8.1. Taking out the Disc from Drive Unit when the
Disc cannot be ejected by OPEN/CLOSE
button--------------------------------------------------------27
8.2. Using the iPod/iPhone ----------------------------------28
19.4. SMPS, AC Inlet and Wireless Adapter P.C.B.---123
20 Appendix Information of Schematic Diagram -------125
20.1. Voltage & Waveform Chart---------------------------125
20.2. Illustration of ICs, Transistor and Diode-----------132
20.3. Terminal Function of ICs------------------------------133
21 Exploded View and Replacement Parts List----------135
21.1. Exploded View and Mechanical replacement
Part List ---------------------------------------------------135
21.2. Electrical Replacement Part List--------------------139
2
1Safety Precautions
1.1.General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properl y
installed.
3. After servicing, carry out the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1.Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to th e
chassis, the reading should be between 1MΩ and 5.2MΩ.
When the exposed metal does not have a return path to the chassis, the reading must be
1.1.2.Leakage Current Hot Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equiva lent)
may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the
limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is
returned to the customer.
Figure 1
3
1.2.Before Repair and Adjustment
Disconnect AC power to discharge unit AC Capacitors as such (C5700, C5701, C5702, C5703, C5704, C5705, C570 6) through a
10 Ω, 10 W resistor to ground.
Caution:
DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.
Current consumption at AC 230 V, 50 Hz in NO SIGNAL mode at volume minimum should be ~ 600 mA.
1.3.Protection Circuitry
The protection circuitry may have operated if either of the following conditions are noticed:
• No sound is heard when the power is turned on.
• Sound stops during a performance.
The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are
“shorted”, or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
If this occurs, follow the procedure outlines below:
1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.
Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.
4
1.4.Caution For AC Cord (For EB only)
5
1.5.Caution for fuse replacement
1.6.Safety Part Information
Safety Parts List:
There are special components used in this equipment which are important for safety.
These parts are marked by () in the Schematic Diagrams & Replacement Parts List. It is essential that these critical parts
should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards. Do not modify the original design
without permission of manufacturer.
Safety Ref No.Part No.Part Name & DescriptionRemarks
8REXX1186-J1P RED WIRE (AC INLET-SMPS)
9REXX1187-J1P BLACK WIRE (AC INLET-SMPS)
15RGRX1006P-GREAR PANEL
26RKMX1010A-K1 UPPER CABINET CASE
44RMZ1280SMPS PCB TOP INSULATOR
51RXQX1056ASMPS PC SHEET UNIT
52RXQX1057AC IN PC SHEET UNIT
A2K2CQ2CA00007 AC CORDEG
A2K2CZ3YY00005 AC CORDEB
A3VQT3Z87O/I BOOK (Ge)EG
A3VQT3Z88O/I BOOK (Fr/It/Sp/Du/Sw/Da/
A3VQT3Z96O/I BOOK (En)EB
PCB7REP4740BASMPS P.C.B.(RTL)
PCB8REP4740BAAC INLET P.C.B.(RTL)
DZ5701 ERZV10V511CS ZNR
L5701ELF19H015ALINE FILTER
L5703ELF17N011ALINE FILTER
T5701ETS61BA126AD MAIN TRANSFORMER
T5751ETS19AB2E6AG SUB TRANSFORMER
T6100G4D1A0000142 SWITCHING TRANSFORMER
PC5702 B3PBA0000503 PHOTO COUPLER
PC5720 B3PBA0000503 PHOTO COUPLER
PC5799 B3PBA0000503 PHOTO COUPLER
PC5901 B3PBA0000503 PHOTO COUPLER
F1K5D312BNA005 FUSE
TH5702 D4CAA5R10001 THERMISTOR
P5701K2AA2B000017 AC INLET
R5700ERJ8GEYJ155V 1.5M 1/4W
R5701ERJ8GEYJ155V 1.5M 1/4W
C5701F0CAF104A105 0.1uF
C5702F0CAF104A105 0.1uF
C5703F0CAF104A105 0.1uF
C5704F1BAF471A013 470pF
C5705F1BAF471A013 470pF
C5706F1BAF471A013 470pF
Fin)
EG
6
2Warning
2.1.Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive
(ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damag e
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as al uminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).
7
2.2.Precaution of Laser Diode
Caution:
This product utilizes a laser diode with the unit turned “on”, invisible laser radiation is emitted from the pickup lens.
Wavelength: 790 nm (CDs)/660 nm (DVDs)/405 nm (BDs)
Maximum output radiation power from pick up : 10 0 µW/VDE
Laser radiation from the pickup unit is safety level, but be sure the followings:
1. Do not disassemble the pickup unit, since radiation from exposed laser diode is dangerous.
2. Do not adjust the variable resistor on the pickup unit. It was already adjusted.
3. Do not look at the focus lens using optical instruments.
4. Recommend not to look at pickup lens for a long time.
ACHTUNG :
Dieses Produkt enthält eine Laserdiode. Im eingeschalteten Zustand wird unsichtbare Laserstrahlung von der Lasereinheit
adgestrahit.
Wellenlänge: 790 nm (CDs)/660 nm (DVDs)/405 nm (BDs)
Maximale Strahlungsleistung der Lasereinhelt: 100 µW/VDE
Die strahlungan der Lasereinheit ist ungefährlich, wenn folgende Punkte beachtet werden:
1. Die Lasereinheit nicht zerlegen, da die Strahlung an der freigelegten Laserdiode gefährlich ist.
2. Den werksseitig justierten Einstellregler der Lasereinheit nicht verstellen.
3. Nicht mit optischen Instrumenten in die Fokussierlinse blicken.
4. Nicht über längere Zeit in die Fokussierlinse blicken.
8
2.3.Service caution based on Legal restrictions
The lead free solder has been used in the mounting proce ss of a ll electrical components on the printed circuit board s used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy ma inly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that
of the normal solder.
Definition of PCB Lead Free Solder being used
The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)
Service caution for repair work using Lead Free Solder (PbF)
• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)
• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of th e normal lead solder, it takes the longer time to melt the
lead free solder.
• Use the soldering iron (more than 70W) equipped with the temperature con trol after setting the temperatu re at 350±30 degrees
C (662±86°F).
Recommended Lead Free Solder (Service Parts Route.)
• The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
Note
* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
9
2.4.Grounding for electrostatic breakdown prevention
As for parts that use optical pick-up (laser diode), the optical pick-up is destroyed by the static electricity of the working environment.
Repair in the working environment that is grounded.
2.4.1.Worktable grounding
• Put a conductive material (sheet) or iron sheet on the area where the optical pickup is placed, and ground the sheet.
2.4.2.Human body grounding
• Use the anti-static wrist strap to discharge the static electricity form your body.
10
3Service Navigation
3.1.Service Information
This service manual contains technical information which will allow service personnel’s to understand and service this model.
Please place orders using the parts list and not the drawing reference numbers.
If the circuit is changed or modified, this information will be followed by supplement service manual to be filed with the orig inal service manual.
• Digital Circuitries:
1) This service manual does not contain the following information, due to the impossibility of servicing at component level.
O Schematic Diagram, Block Diagram of Digital Circuitries on Digital P.C.B..
O Replacement Parts List for individual parts of Digital Circuitries on Digital P.C.B..
O Exploded View and Replacement Parts of individual parts of BD Mechanism Unit.
• WIFI P.C.B.
1) This service manual does not contain the following information, due to the impossibility of servicing at component level.
O Schematic Diagram, Block Diagram and Print Circuit Diagram of WIFI P.C.B..
O Replacement Parts List for individual parts of WIFI P.C.B..
• Wireless System (Optional)
1) This model support to wireless surround speaker, SH-FX71E-K.
2) For information of wireless system, please refer to original service manual (Order No. PSG1002002CE)
11
3.2.How to update the Firmware
The firmware of the unit may be renewed to improve the quality including operational performance and pl ayability. Make sure to
refer the following procedure when performing version-up.
3.2.1.Confirmation of the Firmware Version
Perform following steps to checking the firmware version currently installed in the unit.
1. Turn the unit on and wait the Home screen is displayed.
3. Firmware Version Information screen is displayed.
3.2.2.Updating Firmware
This unit has 2 updating method, one way to update via the internet, the other way to update using CD-R or USB devi ce which is
stored pre-downloaded firmware update file.
3.2.2.1.Updating firmware via the internet
12
3.2.2.2.Updating firmware using the USB device
When updating firmware using USB device, perform following procedures.
(When using CD-R instead of USB device, perform same procedures)
1. Download the latest firmware file of the unit.
The latest firmware required for version-up can be downloaded from “Support Information from NWBG/VDBG-PAVC” web-site
in “TSN system”.
Click file name to download.
After download, click file to decompress. (Total: 1 file).
2. Decompress the downloaded file.
The decompressed file will be named as follows.
File Name: PANA_DVD.FRM
Copy the file to root folder of the USB device.
(If using CD-R instead of USB device, burn the file to a blank CD-R by writing software.)
3. Update the unit.
13
4Specifications
Main unit
OGENERAL
Power consumption:89 W
Power Consumption in standby mode:
Approx. 0.1 W
Power supply:AC 220 V to 240 V, 50 Hz
iPod/iPhone Connector:DC OUT 5 V 1.0 A MAX
Dimensions (W×H×D):430 mm × 40 mm × 279 mm
Mass (Weight):Approx. 3.0 kg
Operating temperature range:0 °C to 40 °C
Operating humidity range:
35 % to 80 % RH (no condensation)
OAMPLIFIER SECTION
RMS Total Power Output:1000 W
1 kHz, 10% total harmonic distortion
FRONT:185 W per channel (3 Ω)
CENTER:180 W per channel (3 Ω)
SURROUND:125 W per channel (3 Ω)
100 Hz, 10% total harmonic distortion
SUBWOOFER:200 W per channel (3 Ω)
Specifications are subject to change without notice.
Solder:
This model uses lead free solder (PbF).
Refer to their respective original service manuals for *1.
OFM TUNER SECTION
Frequency range:
87.50 MHz to 108.00 MHz (50 kHz step)
Antenna terminals:75 Ω (unbalanced)
OTERMINAL SECTION
USB Slot: USB2.0: 2 system
SD card slot:Connector: 1 system
Ethernet:
10BASE-T/100BASE-TX 1 system
Wireless LAN:
Standard Compliance:IEEE802.11 b/g/n
Frequency range:2.4 GHz band
Security:WPA™/WPA2™
(Encryption Type: TKIP/AES,
Authentication Type: PSK),
WEP (64 bit/128 bit)
OVIDEO SECTION
Signal system:PAL/NTSC
Video output
Output level:1.0 Vp-p (75 Ω)
Output connector:Pin jack (1 system)
HDMI AV Output*
Output connector:Type A (19 pin)
HDMI AV Input*
Input connector:Type A (19 pin) 2 system
LASER Specification
Class 1 LASER Product
Wave length:
790 nm (CDs) / 660 nm (DVDs) / 405 nm (BDs)
Laser power:
No hazardous radiation is emitted with the safety protection
* This unit supports “HDAVI Control 5” function.
Note:
14
4.1.Others (Licences)
15
16
5General/Introduction
5.1.VIERA Link™ “HDAVI Control™”
5.2.Enjoying BD-LIVE
17
5.3.Enjoying 3D Video and Photos
5.4.Playable Media
18
19
5.5.File Extension Type Support (MP3/JPEG/DivX/MKV/FLAC/WAV/MPO)
20
6Location of Controls and Components
6.1.Remote Control Key Button Operations
21
6.2.Main Unit Key Button Operations
22
7Installation Instructions
Turn off all equipment before connection and read the appropriate operating instructions.
Do not connect the AC power supply cord until all other connections are completed.
7.1.Speaker Connection
7.2.Connection to a TV
23
7.3.FM Antenna Connection
7.4.Connection to the Network
24
7.5.Playing Back Contents on the DLNA Server (DLNA)
25
7.6.Enjoying Network Service (NETFLIX, etc.)
26
8Operating Instructions
8.1.Taking out the Disc from Drive Unit when the Disc cannot be ejected by
OPEN/CLOSE button
8.1.1.Forcible Disc Eject
8.1.2.When the Disc Eject can not be done
1. Turn off the power and pull out AC cord.
2. Put the unit so that bottom can be seen.
3. Insert paper clips, etc. into the hole on the bottom of Drive and slide the paper clips, etc. in the direction of the arrow t o eject
tray slightly.
27
4. Gently pull out the tray.
5. Remove the disc.
8.2.Using the iPod/iPhone
28
8.2.1.iPod /iPhone Connection
29
8.2.2.iPod /iPhone Playback
30
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