Panasonic TH-50PZ750U Service manual

High Definition Plasma Television
A
A
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GP10DHU Chassis
Specifications
PowerSource PowerConsumption
Maximum 705 W Standby condition 0.2 W
Plasma Displaypanel
Drive method Aspect Ratio 16 : 9
isible screen size (W × H × Diagonal) (No. of pixels)
Sound
Audio Output SuperSlim SP (2.5 W) × 2
PC signals VGA, SVGA, XGA, WXGA, SXGA
Channel Capability (Digital/Analog) VHF/UHF: 2 - 69, CATV: 1 - 135 Operating Conditions Temperature: 32 °F - 104 °F (0 °C - 40 °C)
Connection Terminals
INPUT 1-3 VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
COMPONENTVIDEO INPUT 1-2
HDMI 1-3 AUDIO IN TYPE A Connector×3
C 120 V, 60 Hz
C type
50” (Diagonal)
43.5 ” × 24.4 ” × 49.9 ” (1,106 mm × 622 mm × 1,269 mm) 2,073,600 (1,920 (W) × 1,080 (H)) [5,760 × 1,080 dots]
Woofer(13 W) × 2
Horizontal scanning frequency31 - 69 kHz Vertical scanning frequency59 - 86 Hz
Humidity: 20 % - 80 % RH (non-condensing)
S-VIDEO: Mini DIN 4-pin Y: 1.0 V [p-p] (75 ohm) C: 0.286 V [p-p] (75 ohm)
UDIO L-R: RCA PIN Type × 2 0.5 V [rms] Y: 1.0 V [p-p] (including synchronization) PB,PR: ± 0.35 V [p-p]
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
lThis TV supports “HDAVI Control 2” function.
ORDER NO. MTNC070513CE
B34 Canada: B07
© 2007 Matsushita Electric Industrial Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
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A
A
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TH-50PZ750U
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
PC D-SUB 15PIN: R,G,B/0.7 V [p-p] (75 ohm)
HD,VD/1.0 - 5.0 V [p-p] (high impedance)
UDIO L-R: Stereo Mini Jack ( 3.5 mm) × 1
Card slot SD CARD slot × 1 AVPROG. OUT VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
DIGITAL AUDIO OUT PCM/DolbyDigital, FiberOptic
FEATURES 3D Y/C FILTER CLOSED CAPTION
V-Chip Split-Screen BBE VIVA 3D Photo Viewer Movie playe
Dimensions (W × H × D)
Including pedestal 49.9 ” × 33.5 ” × 14.6 ” (1,266 mm × 850 mm × 369 mm) TV Set only 49.9 ” × 31.6 ” × 5.5 ” (1,266 mm × 802 mm × 138 mm)
Mass
Including pedestal 123.5 lb. (56 kg) TV Set only 105.9 lb. (48 kg)
Note:
·
· Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.
· ·
HDAVI Control 2
CONTENTS
Page Page
1 Applicable signals 5 2 Safety Precautions
2.1. General Guidelines
3 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 4 About lead free solder (PbF) 5 Service Hint 6 Plasma panel replacement method
6.1. Remove the Back cover
6.2. Remove the fan
6.3. Remove the rear terminal cover
6.4. Remove the P-Board
6.5. Remove the tuner unit
6.6. Remove the DG-Board
6.7. Remove the H-Board
6.8. Remove the speaker box assy (left, right)
6.9. Remove the JG-Board
6.10. Remove the PB-Board
6.11. Remove the D-Board
6.12. Remove the SU-Board
6.13. Remove the SD-Board
6.14. Remove the SC-Board
6.15. Remove the SS-Board
6.16. Remove the stand brackets
6.17. Remove the C1-Board
6.18. Remove the C2-Board
10
10 10 10 10 12 12 12 13 13 13 14 14 14 15 15 15 16 16
6
6
7 8 9
6.19. Remove the C3-Board
6.20. Remove the C4-Board
6.21. Remove the C5-Board
6.22. Remove the C6-Board
6.23. Remove the front bracket
6.24. Remove the G-Board
6.25. Remove the GS-Board
6.26. Remove the S-Board
6.27. Remove the K-Board
6.28. Remove the Plasma panel section from the Cabinet assy (glass)
6.29. Remove the squawker speaker
6.30. Replace the plasma panel (finished)
7 Caution statement
7.1. Caution statement.
8 Location of Lead Wiring
8.1. Lead of Wiring (1)
8.2. Lead of Wiring (2)
8.3. Lead of Wiring (3)
8.4. Lead of Wiring (4)
8.5. Lead of Wiring (5)
8.6. Lead of Wiring (6)
8.7. Lead of Wiring (7)
9 Self-check Function
9.1. Check of the IIC bus lines
9.2. Power LED Blinking timing chart
16 16 16 17 17 17 17 18 18
18 19 19
20
20
21
21 22 23 24 25 26 27
28
28 29
2
9.3. No Power 30
9.4. No Picture
9.5. Local screen failure
10 Service Mode
10.1. How to enter into Service Mode
10.2. Service tool mode
11 Adjustment Procedure
11.1. Driver Set-up
11.2. Initialization Pulse Adjust
11.3. P.C.B. (Printed Circuit Board) exchange
11.4. Adjustment Volume Location
11.5. Test Point Location
12 White Balance Adjustment
12.1. White balance adjustment
13 Hotel mode 14 Conductor Views
14.1. P(MULTI)-Board
14.2. P(SUS)-Board
14.3. G-Board
14.4. GH and GS-Board
14.5. K, PB and S-Board
14.6. H-Board
14.7. JG-Board
14.8. DG-Board
14.9. D-Board
14.10. C1-Board
14.11. C2-Board
14.12. C3-Board
14.13. C4-Board
14.14. C5-Board
14.15. C6-Board
14.16. SC-Board
14.17. SU-Board
14.18. SD-Board
14.19. SS-Board
15 Sche matic and Block Diagr am
15.1. Schematic Diagram Note
15.2. Main Block Diagram
15.3. P-Board (1 of 2) Block Diagram
15.4. P-Board (2 of 2) Block Diagram
15.5. P-Board (1 of 2) Schematic Diagram
15.6. P-Board (2 of 2) Schematic Diagram
15.7. PB-Board Block and Schematic Diagram
15.8. G, K and S-Board Block and Schematic Diagram
15.9. GH-Board Block and Schematic Diagram
15.10. GS-Board Block Diagram
15.11. GS-Board Schematic Diagram
15.12. H-Board (1 of 2) Block Diagram
15.13. H-Board (2 of 2) Block Diagram
15.14. H-Board (1 of 3) Schematic Diagram
15.15. H-Board (2 of 3) Schematic Diagram
15.16. H-Board (3 of 3) Schematic Diagram
15.17. JG-Board Block Diagram
15.18. JG-Board (1 of 5) Schematic Diagram
31 32
33
33 35
36
36 37 37 38 38
39
39
41 43
43 46 49 50 51 52 55 57 60 62 63 64 65 66 67 68 71 72 73
77
77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94
15.19. JG-Board (2 of 5) Schematic Diagram
15.20. JG-Board (3 of 5) Schematic Diagram
15.21. JG-Board (4 of 5) Schematic Diagram
15.22. JG-Board (5 of 5) Schematic Diagram
15.23. DG-Board (1 of 4) Block Diagram
15.24. DG-Board (2 of 4) Block Diagram
15.25. DG-Board (3 of 4) Block Diagram
15.26. DG-Board (4 of 4) Block Diagram
15.27. DG-Board (1 of 15) Schematic Diagram
15.28. DG-Board (2 of 15) Schematic Diagram
15.29. DG-Board (3 of 15) Schematic Diagram
15.30. DG-Board (4 of 15) Schematic Diagram
15.31. DG-Board (5 of 15) Schematic Diagram
15.32. DG-Board (6 of 15) Schematic Diagram
15.33. DG-Board (7 of 15) Schematic Diagram
15.34. DG-Board (8 of 15) Schematic Diagram
15.35. DG-Board (9 of 15) Schematic Diagram
15.36. DG-Board (10 of 15) Schematic Diagram
15.37. DG-Board (11 of 15) Schematic Diagram
15.38. DG-Board (12 of 15) Schematic Diagram
15.39. DG-Board (13 of 15) Schematic Diagram
15.40. DG-Board (14 of 15) Schematic Diagram
15.41. DG-Board (15 of 15) Schematic Diagram
15.42. D-Board (1 of 2) Block Diagram
15.43. D-Board (2 of 2) Block Diagram
15.44. D-Board (1 of 8) Schematic Diagram
15.45. D-Board (2 of 8) Schematic Diagram
15.46. D-Board (3 of 8) Schematic Diagram
15.47. D-Board (4 of 8) Schematic Diagram
15.48. D-Board (5 of 8) Schematic Diagram
15.49. D-Board (6 of 8) Schematic Diagram
15.50. D-Board (7 of 8) Schematic Diagram
15.51. D-Board (8 of 8) Schematic Diagram
15.52. C1, C2, C5 and C6 Block Diagram
15.53. C2, C3, C4 and C5-Board Block Diagram
15.54. C1-Board (1 of 2) Schematic Diagram
15.55. C1-Board (2 of 2) Schematic Diagram
15.56. C2-Board (1 of 2) Schematic Diagram
15.57. C2-Board (2 of 2) Schematic Diagram
15.58. C3-Board (1 of 2) Schematic Diagram
15.59. C3-Board (2 of 2) Schematic Diagram
15.60. C4-Board (1 of 2) Schematic Diagram
15.61. C4-Board (2 of 2) Schematic Diagram
15.62. C5-Board (1 of 2) Schematic Diagram
15.63. C5-Board (2 of 2) Schematic Diagram
15.64. C6-Board (1 of 2) Schematic Diagram
15.65. C6-Board (2 of 2) Schematic Diagram
15.66. SC-Board Block Diagram
15.67. SC-Board (1 of 2) Schematic Diagram
15.68. SC-Board (2 of 2) Schematic Diagram
15.69. SU and SD-Board Block Diagram
15.70. SU-Board (1 of 3) Schematic Diagram
15.71. SU-Board (2 of 3) Schematic Diagram
15.72. SU-Board (3 of 3) Schematic Diagram
TH-50PZ750U
95 96 97 98
99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148
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15.73. SD-Board (1 of 3) Schematic Diagram 149
15.74. SD-Board (2 of 3) Schematic Diagram
15.75. SD-Board (3 of 3) Schematic Diagram
15.76. SS-Board Block Diagram
15.77. SS-Board Schematic Diagram
16 Explo ded Views & Replacement Parts List
16.1. Exploded Views
150 151 152 153
155
155
16.2. Packing Exploded Views (Accessories)
16.3. Packing Exploded Views (Stand)
16.4. Replacement Parts List Notes
16.5. Mechanical Replacement Parts List (PDP TV)
16.6. Mechanical Replacement Parts List (Stand)
16.7. Electrical Replacement Parts List
156 157 158 159 160 161
4
1 Applicable signals
TH-50PZ750U
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2 Safety Precautions
2.1. General Guidelines
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires)are supplied as repair parts and only one wireor some of the wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Faston connectors but plugthem straight in orunplug them straightout.
4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1Mohm and 5.2Mohm.
When the exposed metal does not have a return path to
the chassis, the reading must be
Figure 1
.
2.1.2. Leakage Current Hot Check (See Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kohm, 10 watts resistor, in parallel with a
0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the ACplugintheACoutlet and repeat eachof the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.
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TH-50PZ750U
3 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ESdevices.(Otherwiseham less motion suchasthebrushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).
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TH-50PZ750U
4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
· ·
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
· ·
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
· ·
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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5 Service Hint
Remove the Rear Cover
TH-50PZ750U
Board Name Function Board Name Function
P Power Supply D Format Converter, Plasma AI, Sub-Field Processor
PB Fan control C1 Data Driver (Upper Right)
H Speaker out, Sound Processor
AV Terminal, AV Switch
DG DC-DC Converter
Digital Signal Processor, Microcomputer HDMI Interface, Peaks Lite 2, Full HD
JG H264 Decoder SC Scan Drive
G Front terminal, Key Switch SU Scan out (Upper) K Remote receiver, Power LED SD Scan out (Lower) S Power Switch SS Sustain Drive
GS SD Card Slot GH HDMI3 in
C2 Data Driver (Upper Center) C3 Data Driver (Upper Left) C4 Data Driver (Lower Left) C5 Data Driver (Lower Center) C6 Data Driver (Lower Right)
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TH-50PZ750U
6 Plasma panel replacement method
6.1. Remove the Back cover
1. See Service Hint. (Section 5)
6.2. Remove the fan
1. Disconnect the relay connectors.
2. Remove the screws (×3
each) and remove the fan unit.
6.3. Remove the rear terminal cover
6.4. Remove the P-Board
Caution:
To remove P.C.B. wait 1 minute after power was off for discharge from electrolysis capacitors.
1. Unlock the cable clampers to free the cable.
2. Disconnect the connectors (P2, P5, P9, P10, P11,P12, P23 and P25).
3. Remove the screws (×7
) and remove the P-Board unit.
1. Remove the screws (×10 ,×5 ,×2 ,×2 ).
2. Remove the rear terminal cover.
4. Remove the screws (×28 ) on the back side.
5. Disconnect the connectors (CN06-CN02, CN08-CN1602 and CN1702-CN1601).
6. Remove the screws (×10
).
10
7. Remove the molding props (×8 ).
8. Remove the P(Multi)-Board.
9. Remove the molding props (×5
10. Remove the P(Sus)-Board.
TH-50PZ750U
).
Note:
When assembling the P(Multi)-Board and the P(Sus)­Board, the position of each hole of the insulation sheets(A, B, C, D, E) is set to the position of each hole of the P(Multi)­Board and the P(Sus)-Board and then assemble them. ( marks indicate setting positions.)
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TH-50PZ750U
6.5. Remove the tuner unit
1. Unlock the cable clampers to free the cable.
2. Disconnect the connectors (DG1, DG5, DG8, DG9, DG35, DG52, H5, H8, H10, H11, H12, H30 and H51).
3. Disconnect the flexible cable (DG11).
4. Remove the screws (×4
) and remove the tuner unit.
6.7. Remove the H-Board
1. Remove the tuner unit. (See section 6.5.)
2. Disconnect the flexible cable (H3).
3. Disconnect the connector (DG2).
4. Remove the screws (×6
) and remove the H-Board.
6.6. Remove the DG-Board
1. Remove the tuner unit. (See section 6.5.)
2. Disconnect the flexible cable (DG3).
3. Disconnect the connector (DG2).
4. Remove the screws (×6
) and remove the DG-Board.
5. Remove the screw (×1 ) and remove the tuner mounting metal.
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6.8. Remove the speaker box assy (left, right)
1. Unlock the cable clampers to free the cable.
2. Disconnect the relay connectors.
3. Remove the screw (×1
assy (left, right).
) and remove the speaker box
TH-50PZ750U
6.10. Remove the PB-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the connectors (PB30, PB31, PB32, and PB37).
3. Remove the screw (×1
) and remove the PB-Board.
6.9. Remove the JG-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the connectors (JG08, JG09, JG10 and JG19).
3. Remove the screw (×4
) and remove the JG-Board.
4. Remove the screw (×4 ) and remove the PB-Board bracket.
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6.11. Remove the D-Board
1. Remove the PB-Board unit. (See section 6.10.)
2. Disconnect the connectors (D3, D5, D20 and D25).
3. Disconnect the flexible cables (D31, D32, D33, D34, D35 and D36).
4. Remove the screws (×4
) and remove the D-Board.
6.13. Remove the SD-Board
1. Remove the screws (×2 ).
2. Remove the flexible cables (SD1, SD2, SD3,SD4 and SD5) connected to the SD-Board and remove the connector (SC46-SD46).
3. Slide the SD-Board to the left to disconnect from connectors (SC43-SD43 and SC44-SD44) on the SC-Board and remove the SD-Board.
6.12. Remove the SU-Board
1. Remove the screws (×2 ).
2. Remove the flexible cables (SU1, SU2, SU3,SU4 and SU5) connected to the SU-Board and remove the connectors (SC45-SU45).
3. Slide the SU-Board to the left to disconnect from connectors (SC41-SU41 and SC42-SU42) on the SC-Board and remove the SU-Board.
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6.14. Remove the SC-Board
1. Unlock the cable clampers to free the cable.
2. Remove the SU-Board and SD-Board. (See section 6.12. and 6.13.)
3. Unlock the cable clampers to free the cable.
4. Disconnect the connectors (SC2, SC20 and SC23).
5. Remove the screws (×9
) and remove the SC-Board.
TH-50PZ750U
6.16. Remove the stand brackets
6.15. Remove the SS-Board
1. Disconnect the connectors (SS11, SS12, SS35, SS42 and SS44).
2. Remove a short-jumper connector SS34 and re-use for new SS-Board.
3. Disconnect the flexible cables (SS51, SS52, SS53, SS54, SS55 and SS56).
4. Remove the screws (×7
) and remove the SS-Board.
1. Remove the plasma panel section from the servicing stand and lay on a flat surface such as a table (covered) with the plasma panel surface facing downward.
2. Remove the stand brackets (left, right)fastening screws (×5
each) and remove the stand brackets (left, right).
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6.17. Remove the C1-Board
1. Remove the fans. (See section 6.2.)
2. Remove the flexible cables holder fastening screws (×10 ).
3. Disconnect the flexible cables (CA1, CA2, CA3, CA4, and
CA5).
4. Disconnect the flexible cables (C10 and C11).
5. Remove the screws (×5
) and remove the C1-Board.
6.18. Remove the C2-Board
1. Remove the fans. (See section 6.2.)
2. Remove the flexible cables holder fastening screws (×10 ).
3. Disconnect the flexible cables (CA6, CA7, CA8, CA9 and
CA10).
4. Disconnect the flexible cables (C21, C22, C24 and C25).
5. Remove the screws (×5
) and remove the C2-Board.
6.20. Remove the C4-Board
1. Remove the speaker box assy left. (See section 6.8.)
2. Remove the stand bracket left. (See section 6.16.)
3. Remove the flexible cables holder fastening screws (×10 ).
4. Disconnect the flexible cables (CB11, CB12, CB13, CB14
and CB15).
5. Disconnect the flexible cable (C41).
6. Disconnect the connectors (C42 and C44).
7. Remove the screws (×5
) and remove the C4-Board.
6.19. Remove the C3-Board
1. Remove the fans. (See section 6.2.)
2. Remove the flexible cables holder fastening screws (×10 ).
3. Disconnect the flexible cables (CA11, CA12, CA13, CA14
and CA15).
4. Disconnect the flexible cable (C31).
5. Disconnect the connector (C35).
6. Remove the screws (×5
) and remove the C3-Board.
6.21. Remove the C5-Board
1. Remove the tuner unit. (See section 6.5.)
2. Remove the flexible cables holder fastening screws (×10 ).
3. Disconnect the flexible cables (CB6, CB7, CB8, CB9 and
CB10).
4. Disconnect the flexible cables (C51, C52, C54 and C55).
5. Remove the screws (×5
16
) and remove the C5-Board.
6.22. Remove the C6-Board
1. Remove the speaker box assy right. (See section 6.8.)
2. Remove the stand bracket right. (See section 6.16.)
3. Remove the flexible cables holder fastening screws (×10 ).
4. Disconnect the flexible cables (CB1, CB2, CB3, CB4 and
CB5).
5. Disconnect the flexible cables (C60 and C61).
6. Remove the screws (×5
) and remove the C6-Board.
6.25. Remove the GS-Board
1. Remove the stand bracket right. (See section 6.16.)
2. Unlock the cable clampers to free the cable.
3. Remove the screws (×2
4. Remove the SD card unit.
).
TH-50PZ750U
6.23. Remove the front bracket
1. Unlock the cable clampers to free the cable.
2. Disconnect the connector (G51).
3. Disconnect the flexible cable (GH11).
4. Remove the screws (×3
) and remove the front bracket.
6.24. Remove the G-Board
1. Remove the front bracket. (See section 6.23.)
2. Remove the screws (×3
3. Remove the front shield case cover.
).
5. Disconnect the connector (GS52).
6. Remove the screw (×1
7. Remove the GS-Board.
).
4. Remove the screws (×4 ).
5. Remove the G-Board and GH-Board.
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6.26. Remove the S-Board
1. Remove the speaker box assy left. (See section 6.9.)
2. Remove the screws (×2
3. Disconnect the connector (S2).
4. Remove the screws (×2
) and remove the S-Board unit.
) and remove the S-Board.
6.28. Remove the Plasma panel section from the Cabinet assy (glass)
1. Remove the stand brackets (left, right) fastening screw (×1
each).
2. Remove the cabinet assy and the plasma panel fastening
screws (×13
).
6.27. Remove the K-Board
1. Remove the speaker box assy left. (See section 6.9.)
2. Remove the S-Board. (See section 6.26.)
3. Unlock the cable clampers to free the cable.
4. Remove the screws (×2
5. Disconnect the connectors (K1 and K2) and remove the K­Board.
).
3. For leaving the plasma panel from the cabinet assy, pull the bottom of the front frame forward, lift, and remove.
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6.29. Remove the squawker speaker
1. Remove the cabinet assy. (See section 6.28.)
2. Disconnect the relay connectors.
3. Remove the screws (×12
4. Remove the glass holders (left, right).
).
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6.30. Replace the plasma panel (finished)
1. Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel surface facing downward.
2. Attach the C1, C2, C3,C4,C5-Board and the C6-Board,
connect the flexible cables (×30) from the Plasma panel to the C1, C2, C3,C4,C5-Board and the C6-Board, and fit the flexible cable holders.
3. Attach the Hooks (left, right) and fit the Reinforcement
Angles (L, R) and the Connection Plate (A, B, C, D) to the new plasma panel.
4. Place the plasma panel section on the servicing stand.
5. Attach the cabinet assy and each P.C.Board and so on, to
the new plasma panel.
* When fitting the cabinet assy, be careful not to allow any debris, dust or handling residue to remain between the front glass and plasma panel.
5. Remove the screws (×2 ).
6. Remove the squawker speaker.
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7 Caution statement
7.1. Caution statement.
Caution:
Please confirm that all flexible cables are assembled correctly. Also make sure that they are locked in the connectors. Verify by giving the flexible cables a very slight pull.
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8 Location of Lead Wiring
8.1. Lead of Wiring (1)
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8.2. Lead of Wiring (2)
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8.3. Lead of Wiring (3)
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8.4. Lead of Wiring (4)
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8.5. Lead of Wiring (5)
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8.6. Lead of Wiring (6)
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8.7. Lead of Wiring (7)
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9 Self-check Function
Use the self-check function to test the unit.
1. Checking the IIC bus lines
2. Power LED Blinking timing
9.1. Check of the IIC bus lines
9.1.1. How to access
Self-check indication only: Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [OK] button on the remote control
for more than 3 seconds. Self-check indication and forced to factory shipment setting: Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote
control for more than 3 seconds.
9.1.2. Exit
Disconnect the AC cord from wall outlet.
9.1.3. Screen display
9.1.4. Check Point
Confirm the following parts if NG was displayed.
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9.2. Power LED Blinking timing chart
1. Subject Information of LED Flashing timing chart.
2. Contents When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.
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9.3. No Power
First check point
There are following 2 states of No Power indication by power LED.
1. No lit
2. Red is lit then turns red blinking a few seconds later. (See 9.2.)
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