20.4. (D) Sub Panel P.C.B. & (I) USB P.C.B. (Side A & B)
20.5. (E) Power P.C.B.
20.6. (H) Transformer P.C.B.
21 Illustration of ICs, Transistors and Diodes
22 Terminal Function of IC's
22.1. IC7001 (MN6627954MA) Servo Processor,Digital Signal
Processor/Digital filter and D/A Converter
22.2. IC7002 (BA5948FPE2) IC 4CH Drive
22.3. IC2801 (C2CBYY00083) System Microprocessor
23 Exploded Views
23.1. Cabinet Parts Location
23.2. Deck Mechanism Parts Location (RAA4403-S)
23.3. Packaging
24 Replacement Parts List
59
60
61
63
64
65
67
69
69
70
74
75
76
78
79
80
81
82
83
84
85
86
87
89
90
90
91
91
93
93
95
96
97
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SA-AK350GCP
1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, ensure that all the protective devices such as insulation barriers and insulation papers shields are properly
installed.
3. After servicing, check for leakage current checks to prevent from being exposed to shock hazards.
1.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Using an ohmmeter measure the resistance value, between the jumpered AC plug and each expose d metallic cabine t part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the
chassis, the reading should be between 1MΩ and 5.2MΩ.
When the exposed metal does not have a return path to the chassis, the reading must be
1.1.2. Leakage Current Hot Check (See Figure 1)
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitor, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may
be used to make the hot checks, leakage current must not exceed 1/2 milliamp. Should the measurement is out of the limits
specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to
the customer.
.
Fig. 1
1.2. Before Use
Be sure to disconnect the mains cord before adjusting the voltage selector.
Use a minus(-) screwdriver to set the voltage selector (on the rear panel) to the voltage setting for the area in which the unit will
be used. (If the power supply in your area is 110V or 120V, set to the “127V” position.)
Note that this unit will be seriously damaged if this setting is not made correctly. (There is no voltage selector for some countries,
the correct voltage is already set.)
1.3. Before repair and adjustment
Disconnect AC power, discharge Power Capacitors C5101 , C5104, C5171 , C5172, C5920, C5940 and C5950 through a 10Ω,5W
resistor to ground.
DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.
Current consum ption at AC 110 ~ 127V, 60 Hz in NO SIGNAL mode (volume min at CD mode) should be ~ 500mA.
Current consum ption at AC AC 220 ~ 240V, 50 Hz in NO SIGNAL mode (volume min at CD mode) should be ~ 350mA.
1.4. Protection Circuitry
The protection circuitry may have operated if either of the following conditions are noticed:
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SA-AK350GCP
·No sound is heard when the power is turned on.
·Sound stops during a performance.
The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are
“shorted”, or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
If this occurs, follow the procedure outline s below:
1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.
Note :
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.
1.5. Safety Part Information
Safety Parts List:
There are special components used in this equipment which are important for safety.
These parts are marked by
be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards. Do not modify the original design without
permission of manufacturer.
Table 1
Reference No.Part No.Part name & DescriptionRemarks
in the Schematic Diagrams & Replacement Parts List. It is essential that these critical parts should
F2K5D202BLA013FUSE
FP5920K5G702A00009FUSE PROTECTOR
FP5940K5G702Z00004FUSE PROTECT OR
FP5950K5G402A00025FUSE PROTECTOR
JK5950K2AA2B000011JK AC INLET
A2K2CQ2CA00006AC CORD
C5920ECA1JM102E1000 63V
360RAE0165A-VTRAVERSE UNIT
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handlin g any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potent ial shock reasons prior to applyin g power to the unit under test.
2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as aluminium
foil, to prevent electrostatic charge build up or exposu re of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or
comparable conductive material).
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7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installe d.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize body motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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3 Handling Precautions For Traverse Deck
The laser diode in the traverse deck (optical pickup) may break down due to potential difference caused by the static electricity of
clothes or our human body.
So, be careful of electrostatic breakdown during repair of the traverse deck (optical pickup).
·Way of handling the traverse deck (optical pickup)
1. Do not subject the traverse deck (optical pickup) to static electricity as it is extremely sensitive to electrical shock.
2. To prevent the breakdown of the laser diode, an antistatic shorting pin is inserted into the flexible board (FFC board).
3. Do not to apply excessive stress to the flexible board (FFC board). When removing or connecting the short pin, finish the job
in as short time as possible.
4. Do not turn the variable resistor for laser power adjustment. (It is pre-adjusted during production time)
Grounding for electrostatic breakdown prevention
1. Human body grounding
Use the anti-static wrist strap to discharge the static electricity from your body.
2. Work table grounding
Put a conductive material (sheet) or steel sheet on the area where the traverse deck (optical pickup) is place, and ground the
sheet.
Caution :
The static electricity of your clothes will not be grounded through the wrist strap. So, take care not to let your clothes touch the
traverse deck (optical pickup).
Caution when replacing the Traverse Deck
The traverse deck has a short point shorted with solder to protect the laser diode against electrostatics breakdown. Be sure to
remove the solder from the short point before making connections.
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4 Precaution of Laser Diode
Caution :
This product utilizes a laser diode with the unit turned "ON", invisible laser radiation is emitted from the pick up lens.
Wavelength : 780 nm
Maximum output radiation power from pick up : 100 µW/VDE
Laser radiation from pick up unit is safety level, but be sure the followings:
1. Do not disassemble the optical pick up unit, since radiation from exposed laser diode is dangerous.
2. Do not adjust the variable resistor on the pick up unit. It was already adjusted.
3. Do not look at the focus lens using optical instruments.
4. Recommend not to look at pick up lens for a long time.
CAUTION!
THIS PRODUCT UTILIZES A LASER.
USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT
IN HAZARDOUS RADIATION EXPOSURE.
n Use of Caution Labels
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SA-AK350GCP
5 About Lead Free Solder (PbF)
5.1. Service caution based on legal restrictions
5.1.1. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that
of the normal solder.
Definition of PCB Lead Free Solder being used
The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)
Service caution for repair work using Lead Free Solder (PbF)
· The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)
·To put lead free solder, it should be well molten and mixed with the original lead free solder.
·Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
·Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt
the lead free solder.
· Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30
degrees C (662±86°F).
Recommended Lead Free Solder (Service Parts Route.)
· The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
Note
* Ingredient: Tin (Sn), 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
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6 Accessories
SA-AK350GCP
Remote Control
FM Antenna Wire
AC Cord
AM Loop Antenna
Power Plug Adapter
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7 Operating Procedures
7.1. Main Unit Key Buttons Operations
12
7.2. Remote Control Key Buttons Operations
SA-AK350GCP
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8 New Features
8.1. Using the Music Port and Connecting & Playing a USB Mass Storage
Class Device
This feature enables you to enjoy music from a portable audio equipment.
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With reference to page 15 of the operating instruction manual.
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With reference to page 16 of the operating instruction manual.
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9 Self diagnosis and special mode setting
This unit is equipped with functions for checking and inspecting namely: Self-Diagnostic and Test Mode.
9.1. Service Mode Summary Table
The service modes can be activated by pressing various button combination on the main unit and remote control unit. Below is the
summary for the various modes for checking:
Player buttonRemote control button unitApplicationNote
[][4], [7]Entering into Doctor ModeRefer to the section, “9.2
ModeRemote control button unitApplicationNote
In Doctor ModeMain unit [],
[4]+[7]
[4]Set for cold start when reset start is executed the next timeRefer to the section, “9.2
[Muting]Clock SettingRefer to the section, “9.2
[0]Tape Eject TestRefer to the section, “9.2
[DIMMER]All segment display for the FLRefer to the section, “9.2
Display firmware version and EEPROM checksumRefer to the section,
Special Mode Table 1 for
more information.
“9.2.1 for more
information.
for more information.
for more information.
for more information.
for more information.
for more information.
9.2. Special Mode Table 1
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9.2.1. EEPROM Checksum (ROM Correction)
Purpose: To check for microprocessor firmware version and EEPROM checksum (ROM correction).
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Below are the procedures for this mode.
Step 1: Enter into Doctor mode (for more information, refer to section 9.2 on the key operation to enter into this mode.
Step 2: Check for firmware version and EEPROM checksum (By pressing STOP button on main unit followed by “4” and “7” on
remote control).
· W hen entering into DOCTOR MODE, the firmware version and checksum data of EEPROM (if applicable) will appear on FL
display. Below is the information on the EEPROM IC (ROM correction) under 3 possible situations:
1. In the case that the correction point existence data is other than 0 (ie. correction file exists), EEPROM checksum display for
the microprocessor shall be made after calculating checksum by summing up the content of data area from EEPROM IC.
2. In the case when no EEPRO M IC is installed. It is display as below (no display of checksum data)
3. In cases that the filename is different even though a EEPROM is installed, or no correction file exists, [NG] shall be displayed
(the correction point existence data is set to 0 at this condition).
Note: Microprocessor firmware refers to version number for microprocessor IC located on PANEL P.C.B.. It is subject to change
which would be update d accordingly. ROM correction checksum refers to the HEX code that is display ed upon key button s pressed
if an EEPROM is loaded in the unit.
9.3. Reliability Test Mode (CRS1 Mechanism)
Below is the process flow chart of ageing for the CD changer unit. (CRS1)
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9.4. Error code Table Display
Self-Diagnosis Function (refer Section 9.2) provides information on any problems occuring for the unit and its respective
components by display ing the error codes. These error code such as U**, H** and F** are stored in memory and held unless it is
cleared.
The error code is automatically display after entering into self-diagnostic mode.
9.4.1. Error Code Table for Deck Mechanism
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9.4.2. Error Code Table For CD Changer Block
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9.4.3. Error Code Table For Power Supply
9.4.4. CRS1 Error Code display
CRS1 Error Code display
1. The errors that occured in CRS1 Mechanism can be recalled and displayed, in the order of the occurence under self-diagnostic
for procedures to enter this mode.
· Only the first 5 errors will be memorized (in backup memory). The subsequence error shall be ignored and not memorize.
For system with EEPROM as memory backup,memory space in EEPROM is neccesary.
2. To display all error code memorized
In CRS1 Self-Diagnostic mode, press [SINGLE CHANGE] to display subsequence error code.
It shall repeat after reaching error no. 5.
e.g.:
[1____IHMS]→ [SINGLE CHANGE]
[2____ITOP]→ [SINGLE CHANGE]
[3____HOME]→ [SINGLE CHANGE]
[4____LOAD]→ [SINGLE CHANGE]
[5_____UDD]→ [SINGLE CHANGE]
3. To clear the error code memory
In CRS1 Self-Diagnostic mode, long press [SINGLE CHANGE] key (2s or more)
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SA-AK350GCP
10 Assembling and Disassembling
10.1. Caution
Special Note:
This model uses a new CD changer unit CRS1. In this following section does not contain the necessary disassembly &
assembly information for the CD changer unit (CRS1) except the disasembly & assembly of traverse unit. Kindly refer to the
original service manua l for the CD changer unit. (Order No. MD0509368C0).
“ATTENTION SERVICER”
Some chassis components may have sharp edges. Be careful when disassembling and servicing.
1. This section describes procedures for checking the operation of the major printed circuit boards and replacing the main
components.
2. For reassembly after operation checks or replacement, reverse the respective procedures.
Special reassembly procedures are described only when required.
3. Select items from the following index when checks or replacement are required.
4. Refer to the Parts No. on the page of “Parts Location and Replacement Parts List” (Section 24), if necessary.
Caution:
After replacing of CD Changer Unit, ageing test is necessary. Please confirm operation for CD Changer Unit.
Below is the list of disassembly sections
·Disasse mbly of Top Cabinet
·Disasse mbly of Rear Panel
·Disasse mbly of CD Changer Unit (CRS1)
·Disasse mbly of Main P.C.B.
·Disasse mbly of Transformer P.C.B.
·Disasse mbly of Power P.C.B.
·Disasse mbly of Front Panel Unit
·Disasse mbly of Panel P.C.B.
·Disasse mbly of USB P.C.B.
·Disasse mbly of Tact Switch P.C.B.
·Disasse mbly of Deck Mechanism Unit
·Disasse mbly for Deck P.C.B.
·Disasse mbly of Traverse Unit
·Disasse mbly of Deck Mechanism
·Disasse mbly of Deck Mechanism P.C.B.
·Disasse mbly cassette lid
·Rectification for tape jam problem
Below shown is part no. of different screws types used:
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10.2. Disassembly flow chart
The following chart is the procedure for disassembling the casing and inside parts for internal inspection when carrying out the
servicing.
To assemble the unit, reverse the steps shown in the chart as below.
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10.3. Main Parts Location
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