13 Schematic Diagram
14 Printed Circuit Board
15 Exploded View and Replacement Parts List
15.1. Exploded View
15.2. Electrical Replacement Parts List
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1Safety Precautions
1.1.General Guidelines
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the
wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Fasten connectors but plug them straight in or unplug them straight
out.
4. When servicing, observe the original lead dress.If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2.Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground
such as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUCH CURRENT) expressed as voltage U
For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For d. c.: U
Note:
The limit value of U
mA d. c.
The limit value U
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
= 1.0 V,
1
= 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
2
= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
1
and U2, does not exceed the following values:
1
Figure 1
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TH-65VX300ER
2Warning
2.1.Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).
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2.2.About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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3Service Navigation
3.1.Service Hint
Board NameFunctionBoard NameFunction
ADigital Signal Processor, Microcomputer
Audio Processor, Speaker Out Amplifier
DSSlot InterfaceC3Data drive (Left)
DFormat Converter, Plasma AI Processor
Sub-Field Processor, Sync Processor
SCScan driveV2Key switch
SUScan out (Upper)
Non serviceable.
SU-Board should be exchanged for service.
SDScan out (Lower)
Non serviceable.
SD-Board should be exchanged for service.
SSSustain driveH3Speaker terminal
SS2Sustain outHXPC / RS-232C_Input terminal, 3D Signal out, Speaker
C1Data drive (Right)
C2Data drive (Centre)
S1Power switch
V1Remote receiver, LED-G, R
P (MAIN)Power supply
P (SUS)Power supply
terminal (L)
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3.2.Applicable signals
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4Specifications
Product Fiche
Energy efficiency classD
Visible screen size (diagonal)165 cm / 65 inches
On mode average power consumption
Annual energy consumption569 kWh/year
Standby power consumption0.50 W
Off mode power consumption0.30 W
Display resolution1,920 (W) × 1,080 (H)
Power Source220 - 240 V AC, 50/60 Hz
Rated power consumption450 W
Standby power consumptionSave off 0.8 W, Save on 0.5 W
Plasma Display panelDrive method : AC type
Screen size1,434 mm (W) × 806 mm (H) × 1,645 mm (diagonal)
(No.of pixels)2,073,600 (1,920 (W) × 1,080 (H)) [5,760 × 1,080 dots]
Operating condition
Temperature0 °C - 40 °C
Humidity20 % - 80 %
Applicable signals
Scanning format
PC signalsVGA, SVGA, XGA, SXGA
Connection terminals
LAN
AV INHDMI 1-2TYPE A Connector × 2
COMPONENT / RGB IN
Y / GRCA Pin jackwith sync 1.0 Vp-p (75-ohm)
P
B/CB
P
R/CR
AUDIO L-R RCA Pin jack × 20.5 Vrms
PC INHigh-Density Mini D-sub 15 PinY or G with sync 1.0 Vp-p (75-ohm)
Dimensions (W × H × D)1,554 mm × 924 mm × 94 mm
Mass (weight)
main unit onlyapprox. 60.0 kg net
with speakersapprox. 66.0 kg
Notes:
• Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
• This equipment complies with the EMC standards listed below.
EN55022, EN55024, EN61000-3-2, EN61000-3-3.
• Product fiche: Based on (EU) No.1062/2010 ANNEX III
• ENERGY LABEL attached on the back cover is only for European countries.
390 W
Energy consumption XYZ kWh per year, based on the power consumption of the television operating
4 hours per day for 365 days. The actual energy consumption will depend on how the television is used.
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
RJ45 10BASE-T/100BASE-TX, compatible with PJLink
/BRCA Pin jack0.7 Vp-p (75-ohm)
/RRCA Pin jack0.7 Vp-p (75-ohm)
VBS (use HD port)with picture 1.0 Vp-p (high impedance)
D-sub 9 PinRS-232C compatible
3D SHUTTER OUT M3 jack × 1
DC 8V OUT Centre plus, for EIAJ 4mm plug
TM
Y or G without sync 0.7 Vp-p (75-ohm)
/ CB / B:0.7 Vp-p (75-ohm)
P
B
P
/ CR / R:0.7 Vp-p (75-ohm)
R
HD / VD:1.0 - 5.0 Vp-p (high impedance)
without picture 0.3 Vp-p (high impedance)
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5Operating Instructions
TH-65VX300ER
Option Menu for GPF14DMONV series
GPF14DMONV chassis series have special function and operation setting facility called Option Menu. This Option Menu is
useful for special function required customers. This should be set at the installation stage.
Option menusdefault settingContents
Onscreen displayOnEnable/Disable to display input mode indication after power on and no signal
Studio modeOnFor switching functions in setting menus used for television studio applications.
Internal 3D EmitterOnSet the infrared transmitter for the 3D Eyewear.
Display sizeOffDisplay size function On/Off
All AspectOffAspect mode: default/All aspect mode.
Auto SetupManualSets the operational mode of the automatic position adjustment in the POS./
Advanced Motion ResolutionOnDisplays motion picture images at higher resolution.
Power On Message (No activity power
off)
3D Safety PrecautionsOn3D Safety Precautions show/hide is set during power ON.
Memory lock---Locks or unlocks saved profiles. Also for setting passwords.
OnWhether to show/hide No activity power off Precautions at the time of power ON
indication.
SIZE menu.
is set.
When the setting changes from
played as below.
Pressing
“YES” switches the setting.
“On” to “Off”, the confirmation screen is dis-
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6Service Mode
6.1.CAT (Computer Aided Test) mode
How to access the CAT mode.
Method A : Main unit + remote control operation
Press and hold the button on the front panel of the unit and press the RECALL button on the remote control
3 times quickly within 2 second, this will place the unit into the CAT mode.
To exit the CAT mode, access the ID mode and switch off the main power.
Method B : Remote control operation only
1. Set the OFF timer with the [OFF TIMER] button except for 0 minute.
(30 minutes, 60minutes, 90 minutes)
2. Set the volume level of sound to 0.
(Referred to the volume level setting method)
3. Press the RECALL button more than 3 seconds.
How to Exit
Switch off the main power.
Volume level setting method
In order to set a volume level of sound as 0, please set up with the Sound menu.
1. Pushed the MENU button and select [Sound].
2. Select [Volume], and Choose the [0] with the left button.
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6.1.1.IIC mode
Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode and then press the OK button on the
remote control.
Subject and item are mentioned on “IIC mode structure”.
To exit the IIC mode, press the RETURN button on the remote control.
6.1.2.CD mode
Select the CD mode by Up/Down button on the remote control at the front page of CAT mode and then press the [5] button on the
remote control more than 3 seconds.
Memory data change
To exit the CD mode, press the RETURN button on the remote control.
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6.1.3.NW mode
Note :
To display NW mode, set CONTROL I/F SELECT in NETWORK SETUP to [LAN].
Select the NW mode by Up/Down button on the remote control at the front page of CAT mode and then press the OK button on
the remote control.
To exit the NW mode, press the RETURN button on the remote control.
6.1.4.SD mode
Select the SD mode by Up/Down button on the remote control at the front page of CAT mode and then press the OK button on the
remote control.
To exit the SD mode, press the RETURN button on the remote control.
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6.1.5.MS mode
Select the MS mode by Up/Down button on the remote control at the front page of CAT mode and then press the [5] button on the
remote control more than 3 seconds.
To exit the MS mode, press the RETURN button on the remote control.
Caution:
Market Select should be set after exchange of A-Board.
Destination number
NumberModel (Destination)
165VX300U (North America)
365VX300W (Asia, Oceania, ME)
2065VX300ER (Europe, CIS)
Default setting
NumberDestination
1North America
6.1.6.ID mode
Select the ID mode by Up/Down button on the remote control at the front page of CAT mode and then press the [5] button on the
remote control more than 3 seconds.
To exit the ID mode, press the RETURN button on the remote control.
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6.2.IIC mode structure (following items value is sample data)
14
7Troubleshooting Guide
7.1.Self Check
7.1.1.Display Indication
1. Self-check is used to automatically check the bus line
controlled circuit of the Plasma display.
2. To get into the Self-check mode, press the volume down
button on the customer controls at the bottom of the set,
at the same time pressing the OFF-TIMER button on the
remote control, and the screen will show.
If the IIC ports have been checked and found to be incorrect
Or not located then “ - - ” will appear in place of “ OK ”
“ 01 ” in the line of the “ PTCT ” means the number of blinks of
the Power LED is 1. (Reference to 7.1.2)
“ H09 ” in the line of the “ PTCT ” is the error code.
To exit the CAT mode switch off the main power.
Note:
The line of the “ PTCT ” displays when you get into the Selfcheck mode for the first time only after the Power LED
blinks.
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7.1.2.Power LED Blinking timing chart
1. Subject
Information of LED Blinking timing chart.
2. Contents
When an abnormality has occurred to the unit, the protection circuit operates and resets to the stand by mode. At this time,
the defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.
* Refer to 7.1.1 Display Indication
16
7.2.No Power
First check point
There are following 3 states of No Power indication by power LED.
1. No lit.
2. Green is lit then turns red blinking a few seconds later.
3. Only red is lit.
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7.3.No Picture
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7.4.Local screen failure
Plasma display may have local area failure on the screen. Fig - 1 is the possible defect P.C.B. for each local area.
Fig - 1
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8Service Fixture & Tools
8.1.SC jig
Purpose:
To find the failure board (SC or SU/SD) when the power LED is blinking 7 times.
SC jig:
Jumper connector to connect to SC50 connector on SC board
Part number:
TZSC09187
How to use:
Caution: Remove SC jig from SC board after inspection.
1. Remove all connector between SC board and SU/SD board to isolate SC board from both SU and SD board electrically.
Note: The board will be damaged if all connector is not removed (for example; remove connector only for SU board
and stay connecting with SD board. The board will be damaged.)
2. Connect SC jig to connector SC50 at left bottom side of SC board.
3. Turn on the TV/Display Unit and confirm the power LED blinking.
LED blinking: Possible cause of failure is in SC board
No LED blinking (Lighting or no lighting): Possible cause of failure is in SU or SD board
4. After inspection, turn off the TV/Display Unit and wait a few minutes to discharge.
5. Remove SC jig from SC board.
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TH-65VX300ER
9Disassembly and Assem-
bly Instructions
• To disassemble P.C.B., wait for 1 minute after power was off
for discharge from electrolysis capacitors.
•, , , , , and marks indicate screw positions.
9.1.Removal of Rear Cover
1. Remove screws (×26 , ×4 , ×18 ) and M8 Cap (×4
) and then remove the Rear Cover.
3. Remove 4 screws and then remove the Slot Block.
9.3.Removal of DS-Board
1. Remove the Slot Block.
(Refer to Removal of Slot Block)
2. Turn over the Slot Block.
3. Remove 6 screws and then remove DS-Board.
2. Turn over the Rear Cover.
3. Remove the P Print Barrier (C).
9.2.Removal of Slot Block
1. Disconnect the connectors (DS13, P9).
2. Remove the flexible cable from the connector (DS1).
9.4.Removal of D-Board
1. Disconnect the connector (D25).
2. Remove the flexibles cable from the connectors (D15,
D20, D31, D32).
3. Remove 4 screws and then remove D-Board.
9.5.Removal of HX-Board
1. Disconnect the connectors (A14, A38).
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2. Remove 2 Hexagonal-Head screws, 4 screws ( ), 1
screws ( ) and 2 screw ( ) and then remove the HXBoard Block.
3. Turn over the HX-Board Block.
4. Disconnect the connectors (HX1, HX2).
5. Remove 2 Hexagonal-Head screws and 1 screw of HXBoard and then remove HX-Board.
4. Remove 4 screws and then remove A-Board.
Note: when fixing A-Board
• Put the flexible Cable between the Fixed Metal and ABoard when Connect the flexible Cable to the connector
(A1).
9.7.Removal of Fan
1. Disconnect the Fan Relay Connectors.
2. Remove 7 screws and then remove the Fan Block (A),
(B), (C) and the Duct Barrier (A).
9.6.Removal of A-Board
1. Remove the HX-Board Block.
(Refer to Removal of HX-Board)