Panasonic KX-TGH262B, KX-TGH264B, KX-TGH263B, KX-TGHA20B Service Manual

© Panasonic System Networks Co., Ltd. 2014
Unauthorized copying and distribution is a violation
of law.

ORDER NO. KM41402790CE

F13

Telephone Equipment

Model No. KX-TGH260B

KX-TGH262B
KX-TGH263B
KX-TGH264B
KX-TGHA20B

Digital Cordless Answering System
Link-to-Cell Bluetooth Convergence
Solution

B: Black Version
(for U.S.A.)

(Handset)

KX-TGHA20

(Charger Unit)

Model No

Base Unit Handset

Charger Unit Expandable

KX-TGH260

1 (TGH260) 1 (TGHA20)

Up to 6

KX-TGH262

1 (TGH260) 2 (TGHA20) 1

Up to 6

KX-TGH263

1 (TGH260) 3 (TGHA20) 2

Up to 6

KX-TGH264

1 (TGH260) 4 (TGHA20) 3

Up to 6

KX-TGHA20*

1 (TGHA20) 1

Configuration for each model

*KX-TGHA20 is also an optional accessory, which contains a
handset and a charger.

KX-TGH260

(Base Unit)

2

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

WARNING

This service information is designed for experienced repair technicians only and is not designed for use by the general
public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting
to service a product. Products powered by electricity should be serviced or repaired only by experienced professional
technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone
else could result in serious injury or death.

IMPORTANT SAFETY NOTICE

There are special components used in this equipment which are important for safety. These parts are marked by
in the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential that
these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards.
Do not modify the original design without permission of manufacturer.

IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

If lead free solder was used in the manufacture of this product, the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the
use of PbF and how it might be permissible to use Pb solder during service and repair work.

L When you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit.
L The illustrations in this Service Manual may vary slightly from the actual product.

3

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

TABLE OF CONTENTS

PAGE PAGE

1 Safety Precautions----------------------------------------------- 5

1.1. For Service Technicians --------------------------------- 5

2 Warning-------------------------------------------------------------- 5

2.1. Battery Caution--------------------------------------------- 5

2.2. About Lead Free Solder (PbF: Pb free)-------------- 5

2.2.1. Suggested PbF Solder ------------------------------ 6

2.3. Discarding of P. C. Board-------------------------------- 6

3 Specifications ----------------------------------------------------- 7
4 Technical Descriptions-----------------------------------------8

4.1. US-DECT Description------------------------------------ 8

4.1.1. TDD Frame Format ---------------------------------- 8

4.1.2. TDMA system------------------------------------------ 8

4.1.3. Signal Flowchart in the Radio Parts-------------- 9

4.2. Block Diagram (Base Unit_Main)---------------------10

4.3. Tel Interface Circuit---------------------------------------11

4.4. Block Diagram (Base Unit_RF Part)-----------------12

4.5. Circuit Operation (Base Unit)--------------------------13

4.5.1. BBIC (Base Band IC: IC501) ---------------------13

4.5.2. Flash Memory (IC502)------------------------------13

4.5.3. Flash Memory (IC601)------------------------------13

4.5.4. EEPROM (IC611)------------------------------------13

4.5.5. Bluetooth Unit (IC721)------------------------------13

4.5.6. Power Supply Circuit/Reset Circuit--------------14

4.5.7. Telephone Line Interface---------------------------16

4.5.8. Parallel Connection Detect Circuit/Auto
Disconnect Circuit -----------------------------------17

4.5.9. Calling Line Identification (Caller ID)/Call
Waiting Caller ID-------------------------------------18

4.6. Block Diagram (Handset)------------------------------- 20

4.7. Block Diagram (Handset_RF Part)-------------------21

4.8. Circuit Operation (Handset)---------------------------- 22

4.8.1. Outline--------------------------------------------------22

4.8.2. Power Supply Circuit/Reset Circuit--------------22

4.8.3. Charge Circuit ----------------------------------------23

4.8.4. Battery Low/Power Down Detector--------------23

4.8.5. Speakerphone----------------------------------------23

4.9. Behavior of Electric Power Failure-------------------24

4.10. Circuit Operation (Charger Unit)----------------------24

5 Location of Controls and Components ------------------25
6 Installation Instructions---------------------------------------25
7 Operating Instructions-----------------------------------------25
8 T est Mode----------------------------------------------------------26

8.1. Engineering Mode----------------------------------------26

8.1.1. Base Unit ----------------------------------------------26

8.1.2. Handset ------------------------------------------------28

9 Service Mode -----------------------------------------------------30

9.1. How to Clear User Setting (Handset Only)---------30

10 Troubleshooting Guide----------------------------------------31

10.1. Troubleshooting Flowchart-----------------------------31

10.1.1. Check Power------------------------------------------32

10.1.2. Check Record ----------------------------------------33

10.1.3. Check Playback -------------------------------------36

10.1.4. Check Battery Charge------------------------------36

10.1.5. Check Link---------------------------------------------37

10.1.6. Check the RF part -----------------------------------39

10.1.7. Registering a Handset to the Base Unit--------43

10.1.8. Deregistering a Handset ---------------------------43

10.1.9. Check Handset Transmission --------------------44

10.1.10. Check Handset Reception------------------------44

10.1.11. Check Caller ID -------------------------------------44

10.1.12. Check BT Communication------------------------45

11 Disassembly and Assembly Instructions--------------- 47

11.1. Disassembly Instructions------------------------------- 47

11.1.1. Base Unit----------------------------------------------47

11.1.2. Handset------------------------------------------------ 49

11.1.3. Charger Unit------------------------------------------ 50

11.2. How to Replace the Handset LCD-------------------51

12 Measurements and Adjustments --------------------------52

12.1. Equipment Required ------------------------------------ 52

12.2. The Setting Method of JIG----------------------------- 52

12.2.1. Connections (Base Unit) --------------------------52

12.2.2. Connections (Handset) ---------------------------- 53

12.2.3. How to install Batch file into P.C.---------------- 54

12.2.4. Commands-------------------------------------------- 55

12.3. Adjustment Standard (Base Unit)--------------------56

12.3.1. Bottom View ------------------------------------------56

12.4. Adjustment Standard (Handset)---------------------- 57

12.4.1. Component View ------------------------------------57

12.5. Things to Do after Replacing IC or X'tal------------ 58

12.5.1. How to download the data ------------------------ 58

12.6. Frequency Table------------------------------------------60

12.7. Bluetooth Frequency Table ----------------------------61

13 Miscellaneous----------------------------------------------------62

13.1. How to Replace the LLP (Leadless Leadframe
Package) IC -----------------------------------------------62

13.1.1. Preparation--------------------------------------------62

13.1.2. Caution------------------------------------------------- 62

13.1.3. How to Remove the IC-----------------------------62

13.1.4. How to Install the IC--------------------------------63

13.2. How to Replace the Flat Package IC --------------- 64

13.2.1. Preparation--------------------------------------------64

13.2.2. How to Remove the IC-----------------------------64

13.2.3. How to Install the IC--------------------------------65

13.2.4. How to Remove a Solder Bridge----------------65

13.3. Terminal Guide of the ICs, Transistors and
Diodes ------------------------------------------------------66

13.3.1. Base Unit---------------------------------------------- 66

13.3.2. Handset------------------------------------------------66

14 Schematic Diagram --------------------------------------------67

14.1. For Schematic Diagram --------------------------------67

14.1.1. Base Unit (Schematic Diagram (Base
Unit_Main)) -------------------------------------------67

14.1.2. Handset (Schematic Diagram
(Handset_Main))------------------------------------- 67

14.2. Schematic Diagram (Base Unit_Main)--------------68

14.2.1. KX-TGH260------------------------------------------- 68

14.3. Schematic Diagram (BT module) --------------------70

14.4. Schematic Diagram (Base Unit_Operation)-------72

14.4.1. KX-TGH260------------------------------------------- 72

14.5. Schematic Diagram (Handset_Main) --------------- 74

15 Printed Circuit Board ------------------------------------------77

15.1. Circuit Board (Base Unit_Main) ---------------------- 77

15.1.1. Component View ------------------------------------77

15.1.2. Bottom View ------------------------------------------78

15.2. Circuit Board (Base Unit_Operation)---------------- 79

15.2.1. KX-TGH260------------------------------------------- 79

4

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

15.3. Circuit Board (Handset_Main) ------------------------81

15.3.1. Component View ------------------------------------81

15.3.2. Bottom View ------------------------------------------82

16 Exploded View and Replacement Parts List-----------83

16.1. Cabinet and Electrical Parts (Base Unit)----------- 83

16.2. Cabinet and Electrical Parts (Handset)-------------84

16.3. Cabinet and Electrical Parts (Charger Unit)-------85

16.4. Accessories and Packing Materials ----------------- 86

16.4.1. KX-TGH260B-----------------------------------------86

16.4.2. KX-TGH262B-----------------------------------------87

16.4.3. KX-TGH263B-----------------------------------------88

16.4.4. KX-TGH264B-----------------------------------------89

16.4.5. KX-TGHA20B ----------------------------------------90

16.5. Replacement Parts List---------------------------------91

16.5.1. Base Unit----------------------------------------------91

16.5.2. Handset------------------------------------------------92

16.5.3. Charger Unit------------------------------------------93

16.5.4. Accessories and Packing Materials-------------94

16.5.5. Screws -------------------------------------------------94

16.5.6. Fixtures and Tools-----------------------------------94

5

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

1 Safety Precautions

1.1. For Service Technicians

• Repair service shall be provided in accordance with repair technology information such as servic e manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.

2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.

3. FASTON terminals shall be plugged straight in and unplugged straight out.

• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on worktable.

4. Do not grasp IC or LSI pins with bare fingers.

2Warning

2.1. Battery Caution

Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.

Attention:

A nickel metal hydride battery that is recyclable powers the product you have purchased.
Please call 1-800-8-BATTERY (1-800-822-8837) for information on how to recycle this battery.

2.2. About Lead Free Solder (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.

Caution

• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).

• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).

• When applying PbF solder to double layered boards, pl ease check the component side for excess which may flow onto the
opposite side (See the figure below).

Component

Component
pin

Solder

Remove all of the
excess solder

(Slice View)

6

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

2.2.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

2.3. Discarding of P. C. Board

When discarding P. C. Board, delete all personal information such as telephone dire ctory and caller list or scrap P. C. Board.

0.3 mm X 100 g

0.6 mm X 100 g 1.0 mm X 100 g

7

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

3 Specifications

Note:

Design and specifications are subject to change without notice.

Note for Service:

• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.

• Analog telephone connection: Telephone Line

• Optional Range extender: KX-TGA405

• Optional Key detector: KX-TGA20

• T-adaptor: KX-J66

Rechargeable Ni-MH battery
AAA (R03) size (1.2 V 400 mAh)
Super Heterodyne
PLL synthesizer
Quadrature Discriminator

10.368 MHz ±100 Hz
Frequency Modulation
40 bit

Tone (DTMF)/Pulse
Up to 48 digits
Up to 24 digits

(Phonebook)

8 days at Standby,
10 hours at Talk

0 °C - 40 °C (32 °F – 104 °F)
20 % – 80 % relative air humidity
(dry)
Approx. 23

mm x 45 mm x

155

mm

Approx. 110 g

Power source

Receiving Method
Oscillation Method
Detecting Method
Tolerance of OSC Frequency
Modulation Method
ID Code

Ringer Equivalence No. (REN)

Dialing Mode
Redial
Speed Dialer
Power Consumption

Operating Conditions

Dimensions (W x D x H)
Mass (Weight)

AC Adaptor
(PNLV226Z, 120 V AC, 60 Hz)
Super Heterodyne
PLL synthesizer
Quadrature Discriminator

10.368 MHz ± 41 Hz
Frequency Modulation
40 bit

0.1B
Tone (DTMF)/Pulse
Up to 48 digits

Up to 24 digits (Phonebook)
Standby: Approx. 1.1 W
Maximum: Approx. 4.0 W
0 °C - 40 °C (32 °F – 104 °F)
20 % – 80 % relative air humidity
(dry)
Approx. 76 mm x 106 mm x 90 mm
Approx.120 g

Base Unit

Handset

Charger

AC Adaptor
(PNLV233-AZ, 120 V AC, 60 Hz)

Standby: Approx 0.1 W
Maximum: Approx 1.8 W
0 °C - 40 °C (32 °F – 104 °F)
20 % – 80 % relative air humidity
(dry)
Approx. 72 mm x 72 mm x 40 mm
Approx. 40 g

█ Duplex procedure:

TDMA (Time Division Multiple Access)

█ Channel spacing:

1.728MHz (DECT 6.0)

1.0MHz(Bluetooth)

█ Bit rate:

1.152Mbit/s (DECT 6.0)

1.0 Mbit/s (Bluetooth)

█ Modulation:

GFSK (Gaussian Frequency Shift Keying)

█ RF transmission power:

115 mW (max/DECT6.0)

█

Voice coding:

ADPCM 32 kbit/s (DECT 6.0)
CVSD/PCM 64kbit/s (Bluetooth)
PCM 64kbit/s(BT_IC)

█

█

█

█

█

█

█ Standard:

DECT 6.0 (Digital Enhanced Cordless
Telecommunications 6.0)

█ Number of channels:

60 Duplex Channels (DECT 6.0)
79 Duplex channels(Bluetooth)

Bluetooth wireless technology 2.1

█ Frequency range:

1.92 GHz to 1.93 GHz (DECT 6.0)

2.402 GHz to 2.48 GHz (Bluetooth)

8

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4 Technical Descriptions

4.1. US-DECT Description

The frequency range of 1.92 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and ha ndset is same
frequency. Refer to Frequency Table (P.60).

4.1.1. TDD Frame Format

4.1.2. TDMA system

This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417 μs, the 10 ms of voice data is transmitted.

• 2 - Handsets Link

Traffic Bearer

A link is established between base unit and handset.
The state where duplex communication is performed.
Handset doesn't make up duplex in no free RF channels because of interference. (*1)

Dummy Bearer

Base unit sends Dummy-data to the all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)

Note:

(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF parts, it is better in least interference condition.

417 μs (available) 417 μs (blind)

5 ms 5 ms

Up Link ( Handset -> Base Unit ) Down Link ( Base Unit -> Handset )

DATA rate : 1.152 Mbps

RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6

RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6

TX RX

RXTX

Traffic Bearer Dummy bearer

Base unit

Handset 1
(Stand by)
Handset 2
(Link)
Handset 3
(Link)

9

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.1.3. Signal Flowchart in the Radio Parts

Reception

Base unit:

A voice signal from TEL line is encoded to digital data and converted into a 1.9GHz modulated radio signal by BBIC(IC501).
The RF signal, after which is amplified in BBIC, is fed to selected antenna.

Handset:

As for a handset RF, RF signal is received in one antenna.
BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".
BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.

Transmission

Handset:

A voice signal from microphone is encoded to digital data and converted into a 1.9GHz modulated radio signal by BBIC(IC1).
The RF signal, after which is amplified in BBIC, is fed to an antenna.

Base unit:

As for a base unit RF, RF signal is received in two antennas.
BBIC (IC501) compares RF signal levels and selects the antenna to be used. The n BBIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.

10

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.2. Block Diagram (Base Unit_Main)

KX-TGH260/262/263/264 BLOCK DIAGRAM (Base Unit_Main)

SIDE_TONE

CIRCUIT

Crystal

10.368MHz

TR_RLY

TIP

RING

TEL_JACK

RF_Block

IC501

BBIC

DC5.5V+

GND

DC_JACK

+

-

CHARGE

D101

CHARGE

DETECT

Q701

Q141

Q161

REGULATOR

IC302

Power Down

DET

Power supply

at AC failure

KEY

PAD

LED

VBAT

PDN_DET

CHARGE_DET

IC601

IC611

IC502

IC721

BT

Module

Q301

+1.8V

AVD/VDD

QSPI

CIDINp

CIDINn

P3_6

MICh

LSRp

RF_VDD

VDD_PA

ANT1

ANT2

IC722

BT_1.8V

BT_1.8V

CKM/STM

EEPROM

FLASH

(Voice

prompt)

FLASH

(Program)

11

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.3. Tel Interface Circuit

TX AMP

SIDE TONE

RX AMP

CONTROL

CIRCUIT

CALLER ID

DETECT

BELL

DETECT

P101

R142

4

C101

Q141

C102

SA101

TIP

R141

REGULATOR

C104

R102

C106

R104

C103

R101

C105

R103

D101

12

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.4. Block Diagram (Base Unit_RF Part)

10.368

MHz

IC501 RF block

TXDATA

ANT1

RF_TXp

RF_TXn

RF_RXp

RF_RXn

ANT2

Control

Logic

RXDATA

Mixer

Demodulator

PLL

3856-3843MHz

/3859-3845MHz

Modulator

KX-TGH260/262/263/264 BLOCK DIAGRAM (Base Unit_RF Part)

13

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.5. Circuit Operation (Base Unit)

General Description:

(BBIC, Flash Memory, EERROM) is a digital speech/signal processing system that implements all the functions of speech
compression, record and playback, and memory management required in a digital telephone answering machine.
The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that fun ctio ns
as follows.

4.5.1. BBIC (Base Band IC: IC501)

• Voice Message Recording/Play back
The BBIC system uses a proprietary speech compression technique to record and store voice message in Flash Memory.
An error correction algorithm is used to enable playback of these messages from the Flash Memory.

• DTMF Generator
When the DTMF data from the handset is received, the DTMF signal is output.

• Synthesized Voice (Pre-recorded message)
The BBIC implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.

• Caller ID demodulation
The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.

• Digital Switching
The voice signal from telephone line is transmitted to the hand set or the voice signal from the handset is transmitted to the
Telephone line, etc. They are determined by the signal path route operation of voice signal.

• Block Interface Circuit
RF part, LED, Key scan, Speaker, Telephone line.

4.5.2. Flash Memory (IC502)

Main program data is stored.

4.5.3. Flash Memory (IC601)

Following information data is stored.

• Voice signal
ex: Pre-recorded Greeting message, Incoming message

4.5.4. EEPROM (IC611)

Following information data is stored.

• Settings
ex: message numbers, ID code, Flash Time, Tone/Pulse

4.5.5. Bluetooth Unit (IC721)

Use for Bluetooth communication.

RF part

ADPCM

Analog
Front
End

&

Multi­plexer

TEL
Line
Interface

Digital
Speech
Processor

Caller ID
Modem

Digital TAM System

Flash Memory IC601

Host CPU

BBIC (IC501)

TDD & TDMA
with FHSS
Processor

ADPCM

PCM OUT

SP

PCM IN

Keys/ LEDs
/ Charge

EEPROM
IC611

Flash Memory

(Program)

IC502

Bluetooth Unit

14

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.5.6. Power Supply Circuit/Reset Circuit

The power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is
insulated from VBAT by Doubler of BBIC.

Circuit Operation:

+5.5V

+5.5V +3.0V

+3.0V

+1.8V

+3.0V_CP

IC501

IC302

IC611

BBIC

AC Adaptor

3.0V

REGULATOR

EEPROM

VDD3

VDD1

VDD4

+3.0V_CP2

IC601

TAM FLASH

VDD5

RF Part

LEDs

Q301

Bluetooth

unit

IC721

QSPI FLASH

IC502

+1.8V

IC722

Startmonitor

(IC501 57pin)

VDD1 (1.8 V)

VBAT

Reset (RSTN)
(IC501_77pin)

BBIC chip initialize

(CKM/STM)

15

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.5.6.1. Charge Circuit

The voltage from the AC adaptor is supplied to the charge circuits.

R372

D362

R371

CHARGE+

R373

C351

F301

DCP

CHARGE-

+5.5V

DCM

K A

16

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.5.7. Telephone Line Interface

Telephone Line Interface Circuit:
Function

• Bell signal detection

• ON/OFF hook and pulse dial circuit

• Side tone circuit

Bell (RINGING) signal detection and OFF HOOK circuit:

In the idle mode, Q141 is open to cut the DC loop cu rrent and de crease th e ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
L1T → C105 → R103 → R110 → R111→ R112 → BBIC pin18(RINGING)
When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through
the circuit). Following signal flow is the DC current flow.
T → D101 → Q141 → Q161 → R163 → D101 → P101 → R

ON HOOK Circuit:

Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on­hook condition.

Pulse Dial Circuit:

Pin 19 of BBIC turns Q141 ON/OFF to make the pulse dialing.

Side To ne Circ ui t:

Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is
canceled by the canceller circuit of BBIC.

OFF Hook

BELL signal detection

C174

C171

R166

R178

RX
Pin25 of IC501

TX
Pin27 of IC501

R160

+

C161

C167

R165

R162

C173

R151R164

C184

C103

C111

Q161

E

B

C

R163

R117

C115

R109

C109

Q141

Q142

C101

P101

L1T

L1R

D101

C102

1

2

3

+

~~

_

4

R145

C142

C152

R152

A

K

D142

R141

B

E

C

E

B

C

R142

SA101

R111

R101

HOOK
Pin19 of IC501

CIDOUT
Pin24 of IC501

LSRn
Pin28 of IC501

RINGING
Pin18 of IC501

CIDINn
Pin23 of IC501

CIDINp
Pin21 of IC501

R168

PARADET
Pin17 of IC501
ADC1
Pin33 of IC501

ADC0
Pin32 of IC501

R118

C116

R115

R116

R110

C110

R112

C113

C105

R103

C104

R102

C106

R104

17

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.5.8. Parallel Connection Detect Circuit/Auto Disconnect Circuit

Function:

In order to disable call waiting and stutter tone fu nctions when usin g telepho nes co nnected in parallel, it is n ecessary to hav e a
circuit that judges whether a telephone connected in parallel is in use or not. T his circuit determines whether the telephone
connected in parallel is on hook or off hook by detecting changes in the T/R voltage.

Circuit Operation:

Parallel connection detection when on hook:
When on hook, the voltage is monitored at pin 32 of IC501. There is no parallel connection if the voltage is

0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.

Parallel connection detection when off hook:
When off hook, the voltage is monitored at pin 17 of IC501; the presence/absence of a parallel connection is determined by
detecting the voltage changes.
If the Auto disconnect function is ON and statuses are Hold, receiving ICM, OGM transmitting, BBIC disconnects the line after
detecting parallel connection is off hook.

C174

C171

R166

R178

RX
Pin25 of IC501

TX
Pin27 of IC501

R160

+

C161

C167

R165

R162

C173

R151R164

C184

Q161

E

B

C

R163

R117

C115

Q141

Q142

C101

P101

L1T

L1R

D101

C102

1

2

3

+

~~

_

4

R145

C142

C152

R152

A

K

D142

R141

B

E

C

E

B

C

R142

SA101

HOOK
Pin19 of IC501

R168

PARADET
Pin17 of IC501

ADC1
Pin33 of IC501

ADC0
Pin32 of IC501

R118

C116

R115

R116

18

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.5.9. Calling Line Identification (Caller ID)/Call Waiting Caller ID

Function:

Caller ID

The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the
first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK
(Frequency Shift Keying) * format. Data

"1" is a 1200 Hz sine wave, and data "0" is a 2200 Hz sine wave. There are two types of

the message format which can be received: i.e. the single message format and plural message format. The plural message
format allows to transmit the name and data code information in addition to the time and telephone number data.
*: Also the telephone exchange service provides other formats.

1st Ring
2 sec

Silent interval 4 sec

2nd Ring
2 sec

0.5 s 575 ms

min 0.5 s

DATA

0.1 Vrms

STD Ring / 20 Hz
Tip-Ring

DATA in

A

B

DATA out

1200 Hz
=DATA "1"

1 bit=833 µs

2200 Hz
=DATA "0 "

70 Vrms

month dayhour minute number

201348700035161504

Single message format

Plural message format

1st Ring

2 sec

718 ms

2nd Ring

0.5 s

DATA

month

day

hour

minute

number

20134870003516

16

DATA CODE NAME
201 John Smith

04

19

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

Call Waiting Caller ID

Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call,
to receive information about a calling party on a waited call. The transmission of th e calling information takes place almost
immediately after the customer is alerted to the new call so he/she can use this informatio n to decide whether to take the new
call.

Function:

The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and
MARK data pass the following route.
Telephone Line → P101 → C105, C104 → R103, R102 → IC501(23, 21).
If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the
information for the second and subsequent callers is not displayed on the portable handset display.

CAS

CAS: CPE Alerting Signal
Dual Tone of 2130 Hz, 2750 Hz

-15 dBm (900 ohm load)

80 5 ms

MARK

DATA

0~500 ms

58~75 ms about 300 ms

(be changed by
Information Volume)

Continuance Signal
of 1200 Hz (Data "1")

"FSK"

ACK: Acknowledged Signal
DTMF
"D"

ACK

0~100 ms

60 5 ms

Telephone Exchange

Cordless phone

Cordless phone

Signal Flow

Signal Flow

Telephone Exchange

Call Waiting Format

CIDOUT

Pin 24

C110

R110

R109

CIDINn

Pin 23

CIDINp

Pin 21

LSRn

Pin 28

C109

P101

L1T

L1R

SA101

IC501

C103

R101

C105

R103

C104

R102

C106

R104

20

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.6. Block Diagram (Handset)

IC1

IC3

MICp
MICn

LSRp

PAOUTp
PAOUTn

CKM//

CKM/STM

BBIC

RST

CHG_CTL

BATTERY_ON

CHG_DET

WP, CLK, DATA

STB_A~F

KIN_1~4

CHARGE

MIC

Receiver

SP-PHONE SP

LCD

KEYS

RF part

ANT1

X1

10.368 MHz

EEPROM

3V

BATTERY

LED
(LCD)

RSTN

VBAT

VBAT

4V

RXn

RXp

TXp
TXn

KX-TGHA20 BLOCK DIAGRAM (Handset)

KEY_LED

Q6

LED

(KEY)

4V

CHARGE
CONTROL

POWER SUPPLY
CONTROL

IC4

FLASH

MEMORY

QSPI_100~4

QSPI_CS,

*

LSRn

STM

NR_LED

QSPI_SCK1

21

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.7. Block Diagram (Handset_RF Part)

KX-TGHA20 BLOCK DIAGRAM (Handset_RF Part)

RXp

RXn

ANT

TXp

TXn

22

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.8. Circuit Operation (Handset)

4.8.1. Outline

Handset consists of the following ICs as shown in Block Diagram (Handset) (P.20).

• DECT BBIC (Base Band IC): IC1

- All data signals (forming/analyzing ACK or CMD signal)

- All interfaces (ex: Key, Detector Circuit, Charge, EEPROM, LCD)

• EEPROM: IC3

- Setting data is stored. (e.g. ID, user setting)

4.8.2. Power Supply Circuit/Reset Circuit

Circuit Operation:

When powering on the Handset, the voltage is as follows;
BATTERY(2.2 V ~ 2.6 V: BATT+) → F1 → BBIC (IC1) 32 pin
The Reset signal generates IC1 (71 pin) and 1.8 V.

Start monitor

(IC1 50 pin)

1.8 V

VBAT

Reset (*RST)
(IC1_71 pin)

BBIC chip initialize

(STM)

GND

BATTERY
2CELL

BBIC

3.0V

3.0V

Charge Pump Output
For all peripherals

3.0V3.0V

EEPROM

GND

KEY LED

4.0V

VBAT

1.8V

3.0V3.0V

LCD

4.0V

4.0V 1.8V

23

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.8.3. Charge Circuit

Circuit Operation:

When charging the handset on the Base Unit, the charge current is as follows;
DCP(5.5V) → F301 → R371 → R372 → D362 → CHARGE+(Base) → CHARGE+(Handset) → R8 → Q3 → F1 → BA TTERY+...
Battery...
BATTERY- → R45 → GND → CHARGE-(Handset)→ CHARGE-(Base) → GND → DC-(GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q9 of Handset.
Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.14).

4.8.4. Battery Low/Power Down Detector

Circuit Operation:

“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;

• Battery Low
Battery voltage: V(Batt) 2.25 V ± 50 mV

The BBIC detects this level and " " starts flashing.

• Power Down
Battery voltage: V(Batt) 2.0 V ± 50 mV
The BBIC detects this level and power down.

4.8.5. Speakerphone

The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.

CHG +

Q4

R45

R4

47K

R6
10K

Q9

GND

R7 CHG DET (34)

CHG CTRL (33)

100K

CHG -

GND

BATT +

BATTERY

2CELL

BATT -

GND

BBIC

IC1

Q2

R8

Q3

C27

R2

R9

24

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

4.9. Behavior of Electric Power Failure

In case that the power from AC adaptor is lost and lose radio waves, BBIC (IC1) turns Q11 ON since handset presumes that
base unit's power is falied.
Base unit detects that power voltage of AC adaptor +5.5V is OFF, then turns Q351 ON.
It's possible to use the units during the power failure, supplying power to VBAT of base unit from battery of handset through
Q10, CHG terminal and Q351.

4.10. Circuit Operation (Charger Unit)

Charge control is executed at handset side so that the operation when using charger is also controlled by handset.
Refer to Circuit Operation (Handset) (P.22)

The route for this is as follows: DC+pin of J1(+) → CHARGE+pad → Handset → CHARGE-pad → DC-pin of J1(-).

Handset

BATT+

BATT_

Base Unit

Q351

VBAT

Power Supply

at AC failure

(Q10,Q11,Q12)

BBIC

IC1

R45

CHG-

CHG+

R351

R352

3

Power Down

DET

(Q352,Q353,Q354)

+5.5V

PDN_DET

(pin101-IC501)

TP1

TP2

J1

AC Adaptor

25

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

5 Location of Controls and Components

Refer to the Operating Instructions.

Note:

You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

6 Installation Instructions

Refer to the Operating Instructions.

Note:

You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

7 Operating Instructions

Refer to the Operating Instructions.

Note:

You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

26

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

8 Test Mode

8.1. Engineering Mode

8.1.1. Base Unit

1). Press {MENU}.

2). Select "Settings" using or
then press

{SELECT} or {>}.

H/S key operation

H/S LCD

{^}

3). Enter "7", "2", "6", "2", "7", "6", "6", "4".
Note: 7262 7664 = PANA SONI
(see letters printed on dial keys)

5). Enter "

ە

", "ە", "ە", "ە" (Address). (*1)

6). Enter "

㸨

", "㸨" (New Data). (*1)

4). Select "Write EEP" using or
then press

{SELECT} or {>}.

{^} {V}

Default Data

Select "Set tel line" using or
then press

{SELECT} or {>}.(*)

{^} {V}

Service Mode
Read EEP
Write EEP

Set Addr.:

BACK

SELECT

CLEAR

OK

{V}

{OFF}

{FLASH}
{CALL WAIT}

Dial keypad

This pictured model is KX-TGH260

Important:

Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.

Make sure the link between Base and Handset before that. Then in case using not original Handset,

Note: Refer to Registering a Handset to a Base Unit in the Operating Instructions.

you need to deregister Handset.

27

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

Frequently Used Items (Base Unit)

ex.)

Note:

(*1) When you enter the address or New Data, please refer to the table below.

Items Address Default Data New Data Remarks

C-ID(FSK) sensitivity 06 0E 00 01 (6dB up) 02 (12dB up) When the hex change from 00 to 01 or 02, gain

increase by 6 dB or 12 dB.

Frequency 00 07 / 00 08 70/02 - - Use these items in a READ-ONLY mode to

confirm the contents. Careless rewriting may
cause serious damage to the computer system.

ID 00 02~00 06 Given value - -

Desired Number (hex) Input Keys Desired Number (hex) Input Keys

0 0 A [Flash] + 0
1 1 B [Flash] + 1

. . C [Flash] + 2
. . D [Flash] + 3
. . E [Flash] + 4

9 9 F [Flash] + 5

7). Press {OK} , a long confirmation beep

will be heard.

8).

Press to return to standby mode.

After that, turn the base unit power off and then power on.

Note:(*)“Set tel line" isn't displayed in Cell line only mode.
To return to normal mode, execute the following procedure:

New Data

_ _ _ _ _ _

Set Addr.:

Set Addr.:

{OFF}

CLEAR

OK

BACK

1 {MENU} i {#}{1}{5}{7}

2 {V}/{^}: Select "off "i {SELECT}
3 {OFF}

28

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

8.1.2. Handset

Important:

Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.

H/S LCD

1). Press {MENU}.

2). Select "Settings" using or
then press

{SELECT} or {>}.

{^} {V}

3). Enter "7", "2", "6", "2", "7", "6", "6", "4".
Note: 7262 7664 = PANA SONI
(see letters printed on dial keys)

5). Enter "

ە

", "ە", "ە", "ە" (Address). (*1)

7). Press

{OK} , a long confirmation beep

will be heard.

8).

Press to return to standby mode.

After that, remove and reinsert the batteries. Press the Power button for
about 1 second if the power is not turned on.

6). Enter "

㸨

", "㸨" (New Data). (*1)

4). Select "Write EEP" using or
then press

{SELECT} or {>}.

{^} {V}

{OFF}

Default Data

New Data

Service Mode
Read EEP
Write EEP

Set Addr.:

_ _ _ _ _ _

Set Addr.:

Set Addr.:

CLEAR

OK

CLEAR

OK

BACK

BACK

SELECT

H/S key operation

{OFF}

{FLASH}

{CALL WAIT}

Dial keypad

29

KX-TGH260/KX-TGH262/KX-TGH263/KX-TGH264/KX-TGHA20/KX-TGA20

Frequently Used Items (Handset)

ex.)

Note:

(*1) When you enter the address or New Data, please refer to the table below.

(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the
handset.

Items Address Default Data New Data Possible Adjusted

Value MAX (hex)

Possible Adjusted

Value MIN (hex)

Remarks

Frequency 00 07 / 00 08 00 / 01 - - -

(*2)

ID 00 02 ~ 00 06 Given value - - -

Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys

0 0 A [Flash] + 0
1 1 B [Flash] + 1

. . C [Flash] + 2
. . D [Flash] + 3
. . E [Flash] + 4

9 9 F [Flash] + 5