Panasonic GD93 Service Manual

Order Number: MCUK001001G8

Personal Cellular Telephone

EB-GD93

Specification

900 MHz 1800 MHz

Frequency Range Tx: 890 - 915MHz

Tx/Rx frequency separation 45 MHz 95 MHz

RF Channel Bandwidth 200 kHz

Number of RF channels 124 374

Speech coding Full rate/Half rate/Enhanced Full rate

Operating temperature -10 °C to +55 °C

Type Class 4 Handheld Class 1 Handheld

RF Output Power 2 W maximum 1 W maximum

Modulation GMSK (BT = 0.3)

Connection 8 ch/TDMA

Voice digitizing 13 kbps RPE-LTP / 13 kps ACLEP / 5.6 kps CELP /

Transmission speed 270.3 kbps

Diversity Frequency hopping

Signal Reception D ouble superheterodyne

Intermediate Frequencies 225 MHz and 45 MHz

Antenna Terminal Impedance 50 τ

Antenna VSWR <2.1 : 1

Dimensions Height: 120 mm

Volume 81 ml

Weight 80 g

Display Graphical chip on glass liquid crystal, Alphanumeric,

Illumination 4 LEDs for the LCD (7-colour)

Keys 18-key Keypad, Navigation key, Memo key.

SIM Plug-in type only

External DC Supply Voltage 5.8 V

Battery 3.7 V nominal, 650mAh, Li-Ion

Standby Battery Life
DRX 9

Conversation Battery Life
PL 7, DTX 50%

Battery life figures are dependent on network conditions.

Rx: 935 - 960 MHz

VSLEP

Width: 45 mm
Depth: 16.4 mm

16 x 4 characters + 2 lines of icons.

8 LEDs for the keypad (Green)
1 LED Incoming call (Green)
1 Charging LED (Red)

170 hrs maximum

210 minutes

Tx: 1710 - 1785 MHz
Rx: 1805 - 1880 MHz

WARNING

This service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not
contain warnings or cautions to advise non-technical individuals of potential dangers in attempting to service a product.
Products powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or
repair the product or products dealt with in this service manual by anyone else could result in serious injury or death.

© 2000 Matsushita Communication Industrial UK
Ltd. All rights reserved. Unauthorized copying and
distribution is a violation of law.

Issue 1
Revision 0

Company Liability

This Technical Guide is copyright and issued on the strict understanding that it is not be reproduced, copied, or disclosed to
any third party, either in whole or in part, without the prior written consent of Matsushita Communication Industrial UK Ltd.

Every care has been taken to ensure that the contents of this manual give an accurate representation of the equipment.
However, Matsushita Communication Industrial UK Ltd. accepts no responsibility for inaccuracies which may occur and
reserves the right to make changes to specification or design without prior notice.

The information contained in this manual and all rights in any designs disclosed therein, are and remain the exclusive property
of Matsushita Communication Industrial UK Ltd.

Other patents applying to material contained in this publication:

BULL CP8 PATENTS

Comments or correspondence concerning this manual should be addressed to:

Customer Support Department,

Matsushita Communication Industrial UK Ltd.,
Colthrop, Thatcham,

Berkshire, RG19 4ZD.
ENGLAND

© 2000 Matsushita Communication Industrial UK Ltd.

Issue 1 - ii - MCUK001001G8
Revision 0 Techni c a l G uide

CONTENTS

1 INTRODUCTION

1.1 Purpose of this Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.2 Structure of the Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 INTERFACES A ND TEST POINTS

2.1 Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2.2 Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3 RF OVERVIEW

3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4TRANSMITTER

4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.2 Uplink Frequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . 12

5 RECEIVER

5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

5.2 Downlink Frequencies . . . . . . . . . . . . . . . . . . . . . . . . . . 15

5.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . 16

6 BASEBAND OVERVIEW

6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

6.2 Keypad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

6.3 Subscriber Identity Module . . . . . . . . . . . . . . . . . . . . . . 20

6.4 Time Processing Unit (TPU) . . . . . . . . . . . . . . . . . . . . . 20

6.5 CPU Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

6.6 LCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

6.7 Real Time Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

6.8 Microphone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

6.9 Speaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

6.10 Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

6.11 UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

6.12 Acessory ASIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

7 HERCULES

7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

7.2 Digital Signal Processor . . . . . . . . . . . . . . . . . . . . . . . . 27

7.3 CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

7.4 Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

7.5 Interrupt Handler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

7.6 General Purpose I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

7.7 Dedicated I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

8OMEGA

8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

8.2 Uplink I and Q . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

8.3 Downlink I and Q . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

8.4 Power Amplifier Ramp . . . . . . . . . . . . . . . . . . . . . . . . . . 32

8.5 AFC Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

8.6 Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

8.7 Auxiliary A/D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

8.8 Charging Voltage Control. . . . . . . . . . . . . . . . . . . . . . . . 34

9 POWER SUPPLIES

9.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

9.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

9.3 Power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

9.4 Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

9.5 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

MCUK001001G8 Section Issue 1
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Issue 1 Section MCUK001001G8
Revision 0 – iv – Technical Guide

INTRODUCTION

1 INTRODUCTION

1.1. Purpose of this Guide

This Technical Guide contains technical information for the Panasonic GD93 personal cellular telephone operating on the GSM
Digital Cellular Network.

1.2. Structure of the Guide

The manual is structured to provide service engineering personnel with the following technical information:

1. Interface details and relevant test points.

2. Functional description of each section of the mobile telephone.

3. Detailed description of each section of the mobile telephone.

MCUK001001G8 Section 1 Issue 1
Technical Guide – 1 – Revision 0

INTRODUCTION

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Issue 1 Section 1 MCUK001001G8
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2 INTERFACES AND TEST POINTS

2.1. Interfaces

2.1.1 Main and Keypad PCBs

The interface between Main and Keypad PCBs is made via a 33-way connector.

INTERFACES AND TEST POINTS

10
11

12
13
14

15
16
17
18

19

1

7

9

VR
V[5]
V[4]
V[3]

V[2]
V[1]
CAP2+
CAP2-8
CAP1­CAP1+
CAP3­VOUT
GROUND
D2V8

DOUT
S_CLK

LCD_RS
nRESET
LCD_CS

10224-1

GROUND
BL4 2
VBAT 3
KBR(4) 4

KBR(3) 5
KBR(2) 6
KBR(1)

KBR(0)
KBC(4)
KBC(3)
KBC(2)
KBC(1)
KBC(0)
nPOWKEY

20
21

22
23

24
25

26

CN801

27
28

29
30

31
32
33

Figure 2.1: Interboard Connector

No. Signal Name MAIN <==> KEYPAD Function Connection

1 VR ==> LCD Voltage Reference

2 V[5] ==> LCD Voltage Reference

3 V[4] ==> LCD Voltage Reference

4 V[3] ==> LCD Voltage Reference

5 V[2] ==> LCD Voltage Reference

6 V[1] ==> LCD Voltage Reference

7 CAP2+ for LCD Stepup DC/DC

8 CAP2- for LCD Stepup DC/DC

9 CAP1- for LCD Stepup DC/DC

10 CAP1+ for LCD Stepup DC/DC

11 CAP3- for LCD Stepup DC/DC

12 VOUT

13 GND Ground GND

14 D28VB Power Source for LCD module D28VB

15 DOUT LCD control Serial data HERCULES pin 5

16 S_CLK LCD control Serial clock HERCULES pin 12

17 LCD_RS ==> LCD control Address data select HERCULES pin 59

18 nRESET ==> MPU nRESET signal

19 CS.LCD ==> LCD chip select signal HERCULES pin 14

20 GND Ground GND

21 BL[4] KEY Backlight ACC IC #49

22 VBAT Battery Voltage

23 KBR(4) <== Key Row 4 signal for Key scan HERCULES pin 179

24 KBR(3) <== Key Row 3 signal for Key scan HERCULES pin 178

25 KBR(2) <== Key Row 2 signal for Key scan HERCULES pin 176

26 KBR(1) <== Key Row 1 signal for Key scan HERCULES pin 174

27 KBR(0) <== Key Row 0 signal for Key scan HERCULES pin 173

28 KBC(4) ==> Key Column 4 signal for Key scan HERCULES pin 172

29 KBC(3) ==> Key Column 3 signal for Key scan HERCULES pin 171

30 KBC(2) ==> Key Column 2 signal for Key scan HERCULES pin 170

31 KBC(1) ==> Key Column 1 signal for Key scan HERCULES pin 169

32 KBC(0) ==> Key Column 0 signal for Key scan HERCULES pin 165

33 nPOWKEY <== Power Key sense signal OMEGA pin 74

MCUK001001G8 Section 2 Issue 1
Technical Guide – 3 – Revision 0

INTERFACES AND TEST POINTS

3

2.1.2 External I/O

No. Name HH <==>EXT Function H/H Circuit

1 AGND - Audio Ground

2 TX-AUDIO <== Sending Audio
3 RX-AUDIO ==> Received Audio

CASE FRONT

114

10225-1

Figure 2.2: External I/O Connector

10095-1

560

4 VBAT IN /

DATA_MODE0

<== Battery Voltage Supply input /

Data Accessory Recognition 0
5 nACC_SENSE <== Handsfree / Data Accessory detection
6 nAUDIO-ON ==> Audio Path Control

7 SERIAL UP <== Upward serial

8 SERIAL-DOWN ==> Downward serial

9 ACC_PWR ==> Peripheral power supply

10 DTR /

DATA_MODE1

<== RS232C: Data Terminal Ready /

(L: On = un mute, Hi-Z: Off = mute)

(9600 bps: SMS cable)

(33.8 kbps: Data adaptor I/F Card)

(up to 38.4 kbps: Soft Modem cable)

(57.6 kbps: Test Command)

(Baud rate same as SERIAL-UP)

(on: less than 100 mA)

Data Accessory recognition 1
11 RTS <== RS232C: Request to Send
12 CTS / PA-ON ==> PA control signal for test trigger

(L: off, H 2.8V: on)

13 EXT-PWR <== Power supply for Battery Charge
14 GND - Power supply and digital signal

ground

10222-1

4.7 k

10105-1

10097-1

10223-1

2.2k

0.1

330

330

47k

10104-1

330

30

330p

10095-1

Issue 1 Section 2 MCUK001001G8
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2.1.3 SIM Interface

2.2. Test Points

2.2.1 Main PCB

INTERFACES AND TEST POINTS

Pin Signal

1SIMPWR (3V/5V)

2SIM_RST

3 SIM_CLK

4 Not connected

5 Ground

6 Not connected

7 SIM-I/O

8 Not connected

TP No. Signal

TP601 nAUDIO_ON

TP602 DTR/DATA_MODE1

TP603 RTS

TP604 CTS/PA_ON

TP605 SERIAL_DOWN

TP606 SERIAL_UP

TP607 VBAT_IN/DATA_MODE0

TP608 KBR[4]

TP609 KBR[3]

TP610 KBR[2]

TP611 KBR[1]

TP612 KBR[0]

TP613 KBC[4]

TP614 KBC[3]

TP615 KBC[2]

TP616 KBC[1]

TP617 KBC[0]

TP618 nPOWKEY

TP619 SIM I/O

TP620 SIMCLK

TP621 SIM RST

TP622 SIMPWR

TP623 HERCULES TX_IRDA

TP624 HERCULES RX_IRDA

TP625 HERCULES CLK32_OUT

TP626 A28V

TP627 D28VB

TP628 D28V

TP629 D18V

TP630 D20V

TP631 EARP

TP632 EARN

TP633 BAT_TEMP

TP634 BAT_ID

TP635 HF_TXAUDIO

TP636 HF_RXAUDIO

TP No. Signal

TP637 EXT_PWR

TP638 BL[1]

TP639 BL[2]

TP640 BL[3]

TP641 CHARGING_LED

TP642 PAGING_LED

TP643 VBAT

TP644 VBAT

TP645 U607 Pin 1 (32KOUT)

TP646 GROUND

TP647 GROUND

TP649 DTHFO_P

TP650 DTHFO_N

TP651 PHF_DET

TP652 HSRX_AUD

TP653 HSTX_AUD

TP654 E608 (MIC)

TP655 E607 (MIC)

TP656 n_ACC_SENSE

TP658 BL[4]

TP701 HERCULES TDI

TP702 HERCULES TDO

TP703 HERCULES TCK

TP704 HERCULES TMS

TP707 HERCULES nBSCAN

TP708 HERCULES SSDX

TP709 HERCULES SSDR

TP710 HERCULES SSCLK

TP711 HERCULES SSRST

TP712 OMEGA TESTRESET

TP713 OMEGA RESPWRONZ

TP715 OMEGA TDO

TP901 BACK_LED

MCUK001001G8 Section 2 Issue 1
Technical Guide – 5 – Revision 0

INTERFACES AND TEST POINTS

2.2.2 Keypad PCB

TP No. Signal

TP801 VBAT

TP802 DS801 / R801

TP803 DS802 / R801

TP804 DS803 / R802

TP805 DS804 / R802

TP806 DS805 / R803

TP807 DS806 / R803

TP808 DS807 / R804

TP809 DS808 / R804

TP810 nPOWKEY

TP811 KBR[0]

TP812 BL4

TP813 GROUND

Issue 1 Section 2 MCUK001001G8
Revision 0 – 6 – Technical Guide

RF OVERVIEW

3 RF OVERVIEW

3.1. Introduction

3.1.1 General Specifications

The telephone is a Dual Band product incorporating two switchable transceivers, one for the GSM 900 band and another for
the GSM 1800 (DCS 1800) band. The transmit and receive bands for the mobile are given in the table below:

Tx Rx

GSM 900 890-915 MHz 935-960 MHz

GSM 1800 1710-1785 MHz 1805-1880 MHz

Other salient technical features are as follows:

GSM 900 GSM 1800

Rx Bandwidth 25 MHz 75 MHz

Tx Bandwidth 25 MHz 75 MHz

Duplex Spacing 45 MHz 95 MHz

Number of Channels 124 374

AFRCN (Channel Numbers) 1-124 512-885

1st Tx Channel 890.2 MHz 1710.2 MHz

Last Tx Channel 914.8 MHz 1784.8 MHz

1st Rx Channel 935.2 MHz 1805.2 MHz

Last Rx Channel 959.8 MHz 1879.8 MHz

Maximum Tx Power 33.0 dBm

(Class 4) (PL5)

Minimum Tx Power 5.0 dBm

(PL19)

30.0 dBm
(Class 1) (PL0)

0.0
(PL15)

3.1.2. Main PCB Description

All components required for the RF and Logic circuits, excluding the LCD module and backlight LEDs, are contained on the
Main PCB. The Main PCB has six layers with an Any Layer Interstitial Via-Hole (ALIVH) structure which can connect from / to
any layer. Surface and back layer tracks are gold-plated to prevent oxidisation and enable better soldering. The PCB thickness
is 0.7 mm ±0.1 mm.

The majority of RF components are located on both sides of the top half area of the Main PCB. The Keypad PCB back layer
consists mostly of groundplane which is used to provide RF shielding. A metallised plastic chassis has also been designed to
provide smaller walled sections to isolate sensitive RF areas like the synthesiser block from high level interference such as the
PA output and logic noise.

The back cover has a formed shielded enclosure to reduce further spurious emissions and logic noise.

3.2. Functional Description

3.2.1. Frequency Plan

The frequency plan is shown below:

Tx Tx IF RFLO Tx IFLO Tx

GSM 900 890 - 915 MHz 270 MHz 1160 - 1185 MHz 540 MHz

GSM 1800 1710 - 1785 MHz 135 MHz 1575 - 1650 MHz 540 MHz

Rx Rx 1st IF Rx 2nd IF RFLO Rx IFLO Rx

GSM 900 935 - 960 MHz 225 MHz 45 MHz 1160 - 1185 MHz 540 MHz

GSM 1800 1805 - 1880 MHz 225 MHz 45 MHz 1580 - 1655 MHz 540 MHz

MCUK001001G8 Section 3 Issue 1
Technical Guide – 7 – Revision 0

RF OVERVIEW

RF Switch

935 ~ 960 MHz

1,805 ~

1,880 MHz

Dual Rx

SAW BPF

RF VCO
1,160 ~ 1,185 MHz
1,575 ~ 1,655 MHz

Coupler
w/ LPF

Coupler
w/ LPF

LC BPF

GSM: 1,160 ~ 1,185 MHz
DCS: Rx 1,580 ~ 1,655 MHz
Tx 1,575 ~ 1,650 MHz

RF

Synthe

APC

IC

Dual PA
PF08103B-02- TB
(Hitachi)

Bright III RF IC

HD155133TFEB

IF VCO

(VJ3)

Tx VCO

890 ~ 915 MHz
1,710 ~ 1,785 MHz

IF SAW

BPF

225 MHz

2 2

Synthe

IF

%2

Phase

Detector

270 MHz

DCS: 270 MHz

GSM: 540 MHz

GSM: 270 MHz
DCS: 134, 135 MHz

45 MHz

%6

TCXO

(NDK)

%2

I&Q
Mod

%2

GSM: 270 MHz
DCS: 135 MHz

10213-1

935-960 MHz

RF LO
1160-1185 MHz

Figure 3.1: RF Block Diagram

Rx 1st IF
225 MHz

270 MHz

Fdiff
270 MHz

TX VCO
890-915 MHz

Rx 2nd IF
45 MHz

÷2

Fcomparison
270 MHz

Figure 3.2: GSM 900 Frequency Plan

45 MHz

÷2

÷2

270 MHz

I

Q

90 MHz

÷6

IF LO
VCO
540 MHz

I

Q

10214-1

Issue 1 Section 3 MCUK001001G8
Revision 0 – 8 – Technical Guide

RF OVERVIEW

1805-1880 MHz

Rx RF LO
1580-1655 MHz

Tx RF LO
1575-1650 MHz

Rx 1st IF
225 MHz

270 MHz

Fdiff
135 MHz

TX VCO
1710-1785 MHz

Rx 2nd IF
45 MHz

Fcomparison
135 MHz

45 MHz

÷2

270 MHz

÷2

÷2

I

Q

90 MHz

÷6

IF LO VCO
540 MHz

135 MHz

I

Q

10215-1

Figure 3.3: GSM 1800 Frequency Plan

3.2.2 General

The RF circuit design is built around an Hitachi Bright III GSM transceiver IC. Other major components include filters, power
amplifiers, VCOs and the antenna subsystems.

In either band, GSM 900 or GSM 1800, the Rx IF is fixed at 225 MHz and the 2nd IF at 45 MHz. Therefore, the 2nd local
oscillator is fixed at 540 MHz for receiver modes. This oscillator is also fixed at 540 MHz for transmit modes.

The Tx VCO is on-channel in both GSM 900 and GSM 1800 modes of operation.

3.2.3 Antenna

The antenna is a fixed helical type.

A mechanical switch is used to route the RF signal from the external antenna for handsfree operation and test purposes.

3.2.4 Transmit and Receive

The transmit and receive paths are covered in their own specific chapters later in this manual.

3.2.5 RF and Accessory Connector

An external antenna connector for use with handsfree accessories is located close to the PA module to minimise power loss.
Therefore, the PAs do not have to be driven so hard, allowing the voltage supply to be lower, thus improving battery
performance.

MCUK001001G8 Section 3 Issue 1
Technical Guide – 9 – Revision 0

RF OVERVIEW

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Issue 1 Section 3 MCUK001001G8
Revision 0 – 10 – Technical Guide