Panasonic TH-58PH10UK Service manual

Yor

ORDER NO. MTNC070622CE

B34 Canada: D10

High Definition Plasma Display

TH-58PH10UK

GPH10D Chassis

Specifications

PowerSource 120 V AC, 50/60 Hz PowerConsumption

Power on 660 W Stand-bycondition Save OFF 0.6 W, Save ON 0.4 W Power off condition 0.1 W

Plasma Displaypanel Drive method: AC type 58-inch,

16:9 aspect ratio

Screen size 50.7” (1,287 mm) (W) × 28.5” (723 mm) (H) × 58” (1,476 mm) (diagonal)

(No. of pixels) 1,049,088 (1,366 (W) × 768 (H)) [4,098 × 768 dots]

Operating condition

Temperature 32 °F - 104 °F (0 °C - 40 °C) Humidit

Applicable signals

ColorSystem NTSC, PAL, PAL60, SECAM, Modified NTSC Scanning format 525 (480) / 60i 60p, 625 (575)/50i 50p, 750 (720)/60p 50p, 1125 (1080) / 60i 50i 24p 25p

PC signals VGA, SVGA, XGA,

Connection terminals

VIN VIDEO IN (BNC) 1.0 Vp-p (75-ohm)

COMPONENT / RGB IN

PC IN (HIGH-DENSITY MINI-D-SUB 15PIN)

20 % - 80 %

30p 24sF .... SMPTE274M, 1250 (1080) / 50i

SXGA, UXGA ..... (compressed)

Horizontal scanning frequency15 - 110 kHz Vertical scanning frequency48 - 120 Hz

S VIDEO IN (MINI DIN 4PIN) Y: 1.0 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)

UDIO IN (RCA PIN JACK × 4) 0.5 Vrms (high impedance)

/ G (BNC) with/sync1.0 Vp-p (75-ohm)

PB/B (BNC), P

UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)

R (BNC) 0.7 Vp-p (75-ohm)

G with/sync1.0 Vp-p (75-ohm) G without / sync0.7 Vp-p (75-ohm)

B/P

CB:0.7 Vp-p (75-ohm)

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R/P

CR:0.7 Vp-p (75-ohm)

HD/VD:1.0 - 5.0 Vp-p (high impedance)

UDIO IN (M3 JACK) 0.5 Vrms (high impedance) SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE SPEAKERS (6Ω) 16 W [8 W + 8 W] (10 % THD)

Accessories Supplied

Remote Control Transmitter EUR7636070R Batteries 2 × AA Size Fixing bands TMME203 × 2

Dimensions (W × H × D) 55.1” (1,399 mm) × 33.2” (843 mm) × 3.9” (99 mm) Mass (weight)

main unit onl with speakers approx. 130.1 lbs

approx. 119 lbs

Note:

· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

CONTENTS

Page Page

1 Applicable signals 4 2 Safety Precautions

2.1. General Guidelines

3 Prevention of Electrostatic Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 4 About lead free solder (PbF) 5 Service Hint 6 Disassembly

6.1. Removal of Rear Cover

6.2. Removal of HU-Board

6.3. Removal of HA-Board

6.4. Removal of Slot Block

6.5. Removal of DS-Board

6.6. Removal of HX-Board

6.7. Removal of DN-Board

6.8. Removal of P-Board

6.9. Removal of D-Board

6.10. Removal of H3-Board (L, R)

6.11. Removal of SU-Board and SD-Board

6.12. Removal of SC-Board

6.13. Removal of SS2-Board and SS3-Board

6.14. Removal of SS-Board

6.15. Removal of C1, C2 and C3-Board

6.16. Removal of S1-Board

6.17. Removal of Fan

6.18. Removal of V1-Board, V2-Board and Operation Button

6.19. Removal of Escutcheon and Front Glass

6.20. Removal of Plasma Panel

7 Location of Lead Wiring

10 10 10 11 11 11 11 12 12 12 12 13 14 14 15 16

6 7 8 9

9 9 9 9

7.1. Location of Lead Wiring (1)

7.2. Location of Lead Wiring (2)

8 Adjustment Procedure

8.1. Driver Set-up

8.2. Initialization Pulse Adjust

8.3. P.C.B. (Printed Circuit Board) exchange

8.4. Adjustment Volume Location

8.5. Test Point Location

9 Service mode

9.1. CAT (computer Aided Test) mode

9.2. IIC mode structure (following items value is sample data.)

10 Adjustment

10.1. RGB white balance adjustment

10.2. HD white balance adjustment

10.3. Power control adjustment

11 Trouble shooting guide

11.1. Self Check

11.2. No Power

11.3. No Picture

11.4. Local screen failure

12 Option Setting 13 Conductor Views

13.1. P-Board

13.2. HA-Board

13.3. HU-Board

13.4. HX-Board

13.5. H3, S1, V1 and V2-Board

13.6. DS-Board

19 20

21 22 22 23 23

28 30 32

33 35 35 36

37 39

39 45 46 47 48 49

13.7. DN-Board 51

13.8. D-Board

13.9. C1-Board

13.10. C2-Board

13.11. C3-Board

13.12. SC-Board

13.13. SU-Board

13.14. SD-Board

13.15. SS-Board

13.16. SS2 and SS3-Board

14 Block and Schematic Diagram

14.1. Schematic Diagram Notes

14.2. Main Block Diagram

14.3. P-Board Block Diagram

14.4. P-Board (1 of 2) Schematic Diagram

14.5. P-Board (2 of 2) Schematic Diagram

14.6. HA-Board Block and Schematic Diagram

14.7. HU-Board Block Diagram

14.8. HU-Board (1 of 2) Schematic Diagram

14.9. HU-Board (2 of 2) Schematic Diagram

14.10. HX-Board Block and Schematic Diagram

14.11. V1 and V2-Board Block and Schematic Diagram

14.12. DS-Board (1 of 2) and H3-Board Block Diagram

14.13. DS-Board (2 of 2) Block Diagram

14.14. DS-Board (1 of 5) Schematic Diagram

14.15. DS-Board (2 of 5) and H3-Board Schematic Diagram

14.16. DS-Board (3 of 5) Schematic Diagram

14.17. DS-Board (4 of 5) Schematic Diagram

14.18. DS-Board (5 of 5) Schematic Diagram

14.19. DN-Board (1 of 2) Block Diagram

14.20. DN-Board (2 of 2) Block Diagram

14.21. DN-Board (1 of 6) Schematic Diagram

14.22. DN-Board (2 of 6) Schematic Diagram

14.23. DN-Board (3 of 6) Schematic Diagram

14.24. DN-Board (4 of 6) Schematic Diagram

14.25. DN-Board (5 of 6) Schematic Diagram

14.26. DN-Board (6 of 6) Schematic Diagram

14.27. D-Board Block Diagram 53 55 56 57 58 61 62 63 66

67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91

14.28. D-Board (1 of 6) Schematic Diagram

14.29. D-Board (2 of 6) Schematic Diagram

14.30. D-Board (3 of 6) Schematic Diagram

14.31. D-Board (4 of 6) Schematic Diagram

14.32. D-Board (5 of 6) Schematic Diagram

14.33. D-Board (6 of 6) Schematic Diagram

14.34. C1, C2 and C3-Board Block Diagram

14.35. C1-Board (1 of 2) Schematic Diagram

14.36. C1-Board (2 of 2) Schematic Diagram

14.37. C2-Board (1 of 2) Schematic Diagram

14.38. C2-Board (2 of 2) Schematic Diagram

14.39. C3-Board (1 of 2) Schematic Diagram

14.40. C3-Board (2 of 2) Schematic Diagram

14.41. SC, SU and SD-Board Block Diagram

14.42. SC-Board (1 of 3) Schematic Diagram

14.43. SC-Board (2 of 3) Schematic Diagram

14.44. SC-Board (3 of 3) Schematic Diagram

14.45. SU-Board (1 of 2) Schematic Diagram

14.46. SU-Board (2 of 2) Schematic Diagram

14.47. SD-Board (1 of 2) Schematic Diagram

14.48. SD-Board (2 of 2) Schematic Diagram

14.49. SS, S1, SS2 and SS3-Board Block Diagram

14.50. SS-Board (1 of 2) and S1-Board Schematic Diagram

14.51. SS-Board (2 of 2), SS2 and SS3-Board Schematic

Diagram

15 Parts Location

15.1. Exploded View

15.2. Escutcheon part location enlarged view

15.3. Fan part location enlarged view

15.4. Cable relation

15.5. Packing summary

16 Mech anica l Replacement Parts List 17 Repla ceme nt Parts List

17.1. Replacement Parts List Notes

17.2. Electrical Replacement Parts List 92

TH-58PH10UK

93 94 95 96 97 98

99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116

117

119

119 120 120 121 122

123 124

124 125

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1 Applicable signals

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2 Safety Precautions

2.1. General Guidelines

1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.

2. When wiring units (with cables, flexible cables or lead wires)are supplied as repair parts and only one wireor some of the wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

3. When conducting repairs and servicing, do not twist the Faston connectors but plugthem straight in orunplug them straightout.

4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

2.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1Mohm and 5.2Mohm.

When the exposed metal does not have a return path to

the chassis, the reading must be

Figure 1

2.1.2. Leakage Current Hot Check (See Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an

isolation transformer for this check.

2. Connect a 1.5kohm, 10 watts resistor, in parallel with a

0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more

sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the

voltage at each point.

5. Reverse the ACplugintheACoutlet and repeat eachof the

above measurements.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

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3 Prevention of Electrostatic Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ESdevices.(Otherwiseham less motion suchasthebrushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

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4 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb

solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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5 Service Hint

Board Name Function

DN Digital Signal Processor, Microcomputer

D Format Converter, Plasma AI Processor

DS Slot Interface (Audio / Video / Sync Input Switch),

SS Sustain drive SC Scan drive SU Scan out (Upper) SD Scan out (Lower) C1 Data Drive (Lower Right) C2 Data Drive (Lower Center) C3 Data Drive (Lower Left) H3 Speaker terminal

S1 Power switch SS2 Sustain out (Upper) SS3 Sustain out (Lower)

V1 Remote receiver, LED-G, R

V2 Key switch

P Power supply HX PC / RS-232C Input terminal HU Dual Video terminal (BNC / S) HA Component Video terminal (BNC)

Sub-Filed Processor

SYNC Processor, Audio Processor, Speaker Out Amplifier, DC-DC Converter

Note:

Extension cable kit for Slot Board is supplied as service fixtures and tools. (Part No. TZSC07040)

6 Disassembly

· To disassemble P.C.B., wait for 1 minute after power was off for discharge from electrolysis capacitors.

and marks indicate screw positions.

6.1. Removal of Rear Cover

1. Remove screws (×12 , ×24 ) and then remove the Rear Cover.

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6.3. Removal of HA-Board

1. Remove 4 screws (D) and then remove the HA Terminal Block.

2. Remove 4 screws (E).

3. Remove 3 screws (F) and then remove HA-Board.

6.4. Removal of Slot Block

6.2. Removal of HU-Board

1. Remove 4 screws (A) and then remove the HU Terminal Block.

2. Remove 4 screws (B).

3. Remove 3 screws (C) and then remove HU-Board.

1. Disconnect the connectors (DS2, DS4, DS6, DS7, DS8, DS15).

2. Remove the Flexible Cable from the connector (DS1).

3. Remove 4 screws and then remove the Slot Block.

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6.5. Removal of DS-Board

1. Remove the HU Terminal Block. (Refer to Removal of HU-Board)

2. Remove the Slot Block. (Refer to Removal of Slot Block)

3. Disconnect the connector (DS14).

4. The Slot Block is turned inside out.

5. Remove 6 screws and then remove the Slot Cover.

5. Remove 4 Hexagonal-Head screws and 2 screws and then remove HX-Board.

6. Remove 6 screws and then remove DS-Board.

6.6. Removal of HX-Board

1. Remove the HU Terminal Block. (Refer to Removal of HU-Board)

2. Remove the Slot Block. (Refer to Removal of Slot Block)

3. Remove the DS-Board. (Refer to Removal of DS-Board)

4. Remove 2 screws and then remove the Slot Case.

6.7. Removal of DN-Board

1. Disconnect the connectors (DN6, DN31, DN33, DN35).

2. Remove the Flexible Cable from the connector (DN1).

3. Remove 4 screws and then remove DN-Board.

Note:

A re-setup of the destination is performed by MS mode after DN-Board exchange.

6.8. Removal of P-Board

1. Disconnect the connectors (P2, P6, P7, P9, P11, P12, P25).

2. Remove 8 screws and then remove P-Board.

6.9. Removal of D-Board

1. Remove the Slot Block. (Refer to Removal of Slot Block)

2. Disconnect the connectors (D5, D20, D25).

3. Remove the Flexible Cables from the connectors (D31, D32).

4. Remove 4 screws and then remove D-Board.

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3. Remove 3 screws (G) and then remove H3-Board.

6.11. Removal of SU-Board and SDBoard

1. Remove the Flexible Cables from the connectors (SU1,

SU2, SU3, SU4, SD1, SD2, SD3, SD4).

2. Remove 8 screws.

6.10. Removal of H3-Board (L, R)

1. Remove 2 screws and then remove the Speaker Terminal Block (L, R).

3. Disconnect the connectors (SU45, SD46).

4. Slide SU-Board and SD-Board to the left to remove SUBoard and SD-Board from the connectors (SC41, SC42, SC43, SC44).

2. Disconnect the connector (H37).

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6.12. Removal of SC-Board

1. Disconnect the connectors (SU45, SD46, SC2, SC20).

2. Remove 10 screws(

) and then slide SC-Board to the right.

6.13. Removal of SS2-Board and SS3-Board

6.15. Removal of C1, C2 and C3Board

1. Remove the Slot Block.

(Refer to Removal of Slot Block)

2. Remove 8 screws and then remove the Reinforcement

Angle (L, R).

1. Disconnect the connectors (SS23, SS24).

2. Remove the Flexible Cables from the connectors (SS52, SS57).

3. Remove 4 screws and then remove SS2-Board and SS3Board.

6.14. Removal of SS-Board

1. Disconnect the connectors (SS11, SS12, SS23, SS24, SS33, SS34, SS35).

2. Remove the Flexible Cables from the connectors (SS53, SS54, SS55, SS56).

3. Remove 7 screws and then remove SS-Board.

6.15.1. Removal of C1-Board

1. Remove the Flexible Cables from the connectors (C10, C11).

2. Remove 8 screws ( from the connectors (CB1, CB2, CB3, CB4).

3. Remove 6 screws (

) and then remove the Flexible Cables

) and then remove C1-Board.

6.15.2. Removal of C2-Board

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6.15.3. Removal of C3-Board

1. Remove 3 screws and then remove the AC-Inlet Block.

2. Remove the Flexible Cables from the connectors (C20, C21, C22).

3. Remove 8 screws ( from the connectors (CB5, CB6, CB7, CB8).

4. Remove 6 screws (

) and then remove the Flexible Cables

) and then remove C2-Board.

1. Remove 1 screw and then remove the Wire Support.

2. Remove the Flexible Cable from the connector (C32).

3. Disconnect the connectors (C33, C35).

4. Remove 6 screws ( from the connectors (CB9, CB10, CB11).

5. Remove 5 screws (

) and then remove the Flexible Cables

) and then remove C3-Board.

6.16. Removal of S1-Board

1. Remove 2 screws(H)andthen remove theS1-Board Block.

2. Disconnect the connector (S34).

3. Remove 1 screw (J) and then remove S1-Board.

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6.17. Removal of Fan

1. Disconnect the Fan Relay Connectors.

2. Remove 9 screws and then remove the 3 Fan Blocks.

3. Remove each 4 screws (K) and then remove the Fans.

6.18. Removal of V1-Board, V2Board and Operation Button

1. Remove the S1-Board Block.

(Refer to Removal of S1-Board)

2. Disconnect the connectors (DS2, DS15).

3. Remove 8 screws of the Escutcheon.

4. Reassemble the Fans in reverse order.

5. Stick the Cushion (Fan) around the Fan.

Note:

The Cushion of Fan is not re-usable. Please use a new one when Fan exchange.

4. Pull the bottom of the Plasma Panel forward (arrow1).

5. Slide the Plasma Panel and then remove the Plasma Panel

(arrow2).

6. Remove 20 screws and then remove the Fixed Angle (A, B,

C).

7. Remove 1 screw (L).

8. Disconnect the connector (V2) and then remove V1-Board.

9. Remove the Operation Button from V2-Board.

10. Disconnect the connector (V15) and then remove V2-

Board.

6.19. Removal of Escutcheon and Front Glass

1. Remove the S1-Board Block.

(Refer to Removal of S1-Board)

2. Disconnect the connectors (DS2, DS15).

3. Remove 8 screws of the Escutcheon.

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Note: when Front Glass is exchanged

· Along each fixed Angles of an top and bottom, right and left order and the sponge for the Front Glass is pasted to the Front Glass.

4. Pull the bottom of the Plasma Panel forward (arrow1).

5. Slide the Plasma Panel and then remove the Plasma Panel (arrow2).

Note

· The sponges are parts which cannot be recycled. Please use the new article when you exchange the Front Glass.

8. Remove 1 screw (L) and then remove V1-Board.

9. Remove V2-Board and Operation Button.

6. Remove 25 screws and then remove the Fixed Angle (A, B, C, D).

7. Remove the Front Glass.

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6.20. Removal of Plasma Panel

1. Disconnect the Fan Relay Connectors.

2. Remove 9 screws and then remove the 3 Fan Blocks.

3. Remove 8 screws and then remove the Reinforcement Angle (L, R).

9. Remove 3 screws and then remove the Fixed Plate.

4. Disconnect the connectors (DS2, DS4, DS6, DS7, DS8, DS15).

5. Remove the Flexible Cable from the connector (DS1).

6. Remove 4 screws and then remove the Slot Block.

10. Disconnect the connectors (P2, P9, P11, P12, P25).

11. Remove 8 screws (

12. Remove 2 screws ( Terminal Block (L, R).

13. Disconnect the connector (D20).

14. Remove the Flexible Cables from the connectors (C11, C21).

15. Remove 4 screws and then remove D-Board.

) and then remove P-Board.

) and then remove the Speaker

7. Disconnect the connector (DN6).

8. Remove 4 screws and then remove DN-Board.

16. Remove SU-Board and SD-Board. (Refer to Removal of SU-Board and SD-Board)

17. Remove 10 screws and then remove SC-Board.

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24. Remove 3 screws and then remove the AC-Inlet Block.

25. Remove the Flexible Cables from the connectors (C10, C20, C22, C32).

18. Remove SS2-Board and SS3-Board. (Refer to Removal of SS2-Board and SS3-Board)

19. Disconnect the connectors (SS33, SS34, SS35).

20. Remove the Flexible Cables from the connectors (SS53, SS54, SS55, SS56).

21. Remove 7 screws and then remove SS-Board.

22. Remove 2 screws ( ) and then remove the S1-Board Block.

23. Remove 1 screw (

) and then remove the Wire Support.

26. Remove 8 screws of the Escutcheon.

27. Remove the 10 Spacers and Spacer Rings from the Plasma Panel.

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Caution:

· Please confirm the installation place of Spacer and Spacer Ring when you exchange the Plasma Panel, and install Spacer and Spacer Ring in an original installation place after exchanging the Plasma Panel.

28. Lift up the bottom of the Plasma Panel in the direction of the arrow 1 and pull the Plasma Panel in the direction of the arrow 2 and then remove the Plasma Panel.

7 Location of Lead Wiring

7.1. Location of Lead Wiring (1)

The lead wiring is dressed as shown in figure.

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7.2. Location of Lead Wiring (2)

The lead wiring is dressed as shown in figure.

8 Adjustment Procedure

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8.1. Driver Set-up

8.1.1. Item / Preparation

1. Set Aging pattern 0 (Vset adjustment pattern) by IIC mode.

2. Set the picture controls as follows. Picture menu: Standard Picture: +25 Aspect: Full

Caution

1. First perform Vsus adjustment.

2. Confirmation of Vscn voltage should be performed after

confirmation of Vad adjustment. When Vad=-100V, Voltage of Vscn is 45V ±4V.

8.1.2. Adjustments

Adjust driver section voltages. (Refer to the panel data on the panel label).

Check or adjust the following voltages with the multimeter.

Name Test Point Voltage Volume Remarks

Vsus TPVSUS

(SS) Ve TPVE (SS) Ve ± 1V VR6000 (SS) * Vset TPVSET

(SC) Vad TPVAD (SC) -100V ± 1V VR6600 (SC) Vscn TPVSCN

(SC) Vda TPVDA (SS) 75V + 1V, -2V Fixed Vbk TPVBK (SC) 155V ± 1V VR6604 (SC)

*See the Panel label.

Vsus ± 2V VR251 (P) *

320V ± 7V Fixed

Vad + 145V ±4VFixed

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8.2. Initialization Pulse Adjust

1. Set Aging pattern 0 (Vset adjustment pattern) by IIC mode.

2. Set the picture controls as follows. Picture menu: Standard Picture: +25 Aspect: Full

3. Connect Oscilloscope to TPSC1 (T2) and adjust VR6602 for 185±10µ Sec.

Test point Volume Level

T2 TPSC1 (SC) VR6602 (SC) 185 ± 10µ Sec.

8.3. P.C.B. (Printed Circuit Board) exchange

8.3.1. Caution

1. To remove P.C.B., wait 1 minute after power was off for discharge from electrolysis capacitors.

8.3.2. Quick adjustment after P.C.B. exchange

Adjust the following voltages with the multimeter.

P.C.B. Name Test Point Voltage Volume Remarks P Board Vsus TPVSUS (SS) Vsus ± 2V VR251 (P) * SC Board Vad TPVAD (SC) -100V ± 1V VR6600 (SC)

Vbk TPVBK (SC) 155V ± 1V VR6604 (SC) SS Board Ve TPVE (SS) Ve ± 1V VR6000 (SS) * D, DS, DN Board White balance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals DN Board Set Market Select Number to correct destination by MS mode. (See chap. 9.1.4)

*See the Panel label.

Caution:

Absolutely do not reduce Vsus voltage below Ve not to damage the P.C.B.

8.4. Adjustment Volume Location

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8.5. Test Point Location

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9 Service mode

9.1. CAT (computer Aided Test) mode

To exit the CAT mode, access the ID mode and switch off the main power.

9.1.1. IIC mode

Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

Subject and item are mentioned on “IIC mode structure”.

To exit the IIC mode, press the R button on the remote control.

TH-58PH10UK

9.1.2. CD mode

Select the CD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 3 seconds.

Microcomputer software version (IC4702), this version can be upgrade by

1. replace of new version IC

2. Loading the new version software from loader tool, TZSC07036. Memory data change

To exit the CD mode, press the R button on the remote control.

9.1.3. SD mode

Select the SD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

To exit the SD mode, press the R button on the remote control.

TH-58PH10UK

9.1.4. MS mode

Select the MS mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 3 seconds.

To exit the MS mode, press the R button on the remote control.

Caution:

Market Select should be set after exchange of DN-Board.

Destination number

Number Destination Number Destination

0 Japan 16 -1 North America 17 -2 Europe 18 China 3 Others 19 China (Hotel) 4 Britain 20 Russia 5 Taiwan 21 Russia (Hotel) 6 Thailand 22 Hong Kong 7 -- 23 -8 Japan (Hotel) 24 --

9 North America (Hotel) 25 -10 Europe (Hotel) 26 -11 -- 27 -12 Britain (Hotel) 28 Middle East/Hong Kong 13 -- 29 Middle East/Hong Kong (Hotel) 14 Thailand (Hotel) 30 Australia 15 -- 31 Australia (Hotel)

Number Destination

Default setting

1 North America

9.1.5. ID mode

Select the ID mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 3 seconds.

To exit the ID mode, press the R button on the remote control.

9.2. IIC mode structure (following items value is sample data.)

TH-58PH10UK

10 Adjustment

10.1. RGB white balance adjustment

Instrument Name Connection Remarks

· RGB VGA W/B pattern

· Color analyzer

(Minolta CA-100 or equivalent)

Procedure Remarks

· Ensure aging is adequate.

· Make sure the front panel to be used on the final set is fitted.

· Make sure a color signal is not being shown before adjustment.

· Put the color analyzer where there is little color variation.

1. Set COMPONET/RGB-IN SELECT to RGB.

2. Select the IIC mode “PANEL W/B Adj.” item.

3. Check that the color temperature is “COOL (High)”.

4. Output a white balance pattern.

5. Touch the signal receiver of color analyzer to the highlight window’s center.

6. Fix G drive at E0h and adjust B drive and R drive so x, y become the “Color temperature High” in the below table.

7. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

8. Set color temperature to “NORMAL (Medium)”.

9. Fix G drive at E0h and adjust B drive and R drive so the highlight window’s x, y becomes the “Color temperature Medium” in the below table.

10. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

11. Set color temperature to “WARM (Low)”.

12. Set G drive to E0h and adjust B drive and R drive so the highlight window’s x, y become the “Color temperature Low” shown in the below table.

13. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

14. Copy the R drive, G drive and B drive data in NTSC, PAL DVI region.

PC input Panel surface

User setting: Normal (Picture menu: Standard)

Picture Menu: Standard Picture: 25 Aspect: Full Position and size: Normal

· Highlight section Signal amplitude 75%

· Cutoff standard G: 80h

· Drive standard G: E0h

Adjustment target Hi-light: x ± 0.003 y ± 0.003 Hi-light is target of the number at drive adjustment in the hi-light windows. Therefore, it is not target of the hi-light number at after adjustment white balance.

TH-58PH10UK

10.2. HD white balance adjustment

Instrument Name Connection Remarks

· HD W/B pattern (COMPONENT Output)

· Color analyzer

(Minolta CA-100 or equivalent)

Procedure Remarks

· Ensure aging is adequate.

· Make sure the front panel to be used on the final set is fitted.

· Make sure a color signal is not being shown before adjustment.

· Put the color analyzer where there is little color variation.

1. Set COMPONENT/RGB-IN SELECT to COMPONENT.

2. Select the IIC mode "PANEL W/B Adj.” item.

3. Check that the color temperature is “COOL (High)”.

4. Output a white balance pattern.

5. Touch the signal receiver of color analyzer to the highlight window’s center.

6. Fix G drive at E0h and adjust B drive and R drive so x, y become the "Color temperature High" in the below table.

7. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

8. Set color temperature to “NORMAL (Medium)”.

9. Fix G drive at E0h and adjust B drive and R drive so the highlight window´s x, y becomes the "Color temperature Medium" in the below table.

10. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

11. Set color temperature to "WARM (Low)".

12. Set G drive to E0h and adjust B drive and R drive so the highlight window´s x, y become the “Color temperature Low” shown in the below table.

13. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

14. Copy the R drive, G drive and B drive data in YUV1_525ip, YUV3_625ip region.

PC input Panel surface

User setting: Normal (Picture menu: Standard)

Picture Menu: Standard Picture: 25 Aspect: Full Position and size: Normal

· Highlight section Signal amplitude 75%

· Cutoff standard G: 80h

· Drive standard G: E0h

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