AV1-Rear21 Pin terminal (Audio/Video in, TV out, RGB in)
AV2-Rear21 Pin terminal (Audio/Video in, Audio/Video out, S-Video in, Q-Link)
AV4-Rear21 Pin terminal (Audio/Video in, Audio/Video out, S-Video in, RGB in, Q-Link)
ANT-RearUHF / VHF
Operating ConditionsTemperature :0 ° - 40 °C
Dimensions ( W × H × D )1,040 mm × 697 mm × 139 mm (TH-37PE30B)
Mass (Weight)34.5 kg (TH-37PE30B)
PAL 525/60Playback of NTSC tape from some PAL Video recorders (VCR)
DVBDigital terrestrial services via UHF aerial input.
M.NTSCPlayback from M.NTSC Video recorders (VCR)
NTSC (AV INPUT ONLY)Playback from NTSC Video recorders (VCR)
15.56. SS-Board (1 of 2) and S-Board Schematic Diagram
15.57. SS-Board (2 of 2) SS2, SS3, SS4 and SS5-Board
Schematic Diagram
15.58. JG-Board Block Diagram
15.59. JG-Board (1 of 2) Schematic Diagram
15.60. JG-Board (2 of 2) Schematic Diagram
15.61. XV-Board Block Diagram
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127
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131
15.62. XV-Board (1 of 5) Schematic Diagram
15.63. XV-Board (2 of 5) Schematic Diagram
15.64. XV-Board (3 of 5) Schematic Diagram
15.65. XV-Board (4 of 5) Schematic Diagram
15.66. XV-Board (5 of 5) Schematic Diagram
16 Parts Location
17 Packing Exploded Views
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4
1Applicable signals
TH-37PE30B / TH-42PE30B
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TH-37PE30B / TH-42PE30B
2Safety Precautions
2.1.General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.2.Touch-Current Check
1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2.Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe, as shown in Figure 1.
3.Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4.Check each exposed metallic part, and measure the voltage at each point.
5.Reserve the AC plug in the AC outlet and repeat each of the above measure.
6.The potential at any point (TOUGH CURRENT) expressed as voltage U
For a. c.: U
For d. c.: U
= 35 V (peak) and U2= 0.35 V (peak);
1
=1.0V,
1
Note:
The limit value of U
= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
2
mA d. c.
The limit value U
= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
1
7.In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
and U2, does not exceed the following values:
1
Figure 1
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TH-37PE30B / TH-42PE30B
3Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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TH-37PE30B / TH-42PE30B
4About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
· ·
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
· ·
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
· ·
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
1.Subject
Information of LED Flashing timing chart.
2.Contents
When an abnormality has occurred on the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinkes of the Power LED on the front panel of the unit.
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TH-37PE30B / TH-42PE30B
8.2.No Power
First check point
There are following 3 states of No Power indication by power LED.
1.No lit
2.Green is lit then turns red blinking a few seconds later.
3.Only red is lit.
1.No lit
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8.3.No Picture
TH-37PE30B / TH-42PE30B
8.4.Local screen failure
Plasma display may have local area failure on the screen. Fig - 1 is the possible defect P.C.Board for each local area.
Fig - 1
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TH-37PE30B / TH-42PE30B
9Service Mode Function
MPU controls the functions switching for each IICs through IIC bus in this chassis. The following setting and adjustment can be
adjusted by remote control in Service Mode.
9.1.How to enter SERVICE 1
1.In sound menu, set BASS to MAXIMUM, and set TREBLE to MINIMUM.
2.Simultaneously press INDEX button on remote control and DOWN button [
9.2.How to enter SERVICE 2
1.Set the channel to CH99.
2.Select the JPEG Viewer.
3.Press HOLD button on remote control.
Note:
To exit to Service mode, press N or Power button on remote control.
]ontheTVset.
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TH-37PE30B / TH-42PE30B
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9.3.Option Description
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TH-37PE30B / TH-42PE30B
10 CAT (Computer Aided Test) mode
10.1.IIC mode
Select the IIC mode by Up/Down (Channel) button on the remote control at the front page of CAT mode then press the OK button
on the remote control.
Subject and item are mentioned on IIC mode structure.
(Refer to item 10.4.)
To exit the IIC mode, press the MENU button on the remote control.
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TH-37PE30B / TH-42PE30B
10.2.CD mode
Select the CD mode by Up/Down (Channel) button on the remote control at the front page of CAT mode then press the Mute
button on the remote control more than 5 sec.
Micom software version (IC1007), this version can be upgrade by replace of new version IC
Memory data change
To exit the CD mode, press the MENU button on the remote control.
10.3.SD mode
Select the SD mode by Up/Down (Channel) button on the remote control at the front page of CAT mode then press the OK
button on the remote control.
To exit the SD mode, press the MENU button on the remote control.
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TH-37PE30B / TH-42PE30B
10.4.IIC mode structure (following items value is sample data.)
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