Chip Bead Cores
Type:
EXCCL
EXCML
EXC3B
Chip Bead Cores
■ Features
● Effective noise suppression for power lines and high
speed signal lines
● Easy pattern layout on PC Board
Type: EXCCL, EXCML
● Low DC Resistance 3 to 8 m액 typical: Rated
current (3 and 4 Amperes) (type: EXCML)
● Low impedance
Type: EXC3B
● High impedance for high speed signal line noise
● Increased attenuation
● 60 액-1 A, 120 액-0.5 A are achieved by using 1608
size (type: EXC3BP)
■ Ty pe: EXCCL
Explanation of Part Numbers
●
■ Recommended Applications
● Digital equipment such as PCs, word processors,
print ers, HDD, PCC, CD-ROMs, DVD-ROMs.
● Digital audio and video equipment such as VCRs,
DVC, CD Players, DVD Players.
● AC adapters, and switching power supplies.
● Electronic musical instruments, and other digital
equipment.
1
E
2
X
Product Code Type Size Form Suffix
Noise Filter Chip type Bead core
3
C
4
C
5
L
Part kind
6
3
7
2
Dimensions (mm)
Code
4532
3225
3216
8
1
4.5x3.2x1.8
3.2x2.5x1.6
3.2x1.6x1.6
9
6
10
U
Code
Embossed Carrier Taping
U
11 12
1
Packing
Design and spec ifi cations are e ach subj ect to change w ithout notic e. Ask f actory for t he cur rent technical speci fi cations before purchase and/or use.
Should a sa fet y concern ar ise reg arding th is product, please be sure to c ontac t us immediately.
Mar. 2008
Chip Bead Cores
■ Construction
Ferrite core
■ Ty pe: EXCML
Explanation of Part Numbers
●
1
2
■ Dimensions in mm (not to scale)
L
AA
L
W
Electrode
Type
(inches)
EXCCL4532
(1812)
EXCCL3225
(1210)
EXCCL3216
(1206)
3
4
5
6
7
8
Dimensions (mm)
LWHA
4.5±0.4 3.2±0.3 1.8±0.2 0.5±0.2
3.2±0.3 2.5±0.3 1.6±0.3 0.5±0.3
3.2±0.3 1.6±0.3 1.6±0.3 0.5±0.3
9
10
11
12
Mass
(Weight)
[mg/pc.]
125.8
60.5
37
E
Noise Filter
X
Product Code Type MaterialSize Nominal Impedance
Molded
Chip type
C
M
Bead core
L
Part kind
Code
45
32
20
16
2
Dimensions (mm)
4.5x1.6 x1.1
3.2x1.6 x0.9
2.0x1.25x0.9
1.6x0.8 x0.8
0
A
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
3
9
Code
U
H
■ Dimensions in mm (not to scale)■ Construction
e
L
Dimensions (mm)
LWT e
1.6±0.2 0.8±0.2 0.8±0.2
2.0±0.2 1.25±0.20 0.9±0.2
3.2±0.3 1.6±0.3 0.9±0.2
4.5±0.3 1.6±0.3 1.1±0.2
Conductor
Ferrite core
Electrode
Type
(inches)
EXCML16
(0603)
EXCML20
(0805)
EXCML32
(1206)
EXCML45
(1806)
0
U
Form
Packing
Embossed Carrier Taping
(EXCML16 to 32)
Embossed Carrier Taping
(EXCML45)
T
W
(0.4)
(0.5)
(0.6)
(0.6)
Mass
(Weight)
[mg/pc.]
4.5
10.5
21.5
36.0
Design and spec ifi cations are e ach subj ect to change w ithout notic e. Ask f actory for t he cur rent technical speci fi cations before purchase and/or use.
Should a sa fet y concern ar ise reg arding th is product, please be sure to c ontac t us immediately.
Mar. 2008
■ Ty pe : EXC3B
Explanation of Part Numbers
●
Chip Bead Cores
Noise Filter
1
E
2
X
Product Code Type
Code
3
3
C
Dimensions (mm)
1.6x0.8x0.8
Ferrite core
4
3
Size Nominal Impedance Form Suffix
5
B
Multilayer
Chip type
Bead Core
6
B
Characteristics
High frequency
High attenuation
B
for signal Lines
High frequency
High attenuation
P
for Power Lines
7
2
8
2
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
9
1
10 11 12
H
Code
H
Packing
Embossed Carrier Taping
■ Dimensions in mm (not to scale)■ Construction
e
L
T
W
Inner Conductor
■ Ratings
Type Part Number
4532 EXCCL4532U1
3225 EXCCL3225U1
3216 EXCCL3216U1
4516 EXCML45A910H
3216 EXCML32A680U
2012 EXCML20A390U
1608 EXCML16A270U
EXC3BP600H
EXC3BP121H
1608
EXC3BB221H
EXC3BB601H
EXC3BB102H
Electrode
Type
(inches)
EXC3BB
(0603)
EXC3BP
(0603)
Impedance
(액) at 100 MHz tol.(%)
115
Dimensions (mm)
LWT e
1.6±0.2 0.8±0.2 0.8±0.2 0.30±0.15
1.6±0.2 0.8±0.2 0.8±0.2 0.30±0.15
Rated Current
(mA DC)
DC Resistance
(액) max.
2000 0.1
45 2000 0.05
25 2000 0.05
91 3000 0.016
68 3000 0.012
39 4000 0.008
27 4000 0.006
±25
60 1000 0.07
120 500 0.1
220 200 0.3
600 100 0.8
1000 50 1
Mass
(Weight)
[mg/pc.]
4.5
4.5
Design and spec ifi cations are e ach subj ect to change w ithout notic e. Ask f actory for t he cur rent technical speci fi cations before purchase and/or use.
Should a sa fet y concern ar ise reg arding th is product, please be sure to c ontac t us immediately.
Feb. 2006
Chip Bead Cores
■ Impedance Characteristics (Reference Data) Measured by HP4291A
앚Z앚 : Impedance R : Resistance X : Reactance
●EXCCL4532U1 (4532)
140
120
100
80
60
40
훺Z훺,R,X(액)훺Z훺,R,X(액)훺Z훺,R,X(액)
20
0
110100
Z
Frequency(MHz)
●EXCCL3225U1 (3225)
140
120
100
80
60
40
20
0
110100
Z
X
Frequency(MHz)
●EXCML16A270U (1608)
140
120
100
80
R
X
1000 10000
60
훺Z훺,R,X(액)훺Z훺,R,X(액)훺Z훺,R,X(액)훺Z훺,R,X(액)
40
20
0
1
10 100 1000 10000
Z
R
Frequency(MHz)
X
●EXCML20A390U (2012)
140
120
100
80
60
R
1000 10000
40
20
0
110100 1000 10000
Z
R
X
Frequency(MHz)
●EXCCL3216U1 (3216)
140
120
100
80
60
40
20
0
110100
Z
Frequency(MHz)
●EXCML32A680U (3216)
140
120
100
80
60
40
R
X
1000 10000
20
0
110100 10000
Z
R
X
1000
Frequency(MHz)
●EXCML45A910H (4516)
180
160
140
120
100
80
60
40
20
0
110100 1000 10000
Z
R
X
Frequency(MHz)
Design and spec ifi cations are e ach subj ect to change w ithout notic e. Ask f actory for t he cur rent technical speci fi cations before purchase and/or use.
Should a sa fet y concern ar ise reg arding th is product, please be sure to c ontac t us immediately.
Feb. 2006
Chip Bead Cores
■ Impedance Characteristics (Reference Data) Measured by HP4291A
앚Z앚 : Impedance R : Resistance X : Reactance
●EXC3BB221H (1608)
1400
1200
1000
800
600
400
훺Z훺,R,X(액)훺Z훺,R,X(액)
200
0
110100
Frequency(MHz)
●EXC3BB601H (1608)
1400
1200
1000
800
600
400
200
0
110100
Frequency(MHz)
X
1000 10000
R
X
1000 10000
●EXC3BP121H (1608)
200
150
100
Z
R
50
훺Z훺,R,X(액)훺Z훺,R,X(액)
0
110100
Z
R
X
1000 10000
Frequency(MHz)
●EXC3BP600H (1608)
200
150
100
Z
50
0
110100
Z
R
X
1000 10000
Frequency(MHz)
●EXC3BB102H (1608)
1400
1200
1000
800
600
400
훺Z훺,R,X(액)
200
0
110100
Frequency(MHz)
Z
R
X
1000 10000
Design and spec ifi cations are e ach subj ect to change w ithout notic e. Ask f actory for t he cur rent technical speci fi cations b efore purchase and/or use.
Should a sa fet y concern ar ise reg arding th is product, please be sure to c ontac t us immediately.
Feb. 2006
■ Packaging Methods (Taping)
● Standard Quantity
Part Number Kind of Taping Pitch (P1) Quantity
Chip Bead Cores
EXCCL4532U1
EXCCL3225U1
EXCCL3216U1
EXCML45A910H
EXCML32A680U
EXCML20A390U
EXCML16A270U
EXC3B
t
1
t2
첸첸첸첸
Chip component
H
Sprocket hole
Embossed Carrier Taping
φD0
Compartment
A
B
P1 P2 P0
Tape running direction
8 mm 1000 pcs./reel
2000 pcs./reel
4 mm
3000 pcs./reel
4000 pcs./reel
● Taping Reel● Embossed Carrier Taping
T
φ C
E
F
W
E
φ A
φ D
W
φ B
t
Embossed Carrier Dimensions (mm)
Part Number A B W F E P
EXCCL4532U1
EXCCL3225U1
EXCCL3216U1
EXCML45A910H
EXCML32A680U
EXCML20A390U
EXCML16A270U
EXC3B
첸첸첸첸
3.6±0.2 4.9±0.2
2.9±0.2 3.6±0.2
2.0±0.2 3.6±0.2
1.9±0.2 4.8±0.2
1.9±0.2 3.5±0.2
1.5±0.2 2.3±0.2
1.1±0.2 2.1±0.2
H
1.0±0.1 1.8±0.1
12.0±0.2
5.5±0.1
8.0±0.2 3.5±0.1
12.0±0.2
5.5±0.1
8.0±0.2 3.5±0.1
1.75±0.10
Standard Reel Dimensions (mm)
Part Number
A
φ
B
φ
C
φ
EXCCL4532U1
EXCCL3225U1
EXCCL3216U1
EXCML45A910H
180.0
0
60.0±1.0 13.0±0.5 21.0±0.8 2.0±0.5
–3.0
EXCML32A680U
EXCML20A390U
EXCML16A270U
EXC3B
첸첸첸첸
H
1
8.0±0.1
P
2
P
0
D
φ
t
0
1
t
2
2.4 max.
2.1 max.
4.0±0.1
2.0±0.1 4.0±0.1 1.5±0.1
0.20±0.05
1.8 max.
1.6 max.
0.25±0.05
DE W T t
φ
+0.5
13.0
09.5
13.0
09.5
–1.0
+0.5
–1.0
+0.5
–1.0
+0.5
–1.0
16.5 max.
13 max.
16.5 max.
13 max.
1.2±0.5
Design and spec ifi cations are e ach subj ect to change w ithout notic e. Ask f actory for t he cur rent technical speci fi cations b efore purchase and/or use.
Should a sa fet y concern ar ise reg arding th is product, please be sure to c ontac t us immediately.
Feb. 2006
■ Recommended Land Pattern Dimensions in mm (not to scale)
Part Number A B C
EXCCL4532U1
EXCCL3225U1
AB
EXCCL3216U1
EXCML45A910H
EXCML32A680U
EXCML20A390U
C
EXCML16A270U
EXC3B
첸첸첸첸
H
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
Recommended soldering conditions for refl ow
●
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Peak
For soldering (Example : Sn- 37Pb)
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 10 °C max. 10 s
Chip Bead Cores
(mm)
3 5.4 2.8
1.7 4.1 2.1
1.7 4.1 1.2
2.6 to 3 5.5 to 6.5 1.2 to 1.6
1.6 to 2 4 to 5 1.2 to 1.6
0.8 to 1.2 3 to 4 1 to 1.2
0.6 to 1 2 to 3 0.8 to 1
0.8 to 1 2 to 2.6 0.8 to 1
Temp erature Time
Preheating
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
Temp erature Time
Temperature
Heating
Preheating 150 °C to 170 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
Time
<Repair with hand soldering>
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
●
each electrode for 3 seconds or less.
Never touch this product with the tip of a soldering iron.
●
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog.
1. Flow soldering may cause this product to come off because the adhesiveness of the product element is low.
Please consult our sales representative in advance about fl ow soldering.
2. Use rosin-based fl ux or halogen-free fl ux.
3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales per son
in advance.
4. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g.
pliers and tweezers). Otherwise, their bodies may be chipped, affecting their per for mance.
Excessive mechanical stress may damage the bead cores. Handle with care.
5. Store the bead cores in a location with a temperature ranging from -5 °C to +40 °C and a rel a tive humidity of
40 % to 60 %, where there are no rapid changes in temperature or humidity.
6. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the out go ing in spec tion
indicated on the packages.
Design and spec ifi cations are e ach subj ect to change w ithout notic e. Ask f actory for t he cur rent technical speci fi cations b efore purchase and/or use.
Should a sa fet y concern ar ise reg arding th is product, please be sure to c ontac t us immediately.
Jul. 2008
Safety Precautions (Common precautions for EMI Filters, ESD Suppressors, Fuses, and MR Sensors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifi cations described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signifi cant dam age, such as damage to
vehicles (automobile, train, vessel), traffi c lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
Systems equipped with a protection circuit and a protection device
✽
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault
✽
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general elec tron ic equipment
(e.g. AV equipment, home electric appliances, offi ce equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl
4. Electric Static Discharge (ESD) Environment (except ESD Suppressors)
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or infl ammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
, H2S, NH3, SO2, or NO
2
2
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al
at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the out go ing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifi cations. The performance of Thermal Cut offs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl
, H2S, NH3, SO2, or NO
2
2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Jan. 2008
– EL113 –
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