.4.Exit
1. Disconnect the AC cord from wall outlet or switch off the power with [ Power ] button on the main unit.
13
6.4.Hotel mode
1. Purpose
Restrict a function for hotels.
2. Access command to the Hotel mode setup menu
In order to display the Hotel mode setup menu:
While pressing [VOLUME (-)] button of the main unit,
press [AV] button of the remote control three times within2 seconds.
Then, the Hotel modesetupmenu is displayed.
3.To exit the Hotel modesetupmenuDisconnect AC power cord fromwall outlet.
4.Explain the Hotel modesetup menu
ItemFunction
Hotel ModeSelect hotel mode On/Off
Initial INPUTSelect input signal modes.
Set the input, when each time power is switched
on.
Selection :Off/TV/AV1/AV2/AV3/PC/HDMI1/HDMI2/HDMI3/HDMI4
•Off: give priority to a last memory.
Initial POSSelect programme number.
Selection : Off/0 to 99
•Off: give priority to a last memory
Initial VOL LevelAdjust the volume when each time power is
switched on.Selection/Range :Off/0 to 100
•Off: give priority to a last memoryMaximum VOL Level
Button LockSelect local key conditions.
Remote LockSelect remote control key conditions.
Private InformationSelect private information for VIERA Cast is Keep
Adjust maximum volume.Range : 0 to 100
Selection : Off/SETUP/MENU/ALL
•Off: altogether valid
•SETUP: only F-key is invalid
(Tuning guide (menu) can not be selected.)
•MENU: only F-key is invalid
(only Volume/Mute can be selected.)
•ALL: altogether invalid.
Selection : Off/SETUP/MENU
•Off: altogether valid
•SETUP: only Setup menu is invalid
•MENU: Picture/Sound/Setup menu are invalid
orReset if Hotel mode is set to [On] when TVpower on.Selection :Keep/Reset
•Keep: private information for VIERA Cast is
keep
•Reset: private information for VIERA Cast is
reset
14
6.5.Data Copy by SD Card
6.5.1.Purpose
(a) Board replacement (Copy the data when exchanging A-board):
When exchanging A-board, the data in original A-board can be copied to SD card and then copy to new A-board.
(b) Hotel (Copy the data when installing a number of unitsin hotelor anyfacility):
When installinganumber of units in hotel or any facility, thedata in masterTVcan be copied toSD card and then copy to otherTVs.
6.5.2.Preparation
Make pwdfile as startup file for (a) or (b) in a empty SD card.
1.Insert a empty SD cardto your PC.
2.Right-click a blank area in a SD card window, pointto New,and then click text document. A new file is created by default (New Text Document.txt).
3.Right-click the new text document that you just created and select rename, and then change the name and extension of thefile to thefollowing file name for (a) or (b) andpress ENTER.
File name:
(a) For Board replacement : boardreplace.pwd(b) For Hotel : hotel.pwd
Note:
Please make only one file toprevent theoperationerror.
No any other file should not be inSD card.
15
6.5.3.Data copy from TV set to SD Card
1. Turn on the TV set.
2. Insert SD card with a startup file (pwd file) to SD slot.
On-screen Display will be appeared according to the startup file automatically.
3. Input a following password for (a) or (b) by using remote control.
(a) For Board replacement : 2770
(b) For Hotel : 4850
Data will be copied from TV set toSD card.It takes around 2 to 6 minutes maximum for copying.
4.After the completion of copyingto SD card, removeSD card from TVset.
5.Turn off the TV set.
Note:
Following new folder will be createdin SDcardfor data from TV set.
(a) For Board replacement : user_setup(b) For Hotel: hotel
16
6.5.4.Data copy from SD Card to TV set
1. Turn on the TV set.
2. Insert SD card with Data to SD slot.
On-screen Display will be appeared according to the Data folder automatically.
3. Input a following password for (a) or (b) by using remote control.
(a) For Board replacement : 2771
(b) For Hotel : 4851
Data willbe copied from SD card to TV set.
4.After the completion of copying to SDcard, remove SD card from TV set.
(a) For Board replacement : Data willbedeleted after copying (Limited one copy).(b) For Hotel : Data will not be deleted and canbeused for other TVs.
5.Turn off theTVset.
Note:
1.Depending onthe failure of boards, function ofData copy for boardreplacement does not work.
2.This function can be effective among thesamemodel numbers.
17
7Troubleshooting Guide
Use the self-check function to test the unit.
1. Checking the IIC bus lines
2. Power LED Blinking timing
7.1.Check of the IIC bus lines
7.1.1.How to access
7.1.1.1.Self-check indication only:
Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [OK] button on the remote controlfor more than 3 seconds.
7.1.1.2.Self-check indication and forced to factory shipment setting:
Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote con-trol for more than 3 seconds.
Disconnect the AC cordfrom walloutlet or switch off thepower with [ Power ] button on the main unit.
18
7.2.Power LED Blinking timing chart
1. Subject
Information of LED Flashing timing chart.
2. Contents
When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.
Blinking TimesContentsCheck point
1Panel information SOS
LP1 Start SOS3P+ 3.3V SOS A-Board4Power SOSP(MAIN)-Board
5P+ 5V SOS A-Board6Driver SOS1
(SC Energy recovery circuit)
(A-SC FPC DET)7Driver SOS2
(SU/SD Connector DET)
(SU/SD Scan and Logic IC)8Driver SOS3
(SS FPC DET)
(SS Energy recovery circuit)
9Discharge Control SOSA-Board
10Sub 5V SOS
Sub 3.3V SOS
Tuner power SOS
11FAN SOSA-Board
12Sound SOSA-Board
13Emergency SOSA-Board14IROM SOS (ROM in Peaks IC)A-Board
-
P(SUS)-BoardP(SUB)-Board
SC-Board
A-SC FPC
SU-BoardSD-Board
*
SS-Board
SS2-Board
SS FPC
SS2 FPC
A-BoardSC-BoardSS-Board
P(MAIN)-Board
P(SUS)-BoardP(SUB)-Board
FAN
Speaker
Woofer
P(MAIN)-Board
P(SUS)-BoardP(SUB)-Board
*UseSC jig to isolate the board.
19
7.3.No Power
First check point
There are following 3 states of No Power indication by power LED.
1. No lit.
2. Green is lit then turns red blinking a few seconds later. (See 7.2.)
3. Only red is lit.
20
7.4.No Picture
21
7.5.Local screen failure
Plasma display may have local area failure on the screen. Fig-1 is the possible defect P.C.B. for each local area.
Fig-1
22
8Service Fixture & Tools
8.1.SC jig
Purpose:
To find the failure board (SC or SU/SD) when the power LED is blinking 7 times.
SC jig:
Jumper connector to connect to SC50 connector on SC board
Part number:
TZSC09187
How to use:Caution: RemoveSC jig from SC boardafter inspection.
1.Removeall connector between SC boardand SU/SDboard to isolate SC board from both SU and SD boardelectrically.Note: The board will be damaged ifall connector is not removed (for example;remove connectoronly for SU board and stayconnecting with SD board. The boardwill bedamaged.)
2.Connect SC jig to connector SC50 at left bottom side of SC board
3.Turn onthe TV/Display Unit andconfirm the power LED blinking.LED blinking: Possible cause of failure is in SC boardNo LED blinking(Lighting or no lighting): Possible causeof failure isinSU or SD board
4.After inspection, turnoff the TV/Display Unit and wait a few minutes todischarge.
5.Remove SC jig from SC board.
Remark: This SC jigcanbe used for all 2011 Plasma TV andPlasmaDisplay.
23
9Disassembly and Assembly Instructions
9.1.Remove the Rear cover
1. See PCB Layout (Section 3)
9.1.1.Rib of the pedestal
Cannot exclude at the Rear cover because interfere with rib ofthe pedestal.
9.1.2.Exclude the Rear cover from the Set & the Pedestal
1.Lifting ofthe Set. (Work in two people)
MEN:1 Left hand (in Handle point)MEN:2 Right hand (in Handle point)
2.Surpass the Rib (Pedestal)
3.Pull theRear cover bottom (From the Set)
MEN:1 Right hand (Pull the Rear cover)
MEN:2 Left hand (Pull the Rear cover)
24
4. Take down the Set
Caution:
At that time, attention not to sandwich the finger.
5.Exclude the Rear cover (From the Set)Take it off hook in spite of beinglifting.
9.1.3.Attach the Rear cover to the Set & the Pedestal
1.The work that is reverse to exclude. [5]→[4]→[3]→[2]→[1]
25
9.2.Remove the AC inlet
Caution:
To remove P.C.B. wait 1 minute after power was off for discharge from electrolysis capacitors.
1. Disconnect the connector (P9).
2. Remove the screws (×2 ) and remove the Inlet metal.
3.Remove the screw (×1 ) and remove the AC inlet.
9.4.Remove the P(SUS)-Board
Caution:
To remove P.C.B. wait 1 minute after power was off for discharge from electrolysis capacitors.
1. Unlock the cable clampers to free the cable.
2. Disconnect the connectors (P59, P61 and P63).
3. Disconnect the connector (P2).
4.Remove the screws (×4 ) and remove the P(SUS)-Board.
9.3.Remove the P(MAIN)-Board
Caution:
To remove P.C.B. wait 1 minute after power was off for dis-charge from electrolysis capacitors.
1.Unlock the cable clampers to free the cable.
2.Disconnect the connectors (P52, P56, P58, P62 andP64).
3.Disconnect the connectors (P6, P11, P34 and P35).
4.Remove the screws (×5 ) and remove the P(MAIN)-Board.
9.5.Remove the P(SUB)-Board
Caution:
To remove P.C.B. wait 1 minute after power was off for dis-charge from electrolysis capacitors.
1.Disconnect the connectors (P51, P55,P57 and P60).
2.Disconnect the connector (P9).
3.Remove the screws (×4 ) and remove the P(SUB)-Board.
26
9.6.Remove the Terminal covers
and the shield metals
1. Remove the claw (×1 ).
2. Remove the Side terminal cover.
3. Remove the claw (×1 ).
4. Remove the Bottom terminal cover.
5.Removethe screw (×1 ).
6.Removethe USB terminal cover and USB shield metal.
9.7.Remove the A-Board
1. Remove the Terminal covers and the Shield metals. (See
section 9.6.)
2. Unlock the cable clampers to free the cable.
3. Disconnect the connectors (A1, A6, A8, A11, A12 and
A14).
4.Disconnect the flexible cables (A20, A31, A32 and A40).
5.Remove the screw (×1 ) and remove the A-Board.
7.Remove the screws (×2 ).
8.Remove the Bottom shield metal.
9.Removethe screw (×1 ).
10.Remove the Side shield metal.
9.8.Remove the Side unit assy
1.Disconnect the connector (C14).
2.Remove the claws (×2 , ×1 ) and remove the Sideunit assy.
3.Remove the screw (×1 ).
4.RemovetheSide unit mount metal.
27
9.9.Remove the SU-Board
1. Disconnect the flexible cables (SU1, SU2, SU3, SU4 and
SU5) connected to the SU-Board.
2. Disconnect the flexible cable (SU11-SD11) and the bridge
connector (SC41-SU41).
3. Remove the screws (×3 , ×2 ) and remove the SU-Board.
9.11.Remove the SC-Board
1. Remove the SU-Board and SD-Board. (See section 9.9.
and 9.10.)
2. Disconnect the connector (SC2).
3. Disconnect the flexible cable (SC20).
4. Remove the screws (×9 ) and remove the SC-Board.
Caution:
THERMAL CONDUCTIVE SHEET between PlasmaDis-play Panel and SC-board should not be removed whenreplacing SC-board.
9.10.Remove the SD-Board
1.Disconnect the flexiblecables (SD1, SD2, SD3, SD4 andSD5) connected to theSD-Board.
2.Disconnect the flexible cable (SU11-SD11) and the bridgeconnectors (SC42-SD42 and SC46-SD46).
3.Remove the screws (×3 , ×2 ) and removethe SD-Board.
9.12.Remove the SS-Board
1.Disconnect the connector (SS11).
2.Disconnect the flexible cable (SS33).
3.Disconnect the flexible cables (SS64, SS65 and SS66).
4.Remove the screws (×7 , ×3 ) and remove the SS-Board.
28
9.13.Remove the SS2-Board
1. Remove the SS-Board. (See section 9.12.)
2. Disconnect the flexible cable (SS69).
3. Remove the screws (×2 ) and remove the SS2-Board.
9.14.Remove the Fan
1.Unlock the cable clampers to free the cable.
2.Remove the screws (×3 ).
3.Removethe Relay connector and remove the Fan.
9.15.Remove the Speakers
1. Unlock the cable clampers to free the cable.
2. Remove the screws (×4 , ×6 ) and remove the SP
shield metal L.
3.Remove the screws (×4 , ×6 ) and remove the SPshield metal R.
4.Disconnect the Relay connector.
5.Remove the screws (×2 each) and remove the Speak-ers (L, R).
9.16.Remove the Woofer
1.Unlock the cable clampers tofree the cable.
2.Disconnect the Relay connector.
3.Remove the screws (×4 ) and remove the Woofer.
29
9.17.Remove the Stand bracket
1. Remove the Plasma panel section from the servicing
stand and lay on a flat surface such as a table (covered
by a soft cloth) with the Plasma panel surface facing
downward.
2. Unlock the cable clampers to free cable.
3.Remove the Stand bracket fastening screws (×6 , ×4
) and the Stand bracket.
9.19.Remove the S-Board
1. Remove the SP shield metal L. (See section 9.15.)
2. Remove the screws (×2 ).
3. Disconnect the connector (S10) and remove the S-Board.
9.20.Remove the V-Board
1.Removethe SP shield metalR. (See section 9.15.)
2.Remove the Stand bracket. (See section 9.17.)
3.Remove the screw (×1 ) and remove the claws (×3
).
4.Disconnect the connector (V14) and remove the V-Boardfromthe 3D emitter panel.
9.18.Remove the K-Board
1.Remove theSP shield metal L. (Seesection9.15.)
2.Remove theStandbracket. (See section 9.17.)
3.Remove the screw (×1 ).
4.Remove the claws (×3 ).
5.Disconnect the connector (K1) and remove the K-Boardfrom the LED panel.
9.21.Remove the Handles
1.Removethe SP shield metal(L, R). (See section9.15.)
2.Remove the screws (×2 each) and remove the Han-dles (L, R).
9.22.Remove the Bottom cabinetassy
1.Removethe Speakers. (See section9.15.)
2.Remove the Stand bracket. (See section 9.17.)
3.Remove the K, S and V-Board. (See section 9.18- 20.)
4.Removethe Handles. (See section 9.21.)
5.Remove the screws (×4) and remove the Bottom cab-inet assy.
30
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1 point = 1 manual.
You can buy points or you can get point for every manual you upload.