Panasonic TH-58PZ850U Service manual

ORDER NO. MTNC080747CE

B34 Canada: B07

58 inch Class 1080p Plasma HDTV

Model No. TH-58PZ850U

GPF11DU Chassis

1 Safety Precautions

1.1. General Guidelines

1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.

2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

3. When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight out.

4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, ins ulation papers shields are properly installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1Mohm and 5.2Mohm. When the exposed metal does not have a return path to the chassis, the reading must be .

1.1.2. Leakage Current Hot Check (See Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kohm, 10 watts resistor, in parallel with a

0.15μF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

Figure 1

2Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

2.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

3 Service Navigation

3.1. Service Hint

Board Name Function Board Name Function

P Power Supply C1 Data Driver (Lower Right) A DC-DC Converter

Speaker out, Sound Processor AV Terminal, AV Switch Digital Signal Processor, Micom, HDMI Interface Peaks PRO, GC6

D Format Converter, Plasma AI, Sub-Field Processor SS Sustain Drive K Remote receiver, Power LED SS2 Sustain connector (Upper)

S Power Switch SS3 Sustain connector (Lower) GS SD Card Slot GH HDMI4 in GL SD Blue LED G Front Terminal, Key Switch

C2 Data Driver (Lower Center) C3 Data Driver (Lower Left) SC Scan Drive SU Scan out (Upper) SD Scan out (Lower)

PB Fan control

3.2. Applicable signals

* Mark: Applicable input signal for Component (Y, PB, PR), HDMI and PC

horizontal frequency (kHz) vertical frequency (Hz) COMPONENT HDMI PC 525 (480) / 60i 15.73 59.94 * * 525 (480) /60p 31.47 59.94 * * 750 (720) /60p 45.00 59.94 * * 1,125 (1,080) /60i 33.75 59.94 * * 1,125 (1,080) /60p 67.43 59.94 * 1,125 (1,080) /60p 67.50 60.00 * 1,125 (1,080) /24p 26.97 23.98 * 1,125 (1,080) /24p 27.00 24.00 * 640 × 400 @70 31.47 70.08 * 640 × 480 @60 31.47 59.94 * Macintosh13 inch (640 × 480) 35.00 66.67 * 640 × 480 @75 37.50 75.00 * 852 × 480 @60 31.47 59.94 * 800 × 600 @60 37.88 60.32 * 800 × 600 @75 46.88 75.00 * 800 × 600 @85 53.67 85.08 * Macintosh16 inch (832 × 624) 49.73 74.55 * 1,024 × 768 @60 48.36 60.00 * 1,024 × 768 @70 56.48 70.07 * 1,024 × 768 @75 60.02 75.03 * 1,024 × 768 @85 68.68 85.00 * Macintosh 21 inch (1,152 ×870) 68.68 75.06 * 1,280 × 1,024 @60 63.98 60.02 * 1,366 × 768 @60 48.36 60.00 *

Note

• Signals other than above may not be displayed properly.

• The above signals are reformatted for optimal viewing on your display.

4 Specifications

Power Source AC 120 V, 60 Hz Power Consumption

Maximum 742 W Standby condition 0.2 W

Plasma Display panel

Drive method AC type Aspect Ratio 16:9 Visible screen size 58 inch class (58.0 inches measured diagonally) (W × H × Diagonal) 50.5 inch × 28.4 inch × 58.0 inch (1,284 mm × 723 mm × 1,474 mm) (No. of pixels) 2,073,600 (1,920 (W) × 1,080 (H))[5,760 × 1,080 dots]

Sound

Audio Output Super Slim SP (2.5W) × 2, Woofer (13W) × 2

PC signals VGA, SVGA, XGA, WXGA, SXGA

Channel Capability (Digital/Analog) VHF/ UHF: 2 - 69, CATV: 1 - 135 Operating Conditions

Connection Terminals

VIDEO IN 1-2 VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 Ω)

COMPONENT INPUT 1-2 Y: 1.0 V [p-p] (including synchronization)

HDMI 1-4 TYPE A Connector × 4

PC D-SUB 15PIN: R,G,B / 0.7 V [p-p] (75 Ω)

RS232C (Serial) D-sub 9pin for external control LAN (for VIERA CAST IPTV) RJ45 (10BASE-T/100BASE-TX) Card slot SD CARD slot × 1 AV PROG OUT VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 Ω)

DIGITAL AUDIO OUT PCM / Dolby Digital, Fiber Optic

FEATURES 3D Y/C FILTER CLOSED CAPTION

Dimensions (W × H × D)

Including pedestal 56.9 inch × 37.4 inch × 16.2 inch (1,445 mm × 949 mm × 409 mm) TV Set only 56.9 inch × 35.4 inch × 4.3 inch (1,445 mm × 898 mm × 109 mm)

Mass

Including pedestal 137.4 lb. (62.3 kg) TV Set only 128.6 lb. (58.3 kg)

Horizontal scanning frequency 31 - 69 kHz Vertical scanning frequency 59 - 86 Hz

Temperature: 32 °F - 104 °F (0 °C - 40 °C) Humidity: 20 % - 80 % RH (non-condensing)

S-VIDEO: Mini DIN 4-pin Y: 1.0 V [p-p] (75 Ω) C: 0.286 V [p-p] (75 Ω) AUDIO L-R: RCA PIN Type × 2 0.5 V [rms]

, PR: ±0.35 V [p-p]

AUDIO L-R: RCA PIN Type × 2 0.5 V [rms]

This TV supports [HDAVI Control 3] function.

HD, VD / 1.0 - 5.0 V [p-p] (high impedance)

AUDIO L-R:

AUDIO L-R: RCA PIN Type × 2 0.5 V [rms]

V-Chip BBE VIVA 3D Photo viewer HDAVI Control 3 IPTV (VIERA CAST) Movie player

Stereo Mini Jack ( 3.5 mm) × 1

Note

• Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.

5 Service Mode

5.1. How to enter into Service Mode

While pressing [VOLUME ( - )] button of the main unit, press [INFO] button of the remote control three times within 2 seconds.

5.1.1. Key command

[1] button...Main items Selection in forward direction [2] button...Main items Selection in reverse direction [3] button...Sub items Selection in forward direction [4] button...Sub items Selection in reverse direction [VOL] button...Value of sub items change in forward direction ( + ), in reverse direction ( - )

5.1.2. Contents of adjustment mode

• Value is shown as a hexadecimal number.

• Preset value differs depending on models.

• After entering the adjustment mode, take note of the value in each item before starting adjustment.

Main item Sub item Sample Data Remark

ADJUST CONTRAST 000

COLOR 3C TINT 03 SUB-BRT 800

WB-ADJ R-CUT 80

G-CUT 80 B-CUT 80 R-DRV FC G-DRV F8 B-DRV D9 ALL-CUT 80 ALL-DRV FC

OPTION BOOT ROM Factory Preset

STBY-SET 00 EMERGENCY ON CLK MODE 00 CLOCK 000

AGING RGBW

COUNT ALL WHITE ALL RED ALL GREEN ALL BLUE ON/OFF RAMP WHITE RAMP RED RAMP GREEN RAMP BLUE 1% WINDOW COLOR BAR A-ZONE B-ZONE/4 TRIO SCROLL WHITE FLAME

RM-SET CODE A Fixed

SRV-TOOL - See next

5.1.3. How to exit

Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.

5.2. Service tool mode

5.2.1. How to access

1. Select [SRV-TOOL] in Service Mode.

2. Press [OK] button on the remote control.

5.2.2. Display of SOS History

SOS History (Number of LED blinking) indication. From left side; Last SOS, before Last, three occurrence before, 2nd occurrence after shipment, 1st occurrence after shipment. This indication except 2nd and 1st occurrence after shipment will be cleared by [Self-check indication and forced to factory shipment setting].

5.2.3. POWER ON TIME/COUNT

Note : To display TIME/COUNT menu, highlight position, then press MUTE for (3sec). Time : Cumulative power on time, indicated hour : minute by decimal Count : Number of ON times by decimal Note : This indication will not be cleared by either of the self-checks or any other command.

5.2.4. Exit

1. Disconnect the AC cord from wall outlet.

5.3. Hotel mode

1. Purpose Restrict a function for hotels.

2. Access command to the Hotel mode setup menu In order to display the Hotel mode setup menu, please enter the following command (within 2 second). [TV] : Vol. [Down] + [REMOTE] : TV/VIDEO (3 times)

Then, the Hotel mode setup menu is displayed.

3. To exit the Hotel mode setup menu Disconnect AC power cord from wall outlet.

4. Explain the Hotel mode setup menu

item Function Mode Select hotel mode ON/OFF Input Select input signal modes.

Set the input, when each time power is switched on. Selection:

-/RF/COMP1/COMP2/HDMI1/HDMI2/ HDMI3/HDMI4/VIDEO1/VIDEO2/PC

• Off: give priority to a last memory.

Channel Select channel when input signal is RF.

Set the channel, each time power is switched on. Selection: Any channel number or [-]. [-] means the channel when turns off.

Volume Adjust the volume when each time power is

switched on. Range: 0 to 100

Vol. Max Adjust maximum volume.

Range: 0 to 100

OSD Ctrl Restrict the OSD.

Selection: OFF/PATTERN1

• OFF: No restriction

• PATTERN1: restriction

FP Ctrl Select front key conditions.

Selection: Off/Pattern1/All

• Off: altogether valid.

• Pattern: only input key is valid.

• All: altogether invalid.

Pow Ctrl Select POWER-ON/OFF con dition when AC

power cord is disconnected and then connected. OFF: The same condition when AC power cord is disconnected. ON: Forced power ON condition.

6 Troubleshooting Guide

Use the self-check function to test the unit.

1. Checking the IIC bus lines

2. Power LED Blinking timing

6.1. Check of the IIC bus lines

6.1.1. How to access

Self-check indication only: Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [OK] button on the remote control for more than 3 seconds. Self-check indication and forced to factory shipment setting: Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, pre ss [MENU] button on the remote control for more than 3 seconds.

6.1.2. Exit

Disconnect the AC cord from wall outlet.

6.1.3. Screen display

6.1.4. Check Point

Confirm the following parts if NG was displayed.

6.2. Power LED Blinking timing chart

1. Subject Information of LED Flashing timing chart.

2. Contents When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.

6.3. No Power

First check point There are following 2 states of No Power indication by power LED.

1. No lit

2. Red is lit then turns red blinking a few seconds later. (See 6.2.)

6.4. No Picture

6.5. Local screen failure

Plasma display may have local area failure on the screen. Fig-1 is the possible defect P.C.B. for each local area.

Fig-1

7 Disassembly and Assembly Instructions

7.1. Remove the Rear cover

1. See Service Hint. (Section 3)

7.2. Remove the Fan unit

1. Unlock the cable clampers to free the cable.

2. Remove the screws (×3 ).

3. Remove the relay connectors and remove the Fan unit.

4. Remove the screw (×1 ) on the back side.

5. Remove the Fan.

7.3. Remove the PB-Board

1. Disconnect the connectors (PB30, PB31, PB32, PB36 and PB37).

2. Remove the screws (×2 ).

3. Remove the PB-Board.

7.4. Remove the Rear Terminal cover

1. Remove the screws (×6 , ×4 , ×3 ).

2. Remove the Rear Terminal cover.

7.5. Remove the P-Board

Caution:

To remove P.C.B. wait 1 minute after power was off for discharge from electrolysis capacitors.

1. Unlock the cable clampers to free the cable.

2. Disconnect the connectors (P2, P6, P7, P9, P11, P12 and P25).

3. Remove the screws (×8 ) and remove the P-Board unit.

6. Remove the screws (×12 ).

7. Remove the molding props (×6 ).

8. Remove the P(Multi)-Board.

9. Remove the molding props (×6 ).

10. Remove the P(Sus)-Board.

4. Remove the screws (×34 ) on the back side.

5. Disconnect the connectors (P51-P52, P53-P54 and P55P56).

Note:

When assembling the P(Multi)-Board and the P(Sus)Board, the position of each hole of the insulation sheets(A, B, C, D) is set to the position of each hole of the P(Multi)Board and the P(Sus)-Board and then assemble them.

( marks indicate setting positions.)

7.7. Remove the A-Board

1. Remove the A-Board unit. (See section 7.6.)

2. Remove the screws (×8 ) and remove the A-Board.

P-Board backside

7.6. Remove the A-Board unit

1. Unlock the cable clampers to free the cable.

2. Remove the screw (×1 ) and remove the Earth cable.

3. Disconnect the connectors (A1, A3, A5, A6, A7, A9, A10, A11, A12, A30 and A51).

4. Remove the screws (×4 ) and remove the A-Board unit.

7.8. Remove the Speaker box (Woofer/L, Woofer/R)

1. Unlock the cable clampers to free the cable.

2. Disconnect the relay connectors.

3. Remove the screws (×4 each) and remove the Speaker box (Woofer/L, Woofer/R).

4. Remove the screws (×3 ) and remove the Woofer holder L.

7.9. Remove the SU-Board

1. Disconnect the flexible cables (SU1B, SU2B, SU3B, SU4B and SU5B) connected to the SU-Board.

2. Remove the flexible cable (SU11-SD11) and the bridge connector (SC41-SU41).

3. Remove the screws (×3 , ×3 ) and remove the SU- Board.

5. Remove the screws (×3 ) and remove the Woofer holder R.

7.10. Remove the SD-Board

1. Disconnect the flexible cables (SD1B, SD2B, SD3B, SD4B and SD5B) connected to the SD-Board.

2. Disconnect the flexible cable (SU11-SD11) and the bridge connectors (SC42-SD42 and SC46-SD46).

3. Remove the screws (×3 , ×3 ) and remove the SD- Board.

7.11. Remove the SC-Board

1. Remove the SU-Board and SD-Board. (See section 7.9. and 7.10.)

2. Disconnect the connector (SC2).

3. Disconnect the flexible cable (SC20).

4. Remove the screws (×8 ) and remove the SC-Board.

7.12. Remove the SS-Board

1. Unlock the cable clampers to free the cable.

2. Disconnect the connectors (SS11, SS12 and SS33) and the bridge connectors (SS21-SS02 and SS22-SS03).

3. Remove a short-jumper connector SS34 and re-use for new SS-Board.

4. Disconnect the flexible cables (SS54 and SS56).

5. Remove the screws (×6 ) and remove the SS-Board.

7.13. Remove the SS2-Board

1. Disconnect the bridge connector (SS21-SS02) and disconnect the flexible cable (SS52).

2. Remove the screws (×2 ) and remove the SS2-Board.

7.14. Remove the SS3-Board

1. Unlock the cable clampers to free the cable.

2. Disconnect the connectors (SS35).

3. Disconnect the flexible cable (SS57) and disconnect the bridge cable (SS22 - SS03).

4. Remove the screws (×4 ) and remove the SS3-Board.

7.15. Remove the D-Board

1. Remove the A-Board unit. (See section 7.6.)

2. Disconnect the connectors (D3, D5 and D25).

3. Disconnect the flexible cables (D20, D31, D32 and D33).

4. Remove the screws (×4 ) and remove the D-Board.

7.16. Remove the C1-Board

1. Remove the A-Board unit. (See section 7.6.)

2. Remove the Speaker box (Woofer/R). (See section 7.8.)

3. Remove the DD-Heat-sink fastening screws (×10 ).

4. Remove the DD-Heat-sink (×5).

7.17. Remove the C2-Board

1. Remove the A-Board unit. (See section 7.6.)

2. Remove the Speaker box (Woofer/L). (See section 7.8.)

3. Remove the DD-Heat-sink fastening screws (×10 ).

4. Remove the DD-Heat-sink (×5).

5. Disconnect the flexible cables (CB6, CB7, CB8, CB9 and CB10).

6. Disconnect the flexible cables (C20, C21, C22 and C26).

7. Remove the screws (×4 ) and remove the C2-Board.

5. Disconnect the flexible cables (CB1, CB2, CB3, CB4 and CB5).

6. Disconnect the flexible cables (C10 and C11).

7. Remove the screws (×5 ) and remove the C1-Board.

7.18. Remove the C3-Board

1. Remove the Speaker box (Woofer/L). (See section 7.8.)

2. Remove the DD-Heat-sink fastening screws (×10 ).

3. Remove the DD-Heat-sink (×5).

4. Disconnect the flexible cables (CB11, CB12, CB13, CB14 and CB15).

5. Disconnect the flexible cable (C36).

6. Disconnect the connectors (C33 and C35).

7. Remove the screws (×5 ) and remove the C3-Board.

7.19. Remove the Speaker (Squawker)

1. Remove the screws (×4 ) and remove the Bottom support metal.

7.20. Remove the Front bracket

1. Remove the Bottom support metal. (See section 7.19.)

2. Unlock the cable clampers to free the cable.

3. Disconnect the connectors (GS02, GS09 and GH11).

4. Disconnect the connector (A51). (See section 7.6.)

5. Remove the screws (×3 , ×2 ) and remove the Front bracket.

7.21. Remove the G-Board, GSBoard and GH-Board

1. Remove the Front bracket. (See section 7.20.)

2. Remove the screws (×5 ).

2. Disconnect the relay connectors.

3. Remove the screws (×2 each).

4. Remove the Speaker (Squawker/L, Squawker/R).

3. Remove the screws (×4 ).

4. Remove the Front shield case front and the Front shield top.

5. Remove the GH-Board.

6. Remove the screw (×1 ) and remove the GS-Board.

7. Remove the screws (×3 ).

8. Disconnect the connector (G51) and remove the GBoard.

7.22. Remove the stand brackets

7.23. Remove the Plasma panel sec-

and rear mounting metals

1. Remove the plasma panel section from the servicing stand and lay on a flat surface such as a table (covered) with the plasma panel surface facing downward.

2. Remove the stand brackets (left, right) fastening screw (×1 each).

3. Remove the rear mounting metals (left, right) fastening screws (×4 each).

4. Remove the stand brackets and rear mounting metals.

5. Remove the fastening screws (×4 each).

6. Remove the stand brackets from rear mounting metals.

tion from the Cabinet assy (glass)

1. Remove the stand brackets (left, right) fastening screw (×1 each).

2. Remove the cabinet assy and the plasma panel fastening screws (×6 , ×12 ).

3. For leaving the plasma panel from the front frame, pull the bottom of the cabinet assy forward, lift, and remove.

4. Remove the spacers and spacer rings (×6 ).

5. Remove the screws (×2 ) and remove the S-Board unit.

6. Remove the screw (×1 ) and remove the S-Board.

7.24. Remove the K-Board and SBoard

1. Remove the Cabinet assy. (See section 7.23.)

2. Remove the Speaker (Squawker /L). (See section 7.19.)

3. Remove the screws (×5 ) and remove the Bottom shield L.

4. Disconnect the connector (S2).

7. Remove the screws (×2 ).

8. Remove the K-Board and disconnect the connector (K1).

7.25. Remove the GL-Board

1. Remove the Cabinet assy. (See section 7.23.)

2. Remove the Speaker (Squawker /R). (See section 7.19.)

3. Remove the Bottom shield L. (See section 7.24.)

4. Remove the screws (×5 ) and remove the Bottom shield R.

5. Remove the screws (×8 ) and remove the Bottom plate.

6. Remove the screws (×2 ) and remove the GL-Board and disconnect the connector (GL02).

7.26. Replace the plasma panel (finished)

1. Place the new plasma panel (finished) on the flat surface of the table (covered by a soft cloth), with the plasma panel surface facing downward.

2. Attach the C1-Board, C2-Board and the C3-Board, connect the flexible cables (×15) from the plasma panel to the C1-Board, C2-Board and the C3-Board, and fit the flexible cable holders.

3. Attach the Hooks (left, right) and fit the stand brackets (L, R) to the new plasma panel.

4. Place the plasma panel section on the servicing stand.

5. Attach the cabinet assy and each P.C.Board and so on, to the new plasma panel.

*When fitting the cabinet assy, be careful not to allow any debris, dust or handling residue to remain between the front glass and plasma panel.

8 Measurements and Adjustments

8.1. Adjustment Procedure

8.1.1. Driver Set-up

8.1.1.1. Item / Preparation

1. Input a white signal to plasma video input.

2. Set the picture controls as follows. Picture menu: Vivid Normal: Set Aspect: Full

Caution

1. First perform Vsus adjustment.

2. Confirmation of Vscn voltage should be performed after confirmation of Vad adjustment. When Vad= -135V, Voltage of Vscn is 10V ±4V.

8.1.1.2. Adjustments

Adjust driver section voltages referring the panel data on the panel data label. Check or adjust the following voltages with the multimeter.

Name Test Point Voltage Volume Remarks

Vsus TPVSUS

(SS)

Ve TPVE (SS) Ve ± 1V VR16000

Vset TPVSET

(SC)

Vad TPVAD (SC) -135V ± 1V VR16600

Vscn TPVSCN

(SC)

Vda TPVDA (SS) 75V + 1V, -2V Fixed

*See the Panel label.

Vsus ± 2V VR251 (P) *

(SS)

325V ± 10V Fixed

(SC)

Vad+145V ± 4V Fixed

8.1.2. Initialization Pulse Adjust

1. Input the White signal to plasma video input.

2. Set the picture controls as follows. Picture menu : Vivid Normal : Set Aspect : Full

3. Connect Oscilloscope to TPSC1 (SC). Check the voltage (T2) at 100 us period on the down slop.

Test point Volume Level

T2 TPSC1 (SC) VR16602 (SC) 250 V ± 10 V

8.1.3. P.C.B. (Printed Circuit Board) exchange

8.1.3.1. Caution

1. To remove P.C .B. , wait 1 minute after power was off for discharge from electrolysis capacitors.

8.1.3.2. Quick adjustment after P.C.B. exchange

Adjust the following voltages with the multimeter.

P.C.B. Name Test Point Voltage Volume Remarks P Board Vsus TPVSUS (SS) Vsus ± 2V VR251 (P) * SC Board Vad TPVAD (SC) -135V ± 1V VR16600 (SC) SS Board Ve TPVE (SS) Ve ± 1V VR16000 (SS) * A, D Board White balance and Sub brightness for NTSC, PAL, HD, PC and 625i signals

*See the Panel label.

Caution:

Absolutely do not reduce Vsus below Ve not to damage the P.C.B.

8.1.4. Adjustment Volume Location

8.1.5. Test Point Location

8.2. Adjustment

8.2.1. White balance adjustment

Name of measuring instrument Connection Remarks

• W/B pattern

• Color analyzer (Minolta CA-100 or equivalent)

Procedure Remarks

• Make sure the front panel to be used on the final set is fitted.

• Make sure a color signal is not being shown before adjustment.

• Put the color analyzer where there is little color variation.

1. Output a white balance pattern.

2. Check that the color temperature is [Cool].

3. Set to serviceman mode, WB-ADJ.

4. Set [R-CUT] [G-CUT] [B-CUT] the values written in table 1.

5. Attach the sensor of color analyzer to the center of highlight window.

6. Fix G drive at C0h and adjust [B-DRV] and [R-DRV] so x, y value of color analyzer become the [Color temperature High] in table 2.

7. Increase RGB together so the maximum drive value in RGB becomes FC. That is, set [ALL DRIVE] to FC. Execute adjustment again. When that , the maximum v alue of R/G/B DRV should be FC, and either R/G/B DRV should be FC.

8. Set color temperature to [Normal].

9. Set [R-CUT] [G-CUT] [B-CUT] the values written in table 1.

10. Attach the sensor of color analyzer to the center of highlight window.

11. Fix G drive at C0h and adjust [B-DRV] and [R-DRV] so x, y value of color analyzer become the [Color temperature Mid] in table 2.

12. Increase RGB together so the maximum drive value in RGB becomes FC. That is, set [ALL DRIVE] to FC. Execute adjustment again. When that , the maximum v alue of R/G/B DRV should be FC, and either R/G/B DRV should be FC.

13. Set color temperature to [Warm].

14. Set [R-CUT] [G-CUT] [B-CUT] the values written in table 1.

15. Attach the sensor of color analyzer to the center of highlight window.

16. Fix G drive at C0h and adjust [B-DRV] and [R-DRV] so x, y value of color analyzer become the [Color temperature Low] in table 2.

17. Increase RGB together so the maximum drive value in RGB becomes FC. That is, set [ALL DRIVE] to FC. Execute adjustment again. When that , the maximum v alue of R/G/B DRV should be FC, and either R/G/B DRV should be FC.

18. Set color temperature to [Cool].

Component input Panel surface

- adjustment of [Normal] [Warm] by data shift from [Cool] adjust. For [Normal] [Warm] adjustment, set values that the adjusted value of [Cool] plus the figures wrote below.

When the measurement data is not in the following toleran ce by the shipping confirmation, please re-adjust. Tolerance : ( x , y ) = ( setting data±0.007, setting data±0.007)

19. Copy values adjusted by HD pattern to the NTSC data area of EEPROM.

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