Panasonic MS KX-MB783BR Schematic

ORDER NO.KMF0801151CE

Multi-Function printer

Model No. KX-MB783BR

(for Brazil)

© 2008 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and distribu­tion is a violation of law.

KX-MB783BR

TABLE OF CONTENTS

PAG E PAG E

1 Safety Precautions -----------------------------------------------3

1.1. FOR SERVICE TECHNICIANS ------------------------3

1.2. AC CAUTION -----------------------------------------------3

1.3. PERSONAL SAFETY PRECAUTIONS --------------4

1.4. SERVICE PRECAUTIONS ------------------------------4

2Warning--------------------------------------------------------------5

2.1. ABOUT LEAD FREE SOLDER (PbF: Pb free) -----5

2.2. Discarding of P. C. Board --------------------------------6

2.3. INSULATION RESISTANCE TEST--------------------6

2.4. BATTERY CAUTION--------------------------------------6

2.5. LASER BEAM AND FUSER UNIT SECTION ------6

3 Specifications ------------------------------------------------------7 4 General/Introduction---------------------------------------------8

4.1. OPTIONAL ACCESSORIES ----------------------------8

4.2. TRANSLATION LISTS------------------------------------8

4.3. ERROR MESSAGE ---------------------------------------9

5Features------------------------------------------------------------ 11

5.1. General Features----------------------------------------- 11

5.2. HARDWARE REQUIREMENTS FOR MULTI­FUNCTION SOFTWARE------------------------------- 11

6 Technical Descriptions---------------------------------------- 12

6.1. CONNECTION DIAGRAM ----------------------------- 12

6.2. GENERAL BLOCK DIAGRAM------------------------ 13

6.3. MAIN BOARD SECTION------------------------------- 15

6.4. NCU SECTION ------------------------------------------- 27

6.5. ITS (Integrated telephone System) and
MONITOR SECTION------------------------------------ 28

6.6. CIS CONTROL SECTION ----------------------------- 29

6.7. MOTOR DRIVE SECTION----------------------------- 30

6.8. TIMING CHART AND WAVE FORM OF
SCANNER MOTORS ----------------------------------- 34

6.9. FAN MOTOR SECTION-------------------------------- 37

6.10. SOLENOID DRIVER SECTION ---------------------- 39

6.11. LSU (Laser Scanning Unit) SECTION -------------- 40

6.12. SENSORS AND SWITCHES SECTION ----------- 42

6.13. OPERATION BOARD SECTION--------------------- 50

6.14. LCD SECTION-------------------------------------------- 51

6.15. HVPS (High Voltage Power Supply)
SECTION--------------------------------------------------- 52

6.16. HEAT LAMP CONTROL CIRCUIT------------------- 54

6.17. Main Board Section-------------------------------------- 59

6.18. POWER SUPPLY BOARD SECTION --------------62

6.19. Mechanical Operation----------------------------------- 63

7 Location of Controls and Components------------------ 65

7.1. OVERVIEW------------------------------------------------ 65

7.2. CONTROL PANEL--------------------------------------- 66

8 Installation Instructions---------------------------------------67

8.1. INSTALLATION ------------------------------------------- 67

8.2. CONNECTIONS------------------------------------------ 78

9 Operating Instructions ---------------------------------------- 79

9.1. YOUR LOGO --------------------------------------------- 79

10 Test Mode----------------------------------------------------------81

10.1. TEST FUNCTIONS -------------------------------------- 81

11 Se rvic e Mode -----------------------------------------------------85

11.1. PROGRAMMING AND LISTS ------------------------85

11.2. USER MODE (The list below is an example of
the SYSTEM SETUP LIST the unit prints out.)--- 89

11.3. SERVICE MODE SETTINGS (Example of a
printed out list)-------------------------------------------- 90

11.4. HISTORY (Example of a printed out list) ---------- 91

12 Troubleshooting Guide --------------------------------------- 94

12.1. USER RECOVERABLE ERRORS ------------------ 94

12.2. REMOTE PROGRAMMING -------------------------- 96

12.3. TROUBLESHOOTING DETAILS ------------------- 102

12.4. DOCUMENT JAMS (AUTO DOCUMENT
FEEDER) ------------------------------------------------- 181

12.5. RECORDING PAPER JAM --------------------------183

13 Service Fixture & Tools -------------------------------------- 191 14 Disassembly and Assembly Instructions ------------- 192

14.1. ADF SECTION ------------------------------------------193

14.2. REMOVE ADF SECTION (1) ------------------------ 194

14.3. REMOVE ADF SECTION ---------------------------- 195

14.4. REMOVE TOP COVER SECTION-----------------196

14.5. REMOVE SCANNER GLASS SECTION --------- 197

14.6. REMOVE OPERATION PANEL SECTION ------ 198

14.7. LEFT SIDE SECTION --------------------------------- 199

14.8. REMOVE MAIN BOARD -----------------------------199

14.9. REMOVE GEAR CHASSIS SECTION ------------ 200

14.10. REMOVE PAPER FEED ROLLER----------------- 201

14.11. RIGHT SIDE SECTION -------------------------------201

14.12. REMOVE RIGHT SIDE COVER SECTION------202

14.13. LOWER SIDE CABINET SECTION --------------- 203

14.14. REMOVE RIGHT CASSETTE GUIDE ------------204

14.15. REMOVE PICK UP BOARD ------------------------- 204

14.16. REMOVE HIGH VOLTAGE POWER BOARD--- 205

14.17. REMOVE PICK UP ROLLER UNIT ---------------- 206

14.18. REMOVE LOW VOLTAGE POWER BOARD --- 207

14.19. REMOVE FUSER UNIT------------------------------- 208

14.20. Installation Position of The Lead--------------------209

15 Maintenance----------------------------------------------------- 215

15.1. MAINTENANCE ITEMS AND COMPONENT
LOCATIONS ---------------------------------------------215

15.2. MAINTENANCE----------------------------------------- 217

15.3. PRINTING OPERATION PRINCIPLE -------------222

15.4. TERMINAL GUIDE OF THE ICs
TRANSISTORS AND DIODES----------------------227

15.5. HOW TO REPLACE THE FLAT PACKAGE IC - 229

15.6. MAIN BOARD SECTION -----------------------------231

15.7. TEST CHART-------------------------------------------- 233

16 Schematic Diagram ------------------------------------------- 235

16.1. For Schematic Diagram -------------------------------235

16.2. MAIN BOARD -------------------------------------------236

16.3. OPERATION BOARD ---------------------------------246

16.4. SENSOR BOARD --------------------------------------247

17 Printed Circuit Board-----------------------------------------249

17.1. MAIN BOARD -------------------------------------------249

17.2. OPERATION BOARD ---------------------------------251

17.3. SENSOR BOARD --------------------------------------253

18 Exploded View and Replacement Parts List---------- 256

18.1. CABINET, MECHANICAL AND ELECTRICAL
PARTS LOCATION-------------------------------------256

18.2. REPLACEMENT PARTS LIST ----------------------269

2

KX-MB783BR

1 Safety Precautions

1. Before servicing, unplug the AC power cord to prevent an electric shock.

2. When replacing parts, use only the manufacturer's recommended components.

3. Check the condition of the power cord. Replace if wear or damage is evident.

4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.

5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent the customer from being exposed to shock hazards.

1.1. FOR SERVICE TECHNICIANS

• Repair service shall be provided in accordance with repair technology information such as service manual so as to pre-

vent fires, injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.

2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.

3. FASTON terminals shall be plugged straight in and unplugged straight out.

• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover the plastic part's boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on the worktable.

4. Do not touch the IC or LSI pins with bare fingers.

1.2. AC CAUTION

For safety, before closing the lower cabinet, please make sure of the following precautions.

1. The earth lead is fixed with the screw.

2. The AC connector is connected properly.

3

KX-MB783BR

1.3. PERSONAL SAFETY PRECAUTIONS

1.3.1. MOVING SECTIONS OF THE UNIT

Be careful not to let your hair, clothes, fingers, accessories, etc., become caught in any moving sections of the unit.
The moving sections of the unit are the rollers and a gear. There is a separation roller and a document feed roller which are rotated
by the document feed motor. A gear rotates the two rollers. Be careful not to touch them with your hands, especially when the unit
is operating.

1.3.2. LIVE ELECTRICAL SECTIONS

All the electrical sections of the unit supplied with AC power by the AC power cord are live.
Never disassemble the unit for service with the AC power supply plugged in.

CAUTION:

AC voltage is supplied to the primary side of the power supply unit. Therefore, always unplug the AC power cord before disas­sembling for service.

1.4. SERVICE PRECAUTIONS

1.4.1. PRECAUTIONS TO PREVENT DAMAGE FROM STATIC ELECTRICITY

Electrical charges accumulate on a person. For instance, clothes rubbing together can damage electric elements or change their
electrical characteristics. In order to prevent static electricity, touch a metallic part that is grounded to release the static electricity.
Never touch the electrical sections such as the power supply unit, etc.

4

KX-MB783BR

2Warning

2.1. ABOUT LEAD FREE SOLDER (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con­tains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver, (Ag), and Copper, (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.

Caution

• PbF solder has a melting point that is 50° ~ 70° F, (3 0 ° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera­ture control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please be careful not to
heat too long.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, ( 6 0 0 °C).

• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible and
be sure that any remaining is melted prior to applying the Pb solder.

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).

2.1.1. SUGGESTED PBF SOLDER

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac­turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

5

KX-MB783BR

2.2. Discarding of P. C. Board

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

2.3. INSULATION RESISTANCE TEST

1. Unplug the power cord and short the two prongs of the plug with a jumper wire.

2. Turn on the power switch.

3. Measure the resistance value with an ohmmeter between the jumpered AC plug and each exposed metal cabinet part (screw heads, control shafts, bottom frame, etc.). Note: Some exposed parts may be isolated from the chassis by design. These will read infinity.

4. If the measurement is outside the specified limits, there is a possibility of a shock hazard.

2.4. BATTERY CAUTION

CAUTION

Danger of explosion if the battery is replaced incorrectly. Replace only with the same or equivalent type recommended by the
manufacturer. Dispose used batteries according to the manufacturer s instructions.

The lithium battery is a critical component (type
No.CR2354). Please observe for the proper polarity and
replacing it and the soldering the replacement litium battery in.

exact location when

2.5. LASER BEAM AND FUSER UNIT SECTION

• The printer of this unit utilizes a laser. Use of controls or adjustments or performance of procedures other than those specified
herein may result in hazardous radiation exposure.

• The fuser unit is inside of the unit and gets hot. Do not touch it when removing the jammed paper or cleaning the lower glass.

6

KX-MB783BR

3 Specifications

Applicable Lines: Public Switched Telephone Network Document Size: Max. 216 mm in width

Effective Scanning Width: 208 mm Effective Printing Width: Letter/ Legal: 208 mm

Transmission Time*: Approx. 4 s/page (ECM-MMR Memory transmission)** Scanning Density: Scanning resolution:

Photo resolution: 64-level Scanner Type: Color Contact Image Sensor Printer Type: Laser printer Data Compression System: Modified Huffman (MH), Modified READ (MR), Modified Modified READ (MMR) Modem Speed: 33,600 / 31,200 / 28,800 / 26,400 / 24,000 / 21,600 / 19,200 / 16,800 / 14,400 / 12,000 /

Operating Environment: 10°C—32.5°C, 20—70% RH (Relative Humidity) Dimensions (H×W×D): Approx. height 305 mm × width 420 mm × depth 445 mm Mass (Weight): Approx. 13kg Power Consumption: Standby: Approx. 5.5 W

Power Supply: 127V AC, 60Hz Memory Capacity (for operation and

storing memory): Fax Memory Capacity: 2 MB in total

Laser diode properties: Laser output: Max. 5 mW

Print Speed: 18 ppm (page per minute) Printing Resolution: 600 × 600 dpi

Max. 600 mm in length

A4: 202 mm

Up to 600 × 1200 dpi (Optical)
Up to 9600 × 9600 dpi (Interpolated)

Copy resolution:

Up to 600 × 600 dpi (Scanner Glass)
Up to 600 × 300 dpi (Automatic Document Feeder)

FAX res olut ion:

Horizontal:
8 pels/mm
Ver tica l:

3.85 lines/mm-STANDARD

7.7 lines/mm-FINE/PHOTO

15.4 lines/mm-SUPER FINE

9,600 / 7,200 / 4,800 / 2,400 bps; Automatic Fallback

Preheat: Approx. 65 W
Copy: Approx. 320 W
Maximum: Approx. 900 W (When the fuser lamp turns on)

32 MB

Approx. 170 pages of memory reception
Approx. 150 pages of memory transmission
(Based on the ITU-T No. 1 Test Chart in standard resolution.)

Wave length: 760 nm—810 nm
Emission duration: Continuous

* Transmission speed depends upon the contents of the pages, resolution, telephone line conditions and capability of the other
party’s machine.
** Transmission speed is based upon the ITU-T No. 1 Test Chart. (Refer to ITU-T No.1 TEST CHART (P.233).) If the capability of
the other party's machine is inferior to your unit, the transmission time may be longer.

Note:

• Design and specifications are subject to change without notice.

• The pictures and illustrations in these instructions may vary slightly from the actual product.

7

KX-MB783BR

4 General/Introduction

4.1. OPTIONAL ACCESSORIES

Model No. Description Specifications
KX-FAT92A Replacement toner cartridge 1 toner cartridge
KX-FAD93A Replacement drum unit 1 drum unit

4.2. TRANSLATION LISTS

4.2.1. HELP FUNCTION

8

4.3. ERROR MESSAGE

4.3.1. DISPLAY

KX-MB783BR

9

KX-MB783BR

4.3.2. REPORT

4.3.3. OTHERS

10

5 Features

5.1. General Features

General

• Help function
Display:

1. BASIC SETTINGS

2. FEATURE LIST

3. DIRECTORY

4. FAX RECEIVING

5. COPIER

6. REPORTS

7. CALLER ID

• LCD (Liquid Crystal Display) readout

Plain Paper Facsimile Machine

Output tray (approx. 100+50 sheets)
Letter/A4/Legal, G3 compatible
Automatic document feeder (Up to 20 sheets)
Quick scan
Resolution: Standard/Fine/Super fine/Photo (64 level).
STANDARD: For printed or typewritten originals with normal-

KX-MB783BR

sized characters.
FINE: For originals with small printing.
SUPER FINE: For originals with very small printing.
PHOTO: For originals containing photographs, shaded draw­ing, etc.
Broadcast

• 250-sheet paper capacity (60 g/m

Distinctive ring detection.

Large Memory... Performed by DRAM
Approx. 150 pages of memory transmission
Approx. 170 pages of memory reception

Enhanced Copier Function

Multi-copy function (up to 99 copies)
Enlargement and reduction
Separator

64-Level halftone

2

~ 75 g/m2)

5.2. HARDWARE REQUIREMENTS FOR MULTI-FUNCTION SOFTWARE

To use Multi-Function Station on your computer, the following are required:

Operating System:

Windows 98 / Windows Me / Windows 2000 / Windows XP / Windows Vista

CPU:

Windows 98: Pentium® 90 MHz or faster
Windows Me: Pentium 150 MHz or faster
Windows 2000: Pentium 166 MHz or faster
Windows XP: Pentium 300 MHz or faster
Windows Vista: Recent Processor (x86) 800 MHz or higher processor

RAM:

Windows 98: 24 MB (32 MB or more recommended)
Windows Me: 32 MB (64 MB or more recommended)
Windows 2000: 64 MB or more
Windows XP: 128 MB or more
Windows Vista: 512 MB or more

Other Hardware:

CD-ROM drive
Hard disk drive with at least 150 MB of available space
USB interface
LAN interface (10Base-T / 100Base-TX)

Other:

Internet Explorer® 5.0 or later

TM

operating system

11

KX-MB783BR

6 Technical Descriptions

6.1. CONNECTION DIAGRAM

12

6.2. GENERAL BLOCK DIAGRAM

MAIN UNIT

SOC (IC300)

This custom IC is used for general MFP operations.

1) CPU ARM9 operating at 250MHz.

2) SDRAM Controller Controls SDRAM Memory.

3) USB Controller with PHY Apply to USB2.0 HS

4) Scanner I/F Controls the CIS and AFE, and process the scan images.

5) LSU I/F Controls the polygon motor and outputs the VIDEO signal to LSU.

6) MOTOR I/F Controls the DC motor and Stepping Motor.

7) FAN I/F Controls FAN MOTOR and detect the rotation of FAN MOTOR.

8) OPERATION PANEL I/F Serial interface with Operation Panel.

9) SENSOR I/F Detects the sensor signal.

10) I/O PORT I/O Port Interface.

11) A/D, D/A converter Sends beep tones, etc.
Convert the analog signal to the digital signal.

12) RTC Real time clock.

13) MODEM Performs the modulation and the demodulation for FAX communication.

14) Analog Front End I/F Controls the DAA device for TEL/FAX function.

15) LAN Controller Ethernet Control.

ROM (IC402)

This 8MB FLASH ROM contains all of the program instructions on the unit operations.
And support the backup of user setting and FAX receive data.

KX-MB783BR

SYNCHRONOUS DYNAMIC RAM (IC400)

This 256Mbit SDRAM is used for CPU work and receiving memory and page memory.

POWER SUPPLY

DC-DC converters generate 3.3V and 1.2V for system power.
Regurator generates 5V for peripheral devices.

TEL/FAX I/F

Composed of ITS circuit and NCU circuit.
3 ICs called SDAA(Silicon Direct Access Arrangement) control Telephone line, Speaker, and Handset.

READ SECTION

CIS Unit to read transmitted documents.
CIS Unit is connected to FLATBED transit Unit.
Scan data is converted by AFE(IC503).

MOTOR

This model has 1 DC motor and 2 stepping motors.
IC300 drives the DC motor for printing.
IC502 and IC700 drive the stepping motor for Auto Document Feeder motor and CIS carriage.

LSU

Forms the images on the OPC DRUM by rotating polygon motor and reflecting the laser beam against polygon.

SENSORS

Composed of 2 switches and 5 sensors.

POWER SUPPLY BOARD

Supplies +24V and +7V to the Main unit and controls the Heat Lamp.

HIGH VOLTAGE POWER SUPPLY BOARD

Supplies bias need for the printing operation: bias of the DRUM, Developing and Transcription.

FIXING UNIT

Composed heat lamp, thermistor and thermostats.

13

KX-MB783BR

Speaker

Thermistor

ater)

(He

Varistor

CN57

tr or

CN58

Hook SW

or

HVU

CN1

Hand Set

nRP Se s

IT SensorEX

CN53 CN52

egis e Sens ePTOP S nsor
R

CN50

TEL

CN200

CN100

IC100, IC101

CN65

CN508

CN64

CN66

or

IC

IC50

Hole

Toner Sens

CN67

)

51
CN

r

nso

Document Sensor

ADF motor

TEL

CN505

CN56

CN700

EXT

k

CN101

(TNV)

DAA bloc

1

CN70

Motor

Driver

(ADF)

IC700

ge motor

SWPS

CN63

ck Up Se

i
P

t

AC inle

S

Carria

CN60

Ope

CN62

CN61

Thermistor

G/A

nsit

FB Tra

CN59

(Room)

CN2

IC1

Color CI

CN509

0

CN51

CN511

Motor

AFE

Main Board

CN514

Driver

IC503

(FB)

7

CN50

IC502

SoC

)

bit

IC400

(256M

SDRAM

FLASH

(32/64Mbit)

CN506

(sirius

IC402

IC300

Lite)

CN502

Phy

0

CN30

USB

LAN

0

CN75

CN504

CONVERTER

DC-DC

CN500

CN501

AN motor (right
F

CN101

stat

ed

ed

Flat B

Flat B

LCD

2Line

Operation Panel Board

Thermo

id

AC cord set

Heater lamp

DC motor

Pick-up Soleno

Resist Solenoid

FAN motor (left)

(LSU)

Polygon motor

ostat

erm
Th

14

6.3. MAIN BOARD SECTION

[FAX Tx]

1. An analog image data is output from CIS unit to IC503.
IC503 decode the analog data to digital data, and output to IC300.
Scanner I/F in IC300 process image data and store it in IC400
through SDRAM I/F.

2. CPU compress the data in IC400.

3. CPU transfer the data to MODEM
and output it to TEL LINE through DAA circuit.

CN59

CN510

CN61

CN500

SDRAM

MODEM

Scanner

I/F

Print I/F

AFE

IC503

IC400

IC300

Main Board

FB tr ansit Board

CN300

SDRAM

I/F

CN750

LAN

USB

USB

I/F

CPU

DAA

IC100
IC101

PHY

LAN

I/F

DSPJBIG

CN100

IC750

CIS unit

LSU

TEL

LINE

PC

6.3.1. Data Flow

KX-MB783BR

[FAX Rx]

TEL

LINE

PC

LAN

USB

CIS unit

Main Board

IC100
IC101

DAA

CN100

IC750

PHY

CN750

CN300

MODEM

LAN

1. FAX data is input from TEL LINE to MODEM in IC300
through DAA circuit.

And then store it in IC400 through SDRAM I/F.

FB tr ansit Board

CN61

CN59

2. CPU decompress the data in IC400.

3. Print I/F retrieve the data from IC400 and output it to LSU.

USB

I/F

I/F

CPU

CN510

AFE

Scanner

IC503

IC300

DSPJBIG

Print I/F

SDRAM

I/F

I/F

CN500

IC400

SDRAM

LSU

15

KX-MB783BR

[PC Scan]

TEL

LINE

PC

LAN

USB

CIS unit

Main Board

IC100
IC101

DAA

CN100

IC750

PHY

CN750

CN300

MODEM

LAN

I/F

CN61

USB

I/F

FB tr ansit Board

CN59

CN510

CPU

AFE

Scanner

1. An analog image data is output from CISunit to IC503.
IC503 decode the analog data to digital data, and output to IC300.
Scanner I/F in IC300 process image data and store it in IC400
through SDRAM I/F.

2. If necessary, the data is compressed via DSP.

3. When you use the LAN, the data is output to PC

through the LAN I/F and PHY(IC750).
or
When you use the USB, the data is output to PC
through the USB I/F.

IC503

IC300

DSPJBIG

Print I/F

SDRAM

I/F

I/F

CN500

IC400

SDRAM

LSU

[PC print]

TEL

LINE

PC

LANLAN

USB

CIS unit

Main Board

IC100
IC101

DAA

CN100

IC750

PHY

CN750

CN300

MODEM

LAN

I/F

CN61

USB

I/F

FB tr ansit Board

CN59

CN510

CPU

AFE

Scanner

I/F

1. The print data is output from PC through LAN
and pass the PHY(IC750) and LAN I/F in IC300.
or
The print data is output from PC through USB
and pass the USB I/F in IC300.
then the data is stored in IC400 through SDRAM I/F.

2. Print I/F retrieve the data from IC400 and output it to LSU.

IC503

IC300

DSPJBIG

Print I/F

SDRAM

I/F

CN500

IC400

SDRAM

LSU

16

[Copy]

CIS unit

CN61

FB tr ansit Board

CN59

1. An analog image data is output from CISunit to IC503.
IC503 decode the analog data to digital data, and output to IC300.
Scanner I/F in IC300 process image data and store it in IC400
through SDRAM I/F.

2. If necessary, the data is compressed via JBIG.

3. Print I/F retrieve the data from IC400 and output it to LSU.

KX-MB783BR

PC

TEL

LINE

LAN

USB

Main Board

IC100
IC101

DAA

CN100

IC750

PHY

CN750

CN300

MODEM

LAN

I/F

USB

I/F

CPU

CN510

AFE

Scanner

I/F

IC503

DSPJBIG

Print I/F

IC300

SDRAM

I/F

LSU

CN500

IC400

SDRAM

17

KX-MB783BR

Description of Pin Distribution (IC300) SOC (System On Chip)

PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION
A02 LEDONB O 3.3V SCANNER INTERFACE
A03 NCCDON O 3.3V SCANNER INTERFACE
A04 AFEMCLK O 3.3V SCANNER INTERFACE
A05 NCCDCP O 3.3V NOT USED
A06 CCDCLK O 3.3V NOT USED
A07 PIO29 O 3.3V OPERATION PANEL INTERFACE
A08 PIO57 O 3.3V CARRIAGE MOTOR INTERFACE
A09 PIO53 O 3.3V CARRIAGE/ADF MOTOR INTERFACE
A10 PIO50 O 3.3V CARRIAGE/ADF MOTOR INTERFACE
A11 PIO46 O 3.3V FAN1 CONTROL
A12 PIO42 O 3.3V DC MOTOR INTERFACE
A13 NFRCE O 3.3V FLASH MEMORY CHIP SELECT
A14 FRMD0 I/O 3.3V FLASH MEMORY DATA BUS 0
A15 FRMD3 I/O 3.3V FLASH MEMORY DATA BUS 3
A16 FRMD7 I/O 3.3V FLASH MEMORY DATA BUS 7
A17 FRMA3 O 3.3V FLASH MEMORY ADDRESS BUS 3
A18 FRMA6 O 3.3V FLASH MEMORY ADDRESS BUS 6
A19 FRMA10 O 3.3V FLASH MEMORY ADDRESS BUS 10
A20 THRMAVDD - 3.3V POWER SUPPLY
A21 FRMA11 O 3.3V FLASH MEMORY ADDRESS BUS 11
A22 FRMA15 O 3.3V FLASH MEMORY ADDRESS BUS 15
A23 FRMA17 O 3.3V FLASH MEMORY ADDRESS BUS 17
A24 FRMA20 O 3.3V FLASH MEMORY ADDRESS BUS 20
A25 FRMA22 O 3.3V FLASH MEMORY ADDRESS BUS 22
AA01 SDMD8 I/O 3.3V SDRAM DATA BUS 8
AA02 SDMD9 I/O 3.3V SDRAM DATA BUS 9
AA03 SDMA7 O 3.3V SDRAM ADDRESS BUS 7
AA04 SDMA6 O 3.3V SDRAM ADDRESS BUS 6
AA23 VDD1.2 - 1.2V POWER SUPPLY
AA24 AFERST O 3.3V NCU INTERFACE
AA25 RING I 3.3V NCU INTERFACE
AA26 EXTINT I 3.3V NCU INTERFACE
AB01 SDMD10 I/O 3.3V SDRAM DATA BUS 10
AB02 SDMD11 I/O 3.3V SDRAM DATA BUS 11
AB03 SDMA5 O 3.3V SDRAM ADDRESS BUS 5
AB04 VDD1.2 - 1.2V POWER SUPPLY
AB23 VSS - GND GND
AB24 BTXD O 3.3V NCU INTERFACE
AB25 BRXD I 3.3V NCU INTERFACE
AB26 AFECLK O 3.3V NCU INTERFACE
AC01 SDMD12 I/O 3.3V SDRAM DATA BUS 12
AC02 SDMD13 I/O 3.3V SDRAM DATA BUS 13
AC03 SDMA4 O 3.3V SDRAM ADDRESS BUS 4
AC04 VSS - GND GND
AC05 VSS - GND GND
AC06 VDD1.2 - 1.2V POWER SUPPLY
AC07 TXD0 O 3.3V ETHERNET INTERFACE
AC08 TX_ER O 3.3V ETHERNET INTERFACE
AC09 RXD1 I 3.3V ETHERNET INTERFACE
AC10 VDD3.3 - 3.3V POWER SUPPLY
AC11 TEST I 3.3V NOT USED
AC12 USBREXT I 3.3V USB INTERFACE
AC13 VDD1.2 - 1.2V POWER SUPPLY
AC14 VDD3.3 - 3.3V POWER SUPPLY
AC15 USBXIN I 3.3V CRYSTAL(12MHz) INPUT
AC16 LSI_SCAN_ENABLE I 3.3V NOT USED
AC17 VDD1.2 - 1.2V POWER SUPPLY
AC18 NWDTRST O 3.3V WATCH DOG TIMER RESET OUTPUT
AC19 LSI_TN I 3.3V NOT USED
AC20 PSCIO2 I 3.3V INPUT PORT (FANDET1)
AC21 PSCIO6 O 3.3V NOT USED
AC22 VDD1.2 - 1.2V POWER SUPPLY
AC23 VSS - GND GND
AC24 ATXD O 3.3V NCU INTERFACE
AC25 BBITCLK I/O 3.3V NCU INTERFACE

18

PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION
AC26 BSPCLK I/O 3.3V NCU INTERFACE
AD01 SDMD14 I/O 3.3V SDRAM DATA BUS 14
AD02 SDMD15 I/O 3.3V SDRAM DATA BUS 15
AD03 VSS - GND GND
AD04 NBATRST I 3.3V BATTERY RESET INPUT
AD05 VDD2RTC - 1.2V POWER SUPPLY
AD06 CRS I 3.3V ETHERNET INTERFACE
AD07 TXD1 O 3.3V ETHERNET INTERFACE
AD08 RX_DV I 3.3V ETHERNET INTERFACE
AD09 RXD2 I 3.3V ETHERNET INTERFACE
AD10 RX_ER I 3.3V ETHERNET INTERFACE
AD11 CLKSEL I 3.3V NOT USED
AD12 USBVSSA33_BIAS - GND GND
AD13 USBVSSA33 - GND GND
AD14 USBVDDA12_SQ - 1.2V POWER SUPPLY
AD15 USBVSSA12 - GND GND
AD16 LSI_TRSTN I 3.3V NOT USED
AD17 LSI_TDO O 3.3V NOT USED
AD18 NRST I 3.3V SYSTEM RESET INPUT
AD19 HTRCTL O 3.3V HEATER CONTROL
AD20 PSCIO3 I 3.3V INPUT PORT (POUT)
AD21 PSCIO7 O 3.3V NOT USED
AD22 PSCIO15 I 3.3V INPUT PORT (RPS)
AD23 NC - - NOT USED
AD24 VSS - GND GND
AD25 ASPCLK I/O 3.3V NCU INTERFACE
AD26 ARXD I 3.3V NCU INTERFACE
AE01 SDLDM1 O 3.3V SDRAM DQML1
AE02 VSS - GND GND
AE03 SYSPLLVSS1 - GND GND
AE04 RTCCLKOUT O 3.3V CRYSTAL(32.768KHz) OUTPUT
AE05 RTCPWRDWN I 3.3V RTC POWER DOWN
AE06 TX_CLKI I 3.3V ETHERNET INTERFACE
AE07 TXD2 O 3.3V ETHERNET INTERFACE
AE08 RX_CLKI I 3.3V ETHERNET INTERFACE
AE09 RXD3 I 3.3V ETHERNET INTERFACE
AE10 MDC O 3.3V ETHERNET INTERFACE
AE11 NC - - NOT USED
AE12 USBID O 3.3V NOT USED
AE13 USBDM I/O 3.3V USB INTERFACE
AE14 USBVSSA12_SQ - GND GND
AE15 USBVDDA12PLL - 1.2V POWER SUPPLY
AE16 USBVDDA12 - 1.2V POWER SUPPLY
AE17 LSI_TDI I 3.3V NOT USED
AE18 LSI_PROCMON O 3.3V NOT USED
AE19 LSI_IDDT I 3.3V NOT USED
AE20 PSCIO1 I 3.3V INPUT PORT (PICK)
AE21 PSCIO5 O 3.3V NOT USED
AE22 PSCIO13 I 3.3V INPUT PORT (TNR)
AE23 MDMCLKOUT O 3.3V CRYSTAL(24.576MHz) OUTPUT
AE24 MDMPLLVDD - 3.3V POWER SUPPLY
AE25 VSS - GND GND
AE26 ABITCLK I/O 3.3V NCU INTERFACE
AF02 SYSPLLVDD1 - 3.3V POWER SUPPLY
AF03 VDD3.3OSC - 3.3V POWER SUPPLY
AF04 RTCCLKIN I 3.3V CRYSTAL(32.768KHz) INPUT
AF05 COL I 3.3V ETHERNET INTERFACE
AF06 TX_EN O 3.3V ETHERNET INTERFACE
AF07 TXD3 O 3.3V ETHERNET INTERFACE
AF08 RXD0 I 3.3V ETHERNET INTERFACE
AF09 MDIO I/O 3.3V ETHERNET INTERFACE
AF10 MGTINT I 3.3V ETHERNET INTERFACE
AF11 USBVBUS O 3.3V USB INTERFACE
AF12 USBVDDA33_BIAS - 3.3V POWER SUPPLY
AF13 USBDP I/O 3.3V USB INTERFACE
AF14 USBVDDA33 - 3.3V POWER SUPPLY
AF15 USBVSSA12PLL - GND GND

KX-MB783BR

19

KX-MB783BR

PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION
AF16 USBXOUT I 3.3V CRYSTAL(12MHz) OUTPUT
AF17 LSI_TMS I 3.3V NOT USED
AF18 LSI_TCK I 3.3V NOT USED
AF19 LSI_CW_TAP I 3.3V NOT USED
AF20 PSCIO0 I 3.3V INPUT PORT (REGIST)
AF21 PSCIO4 O 3.3V NOT USED
AF22 PSCIO12 I 3.3V INPUT PORT (POUT)
AF23 PSCIO14 I 3.3V INPUT PORT (DOCU)
AF24 MDMCLKIN I 3.3V CRYSTAL(24.576MHz) INPUT
AF25 MDMPLLVSS - GND GND
B01 AFEADC0 I 3.3V NOT USED
B02 VSS - GND GND
B03 LEDONG O 3.3V SCANNER INTERFACE
B04 AFERSMP O 3.3V NOT USED
B05 AFEVSMP O 3.3V SCANNER INTERFACE
B06 NCCDRS O 3.3V SCANNER INTERFACE
B07 PIO30 I/O 3.3V OPERATION PANEL INTERFACE
B08 MMPWR O 3.3V NOT USED
B09 PIO54 O 3.3V CARRIAGE/ADF MOTOR INTERFACE
B10 PIO51 O 3.3V CARRIAGE/ADF MOTOR INTERFACE
B11 PIO47 O 3.3V NOT USED
B12 PIO43 O 3.3V DC MOTOR INTERFACE
B13 NFROE O 3.3V FLASH MEMORY CHIP OUTPUT ENABLE
B14 FRMD1 I/O 3.3V FLASH MEMORY DATA BUS 1
B15 FRMD4 I/O 3.3V FLASH MEMORY DATA BUS 4
B16 FRMA0 O 3.3V FLASH MEMORY ADDRESS BUS 0
B17 FRMA4 O 3.3V FLASH MEMORY ADDRESS BUS 4
B18 FRMA7 O 3.3V FLASH MEMORY ADDRESS BUS 7
B19 THRMAVSS - GND GND
B20 TONE O 3.3V ANALOG(TONE) OUTPUT
B21 FRMA12 O 3.3V FLASH MEMORY ADDRESS BUS 12
B22 FRMA16 O 3.3V FLASH MEMORY ADDRESS BUS 16
B23 FRMA19 O 3.3V FLASH MEMORY ADDRESS BUS 19
B24 FRMA21 O 3.3V FLASH MEMORY ADDRESS BUS 21
B25 VSS - GND GND
B26 DOTPLLVSS - GND GND
C01 AFEADC3 I 3.3V NOT USED
C02 AFEADC1 I 3.3V NOT USED
C03 VSS - GND GND
C04 LEDONR O 3.3V SCANNER INTERFACE
C05 OEB O 3.3V NOT USED
C06 CCDSH O 3.3V SCANNER INTERFACE
C07 PIO31 O 3.3V OPERATION PANEL INTERFACE
C08 OPMPWR O 3.3V NOT USED
C09 PIO55 O 3.3V CARRIAGE/ADF MOTOR INTERFACE
C10 PIO52 O 3.3V CARRIAGE/ADF MOTOR INTERFACE
C11 PIO49 O 3.3V OUTPUT PORT(HSSPMUTE)
C12 PIO45 O 3.3V DC MOTOR INTERFACE
C13 NFRWE O 3.3V FLASH MEMORY CHIP WRITE ENABLE
C14 FRMD2 I/O 3.3V FLASH MEMORY DATA BUS 2
C15 FRMD6 I/O 3.3V FLASH MEMORY DATA BUS 6
C16 FRMA2 O 3.3V FLASH MEMORY ADDRESS BUS 2
C17 FRMA5 O 3.3V FLASH MEMORY ADDRESS BUS 5
C18 FRMA9 O 3.3V FLASH MEMORY ADDRESS BUS 9
C19 THRMSTR0 I 3.3V ANALOG INPUT(THERMISTOR)
C20 TONEAVDD - 3.3V POWER SUPPLY
C21 FRMA14 O 3.3V FLASH MEMORY ADDRESS BUS 14
C22 FRMA18 O 3.3V FLASH MEMORY ADDRESS BUS 18
C23 FRMA23 O 3.3V FLASH MEMORY ADDRESS BUS 23
C24 VSS - GND GND
C25 DOTPLLVDD - 3.3V POWER SUPPLY
C26 DOTCLKIN I 3.3V CRYSTAL(20MHz) INPUT
D01 AFEADC5 I 3.3V SCANNER INTERFACE
D02 AFEADC4 I 3.3V SCANNER INTERFACE
D03 AFEADC2 I 3.3V NOT USED
D04 VSS - GND GND
D05 VSS - GND GND

20

PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION
D06 VDD1.2 - 1.2V POWER SUPPLY
D07 PIO32 O 3.3V OPERATION PANEL INTERFACE
D08 CRMPWR O 3.3V MOTOR CURRENT CONTROL
D09 PIO56 O 3.3V ADF MOTOR INTERFACE
D10 VDD1.2 - 1.2V POWER SUPPLY
D11 PIO48 O 3.3V FAN2 CONTROL
D12 PIO44 O 3.3V DC MOTOR INTERFACE
D13 VDD3.3 - 3.3V POWER SUPPLY
D14 VDD1.2 - 1.2V POWER SUPPLY
D15 FRMD5 I/O 3.3V FLASH MEMORY DATA BUS 5
D16 FRMA1 O 3.3V FLASH MEMORY ADDRESS BUS 1
D17 VDD3.3 - 3.3V POWER SUPPLY
D18 FRMA8 O 3.3V FLASH MEMORY ADDRESS BUS 8
D19 THRMSTR1 I 3.3V ANALOG INPUT(THERMISTOR)
D20 TONEAVSS - GND GND
D21 FRMA13 O 3.3V FLASH MEMORY ADDRESS BUS 13
D22 VDD1.2 - 1.2V POWER SUPPLY
D23 VSS - GND GND
D24 NC - - NOT USED
D25 DOTCLKOUT O 3.3V CRYSTAL(20MHz) OUTPUT
D26 PIO66 O 3.3V NOT USED
E01 SDUDM0 O 3.3V SDRAM DQMU0
E02 AFEADC7 I 3.3V SCANNER INTERFACE
E03 AFEADC6 I 3.3V SCANNER INTERFACE
E04 VSS - GND GND
E23 VDD1.2 - 1.2V POWER SUPPLY
E24 FRMA24 O 3.3V FLASH MEMORY ADDRESS BUS 24
E25 PIO65 O 3.3V NOT USED
E26 PIO64 O 3.3V NOT USED
F01 SDMD16 I/O 3.3V SDRAM DATA BUS 16
F02 SDMD17 I/O 3.3V SDRAM DATA BUS 17
F03 AFESIFCLK O 3.3V SCANNER INTERFACE
F04 VDD1.2 - 1.2V POWER SUPPLY
F23 PIO24 I 3.3V LSU INTERFACE
F24 PIO61 O 3.3V OUTPUT PORT(SPMUTE)
F25 PIO60 O 3.3V NOT USED
F26 PIO3 O 3.3V LSU INTERFACE
G01 SDMD18 I/O 3.3V SDRAM DATA BUS 18
G02 SDMD19 I/O 3.3V SDRAM DATA BUS 19
G03 AFESIFDIN I 3.3V SCANNER INTERFACE
G04 AFESIFEN O 3.3V SCANNER INTERFACE
G23 PSCIO24 I 3.3V LSU INTERFACE
G24 PIO2 O 3.3V LSU INTERFACE
G25 PIO59 O 3.3V LAN CONTROLLER RESET
G26 PIO58 O 3.3V OUTPUT PORT(CIDRLY)
H01 SDMD20 I/O 3.3V SDRAM DATA BUS 20
H02 SDMD21 I/O 3.3V SDRAM DATA BUS 21
H03 NSDCS2 O 3.3V SDRAM CHIP SELECT 2
H04 AFESIFDOUT O 3.3V SCANNER INTERFACE
H23 PIO63 O 3.3V LSU INTERFACE
H24 PIO62 O 3.3V LSU INTERFACE
H25 PIO28 O 3.3V NOT USED
H26 PIO21 O 3.3V LSU INTERFACE
J01 SDMD22 I/O 3.3V SDRAM DATA BUS 22
J02 SDMD23 I/O 3.3V SDRAM DATA BUS 23
J03 SDMA3 O 3.3V SDRAM ADDRESS BUS 3
J04 SDMA2 O 3.3V SDRAM ADDRESS BUS 2
J23 PIO6 O 3.3V HIGH VOLTAGE UNIT INTERFACE
J24 PIO27 O 3.3V NOT USED
J25 PIO5 O 3.3V HIGH VOLTAGE UNIT INTERFACE
J26 PIO4 O 3.3V HIGH VOLTAGE UNIT INTERFACE
K01 VSS - GND GND
K02 SDCLK2 O 3.3V SDRAM CLOCK 2
K03 VSS - GND GND
K04 VDD3.3 - 3.3V POWER SUPPLY
K23 VDD1.2 - 1.2V POWER SUPPLY
K24 PIO41 O 3.3V NOT USED

KX-MB783BR

21

KX-MB783BR

PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION
K25 PIO40 O 3.3V NOT USED
K26 PIO39 O 3.3V NOT USED
L01 SDMD24 I/O 3.3V SDRAM DATA BUS 24
L02 SDMD25 I/O 3.3V SDRAM DATA BUS 25
L03 SDMA1 O 3.3V SDRAM ADDRESS BUS 1
L04 SDMAÇO O 3.3V SDRAM ADDRESS BUS 0
L11 VSS - GND GND
L12 VSS - GND GND
L13 VSS - GND GND
L14 VSS - GND GND
L15 VSS - GND GND
L16 VSS - GND GND
L23 PIO37 I 3.3V INPUT PORT (RING)
L24 PIO38 O 3.3V NOT USED
L25 PIO36 O 3.3V NOT USED
L26 PIO35 O 3.3V NOT USED
M01 SDMD26 I/O 3.3V SDRAM DATA BUS 26
M02 SDMD27 I/O 3.3V SDRAM DATA BUS 27
M03 SDMA10 O 3.3V SDRAM ADDRESS BUS 10
M04 SDBA1 O 3.3V SDRAM BANK ADDRESS 1
M11 VSS - GND GND
M12 VSS - GND GND
M13 VSS - GND GND
M14 VSS - GND GND
M15 VSS - GND GND
M16 VSS - GND GND
M23 PIO33 O 3.3V NOT USED
M24 PIO34 O 3.3V NOT USED
M25 PIO26 O 3.3V NOT USED
M26 PIO25 O 3.3V OUTPUT PORT(CNGMUTE)
N01 SDMD28 I/O 3.3V SDRAM DATA BUS 28
N02 SDMD29 I/O 3.3V SDRAM DATA BUS 29
N03 SDBA0 O 3.3V SDRAM BANK ADDRESS 0
N04 VDD1.2 - 1.2V POWER SUPPLY
N11 VSS - GND GND
N12 VSS - GND GND
N13 VSS - GND GND
N14 VSS - GND GND
N15 VSS - GND GND
N16 VSS - GND GND
N23 VDD3.3 - 3.3V POWER SUPPLY
N24 PIO23 O 3.3V NOT USED
N25 PIO22 O 3.3V NOT USED
N26 PIO20 O 3.3V NOT USED
P01 SDMD30 I/O 3.3V SDRAM DATA BUS 30
P02 SDMD31 I/O 3.3V SDRAM DATA BUS 31
P03 NSDCS O 3.3V SDRAM CHIP SELECT 1
P04 VDD3.3 - 3.3V POWER SUPPLY
P11 VSS - GND GND
P12 VSS - GND GND
P13 VSS - GND GND
P14 VSS - GND GND
P15 VSS - GND GND
P16 VSS - GND GND
P23 VDD1.2 - 1.2V POWER SUPPLY
P24 PIO16 O 3.3V NOT USED
P25 PIO17 O 3.3V NOT USED
P26 PIO18 I 3.3V HIGH VOLTAGE UNIT INTERFACE
R01 SDUDM1 O 3.3V SDRAM DQMU1
R02 SDLDM0 O 3.3V SDRAM DQML0
R03 BZVDD33 - 3.3V POWER SUPPLY
R04 BZRST33 - 3.3V POWER SUPPLY
R11 VSS - GND GND
R12 VSS - GND GND
R13 VSS - GND GND
R14 VSS - GND GND
R15 VSS - GND GND

22

PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION
R16 VSS - GND GND
R23 PIO13 O 3.3V NOT USED
R24 PIO12 O 3.3V NOT USED
R25 PIO14 O 3.3V NOT USED
R26 PIO15 O 3.3V NOT USED
T01 SDMD0 I/O 3.3V SDRAM DATA BUS 0
T02 SDMD1 I/O 3.3V SDRAM DATA BUS 1
T03 NSDCAS O 3.3V SDRAM CAS
T04 NSDRAS O 3.3V SDRAM RAS
T11 VSS - GND GND
T12 VSS - GND GND
T13 VSS - GND GND
T14 VSS - GND GND
T15 VSS - GND GND
T16 VSS - GND GND
T23 PIO9 O 3.3V OUTPUT PORT(SNPICK)
T24 PIO8 O 3.3V NOT USED
T25 PIO10 O 3.3V NOT USED
T26 PIO11 O 3.3V OUTPUT PORT(SNREG)
U01 SDMD2 I/O 3.3V SDRAM DATA BUS 2
U02 SDMD3 I/O 3.3V SDRAM DATA BUS 3
U03 NSDWE O 3.3V SDRAM WRITE ENABLE
U04 VDD1.2 - 1.2V POWER SUPPLY
U23 VDD3.3 - 3.3V POWER SUPPLY
U24 PIO0 I 3.3V INPUT PORT (HOOK)
U25 PIO1 O 3.3V OUTPUT PORT(EXTRLY)
U26 PIO7 O 3.3V NOT USED
V01 SDMD4 I/O 3.3V SDRAM DATA BUS 4
V02 SDMD5 I/O 3.3V SDRAM DATA BUS 5
V03 SDCKE O 3.3V SDRAM CLOCK ENABLE
V04 SDMA12 O 3.3V SDRAM ADDRESS BUS 12
V23 PSCIO20 O 3.3V NOT USED
V24 PSCIO21 O 3.3V NOT USED
V25 PSCIO22 O 3.3V NOT USED
V26 PSCIO23 O 3.3V NOT USED
W01 SDMD6 I/O 3.3V SDRAM DATA BUS 6
W02 SDMD7 I/O 3.3V SDRAM DATA BUS 7
W03 SDMA11 O 3.3V SDRAM ADDRESS BUS 11
W04 SDMA9 O 3.3V SDRAM ADDRESS BUS 9
W23 PSCIO16 O 3.3V NOT USED
W24 PSCIO17 I 3.3V INPUT PORT (FANDET2)
W25 PSCIO18 I 3.3V INPUT PORT (TOPCVR)
W26 PSCIO19 I 3.3V INPUT PORT (PSTART)
Y01 VSS - GND GND
Y02 SDCLK O 3.3V SDRAM CLOCK 1
Y03 SDMA8 O 3.3V SDRAM ADDRESS BUS 8
Y04 VSS - GND GND
Y23 AFESEL0 I 3.3V NCU INTERFACE
Y24 AFESEL1 I 3.3V NCU INTERFACE
Y25 EXMDMCS O 3.3V NOT USED
Y26 DP O 3.3V NCU INTERFACE

KX-MB783BR

23

KX-MB783BR

6.3.2. RTC BACKUP CIRCUIT

1. Function This unit has a lithium battery (BAT300) which works for the Real Time Clock IC (RTC: inside IC300). The RTC continues to work, backed up by a lithium battery even when the power switch is OFF.

2. RTC Inside (IC300) Backup Circuit Operation When the power switch is turned ON, power is supplied to the RTC (inside IC300). At this time, the voltage at pin AD4 of the IC300 is +3.3V. When the power switch is turned OFF, the BAT300 supplies power to RTC through DA300. When the power switch is OFF and the voltage of +3.3V decreases, pin AD4 of RTC (IC300) becomes roughly the same volt­age as the battery voltage. RTC goes into the backup mode, in which the power consumption is lower.

24

KX-MB783BR

6.3.3. MODEM CIRCUIT OPERATION

The modem (Included IC300) has all the hardware satisfying the CCITT standards mentioned previously.
ALL processing is controlled by the SOC (IC300) according to CCITT procedures.
This modem (Included IC300) has an automatic application equalizer. With training signal 1 or 2 at the time of G3 reception, it can
automatically establish the optimum equalizer.

Facsimile Transmission/DTMF Line Send

The digital image data sent on ATXD line from modem (Included IC300) .
DAA IC100(6→9,10), Line side DAA IC101 and the NCU section to the telephone line.

Facsimile Reception

The analog image data which is received from the telephone line passes through the NCU section and enters line side DAA*
IC100. The signals are changed to digital data in IC100 (5,6) ,IC101(9,10→5) and IC300. In this case, the image signals from
the telephone line are transmitted serially. Here, the internal equalizer circuit reduces the image signals to a long-distance
receiving level. This is designed to correct the characteristics of the frequency band centered around 3 kHz and maintain a con­stant receiving sensitivity.

Busy/Dial Tone Detection

The path is the same as Facsimile Reception.

Call Tone Transmission

This is the call signal which is generated the SOC (IC300) and sent to the speaker.

1

*

DAA : Direct Access Arrangement

1

25

KX-MB783BR

6.3.4. TEL LINE SECTION

Composed of ITS circuit and NCU circuit.

6.3.4.1. DESCRIPTION OF BLOCK DIAGRAM IN ANALOG SECTION

Function

The analog section works as an interface between the telephone line.
DAA control ITS circuit and NCU circuit.
DAA control signals are output from Soc IC300.

Circuit Operation

[NCU]: Network Control Unit the NCU comprises of the following; DC loop forming circuit to connect with the telephone line;
Switching circuit for other interconnected telephones; Bell detection circuit; Remote fax activation circuit.
Refer to NCU SECTION (P.27) for the details.

6.3.4.2. BLOCK DIAGRAM

EXTRLY

RING

ARXD
ATXD

BTXD
BRXD

IC100

16

10

9

5

6

IC200

4

10

5

16

1

5

6

8

9

IC101

3

13

16

14

12

1

15

AGC

KX-MB783BR: MAIN BOARD BLOCK DIAGRAM

HS_MIC(+)

HS_MIC(+)

HS_SP(+)
HS_SP(-)

SP(+)

SP(-)

T
R

T
R

26

KX-MB783BR

6.4. NCU SECTION

6.4.1. GENERAL

This section is the interface between the telephone line and external telephone. It is composed of an EXT. TEL line relay (RLY100),

bell detection circuit, TAM interface circuit and line amplifier.

6.4.2. EXT. TEL. LINE RELAY (RY100)

1. Circuit Operation Normally, this relay switches to the external telephone side and switches to the open side while OFF-HOOK. IC300 (U25) High Level→Q100 ON→RY100 (ON)

6.4.3. BELL DETECTION CIRCUIT

1. Circuit Operation The signal waveform is indicated below. The bell signal input to IC101 and ring detected signal output from pin 16 of IC100. IC300 monitor this signal and judged as bell. TEL LINE→IC101 (8,9 - 5,6)→IC100 (9,10 - 16)→IC300(L23)

6.4.4. CALLING LINE IDENTIFICATION CIRCUIT

1. Function This unit is compatible with the Caller ID service offered by your local telephone company. To use this feature, you must sub­scribe to a Caller ID service. The data for the caller ID from the telephone exchange is sent during the interval between the first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK (Frequency Shift Keying) format. Data “0” is a 1200 Hz sine wave, and data 1 a 2200 Hz sine wave. There are two type of the message format which can be received: i.e.the single data message format and multiple data mes­sage format. The multiple data format allows to transmit the name and data code information in addition to the time and telephone number data. When there is multiple data in the unit, the name or telephone number are displayed.

2. Circuit Operation The caller ID signal input from TEL LINE is processed with Soc (IC300).

TEL LINE→IC101 (8,9 - 5,6)→IC100 (9,10 - 5)→IC300(AD26)

6.4.5. REMOTE FAX ACTIVATION CIRCUIT

1. Function Another telephone connected to same line activates the unit to the FAX mode by using a DTMF signal.

2. Signal Path TEL LINE→IC101 (8,9 - 5,6)→IC100 (9,10 - 5)→IC300(AD26)

6.4.6. TAM INTERFACE CIRCUIT

This circuit is to switch between FAX receiving and the external TAM’s message recording automatically.

For details, please refer to TAM INTERFACE SECTION (P.28).

27

KX-MB783BR

6.5. ITS (Integrated telephone System) and MONITOR SECTION

6.5.1. GENERAL

The general ITS operation is performed by IC200 which has a handset circuit. The alarm tone, the key tone, and the beep are output from Soc IC300.

6.5.1.1. TELEPHONE MONITOR

1. Function This is the function when you are not holding the handset and can hear the caller’s voice from the line.

2. Circuit Operation (Telephone Monitor Signal Path) Signals received from the telephone line are output through at the speaker via the following path.

3. Signal Path TEL LINE→D103→Q104→C106→IC101(3-5,6)→IC100(9,10-5)→IC300(AD26-AB24)→IC200(4-1)→IC202(2-1)→IC204(4-

5,8)→CN200(1,2)→CN58(1,2)→CN57(1,2)→SPEAKER

6.5.1.2. MONITOR CIRCUIT

1. Function This circuit monitors various tones, such as (1) DTMF tone, (2) Alarm/Beep/Key tone/Bell.

2. Signal Path

a. DTMF MONITOR

(Speaker Operation)
IC300(AB24)→IC200(4-1)→IC202(2-1)→IC204(4-5,8)→CN200(1,2)→CN58(1,2)→CN57(1,2)→SPEAKER

b. ALARM/BEEP/KEY TONE/BELL

IC300(B20)→IC202(2-1)→IC204(4-5,8)→CN200(1,2)→CN58(1,2)→CN57(1,2)→SPEAKER

6.5.1.3. TAM INTERFACE SECTION

1. Function When TAM is connected to this unit, the unit receives documents for FAX calls or the external TAM records a voice message automatically.

2. Circuit Operation The TAM INTERFACE circuit consists of Soc(IC300) to detect the other party CNG signal, and RLY100 to separate EXT.TAM.

a. CNG signal detection circuit

The CNG signal from the other party’s FAX is detected in Soc IC300
(Signal path)
TEL LINE→IC101 (8,9 - 5,6)→IC100 (9,10 - 5)→IC300(AD26)

b. Remote receiving

This is the parallel-connected DTMF signal for the TEL or EXT.TEL mode between T and R. When the other party is a
FAX, the unit switches to FAX receiving.
(Signal Path)
TEL LINE→IC101 (8,9 - 5,6)→IC100 (9,10 - 5)→IC300(AD26)

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KX-MB783BR

6.6. CIS CONTROL SECTION

The scanning block of this device consists of a control circuit and a CIS (contact image sensor), and AFE (Analog Front End) include A/D Converter.

When an original document is inserted and the start button pressed, pin A3 of IC300 goes to a low level and the transistor Q518
turns on. This applies voltage to the CIS. The CIS is driven by each of the CCDSH , CCDCLK signals output from IC300, and the
original image illuminated by the LED to output an analog image signal.
The analog image signal is input to the AFE on VINP(20pin of IC503) and converted into 16-bit data by the A/D converter inside
IC503. Then this signal undergoes digital processing in order to obtain a high-quality image.

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KX-MB783BR

6.7. MOTOR DRIVE SECTION

6.7.1. Engine Motor Control Circuit

1. Functions

All driving forces of printer engine part are supplied by this engine motor.
Engine motor is controlled so as to rotate at constant speed during printing and copying.

2. Motor operation

<Start operation>
In order to start the motor rotation, following 3 signals are supplied from IC300.

1. SS signal (Output pin: Pin B12/Output Signal: "H") When this signal is inverted by transistor Q502 and becomes "L", motor recognize this signal as "start" signal.

2. Clock signal (Output pin: Pin A12/Output Signal: Pulse) Pulse frequency :approx. 1.9KHz (at normal printing speed, ) Pulse frequency :approx. 0.5KHz.(at half printing speed) This signal is also inverted by transistor Q525, and supplied to motor as "clock" signal .

3. Brake signal (Output pin: Pin C12/Output Signal: "H") When this signal is inverted by transistor Q526 and becomes "L", motor recognize this signal as "brake off" signal.

When motor reaches constant speed, "L" signal is supplied from motor to IC300 pin B12 as "Lock detect (LD)" signal.
if "LD" signal does not becomes "L" within predetermined period after "SS" signal becomes "H", or if "LD" signal becomes
"H" during rotation, it is judged that motor Error occurred.

Timing Chart of Start operation

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