Panasonic Fax KX-TC2105LBB Schematic

ORDER NO. KM40510896CE

Telephone Equipment

KX-TC2105LBB

Cordless Phone

Black Version (for Brazil)

KX-TC2105LBB

Note:

Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can download and refer to the original Operating Instructions on TSN Server for further information.

CONTENTS

Page Page

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4

1.1. Suggested PbF Solder

1.2. How to recognize that Pb Free Solder is Used

2 FOR SERVICE TECHNICIANS 3 CAUTION 4 OPERATING INSTRUCTIONS

4.1. Battery

4.2. Location of Controls

4.3. Connection

4.4. Troubleshooting

5 DISASSEMBLY INSTRUCTIONS 6 TROUBLESHOOTING GUIDE

6.1. Check Power

6.2. Bell Reception

6.3. Check Battery Charge

6.4. Check Link

6.5. Check Handset Transmission

6.6. Check Handset Reception

7 ADJUSTMENTS (BASE UNIT)

7.1. Test Mode Flow Chart (Base Unit)

7.2. How to change the channel

7.3. Adjustment

7.4. Adjustment Standard (Base Unit)

8 ADJUSTMENTS (HANDSET)

8.1. Test Mode Flow Chart (Handset)

8.2. How to change the channel

8.3. Adjustment

8.4. Adjustment Standard (Handset)

9 RF SPECIFICATION

9.1. Base Unit

9.2. Handset

10 HOW TO CHECK THE HANDSET SPEAKER 11 FREQUENCY TABLE (MHz) 12 EXPLANATION OF CPU DATA COMMUNICATION

12.1. STAND-BY -> TALK, TALK -> STAND-BY

12.2. Ringing

10 12

13 14 15 16 17 18

19 20 20 21

22 23 23 24

25 25

25 26 27

27 28

4 5

5 5 6

6 7 8 9

12.3. Changing the Channel

12.4. Ports for transmitting and receiving of data

12.5. Waveform of DATA used for cordless transmission and reception

13 B LOCK DIAGRAM (BASE UNIT) 14 CIRCUIT OPERATION (BASE UNIT)

14.1. Outline

14.2. Power Supply Circuit

14.3. Reset Circuit

14.4. Charge Circuit

14.5. Telephone Line Interface

14.6. Transmitter/Receiver

15 B LOCK DIAGRAM (HANDSET) 16 CIRCUIT OPERATION (HANDSET)

16.1. Outline

16.2. Reset Circuit

16.3. Battery Low / Power Down Detector

17 SIGNAL ROUTE 18 CPU DATA (Base Unit)

18.1. IC201

19 CPU DATA (Handset)

19.1. IC701

20 RF IC (Base Unit and Handset)

20.1. Base Unit: IC401, Handset: IC801

21 HOW TO REPLACE THE FLAT PACKAGE IC

21.1. PREPARATION

21.2. FLAT PACKAGE IC REMOVAL PROCEDURE

21.3. FLAT PACKAGE IC INSTALLATION PROCEDURE

21.4. BRIDGE MODIFICATION PROCEDURE

22 CABINET AND ELECTRICAL PARTS (BASE UNIT) 23 CABINET AND ELECTRICAL PARTS (HANDSET) 24 ACCESSORIES AND PACKING MATERIALS 25 TER MINAL GU IDE OF THE ICs, TR ANSISTO RS AND DIODES

25.1. Base Unit

25.2. Handset

29 30

31 32

32 33 34 35 35 36

38 39

39 39 40

41 42

45 45 46 46

47 48 49

50 50

KX-TC2105LBB

26 REPLACEMENT PARTS LIST 51

26.1. Base Unit

26.2. Handset

26.3. Accessories and Packing Materials

27 FOR SCHEMATIC DIAGRAM

27.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))

27.2. Handset (SCHEMATIC DIAGRAM (HANDSET))

28 SCHEMATIC DIAGRAM (BASE UNIT)

51 53 54

55 55

29 SCHEMATIC DIAGRAM (HANDSET) 30 CIRCUIT BOARD (BASE UNIT)

30.1. Component View

30.2. Flow Solder Side View

31 CIRCUIT BOARD (HANDSET)

31.1. Component View

31.2. Flow Solder Side View

57 59

59 60

61 62

KX-TC2105LBB

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn), Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.

Caution

• PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with temperature control and adjust it to 700°F ± 20° F (370°C ± 10°C). In case of using high temperature soldering iron, please be careful not to heat too long.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).

• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible

and be sure that any remaining is melted prior to applying the Pb solder.

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the opposite side (See the figure below).

1.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper (Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac turer’s specific instructions for the melting points of their products and any precautions for using their product with other materials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

1.2. How to recognize that Pb Free Solder is Used

(Example: Handset P.C.B.)

PROGRAM

LOUD

GND OUTPUT

MIC

RINGER

PAUSE

LED703

LED704

LED702

LED705

FLASH LED701

TALK

REDIAL

PbF

AUTO

DIRECT

DTCOUT

R843 C866

C864

PSAVE

C839 C838

R848 C848

TXVCO

C861

R837

Q804

R838

R841

C862

C860

R839

C858

C836 C804

C832

R802

C831

Marked

Note:

The location of the "PbF" mark is subject to change without notice.

2 FOR SERVICE TECHNICIANS

ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on worktable.

4. Do not grasp IC or LSI pins with bare fingers.

KX-TC2105LBB

TXPOWER

C852

6431

C865

Q802

C854

C870 C857

R830

R835

C855 R836

C863

R804

Q803

C808

R834

433

C805

C873

C872

C851

R831

R833

C856

664

R801

SP+ SP-

C853

NDTC

GND

IFOUT

R803

C803

Q801

C802

C801

ANT_TP

IFGND

R851 C871 R850

RXVCO

3 CAUTION

1. Danger of explosion if battery is incorrectly replaced.

2. Replace only with the same or equivalent type recommended by the manufacturer.

3. Dispose of used batteries according to the manufacturer´s Instructions.

KX-TC2105LBB

4 OPERATING INSTRUCTIONS

4.1. Battery

4.1.1. Recharge

4.1.2. Battery information

4.1.3. Battery Replacement

4.2. Location of Controls

4.2.1. Base Unit

KX-TC2105LBB

4.2.2. Handset

KX-TC2105LBB

4.3. Connection

4.4. Troubleshooting

KX-TC2105LBB

5 DISASSEMBLY INSTRUCTIONS

Shown in Fig.- To Remove Remove

1 Cabinet Cover Screws (2.6 × 12)....................... (A) × 4

Main P.C. Board Main P.C. Board

KX-TC2105LBB

Shown in Fig.- To Remove Remove

2 Cabinet Cover Battery compartment cover.

3 Screws (2.6 × 12)......................(B) × 2

4 Follow the procedure.

5 Main P. C. Board Screw (2.6 × 12)........................(C) × 1

Main P. C. Board

KX-TC2105LBB

6 TROUBLESHOOTING GUIDE

Cross Reference:

Check Power (P.13) Bell Reception (P.14) Check Battery Charge (P.15) Check Link (P.16) Check Handset Transmission (P.17) Check Handset Reception (P.18)

6.1. Check Power

KX-TC2105LBB

Cross Reference:

Reset Circuit (P.34) Power Supply Circuit (P.33)

Cross Reference:

Charge Circuit (P.35)

*: Each measurement points are shown in CIRCUIT BOARD (BASE UNIT) (P.59) or CIRCUIT BOARD (HANDSET) (P.61)

Note:

*CPU: IC201

Note:

*CPU: IC701

KX-TC2105LBB

6.2. Bell Reception

Cross Reference:

Check Link (P.16) Telephone Line Interface (P.35)

Cross Reference:

Check Link (P.16)

*: Each measurement points are shown in CIRCUIT BOARD (BASE UNIT) (P.59) or CIRCUIT BOARD (HANDSET) (P.61)

Note:

*CPU: IC201

Note:

*CPU: IC701

6.3. Check Battery Charge

KX-TC2105LBB

Cross Reference:

Charge Circuit (P.35)

Cross Reference:

Reset Circuit (P.39)

*: Each measurement points are shown in CIRCUIT BOARD (BASE UNIT) (P.59) or CIRCUIT BOARD (HANDSET) (P.61)

Note:

*CPU: IC201

Note:

*CPU: IC701

KX-TC2105LBB

6.4. Check Link

**: Refer to Adjustment (P.20) Note:

*CPU: IC201 *RF IC: IC401

*: Each measurement points are shown in CIRCUIT BOARD (BASE UNIT) (P.59) or CIRCUIT BOARD (HANDSET) (P.61)

KX-TC2105LBB

**: Refer to Adjustment (P.23). Note:

*CPU: IC701 *RF IC: IC801

*: Each measurement points are shown in CIRCUIT BOARD (BASE UNIT) (P.59) or CIRCUIT BOARD (HANDSET) (P.61)

6.5. Check Handset Transmission

Cross Reference:

SIGNAL ROUTE (P.41)

KX-TC2105LBB

6.6. Check Handset Reception

Cross Reference:

SIGNAL ROUTE (P.41)

7 ADJUSTMENTS (BASE UNIT)

If your unit has below symptoms, adjust or confirm each item using remedy column from the table.

Symptom Remedy* The base unit does not respond to a call from handset. Make adjustments in item (A) The base unit does not transmit or the transmit frequency is off. Make adjustments in item (B) The transmit frequency is off. Make confirmation in item (C) The transmit power output is low, and the operating distance between the base unit and

the handset is less than normal. The reception sensitivity of base unit is low with noise. Make confirmation in item (E) The transmit level is high or low. Make confirmation in item (F) The reception level is high or low. Make confirmation in item (G) The unit does not link. Make confirmation in item (H)

*: Refer to Adjustment (P.20).

7.1. Test Mode Flow Chart (Base Unit)

The operation-flow of Test mode and main check items are shown below.

Make adjustments in item (D)

KX-TC2105LBB

Note:

**: Refer to the above table.

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