Panasonic FP-ABP8 User Manual

ABP8
01/2006
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ORDERING INFORMATION
Type Part No.
Type I ABP811161P
Type II ABP811261P
Remarks: Standard packaging 1 reel: 2,000 pcs. 1 case: 5 reels (10,000 pcs.)
FP (ABP8) SWITCHES
• Ultra-miniature size (3.4×3.4×2.4mm .134×.134×.094 inch) Meet the market requirements of FDD miniaturization
• Low operating force Max. 0.3 N
• SMD type available
TYPICAL APPLICATIONS
• Floppy Disk Drivers
• Optical Disk Drivers
• CD-ROM Drivers
• Notebook Personal Computers
• Portable Handy Phones
• VCR
• Printers
SPECIFICATIONS
1. Contact rating
Standard rating 0.1A 10V DC
Low-level circuit rating 0.01mA 5V DC
2. Characteristics
Expected electrical life (Min. operations)
Insulation resistance (by 100V DC insulation resistance meter)
Dielectric Strength 100Vrms for 1 min.
Vibration resistance
Shock resistance
Ambient temperature –25°C to +80°C –13°F to +176°F (not freezing below 0°C 32°F)
Initial contact resistance Max. 3Ω (by HP4328A)
3. Operating characteristics
Operating force Max. 0.3 N
Free position Max. mm inch 3.7 .146 4.9 .193
Operating position mm inch 3.3±0.2 .130 ±.008 4.5±0.2 .177 ±.008
Total travel position Max. mm inch 2.3 .091 3.5 .138
Total stroke mm inch 1.2 .047
0.1A 10V DC resistive
10mA 5V DC resistive
2
14.7m/s
8 to 500Hz (contact opening: Max. 10µsec.)
Min. 294 m/s2 (contact opening: Max. 10µsec.)
Type I Type II
Min. 5×10
Min. 10
Min. 100M
4
5
140
DIMENSIONS
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01/2006
Type I
C0.1
.004
.008
.047
0.2
.134
0.8 dia.
.031 dia.
±0.05
1.2
±.002
3.4
1.0
.039
Terminal #1
1.5
.059
0.25
.010
Terminal #2
1.2
.047
2.3
.091
0.15 max.
.006
C
L
dia.
dia.
FP
3.7 max.
.146
1.0
.039
Terminal #3
3.4
.134
0.3
.012
OP
±0.2
3.3
±.008
TTP
.130
2.3 max.
.091
NOTES
1. Soldering operations
1) For manual soldering; By using 18W Max. (iron tip temperature: 320°C 608°F Max.) soldering should be completed within 3 seconds.
2) For reow soldering; Perform soldering reow at a peak sur­face temperature of the PC board not to exceed 245°C 473°F. See the below rec- ommended temperature profile.
Recommended condition for 245
473
220
428
150
302
Temperature (°C °F)
3) During soldering, care should be taken not to apply excessive stress to the termi­nals as the resulting deformation may cause malfunction. Excessively high sol­der tab temperature and soldering iron wattage should also be avoided as these factors may harm switching performance.
2. Setting of the operation object
In setting the operation object; keep the following distance between the switch bot­tom and the operation object at T.T.P. (To­tal Travel Position)
reflow temperature profile
Preheating within 2 min.
with 30 sec.
ABP8
mm inch
Type II Recommended PC board pattern
0.2
±.008
TTP
3.5 max.
.138
C0.1
.004
.008
1.2
.047
C
L
0.8 dia.
.031 dia.
±0.05
dia.
±.002
dia.
0.25
.010
Terminal #1
Terminal #2
2.9
.114
2.3
.091
0.15 max.
.006
FP
4.9 max.
.193
Terminal #3
OP
±0.2
4.5
.177
ABP811161P: 2.3 to 2.9mm
.091 to .114 inch
ABP811261P: 3.5 to 4.1mm
.138 to .161 inch
3. Quality Check under Actual Loading Conditions
To assure reliability, check the switch un­der actual loading conditions. Avoid any situation that may adversely affect switch­ing performance.
4. Environment
1) These switches do not have a sealed construction. As such, the construction of the equipment in which the switches are to be installed should be given careful consideration when the switches are to be used in locations where corrosive gases, silicon or other substances which will ad­versely affect the contacts are used, where there is a high concentration of dust or where the switches may be ex­posed to condensation or water. Using switches in locations like these may cause malfunctioning.
2) Avoid using this switch in high-temper­ature, high-humidity or condensation­forming environments and avoid allowing droplets of water to remain on the switch or come into contact with it. These condi­tions may interfere with the performance of the switch (resulting in short-circuiting,
1.1
.043
0.7
.028
+0.2
1.3 dia. hole
0
+.008
.051 dia. hole
0
Terminal #3
migration, etc.). Use the type with the gold contacts in applications involving trains, aircraft, motor vehicles or medical equip­ment where the switch must satisfy safety and high reliability requirements. Please consult with us for the applications re­quired high reliability.
3) Because the humidity range differs de­pending on the ambient temperature, the humidity range indicated below should be used. Continuous operation of the switch is possible within this range, but continu­ous use near the limit of the range should be avoided.
This humidity range does not guarantee permanent performance.
(Avoid freezing when used at temperatures lower than 0°C 32°F)
(Top view)
Schematic
SPST-NO
85
Tolerance range
5
–25
+32
–13
3.7
.146
Terminal #1
Terminal #2
Humidity, %R.H.
(Avoid condensation when used at temperatures higher than 0°C 32°F)
0
Temperature, °C °F
1.1
.043
1.5
.059
80
176
141
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