Panasonic TH-50PH9UK Service manual

ORDER NO. MTNC060689CE

D10 Canada: B07

High Definition Plasma Display

TH-50PH9UK

GPH9D Chassis

Specifications

Power Source 120 VAC, 50/60Hz Power Consumption

Maximum 460 W Stand-bycondition Save OFF 0.5 W, Save ON 0.3 W Power off condition 0.1W

Plasma Displaypanel Drive method:AC type 50-inch,

16:9 aspect ratio

Contrast Ratio Max10000:1

Screen size 43.5” (1,106 mm) (W) × 24.5” (622 mm) (H) × 50” (1,269 mm) (diagonal)

(No. of pixels) 1,049,088 (1,366 (W) × 768 (H) [4,098 × 768 dots]

Operating condition

Temperature 32 °F - 104 °F (0 °C - 40 °C) Humidit

Applicablesignals

Color System NTSC, PAL, PAL60, SECAM, Modified NTSC Scanning format 525 (480) / 60i 60p, 625 (575)/50i 50p, 750 (720)/60p 50p, 1125 (1080) / 60i 50i 24p 25p

PC signals VGA, SVGA, XGA,

Connection terminals

V VIDEO IN / OUT (BNC) 1.0 Vp-p (75-ohm or high impedance)

COMPONENT / RGB

PC (HIGH-DENSITYMini-D-SUB 15PIN) R,G,B/0.7 Vp-p (75-ohm)

20 % - 80 %

30p 24sF .... SMPTE274M, 1250 (1080) / 50i

SXGA, UXGA..... (compressed)

Horizontal scanning frequency 15 - 110 kHz Vertical scanning frequency 48 - 120 Hz

S VIDEO IN (MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)

UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)

/ G (BNC) 1.0 Vp-p/composite (75-ohm)

0.7 Vp-p/non-composite (75-ohm)

PB/B (BNC), PR/R (BNC) 0.7 Vp-p (75-ohm)

UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)

TH-50PH9UK

HD, VD/1.0 - 5.0 Vp-p (high impedance) Component Y: 1.0 Vp-p (75-ohm : include sync) PB/CB: 0.7 Vp-p (75-ohm) P

CR: 0.7 Vp-p (75-ohm)

UDIO IN (M3 JACK) 0.5 Vrms (high impedance) SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE SPEAKERS (6Ω) 16 W [8 W + 8 W] (10 % THD)

Accessories Supplied

Remote Control Transmitter EUR7636070R Batteries 2×AASize Fixing bands (TMME203 or TMME187) × 2

Dimensions (W×H×D) 47.6” (1,210 mm) × 28.5” (724 mm) × 3.7” (95 mm) Mass (weight)

main unit onl with speakers approx. 90.4 lbs

approx. 81.6 lbs

Notes:

· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

· This equipment complies with the EMC standards listed below. EN55022, EN55024, EN61000-3-2, EN61000-3-3. (EK/ES/BK/BS)

CONTENTS

Page Page

1 Applicable signals 4 2 Safety Precautions

2.1. General Guidelines

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 4 About lead free solder (PbF) 5 Service Hint 6 Disassembly

6.1. Removal of the Back Cover

6.2. Removal of the HU-Board

6.3. Removal of the HA-Board

6.4. Removal of the Slot Block

6.5. Removal of the J-Board

6.6. Removal of the HX-Board

6.7. Removal of the PB-Board

6.8. Removal of the DA-Board

6.9. Removal of the P-Board

6.10. Removal of the D-Board

6.11. Removal of the H3-Board (L, R)

6.12. Removal of the SU-Board and the SD-Board

6.13. Removal of the SC-Board

6.14. Removal of the SS2-Board and the SS3-Board

6.15. Removal of the SS-Board

6.16. Removal of the C1, C2, C3, C4, C5 and the C6-Board

6.17. Removal of the S1-Board

10 10 10 11 11 12 12 12 13 13 13 13 15

6 7 8 9

9 9 9 9

6.18. Removal of the Fan

6.19. Removal of the Escutcheon

6.20. Removal of the V1-Board and the V2-Board

6.21. Removal of the Plasma Panel

7 Location of Lead Wiring

7.1. Location of Lead Wiring (1)

7.2. Location of Lead Wiring (2)

7.3. Location of Lead Wiring (3)

7.4. Location of Lead Wiring (4)

8 Adjustment Procedure

8.1. Driver Set-up

8.2. Initialization Pulse Adjust

8.3. P.C.B. (Printed Circuit Board) Remove

8.4. Adjustment Volume Location

8.5. Test Point Location

9 Service mode

9.1. CAT (computer Aided Test) mode

9.2. IIC mode structure (following items value is sample data.)

10 Adjustment

10.1. RGB white balance adjustment

10.2. HD white balance adjustment

10.3. Power control adjustment

11 Trouble shooting guide

11.1. Self Check

15 16 16 17

20 21 22 22

23 24 24 25 25

30 32 34

11.2. No Power 37

11.3. No Picture

11.4. Local screen failure

12 Option Setting 13 Conductor Views

13.1. P-Board

13.2. PB-Board

13.3. HA-Board

13.4. HU-Board

13.5. HX-Board

13.6. H3, S1, V1 and V2-Board

13.7. J-Board

13.8. DA-Board

13.9. D-Board

13.10. C1-Board

13.11. C2-Board

13.12. C3-Board

13.13. C4-Board

13.14. C5-Board

13.15. C6-Board

13.16. SC-Board

13.17. SU-Board

13.18. SD-Board

13.19. SS-Board

13.20. SS2 and SS3-Board

14 Block and Schematic Diagram

14.1. Schematic Diagram Notes

14.2. Main Block Diagram

14.3. P-Board Block Diagram

14.4. P-Board (1 of 2) Schematic Diagram

14.5. P-Board (2 of 2) Schematic Diagram

14.6. PB-Board Block and Schematic Diagram

14.7. HA-Board Block and Schematic Diagram

14.8. HU-Board Block Diagram

14.9. HU-Board (1 of 2) Schematic Diagram

14.10. HU-Board (2 of 2) Schematic Diagram

14.11. HX-Board Block and Schematic Diagram

14.12. V1 and V2-Board Block and Schematic Diagram

14.13. J-Board (1 of 2) Block Diagram

14.14. J-Board (2 of 2) Block Diagram

14.15. J-Board (1 of 5) and H3-Board Schematic Diagram

14.16. J-Board (2 of 5) Schematic Diagram

14.17. J-Board (3 of 5) Schematic Diagram

14.18. J-Board (4 of 5) Schematic Diagram

14.19. J-Board (5 of 5) Schematic Diagram

14.20. DA-Board (1 of 2) Block Diagram

14.21. DA-Board (2 of 2) Block Diagram

14.22. DA-Board (1 of 6) Schematic Diagram

14.23. DA-Board (2 of 6) Schematic Diagram 37 38

39 41

41 44 45 46 47 48 49 51 53 55 56 57 58 59 60 61 64 65 66 68

69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90

14.24. DA-Board (3 of 6) Schematic Diagram

14.25. DA-Board (4 of 6) Schematic Diagram

14.26. DA-Board (5 of 6) Schematic Diagram

14.27. DA-Board (6 of 6) Schematic Diagram

14.28. D-Board (1 of 2) Block Diagram

14.29. D-Board (2 of 2) Block Diagram

14.30. D-Board (1 of 8) Schematic Diagram

14.31. D-Board (2 of 8) Schematic Diagram

14.32. D-Board (3 of 8) Schematic Diagram

14.33. D-Board (4 of 8) Schematic Diagram

14.34. D-Board (5 of 8) Schematic Diagram

14.35. D-Board (6 of 8) Schematic Diagram

14.36. D-Board (7 of 8) Schematic Diagram

14.37. D-Board (8 of 8) Schematic Diagram

14.38. C1, C2, C5 and C6-Board Block Diagram

14.39. C3, C4, SS, S1, SS2 and SS3-Board Block Diagram

14.40. C1-Board (1 of 2) Schematic Diagram

14.41. C1-Board (2 of 2) Schematic Diagram

14.42. C2-Board (1 of 3) Schematic Diagram

14.43. C2-Board (2 of 3) Schematic Diagram

14.44. C2-Board (3 of 3) Schematic Diagram

14.45. C3-Board (1 of 2) Schematic Diagram

14.46. C3-Board (2 of 2) Schematic Diagram

14.47. C4-Board (1 of 2) Schematic Diagram

14.48. C4-Board (2 of 2) Schematic Diagram

14.49. C5-Board (1 of 3) Schematic Diagram

14.50. C5-Board (2 of 3) Schematic Diagram

14.51. C5-Board (3 of 3) Schematic Diagram

14.52. C6-Board (1 of 2) Schematic Diagram

14.53. C6-Board (2 of 2) Schematic Diagram

14.54. SS, S1, SS2 and SS3-Board Schematic Diagram

14.55. SC, SU and SD-Board Block Diagram

14.56. SC-Board (1 of 2) Schematic Diagram

14.57. SC-Board (2 of 2) Schematic Diagram

14.58. SU-Board (1 of 2) Schematic Diagram

14.59. SU-Board (2 of 2) Schematic Diagram

14.60. SD-Board (1 of 2) Schematic Diagram

14.61. SD-Board (2 of 2) Schematic Diagram

15 Parts Location

15.1. Exploded View

15.2. Fan part location enlarged views

15.3. Cable relation

15.4. Packing summary

16 Mechanica l Replacement Parts List 17 Replacement Parts List

17.1. Replacement Parts List Notes

17.2. Electrical Replacement Parts List

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91 92 93 94 95 96 97 98

99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129

131

131 132 133 134

135 136

136 137

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1 Applicable signals

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2 Safety Precautions

2.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

2.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1MΩ and 5.2MΩ.

When the exposed metal does not have a return path to

the chassis, the reading must be

Figure 1

2.1.2. Leakage Current Hot Check (See

Figure 1 .)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1 .

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outsideof the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

TH-50PH9UK

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistorsand semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, whichshould be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder Remove device. Some solder Remove devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient todamage an ES device).

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4 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

Caution

· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb

solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also beused.

stamped on the back of PCB.

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5 Service Hint

Board Name Function

DA Digital Signal Processor, Micon

D Format Converter, Plasma Ai Processor

J Slot Interface (Audio / Video / Sync inputSwitch), SYNC processor,

SS Sustain drive SC Scan drive SU Scan out (Upper) SD Scan out (Lower) C1 Data Drive (Upper Right) C2 Data Drive (Upper Center) C3 Data Drive (Upper Left) C4 Data Drive (Lower Left) C5 Data Drive (Lower Center) C6 Data Drive (Lower Right) H3 Speaker terminal

S1 Power switch SS2 Sustain out (Upper) SS3 Sustain out (Lower)

V1 Remote receiver, LED-G, R

V2 Key switch

PB Fan control

P Power supply HX PC / RS-232C Input terminal HU Dual Video terminal (BNC / S) HA Component Video terminal (BNC)

Sub-Filed Processor

Sound processor

Note:

Extension cable kit for Slot Board is supplied as service fixtures and tools. (Part No. TZSC07040)

6 Disassembly

· To disassemble P.C.B., wait for 1 minute after power was off for discharge from electrolysis capacitors.

and marks indicate screw positions.

6.1. Removal of the Back Cover

1. Remove the screws (×18 ,×6 ,×4 ) and then remove the Back Cover.

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6.3. Removal of the HA-Board

1. Remove the 4 screws(D) and then remove the HA Terminal Block.

2. Remove the 4 screws(E).

3. Remove the 3 screws(F) and then remove the HA-Board.

6.4. Removal of the Slot Block

6.2. Removal of the HU-Board

1. Remove the 4 screws(A) and then remove the HU Terminal Block.

2. Remove the 4 screws(B).

3. Remove the 3 screws(C) and then remove the HU-Board.

1. Disconnect the couplers (J1, J2, J3, J4, J5, J6, J7, J8, J10, J15, J30).

2. Remove the 4 screws and then remove the Slot Block.

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6.5. Removal of the J-Board

1. Remove the HU Terminal Block and the HATerminal Block. (Reference to Removal of the HU-Board and the HA-

Board)

2. Remove the Slot Block. (Reference to Removal of the Slot Block)

3. The Slot Block is turned inside out.

4. Remove the 6 screws and then remove the Slot cover.

5. Remove the 6 screws.

6. Release the coupler(J14) from HX-Board and then remove the J-Board.

5. Remove the 4 Hexagonal-Head screws and the 1 screw and then remove the HX-Board.

6.6. Removal of the HX-Board

1. Remove the HU Terminal Block and the HATerminal Block. (Reference to Removal of the HU-Board and the HA-Board)

2. Remove the Slot Block. (Reference to Removal of the Slot Block)

3. Remove the J-Board. (Reference to Removal of the J-Board)

4. Remove the 2 screws and then remove the Slot Case.

6.7. Removal of the PB-Board

1. Disconnect the couplers(PB30, PB31, PB33, PB35).

2. Remove the 1 screw and then remove the PB-Board.

6.8. Removal of the DA-Board

1. Disconnect the couplers(PB30, PB31, PB33, PB35).

2. Remove the 2 screws and then remove the PB-Board Block.

3. Disconnect the couplers(DA1, DA3, DA5, DA6).

4. Remove the Flexible Cable from the coupler(DA2).

5. Remove the 2 screws and then remove the DA-Board and Fixed Plate.

3. Remove the 11 screws (Bottom view).

4. Remove the 5 screws ( ). Remove the P-Board from the 8 molding props (

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Note:

A re-setup of the destination is performed by MS mode after DA-Board exchange.

6.9. Removal of the P-Board

1. Disconnect the couplers(P2, P5, P9, P10, P11, P12, P23, P25).

2. Remove the 6 screws and then remove the P-Board.

Note:

· When assembling the P-Board, the position of each hole of the insulation sheets(A, B) are set to the position of each hole of the P-Board and then assemble them. (

marks indicate setting positions.)

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6.10. Removal of the D-Board

1. Remove the Slot Block. (Reference to Removal of the Slot Block)

2. Disconnect the couplers(D5, D20)

3. Remove the Flexible Cable from the couplers (D3, D31, D32, D33, D34).

4. Remove the 4 screws and then remove the D-Board.

6.12. Removal of the SU-Board and the SD-Board

1. Remove the Speaker Terminal Block(R).

(Reference to Removal of the H3-Board(L, R))

2. Remove the Flexible Cable from the couplers(SU1, SU2,

SU3, SU4, SD1, SD2, SD3, SD4).

3. Remove the 6 screws.

6.11. Removal of the H3-Board (L, R)

1. Remove 1 screw each and then remove the Speaker

Terminal Block (L, R).

2. Disconnect the coupler(H37).

3. Remove the 3 screws (F) and then remove the H3-Board.

4. Disconnect the couplers(SU45, SD46).

5. Slide the SU-Board and the SD-Board to the left, remove the SU-Board and the SD-Board from the couplers(SC41, SC42).

6.13. Removal of the SC-Board

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6.15. Removal of the SS-Board

1. Disconnect the couplers(SU45, SD46).

2. Disconnect the couplers(SC2, SC20, SC23).

3. Remove the 9 screws ( the right.

) and then slide the SC-Board to

6.14. Removal of the SS2-Board and

the SS3-Board

1. Disconnect the coupler(SS23).

2. Disconnect the Flexible Cable(SS55).

3. Disconnect the coupler(SS22).

4. Disconnect the Flexible Cable(SS56).

5. Remove 2 screws each and then remove the SS2- Board and the SS3-Board.

1. Disconnect the couplers(SS11, SS12, SS20, SS21, SS33, SS34, SS43, SS44).

2. Remove the Flexible Cable from the couplers(SS51, SS52, SS53, SS54).

3. Remove the 7 screws and then remove the SS-Board.

6.16. Removal of the C1, C2, C3, C4,

C5 and the C6-Board

1. Remove the Slot Block. (Reference to remove of the Slot Block).

2. Remove the Speaker Terminal Block(L, R). (Refernce to remove of the Speaker Terminal Block(L, R).

3. Remove 4 screws each ( Blocks(L, R).

4. Disconnect the Fan Relay Couplers.

5. Remove 3 screws each ( Blocks.

) and then remove the Stand

) and then remove the 3 Fan

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6.16.1. Removal of the C1-Board

6.16.3. Removal of the C3-Board

1. Remove the Flexible Cable from the coupler(C10).

2. Remove the 6 screws ( Cable from the couplers(CA1, CA2, CA3).

3. Remove the 5 screws (

) and then remove the Flexible

) and then remove the C1-Board.

6.16.2. Removal of the C2-Board

1. Remove the Flexible Cable from the couplers(C20, C21, C22).

2. Remove the 8 screws ( Cable from the couplers(CA4, CA5, CA6, CA7).

3. Remove the 5 screws (

) and then remove the Flexible

) and then remove the C2-Board.

1. Remove the Flexible Cable from the couplers(C31, C32).

2. Disconnect the couplers(C33).

3. Remove the 8 screws and ( Cable from the couplers(CA8, CA9, CA10, CA11).

4. Remove the 5 screws (

) then remove the Flexible

) and then remove the C3-Board.

6.16.4. Removal of the C4-Board

1. Remove the Flexible Cable from the couplers(C41, C42).

2. Disconnect the couplers(C43, C44).

3. Remove the 8 screws ( Cable from the couplers(CB8, CB9, CB10,CB11).

4. Remove the 5 screws (

) and then remove the Flexible

) and then remove the C4-Board.

6.16.5. Removal of the C5-Board

1. Remove the Flexible Cable from the couplers(C50, C51, C52).

2. Remove the 8 screws ( Cable from the couplers(CB4, CB5, CB6, CB7).

3. Remove the 5 screws (

) and then remove the Flexible

) and then remove the C5-Board.

6.16.6. Removal of the C6-Board

1. Remove the Flexible Cable from the coupler(C60).

2. Remove the 6 screws and ( Cable from the couplers(CB1, CB2, CB3).

3. Remove the 5 screws and (

) then remove the Flexible

) then remove the C6-Board.

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2. Remove the 2 screws(G) and then remove the S1-Board Block.

3. Disconnect the coupler(S34).

4. Remove the 1 screw(H) and then remove the S1-Board.

6.18. Removal of the Fan

1. Disconnect the Fan Relay Couplers.

2. Remove 3 screws each and then remove the 3 Fan Blocks.

6.17. Removal of the S1-Board

1. Disconnect the coupler(SS34).

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3. Remove 4 screws each (J) and then remove the Fans.

4. Reassemble the Fans in reverse order.

5. Stick the Cushion (Fan) around the Fan.

Note:

The Cushion (Fan) are unsuitable to reuse. Please use a new one at the time of Fan exchange.

6.19. Removal of the Escutcheon

1. Remove the S1-Board Block. (Reference to Removal of the S1-Board)

2. Disconnect the couplers(J2, J15).

3. Remove the 2 screws of the Escutcheon.

6.20. Removal of the V1-Board and the V2-Board

1. Remove the Escutcheon.

(Reference to Removal of the Escutcheon)

2. Remove the 6 screws and then remove the Fixed Angle.

3. Remove the 1 screw(K).

4. Disconnect the coupler(V2) and then remove the V1-Board.

5. Remove the operation button from the V2-Board.

6. Disconnect the coupler(V15) and then remove the V2-

Board.

4. Pull the bottom of the Plasma Panel forward (arrow1).

5. Slide the Plasma Panel and then remove the Plasma Panel (arrow2).

6.21. Removal of the Plasma Panel

1. Disconnect the Fan Relay Couplers.

2. Remove 3 screws each ( Blocks.

3. Remove 4 screws each ( Black(L, R).

4. Remove 1 screws each ( Speaker Terminal Black(L, R).

) and then remove the 3 Fan

) and then remove the Stand

) and then remove the

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10. Disconnect the couplers(P2, P9, P11, P12, P23, P25).

11. Remove the 6 screws (

12. Disconnect the coupler(D20).

13. Remove the Flexible Cable from the couplers(D31, D32, D33, D34).

14. Remove the 4 screws and then remove the D-Board.

) and then remove the P-Board.

5. Disconnect the couplers(J1, J2, J3, J4, J5, J6, J7, J8, J10, J15, J30).

6. Remove the 4 screws and then remove the Slot Block.

7. Disconnect the coupler(DA5).

8. Remove the Flexible Cable from the coupler(DA2).

9. Remove the 4 screws and then remove the DA-Board Block.

15. Remove the Flexible Cable from the couplers(SU1, SU2, SU3, SU4, SD1, SD2, SD3, SD4).

16. Remove the 6 screws.

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17. Disconnect the couplers(SU45, SD46).

18. Slide the SU-Board and the SD-Board to the left, remove the SU-Board and the SD-Board from the couplers(SC41, SC42).

24. Disconnect the couplers(SS33, SS43, SS44).

25. Remove the Flexible Cable from the couplers(SS51, SS52, SS53, SS54).

26. Remove the 7 screws and then remove the SS-Board.

19. Remove the 2 screws and ( ) then remove the Clamper and the Shield Sheet.

20. Remove the 9 screws and (

) then remove the SC-Board.

21. Disconnect the couplers(S22, S23).

22. Remove the Flexible Cable from the couplers(S55, S56).

23. Remove 2 screws each and then remove the SS2- Board and the SS-3Board.

27. Remove the 22 screws.

28. Remove the Flexible Cable from the couplers(CA1, CA2, CA3, CA4, CA5, CA6, CA7, CA8, CA9, CA10, CA11).

29. Remove the Flexible Cable from the couplers(C10, C21, C22, C31).

30. Remove 5 screws each and then remove the C1-Board, the C2-Board and the C3-Board.

31. Remove the 22 screws

32. Remove the Flexible Cable from the couplers(CB1, CB2, CB3, CB4, CB5, CB6, CB7, CB8, CB9, CB10, CB11).

33. Remove the Flexible Cable from the couplers(C41, C42, C50, C51).

34. Remove 5 screws each and then remove the C4-Board, the C5-Board and the C6-Board.

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37. Remove the 2 screws of the Escutcheon.

38. Pull the bottom of the Plasma Panel forward (arrow1).

39. Slide the Plasma Panel and then remove the Plasma Panel (arrow2).

35. Remove the 2 screws and then remove the S1-Board Block.

36. Remove the 3 screws and then remove the AC-Inlet Block.

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7 Location of Lead Wiring

7.1. Location of Lead Wiring (1)

7.2. Location of Lead Wiring (2)

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7.3. Location of Lead Wiring (3)

7.4. Location of Lead Wiring (4)

8 Adjustment Procedure

8.1. Driver Set-up

8.1.1. Item / Preparation

1. Input a white signal of the RGB signal generator. Aging pattern : 0

2. Set the picture adjustment items as follows.

· Picture menu : Standard

· Color temperature : Normal

· Picture : 25

· Aspect : Full

8.1.2. Adjustments

Adjust driver section voltages referring the panel data on the panel data label.

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Caution

1. First perform Vsus voltage adjustment.

2. Confirmation of Vscn voltage should be performed after confirmation of Vad voltage adjustment.

When Vad = -105V, Voltage of Vscn is 35V ± 4V.

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8.2. Initialization Pulse Adjust

1. Input a white signal to plasma video input.

2. Set the picture adjustment items as follows.

· Picture menu : Standard

· Color temperature : Normal

· Picture : 25

· Aspect : Full

3. Connect Oscilloscope to TPSC1 (T2) and adjust VR6602 for 195 ± 10µ Sec.

Test point Volume Level

T2 TPSS1 (SS) VR6602(SC) 195 ± 10µ Sec

8.3. P.C.B. (Printed Circuit Board) Remove

8.3.1. Caution

1. To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.

8.3.2. Quick adjustment after P.C.B. Remove

P.C.B. Name Test Point Voltage Volume Remarks P Board Vsus TPVSUS Vsus ± 2V VR251 (P) * SC Board Vad TPVAD -105V ± 1V VR6600 (SC)

Vscn TPVSCN Vad+ 140V ± 4V Fixed Vset TPVSET 280V ± 7V Fixed

SS Board Ve TPVE Ve ± 1V VR6000 (SS) *

Vda TPVDA 75V ± 1V Fixed D, J Board White blance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals DA Board Set Market Select Nomber to correct destination by Ms mode (See chap. 9.1.4)

*See the Panel label.

Caution:

Absolutely do not reduce Vsus below Ve not to damage the P.C.B.

8.4. Adjustment Volume Location

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8.5. Test Point Location

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9 Service mode

9.1. CAT (computer Aided Test) mode

To exit the CAT mode, access the ID mode and switch off the main power.

9.1.1. IIC mode

Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

Subject and item are mentioned on “IIC mode structure”.

To exit the IIC mode, press the R button on the remote control.

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9.1.2. CD mode

Select the CD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 5 seconds.

Micom software version (IC9702), this version can be upgrade by

1. replace of new version IC

2. Loading the new version software from loader tool, TZSC07036. Memory data change

To exit the CD mode, press the R button on the remote control.

9.1.3. SD mode

Select the SD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

To exit the SD mode, press the R button on the remote control.

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9.1.4. MS mode

Select the MS mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 5 seconds.

To exit the MS mode, press the R button on the remote control.

Caution:

Market Select should be set after exchange of DA-Board.

Destination number

Number Destination Number Destination

0 Japan 14 Thailand (Hotel) 1 North America 15 -2 Europe 16 Mexico 3 Others 17 Mexico (Hotel) 4 Britain 18 China 5 Taiwan 19 China (Hotel) 6 Thailand 20 -7 -- 21 -8 Japan (Hotel) 22 --

9 North America (Hotel) 23 -10 Europe (Hotel) 24 -11 Others (Hotel) 25 -12 Britain (Hotel) 26 --

Number Destination

Default setting

1 North America

9.1.5. ID mode

Select the ID mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 5 seconds.

To exit the ID mode, press the R button on the remote control.

9.2. IIC mode structure (following items value is sample data.)

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10 Adjustment

10.1. RGB white balance adjustment

Instrument Name Connection Remarks

· RGB VGA W/B pattern

· Color analyzer

(Minolta CA-100 or equivalent)

Procedure Remarks

· Ensure aging is adequate.

· Make sure the front panel to be used on the final set is fitted.

· Make sure a color signal is not being shown before adjustment.

· Put the color analyzer where there is little color variation.

1. Set COMPONET/RGB-IN SELECT to RGB.

2. Select the IIC mode “PANEL W/B Adj.” item.

3. Check that the color temperature is “COOL (High)”.

4. Output a white balance pattern.

5. Touch the signal receiver of color analyzer to the highlight window’s center.

6. Fix G drive at E0h and adjust B drive and R drive so x, y become the “Color temperature High” in the below table.

7. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

8. Set color temperature to “NORMAL (Medium)”.

9. Fix G drive at E0h and adjust B drive and R drive so the highlight window’s x, y becomes the “Color temperature Medium” in the below table.

10. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

11. Set color temperature to “WARM(Low)”.

12. Set G drive to E0h and adjust B drive and R drive so the highlight window’s x, y become the “Color temperature Low” shown in the below table.

13. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

14. Copy the R drive, G drive and B drive data in NTSC, PAL DVI region.

PC input Panel surface

User setting: Normal (Picture menu: Standard)

Picture Menu: Standard Picture: 25 Aspect: Full Position and size: Normal

· Highlight section Signal amplitude 75%

· Cutoff standard G: 80h

· Drive standard G: E0h

Adjustment target Hi-light: x ± 0.003 y ± 0.003 Hi-light is target of the number at drive adjustment in the hi-light windows. Therefore, it is not target of the hi-light number at after adjustment white balance.

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