Panasonic TH-42PX20U-P Service manual

ORDER NO. ITD0309035C1

High Definition Plasma Television

TH-42PX20U-P

GPH6DU Chassis

Specifications

Power Source AC 120 V, 50/60 Hz Power Consumption Maximum :595 W

Stand-by condition :0.9 W

Plasma Displ ay panel Drive method :AC type 42-inch, 16 :9 aspect ratio Screen Size 36.22 “ (920 mm) (W) × 20.39 “ (518 mm) (H) × 41.57 “ (1056 mm) (diagonal) Dimensions (W × H × D ) Mass (Weight) 90.4 lb.(41 kg)Net Channel Capability-181 VHF-12 :UHF-56 :Cable-125 Sound

Speaker Woofer 80mm × 2 , Tweeter 16mm × 73mm × 8 Audio Output 26W[5W+5W,8W+8W](10%THD) Headphone M3 (3.5 mm) Jack × 1

FEATURES Two screen display fuctions 3D Y/C FILTER

Accessories Supplied Remote control Transmitter EUR7603ZB0

Operating Conditions Temperature : 34 °F - 104 °F (0° - 40°C)

Connection Terminals RGB input D-SUB 15pin R, G, B /0.7 Vp-p (759)

44.88 “ (1140mm) × 29.8 “ (757 mm) × 5.47 “ (139 mm)

BBE VIVA LINEAR PIP CLOSED CAPTION

AA Battery × 2 Ferrite cores (large × 5, small × 5) AC Cord F type Antenna Adaptor (3C-2V × 2, 5C-2V × 2) Pedestal

Humidity : 20 % - 80 % (non-condensing)

AV INPUT 1-3

-Chip

IDEO (Phono Jack Type) S-VIDEO (Mini DIN 4-pin)

UDIO L-R (Phono Jack Type × 2)

HD, VD /1.0 -5.0 Vp-p (high impedance)

1.0 Vp-p (759 )

Y :1.0 Vp-p (759), C : 0.286 Vp-p (759)

0.5 Vrms

B19 Canada: B07

TH-42PX20U-P

Note:

AV PROG.OUT

TO AUDIO AMP

COMPONENT VIDEO Y 1.0 Vp-p (including synchronization) INPUT1-2 PB /PR ±0.35Vp-p

HDMI INPUT HDMI type A connector

Design and Specifications are subject to change without notice.Weight and Dimensions shown are approximate.

IDEO

(Phono Jack Type)

UDIO L-R

(Phono Jack Type × 2)

UDIO L-R

(Phono Jack Type × 2)

UDIO L-R

(Phono Jack Type × 2)

UDIO L-R

(Phono Jack Type × 2)

1.0 Vp-p (759 )

0.5 Vrms

CONTENTS

1 Applicable signals 4 2 Safety Precautions

2.1. General Guidelines

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 4 About lead free solder (PbF) 5 Service Hint 6 Location of Lead Wiring

6.1. Lead of Wiring (1)

6.2. Lead of Wiring (2)

6.3. Lead of Wiring (3)

6.4. Lead of Wiring (4)

6.5. Lead of Wiring (5)

6.6. Lead of Wiring (6)

7 Self-c heck Function

7.1. Self-check of the microcomputer control system (bus line)

7.2. Power LED Blinking timing chart

7.3. No Power

7.4. No Picture

7.5. Local screen failure

8 Serviceman Mode (Electronic Controls) 9 CAT (computer Aided Test) mode

9.1. IIC mode

9.2. CD mode

9.3. SD mode

9.4. IIC mode structure (following items value is sample data.)

10 Adjustment Procedure

Page Page

6 7

11 Adjustment 8 9

10 11

12 Hotel mode

13 Conductor Views

13 14

15 16 17 18 18

19 21

21 22 22

13.10. C2-Board

13.11. C3-Board

13.12. C4-Board

13.13. SC-Board

13.14. SU-Board

13.15. SD-Board

13.16. SS, SS2 and SS3-Board

13.17. JG-Board

10.1. Driver Set-up

10.2. Initialization Pulse Adjust

10.3. P.C.B. (Printed Circuit Board) exchange

10.4. Adjustment Volume Location

10.5. Test Point Location

11.1. Pedestal setting

11.2. NTSC panel white balance

11.3. HD panel white balance

11.4. Sub brightness setting

13.1. PF-Board

13.2. P-Board

13.3. PA-Board

13.4. TA and TB-Board

13.5. H-Board

13.6. DV-Board

13.7. DG-Board

13.8. D-Board

13.9. C1-Board

24 25 26 26 26

27 28 29 30

31 33

33 34 36 38 39 40 42 44 47 48 49 50 51 54 55 56 58

13.18. G-Board 60

13.19. K and S-Board

14 Block and Schematic Diagrams

14.1. Schematic Diagram Notes

14.2. Main Block Diagram

14.3. PF-Board Block Diagram

14.4. PF-Board Schematic Diagram

14.5. P-Board Block Diagram

14.6. P-Board (1 of 6) Schematic Diagram

14.7. P-Board (2 of 6) Schematic Diagram

14.8. P-Board (3 of 6) Schematic Diagram

14.9. P-Board (4 of 6) Schematic Diagram

14.10. P-Board (5 of 6) Schematic Diagram

14.11. P-Board (6 of 6) Schematic Diagram

14.12. PA and G-Board Block Diagram

14.13. PA-Board (1 of 3) Schematic Diagram

14.14. PA-Board (2 of 3) Schematic Diagram

14.15. PA-Board (3 of 3) Schematic Diagram

14.16. G-Board Schematic Diagram

14.17. TA, TB and H-Board Block Diagram

14.18. TA and TB-Board Schematic Diagram

14.19. H-Board (1 of 2) Schematic Diagram

14.20. H-Board (2 of 2) Schematic Diagram

14.21. DV-Board Block Diagram

14.22. DV-Board (1 of 3) Schematic Diagram

14.23. DV-Board (2 of 3) Schematic Diagram

14.24. DV-Board (3 of 3) Schematic Diagram

14.25. JG-Board Block Diagram

14.26. JG-Board (1 of 5) Schematic Diagram

14.27. JG-Board (2 of 5) Schematic Diagram

14.28. JG-Board (3 of 5) Schematic Diagram

14.29. JG-Board (4 of 5) Schematic Diagram

14.30. JG-Board (5 of 5) Schematic Diagram

14.31. DG-Board Block Diagram

14.32. DG-Board (1 of 7) Schematic Diagram

14.33. DG-Board (2 of 7) Schematic Diagram

14.34. DG-Board (3of 7) Schematic Diagram

14.35. DG-Board (4 of 7) Schematic Diagram

14.36. DG-Board (5 of 7) Schematic Diagram

14.37. DG-Board (6 of 7) Schematic Diagram

14.38. DG-Board (7 of 7) Schematic Diagram

14.39. D-Board (1 of 2) Block Diagram

14.40. D-Board (2 of 2) Block Diagram

14.41. D-Board (1 of 15) Schematic Diagram

14.42. D-Board (2 of 15) Schematic Diagram

100 101 102 103 104

14.43. D-Board (3 of 15) Schematic Diagram

63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99

14.44. D-Board (4 of 15) Schematic Diagram

14.45. D-Board (5 of 15) Schematic Diagram

14.46. D-Board (6 of 15) Schematic Diagram

14.47. D-Board (7 of 15) Schematic Diagram

14.48. D-Board (8 of 15) Schematic Diagram

14.49. D-Board (9 of 15) Schematic Diagram

14.50. D-Board (10 of 15) Schematic Diagram

14.51. D-Board (11 of 15) Schematic Diagram

14.52. D-Board (12 of 15) Schematic Diagram

14.53. D-Board (13 of 15) Schematic Diagram

14.54. D-Board (14 of 15) Schematic Diagram

14.55. D-Board (15 of 15) Schematic Diagram

14.56. C1, C2, C3, C4 and K-Board Block Diagram

14.57. C1-Board (1 of 2) Schematic Diagram

14.58. C1-Board (2 of 2) Schematic Diagram

14.59. C2-Board (1 of 2) Schematic Diagram

14.60. C2-Board (2 of 2) Schematic Diagram

14.61. C3-Board (1 of 2) Schematic Diagram

14.62. C3-Board (2 of 2) Schematic Diagram

14.63. C4-Board (1 of 2) Schematic Diagram

14.64. C4-Board (2 of 2) Schematic Diagram

14.65. S and K-Board Schematic Diagram

14.66. SC-Board Block Diagram

14.67. SC-Board (1 of 2) Schematic Diagram

14.68. SC-Board (2 of 2) Schematic Diagram

14.69. SU-Board Block Diagram

14.70. SU-Board (1 of 2) Schematic Diagram

14.71. SU-Board (2 of 2) Schematic Diagram

14.72. SD-Board Block Diagram

14.73. SD-Board (1 of 2) Schematic Diagram

14.74. SD-Board (2 of 2) Schematic Diagram

14.75. SS, S, SS2 and SS3-Board Block Diagram

14.76. SS-Board (1 of 2) Schematic Diagram

14.77. SS, SS2 and SS3-Board Schematic Diagram

15 Parts Location

15.1. Parts Location (1)

15.2. Parts Location (2)

15.3. Parts Location (3)

15.4. Parts Location (4)

15.5. Parts Location (5)

16 Mechanical Replacement Parts List 17 Replacement Parts List

17.1. Replacement Parts List Notes

17.2. Electrical Replacement Parts List

TH-42PX20U-P

105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139

141

141 142 143 144 145

146 147

147 148

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1 Applicable signals

2 Safety Precautions

2.1. General Guidelines

1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

2.1.1. Leakage Current Cold Check

1.Unplug the AC cord and connect a jumper between the two prongs on the plug.

2.Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1M9 and 5.2M9.

When the exposed metal does not have a return path to

the chassis, the reading must be

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Figure 1

2.1.2. Leakage Current Hot Check (See Figure 1.)

1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2.Connect a 1.5k9, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3.Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4.Check each exposed metallic part, and measure the voltage at each point.

5.Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6.The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

TH-42PX20U-P

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.

5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable conductive material).

7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

TH-42PX20U-P

4 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

Caution



 ·Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.



Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).



 ·Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).



If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.



 ·After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto



the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

stamped on the back of PCB.

TH-42PX20U-P

5 Service Hint

Board Name Function Board Name Function

C1 DATA DRIVER (UPPER RIGHT) PF LINE FILTER C2 DATA DRIVER (UPPER LEFT) SC SCAN DRIVE

D DIGTAL SIGINAL PROCESS SD SCAN OUT (DOWN)

DG DIGTAL CORE MICOM SS SUSTAIN DRIVE

G FRONT TERMINAL, SWITCH SS2 SUSTAIN CONNECTION (UP) H REAE TERMINAL SS3 SUSTAIN CONNECTION (DOWN) K LED, REMOTE, SU SCAN OUT (UP) P POWER SUPPLY TA MAIN TUNER

PA DC/DC, AUDIO TB SUB TUNER

C3 DATA DRIVER (LOWER RIGHT) JG PC/SD CARD C4 DATA DRIVER (LOWER LEFT) DV HDMI

S POWER SW

6 Location of Lead Wiring

6.1. Lead of Wiring (1)

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6.2. Lead of Wiring (2)

6.3. Lead of Wiring (3)

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6.4. Lead of Wiring (4)

6.5. Lead of Wiring (5)

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6.6. Lead of Wiring (6)

7 Self-check Function

When symptoms like “the power fails sometimes” or “sometimes there is no picture and/or sound” can not be confirmed at the time of servicing, the self-check function can be used to confirm the occurrence and to find the defective circuit.

In case of “power failure”, flashing of the “POWER” indication (red) at the front of the unit can be used to narrow down the +B line.

7.1. Self-check of the microcomputer control system (bus line)

Indicaton method

Press the “ACTION” button in the control panel of the unit simultaneously with the “POWER” button in the control panel of the unit. Hold them few seconds.

Return to he normal screen

Press any button on the unit or in the remote control.

Screen Display

TH-42PX20U-P

Display Ref. No. Description Board MEMORY IC002 EEPROM for Main MPU DG SOUND IC2401 Sound Control H YUV_SW IC4301 YUV switch H GC2M1 IC4501 Global Core 2 for main DG GC2S1 IC4502 Global Core 2 for sub DG EXDAC2 IC5011 EXDAC DV TNR1 TNR201 Tuner 1 TA MTS IC4205 Multiplex sound H EXDAC IC8031 External I/O DG GC2M2 IC4501 Global Core 2 for main DG GC2S2 IC4502 Global Core 2 for sub DG PANEL ----- Panel ----TNR2 TNR251 Tuner 2 TB AVSW IC4302 AV switch H CONV IC3801 Convert Micom DG SND2 IC4203 BBE H HDMI IC5003 HDMI Recelver DV

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7.2. Power LED Blinking timing chart

1.Subject Information of LED Flashing timing chart.

2.Contents When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the

defective block can be identified by the number of blinkes of the Power LED on the front panel of the unit.

3.Remarks Above Fan function is operated during the fans are installed.

7.3. No Power

First check point

There are following 3 states of No Power indication by power LED.

1.No lit

2.Green is lit then turns red blinking a few seconds later.

3.Only red is lit.

1.No lit

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7.4. No Picture

7.5. Local screen failure

Plasma display may have local area failure on the screen. Fig - 1 is the possible defect P.C.B. for each local area.

Fig - 1

8 Serviceman Mode (Electronic Controls)

This Receiver has electronic technology using the I2C BUS Concept. It performs as a control function and it replaces many mechanical controls. Instead of adjusting mechanical controls individually, many of the control function are now performed by using “On Screen Display Menu”. (The Serviceman Adjustment Mode.)

Note

It is suggested that the technician reads all the way through and understand the following the procedure for Entering/Exiting the Serviceman Mode; then proceed with the instructions working the Receiver. When becoming familiar with the procedure, the Flow Chart for Serviceman Mode may be used as a quick guide.

Quick Entry to Serviceman Mode:

At times when minor adjustments need to be done to the electronic controls, the method of Entering the serviceman Mode without removal of the cabinet back is as follows using the Remote Control:

1.Select SET-UP icon and select CABLE mode.

2.Select TIMER icon and set SLEEP time for 30 Min.

3.Press ACTION button twice to exit menus.

4.Tune to the Channel 124.

5.Adjust VOLUME to minimum (0).

6.Press the VOL

button (decrease) on Receiver. Red “CHK” appears in upper corner.

TH-42PX20U-P

7.Press the Power Button on the Remote Control to select one of six Serviceman Adjustment Modes. a.Serviceman H ADJUSTMENT. b.Serviceman V ADJUSTM ENT.

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c.Serviceman OTHER ADJUSTMENT.

Exiting the Serviceman Mode:

Press the Power buttons on the Receiver.

For Adjustments:

1.Press Channel Up/Down on the Remote Control to select one of the available Service Adjustments (a in Fig.1).

Note:

Write Down the original value set (b in Fig.1) for each address before modifying anything. It is easy to erroneously adjust the wrong item.

2.Press Volume Up/Down on the Remote Control to adjust the level of the selected Service Adjustment (b in Fig.1).

MAIN ITEM

H HPOS 15 1C CE

V VPOS 15 1E 0C

OTHER SOSSW 01 97 01

EEP AREA 15 9C ALL

SUB ITEM ORIGINAL

VALUE

HWID 15 1B 2B HP OF 15 61 FC HW OF 15 60 00

VWID 15 D1 VP OF 15 20 VW OF 15 29

POFWT 15 89 0A PSRVS SPDYN 15 86 -00

IN EX 15 9D EX IN 15 9E

EEPROM ADRESS DEFAULT SLEEVE SUB

LEVEL

9 CAT (computer Aided Test) mode

TH-42PX20U-P

To exit the CAT mode, access the ID mode and switch off the main power.

9.1. IIC mode

Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on the remote control.

“IIC mode structure”.

To exit the IIC mode, press the RECALL button on the remote control.

TH-42PX20U-P

9.2. CD mode

Select the CD mode by Up/Down button on the remote control at the front page of CAT mode then press the Mute button on the remote control more than 5 sec.

Micom software version (IC9705), this version can be upgrade by

1.replace of new version IC

2.Loading the new version software from loader tool, TZSC07036.

Memory data change

To exit the CD mode, press the RECALL button on the remote control.

9.3. SD mode

Select the SD mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on the remote control.

To exit the SD mode, press the RECALL button on the remote control.

9.4. IIC mode structure (following items value is sample data.)

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10 Adjustment Procedure

10.1. Driver Set-up

10.1.1. Item / Preparation

1.Input an APL 100 % white signal.

2.Set the picture controls: Picture mode: Normal White balance: Cool Aspect: 16:9

10.1.2. Adjustments

Adjust driver section voltages referring the panel data on the panel data label.

Name Test Point Voltage Volume Remarks

Vsus TPVSUS

(SS) Ve TPVE (SS) 150V ± 1V R6770 (SS) Vset TPVSET

(SC) Vad TPVAD (SC) -90V ± 1V R6477 (SC) Vscn TPVSCN

(SC) Vda TPVDA (SS) 67V ± 1V VR665 (P)

170V ± 2V VR641 (P)

220V ± 5V ---

Vad*+118V ±2V---

*See the Panel label.

10.2. Initialization Pulse Adjust

1.Input a Cross hatch signal.

2.Set the picture controls: Picture mode: Normal White balance: Cool

Adjust the indicated test point for the specified wave form.

Test point Volume Level T1 TPSC1 (SC) --- 20 ± 15µ Sec T2 TPSS1 (SS) R6557 (SC) 170 ± 10µ Sec

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10.3. P.C.B. (Printed Circuit Board) exchange

10.3.1. Caution

1.To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.

10.3.2. Quick adjustment after P.C.B. exchange

P.C.B. Name Test Point Voltage Volume Remarks

P Board Vsus TPVSUS (SS) 170V ± 1V VR641 (P)

Vda TPVDA (SS) 67V ± 1V VR665 (P)

SC Board Vad TPVAD (SC) -90V ± 1V R6477 (SC)

Vset TPVSET (SC) 220V ± 6V ---

Vscn TPVSCN (SC) Vad + 118 ± 2V --SS Board Ve TPVE (SS) 150V ± 1V R6770 (SS) D, DG Board White blance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals

*See the Panel label.

10.4. Adjustment Volume Location

10.5. Test Point Location

11 Adjustment

11.1. Pedestal setting

INPUT Alignment menu ProcedureEquipment Setting

1 RF Picture: PANEL W/B

Gray Scale Pattern

Black 2 %

Black 0 %

White balance: G cut off

Aspect:

Normal R cut off 1) Set R,G and B cut off to "

Cool B cut off

Chroma Control:

16:9

RGB Sub Adjust:

Chroma Control:

RGB Sub Adjust:

Chroma Control:

RGB Sub Adjust:

Gun off

G Sub Bright

Gun off

B Sub Bright

Gun off

R Sub Bright

** Adjust at the dark room.

80 ".

2) Set Gun off to "

3) Adjust G Sub bright 1 to start some of green pixels emission at black 2% area and no emission at black 0% area.

4) Set Gun off to "

5) Adjust B Sub bright 1 to start some of blue pixels emission at black 2% area and no emission at black 0% area.

6) Set Gun off to "

7) Adjust R Sub bright 1 to start some of red pixels emission at black 2% area and no emission at black 0% area.

5". (Only green pixels can emit.)

3". (Only blue pixels can emit.)

6". (Only red pixels can emit.)

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2 HD Picture: 1) Change input to HD signal.

Gray Scale Normal PANEL W/B Pattern White balance: R,G,B cut off 2) Repeat procedure 1) to 7) of Component input signal.

Cool PANEL W/B

Aspect: R,G,B Drive

16:9

Black 2 %

Black 0 %

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11.2. NTSC panel white balance

INPUT Alignment menu ProcedureEquipment Setting

1 NTSC Color Picture: 1) Find the nearest area to brightness of 10 cd/m2 as Low

Gray Scale Analyzer Normal Sub Adjust light by color sensor. Pattern White balance: Sub Bright 2) Adjust Sub bright to set Low light level to 10 cd/m

Aspect: PANEL W/B

High light 75% Sub Adjust

Low light 15% Sub Bright 5) If Sub Bright is changed re-adjust it to set Low light

Cool exactly.

16:9 G cut off 3) Set G cut off to " 80 ".

PANEL W/B

B cut off 4) Adjust B and R cut off to set color temperature as

R cut off shown Fig.-01.

to 10 cd/m

6)Find 75% of white area by color sensor.

PANEL W/B

G Drive 7) Set G Drive to " E8 ".

PANEL W/B

B Drive 8) Adjust B and R Drive to set color temperature

R Drive as shown Fig.-01.

9) Repeat item 4) to 7) to set both Low light and high light.

PANEL W/B

R,G,B Drive 10) Increase same steps of R, G and B Drive to set R,G,B Drive largest level of 3 color drive to "FC".

PANEL W/B

R,G,B cut off 11) Re-adjust Low light level again.

Color Temp. x y

Cool 0.276 0.276

Normal 0.288 0.296

Warm 0.313 0.329

Fig. -01

2 Picture: 1) Change white balance to "Normal".

Normal PANEL W/B

White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.

Normal PANEL W/B

Aspect: R,G,B Drive

16:9

3 Picture: 1) Change white balance to "Warm".

Normal PANEL W/B

White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.

Warm PANEL W/B

Aspect: R,G,B Drive

16:9

4 Picture: Picture Menu 1) Change color templature to "Cool".

Normal Sub Adjust

White balance: Sub Bright 2)Re-set Sub bright to "30"

Cool

Aspect:

16:9

11.3. HD panel white balance

INPUT Alignment menu ProcedureEquipment Setting

Gray Scale Pattern

High light 75%

Low light 15%

Color Picture: 1) Find the nearest area to brightness of 10 cd/m2 as Low Analyzer Normal Sub Adjust light by color sensor.

White balance: Sub Bright 2) Adjust Sub bright to set Low light level to 10 cd/m

Cool

Aspect: PANEL W/B

16:9 G cut off 3) Set G cut off to " 80 ".

PANEL W/B

Sub Adjust

Sub Bright 5) If Sub Bright is changed re-adjust it to set Low light

PANEL W/B

exactly.

B cut off 4) Adjust B and R cut off to set color temperature as R cut off shown Fig.-04.

to 10 cd/m

6)Find 75% of white area by color sensor.

G Drive 7) Set G Drive to " E8 ".

B Drive 8) Adjust B and R Drive to set color temperature

R Drive as shown Fig.-04.

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9) Repeat item 4) to 7) to set both Low light and high light.

PANEL W/B

R,G,B Drive 10) Increase same steps of R, G and B Drive to set R,G,B Drive largest level of 3 color drive to "FC".

PANEL W/B

R,G,B cut off 11) Re-adjust Low light level again.

Color Temp. x y

Cool 0.276 0.276

Normal 0.288 0.296

Warm 0.313 0.329

Fig. -04

2 Picture: 1) Change white balance to "Normal".

Normal PANEL W/B

White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.

Normal

PANEL W/B

Aspect: R,G,B Drive

16:9

3 Picture: 1) Change white balance to "Warm".

Normal PANEL W/B

White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.

Warm

PANEL W/B

Aspect: R,G,B Drive

16:9

4 Picture: Picture Menu 1) Change color templature to "Cool".

Normal Sub Adjust

White balance: Sub Bright 2)Re-set Sub bright to "30"

Cool

Aspect:

16:9

TH-42PX20U-P

11.4. Sub brightness setting

INPUT Alignment menu ProcedureEquipment Setting

1 RF Picture: PANEL W/B

Gray Scale Normal All cut off 1) Set white balance to Pattern Aspect:

** Adjust at the dark room.

Cool

16:9 2) Adjust All cut off to start some pixels emission

at black 2% area and no emission at black 0% area.

3) Write down all cut off data.

4) Set white balance to

Black 2 %

Black 0 % 5) Adjust All cut off to set same data of Cool mode.

6) Set white balance to

7) Adjust All cut off to set same data of Cool mode.

HD 8) Change to HD signal. Gray Scale Pattern 9) Copy PAL All cut off data to HD mode.

Nornal

warm

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