Panasonic TH-58PZ850AZ Schematic

ORDER NO. ITD0809088CE

Plasma TV

Model No. TH-58PZ850AZ

GPF11DA Chassis

1 Safety Precautions

1.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.2. Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reserve the AC plug in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUGH CURRENT) expressed as voltage U

For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);

For d. c.: U

Note:

The limit value of U

mA d. c. The limit value U

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

= 1.0 V,

= 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0

= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.

and U2, does not exceed the following values:

Figure 1

2Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

2.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

3 Service Navigation

3.1. Service Hint

Board Name Function Board Name Function

P Power Supply C1 Data Driver (Lower Right) A DC-DC Converter

Speaker out, Sound Processor AV Termin a l , AV Sw i t c h Digital Signal Processor, Micom, HDMI Interface Peaks PRO, GC6

D Format Converter, Plasma AI, Sub-Field Processor SS Sustain Drive K Remote receiver, Power LED SS2 Sustain connector (Upper)

S Power Switch SS3 Sustain connector (Lower) GS SD Card Slot GH HDMI4 in GL SD Blue LED G Front Terminal, Key Switch HC PC in, Audio out PA Fan control

C2 Data Driver (Lower Center) C3 Data Driver (Lower Left) SC Scan Drive SU Scan out (Upper) SD Scan out (Lower)

3.2. Applicable signals

4 Specifications

Power Source AC 220 - 240 V, 50/60 Hz Power Consumption

Average use 670 W Standby condition 0.4 W

Plasma Display panel

Aspect Ratio 16:9 Visible screen size 147 cm (diagonal)

1,284 mm (W) × 723 mm (H)

Number of pixels 2,073,600 (1,920 (W) × 1,080 (H))

Sound

Speaker

Audio Output 31 W (15.5 W + 15.5 W), 10% THD Headphones M3 (3.5 mm) stereo mini Jack × 1

PC signals VGA, SVGA, XGA, SXGA

Receiving Systems / Band name PAL B/G Reception of Off air broadcasts

Aerial - Rear VHF/UHF Operating Conditions

Connection Terminals

AV1 I n p u t

AUDIO L - R RCA PIN Type × 2 0.5 V[rms] VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω) COMPONENT Y

AV2 I n p u t

AUDIO L - R RCA PIN Type × 2 0.5 V[rms] VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω) COMPONENT Y

AV3 I n p u t

AUDIO L - R RCA PIN Type × 2 0.5 V[rms] VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω) S VIDEO Mini DIN 4-pin Y:1.0 V[p-p] (75 Ω) C:0.286 V[p-p] (75 Ω)

AV4 I n p u t

AUDIO L - R RCA PIN Type × 2 0.5 V[rms] VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω) S VIDEO Mini DIN 4-pin Y:1.0 V[p-p] (75 Ω) C:0.286 V[p-p] (75 Ω)

Woofer ( 80mm) × 2pcs, Tweeter (23mm × 100mm) × 2pcs

Horizontal scanning frequency 31 - 69 kHz Vertical scanning frequency 59 - 86 Hz

Digital TV 8 MHz UHF (New Zealand) free-to-air TV broadcast reception PAL 6 0 Hz M.NTSC NTSC

Temperature: 0 °C - 40 °C Humidity: 20 % - 80 % RH (non-condensing)

, PR/C

B/CB

, PR/C

Playback of NTSC tape from some PAL Video recorders (VCR) Playback from M.NTSC Video recorders (VCR) Playback from NTSC Video recorders (VCR)

1.0 V[p-p] (including synchronization) ±0.35 V[p-p]

Monitor Output

AUDIO L - R RCA PIN Type × 2 0.5 V [rms] (high impedance) VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω)

Others

HDMI 1-4 Input TYPE A Connectors This TV supports “HDAVI Control 3” function. PC Input HIGH-DENSITY D-SUB 15PIN R, G, B/ 0.7 V [p-p] (75 Ω)

DIGITAL AUDIO OUT PCM / Dolby Digital, Fiber optic Card slot SD Card slot × 1

Dimensions (W × H × D) 1,445 mm × 949 mm × 409 mm (With Pedestal)

1,445 mm × 898 mm × 109 mm (TV only)

Mass 63.5 kg Net (With Pedestal)

59.0 kg Net (TV only)

HD, VD/TTL Level 2.0 - 5.0 V [p-p] (high impedance)

Note

• Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.

• Pedestal : ST-58R4-WG (For safety approval)

5 Service Mode

5.1. How to enter into Service Mode

While pressing [VOLUME ( - )] button of the main unit, press [0] button of the remote control three times within 2 seconds.

5.1.1. Key command

[1] button...Main items Selection in forward direction [2] button...Main items Selection in reverse direction [3] button...Sub items Selection in forward direction [4] button...Sub items Selection in reverse direction [RED] button...All Sub items Selection in forward direction [GREEN] button...All Sub items Selection in reverse direction [VOL] button...Value of sub items change in forward direction ( + ), in reverse direction ( - )

5.1.2. Contents of adjustment mode

• Value is shown as a hexadecimal number.

• Preset value differs depending on models.

• After entering the adjustment mode, take note of the value in each item before starting adjustment.

5.1.3. How to exit

Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.

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