Panasonic A4US User Manual

Page 1
AXE1/AXE2
Bellows contact construction
(Against dropping!)
Ni barrier construction
(Against solder rise!)
Porosity treatment
(Against corrosive gases!)
V notch and Double contact constructions
(Against foreign particles and flux!)
For board-to-FPC
New
Socket Header
RoHS compliant
Narrow pitch connectors
(0.4mm pitch)
1. Mated width: 2.2 mm and Mated height: 0.8 mm, 1.0 mm and 1.5 mm
When mated, the footprint is reduced by approx. 12% from A4S series (50 pin contacts), contributing to the functionality enhancement and size reduction of end equipment.
Soldering terminals at each corner
Suction face: 0.6mm*
2.2mm
Suction face: 0.7mm*
1.8mm
* Suction face size for the 1.0 mm/1.5 mm mated
height type: Socket — 0.64 mm, Header — 0.76 mm
2. Improves degree of design freedom (Mated height of 0.8 mm, 1.0 mm, or
1.5 mm with the same foot pattern)
12.5 mm (50 pin contacts)
Socket
Soldering terminals at each corner
11.8 mm (50 pin contacts)
Header
A4US Series
3. “ ” ensures high resistance to various environments in lieu of its space­saving footprint.
4. Simple lock structure provides tactile feedback to ensure excellent mating/unmating operation feel.
5. Soldering terminals at each corner enhance mounting strength.
6. Gull-wing-shaped terminals to facilitate visual inspections.
APPLICATIONS
Suitable for board-to-FPC connections in mobile equipment that requires size and thickness reduction and functionality enhancement.
ORDERING INFORMATION
AXE 42
1: Socket 2: Header
Number of pins (2 digits) Mated height
<Socket> 1: 0.8 mm 2: 1.0 mm/1.5 mm <Header> 1: 0.8 mm 2: 1.0 mm 3: 1.5 mm
Functions 2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion) <Socket> 4: Base: Ni plating, Surface: Au plating (for Ni barrier available) <Header> 4: Base: Ni plating, Surface: Au plating
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ACCTB4E 201201-T1
Page 2
AXE1/AXE2
PRODUCT TYPES
Mated height Number of pins
10 AXE110124 AXE210124 14 AXE114124 AXE214124 18 AXE118124 AXE218124 20 AXE120124 AXE220124 24 AXE124124 AXE224124
0.8mm
1.0mm
1.5mm
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units Samples for mounting check: 50-connector units. Please contact our sales office.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our sales office.
3. Please contact us for connectors having a number of pins other than those listed above.
30 AXE130124 AXE230124 36 AXE136124 AXE236124 40 AXE140124 AXE240124 50 AXE150124 AXE250124 60 AXE160124 AXE260124 70 AXE170124 AXE270124 80 AXE180124 AXE280124 10 AXE110224 AXE210224 20 AXE120224 AXE220224 34 AXE134224 AXE234224 40 AXE140224 AXE240224 60 AXE160224 AXE260224 80 AXE180224 AXE280224 20 AXE120224 AXE220324 60 AXE160224 AXE260324 80 AXE180224 AXE280324
Socket Header Inner carton (1-reel) Outer carton
Part number Packing
5,000 pieces 10,000 pieces
SPECIFICATIONS
1. Characteristics
Item Specifications Conditions Rated current 0.30A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC
Electrical characteristics
Mechanical characteristics
Environmental characteristics
Lifetime characteristics
Unit weight
Breakdown voltage 150V AC for 1 min. Insulation resistance Min. 1,000M (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Max. 90m Composite insertion force Max. 0.981N/pin contacts × pin contacts (initial)
Composite removal force Min. 0.165N/pin contacts × pin contacts Contact holding force
(Socket contact) Ambient temperature –55°C to +85°C No freezing at low temperatures. No dew condensation.
Soldering heat resistance
Storage temperature
Thermal shock resistance (header and socket mated)
Humidity resistance (header and socket mated)
Saltwater spray resistance (header and socket mated)
H2S resistance (header and socket mated)
Insertion and removal life 30 times
No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute.
Based on the contact resistance measurement method specified by JIS C 5402.
Min. 0.20N/pin contacts
Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec. Soldering iron –55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
5 cycles, insulation resistance min. 100M, contact resistance max. 90m
120 hours, insulation resistance min. 100M,
contact resistance max. 90m
24 hours, insulation resistance min. 100M,
contact resistance max. 90m
48 hours, contact resistance max. 90m
60 pin contacts Socket (h = 0.8mm: 0.03g, h = 1.0/1.5mm: 0.04g)
Header (h = 0.8mm: 0.01g, h = 1.0mm: 0.02g, h = 1.5mm: 0.03g)
Measuring the maximum force. As the contact is axially pull out.
Infrared reflow soldering
No freezing at low temperatures. No dew condensation. Sequence
0
1. –55 °C, 30 minutes
3
2. ~ , Max. 5 minutes
+3
3. 85 °C, 30 minutes
0
4. ~ , Max. 5 minutes Bath temperature 40±2°C,
humidity 90 to 95% R.H. Bath temperature 35±2°C,
saltwater concentration 5±1% Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H. Repeated insertion and removal speed of max. 200 times/
hours
ACCTB4E 201201-T1
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Page 3
AXE1/AXE2
2. Material and surface treatment
Part name Material Surface treatment
Molded portion
Contact and
Post
DIMENSIONS (Unit: mm)
Socket (Mated height: 0.8 mm)
LCP resin (UL94V-0)
Copper alloy
Contact portion: Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
Base: Ni plating, Surface: Au plating
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)
Terminal coplanarity
(Contact and soldering terminals)
0.60 (Suction face)
Y (Note)
Z (Note)
0.40±0.05
0.15±0.03
0.30±0.03
A
B±0.1
C±0.1
0.77
1.90
(0.80)
2.20
1.24
General tolerance: ±0.2
Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically.
Header (Mated height: 0.8 mm)
Terminal coplanarity
(Post and soldering terminals)
General tolerance: ±0.2
0.70 (Suction face)
Soldering terminals
0.40±0.05
0.15±0.03
0.15±0.03
A
B±0.1
C±0.1
1.28
(0.54)
(0.72)
0.65
1.80 (Soldering terminals portion)
0.08
0.08
Dimension table (mm)
Number of pins/
dimension
10 4.5 1.6 3.6 14 5.3 2.4 4.4 18 6.1 3.2 5.2 20 6.5 3.6 5.6 24 7.3 4.4 6.4 30 8.5 5.6 7.6 36 9.7 6.8 8.8 40 10.5 7.6 9.6 50 12.5 9.6 11.6 60 14.5 11.6 13.6 70 16.5 13.6 15.6 80 18.5 15.6 17.6
Dimension table (mm)
Number of pins/
dimension
10 3.8 1.6 3.2 14 4.6 2.4 4.0 18 5.4 3.2 4.8 20 5.8 3.6 5.2 24 6.6 4.4 6.0 30 7.8 5.6 7.2 36 9.0 6.8 8.4 40 9.8 7.6 9.2 50 11.8 9.6 11.2 60 13.8 11.6 13.2 70 15.8 13.6 15.2 80 17.8 15.6 17.2
A B C
A B C
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ACCTB4E 201201-T1
Page 4
Socket (Mated height: 1.0 mm and 1.5 mm)
AXE1/AXE2
0.64
Y (Note)
Z (Note)
(Suction face)
0.40±0.05
0.15±0.03
0.30±0.03
A
B±0.1
C±0.1
(0.80)
0.97
1.96
2.20
1.30
General tolerance: ±0.2
Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically.
Header (Mated height: 1.0 mm)
0.76
A
B±0.1
0.40±0.05
0.15±0.03
(Suction face)
0.85
Terminal coplanarity
0.08
(Contact and soldering terminals)
Terminal coplanarity
0.08
(Post and soldering terminals)
Dimension table (mm)
Number of pins/
dimension
10 4.5 1.6 3.6 20 6.5 3.6 5.6 34 9.3 6.4 8.4 40 10.5 7.6 9.6 60 14.5 11.6 13.6 80 18.5 15.6 17.6
A B C
Soldering terminals
Header (Mated height: 1.5 mm)
Soldering terminals
0.76
(Suction face)
0.15±0.03
0.40±0.05
0.15±0.03
0.15±0.03
C±0.1
A
B±0.1
C±0.1
1.36
0.77
(0.515)
1.80
(Soldering terminals portion)
General tolerance: ±0.2
1.80
(Soldering terminals portion)
Terminal coplanarity
0.08
(Post and soldering terminals)
1.35
1.36
(0.50)
(0.80)
General tolerance: ±0.2
Dimension table (mm)
Number of pins/
dimension
10 3.8 1.6 3.2 20 5.8 3.6 5.2 34 8.6 6.4 8.0 40 9.8 7.6 9.2 60 13.8 11.6 13.2 80 17.8 15.6 17.2
Dimension table (mm)
Number of pins/
dimension
20 5.8 3.6 5.2 60 13.8 11.6 13.2 80 17.8 15.6 17.2
A B C
A B C
Socket and Header are mated
Header
0.80±0.1
Socket Socket Socket
ACCTB4E 201201-T1
Header
1.00±0.1
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Header
1.50±0.1
Page 5
AXE1/AXE2
2.20±0.03
0.90±0.03
2.20±0.03
0.50±0.03
(0.85)
(0.65)
0.40±0.03
0.80±0.03
0.28±0.03
0.23±0.03
0.80±0.01
0.23±0.01
2.07±0.01
(0.76)
0.55±0.01
2.07±0.01
1.03±0.01
(0.52)
0.40±0.01
0.20±0.01
EMBOSSED T APE DIMENSIONS (Unit: mm)
• Specifications for taping
(In accordance with JIS C 0806-3:1999. Ho w ever, not applied to the mounting-hole pitch of some connectors.)
Tape I Tape II
Leading direction after packaging
+0.3
0.1
(C)
(1.75)
1.5
(4.0)
(2.0)
8.0
+0.1
0
dia.
(A±0.3)(A )
(B)
(C)
(1.75)
(4.0)
(2.0)
8.0
1.5
+0.1 0
dia.
• Dimension table (Unit: mm)
Type/Mated height Number of pins Type of taping A B C D Quantity per reel
Common for sockets and headers:
0.8mm, 1.0mm and 1.5mm
Max. 24 Tape I 16.0 7.5 17.4 5,000 30 to 70 Tape I 24.0 11.5 25.4 5,000
80 Tape II 32.0 28.4 14.2 33.4 5,000
• Connector orientation with respect to embossed tape feeding direction
Direction of tape progress
Type
Socket Header
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
(D±1)
380 dia.
Common for A4US
Top cover tape
Embossed carrier tape
Embossed mounting-hole
Taping reel
NOTES
1. Design of PC board patterns
Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas.
2. Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or
0.5 mm. In order to reduce solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference.
3. See the common “NOTES FOR USE” on the next page for other points to be noted.
Note: There is no indication on this product regarding top-bottom or left-right orientation.
• Socket (Mated height: 0.8 mm, 1.0 mm and 1.5 mm)
Recommended PC board pattern (TOP VIEW)
0.40±0.03
2.60±0.03
1.04±0.03
(0.78)
Recommended metal mask opening pattern
Metal mask thickness: When 120µm
2.60±0.01
1.04±0.01
(0.78)
0.23±0.03
0.80±0.03
1.45±0.03
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
0.40±0.01
0.20±0.01
0.80±0.01
1.45±0.01
: Insulatin area
(0.50)
C0.30
(0.40)
C0.30
0.20±0.03
1.70±0.01
1.60±0.03
2.50±0.01
• Header (Mated height: 0.8 mm, 1.0 mm and 1.5 mm)
Recommended PC board pattern (TOP VIEW)
Recommended metal mask opening pattern
Metal mask thickness: When 120µm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 73%)
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
ACCTB4E 201201-T1
Page 6
NOTES FOR USE
Connector mounting
When the working environment is dry, be careful for static buildup. The buildup of static electricity occasionally causes the products to cling to the taping material. To prevent static buildup, it is recommended that you maintain the relative humidity of your working environment at 40 to 60%, while eliminating static using an ionizer or other means.
Soldering
1) Manual soldering.
• Due to the connector’s low profile, if an excessive amount of solder is applied to this product during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact.
• Make sure that the soldering iron tip is heated within the temperature and time limits indicated in the specifications.
• Flux from the solder wire may adhere to the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any flux before use.
• Be aware that a load applied to the connector terminals while soldering may displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for printing paste solder.
• To determine the relationship between the screen opening area and the PC­board foot pattern area, refer to the diagrams in the recommended patterns for PC boards and metal masks. Make sure to use the terminal tip as a reference position when setting. Avoid an excessive amount of solder from being applied, otherwise, interference by the solder will cause an imperfect contact.
Terminal
• Consult us when using a screen-printing thickness other than that recommended.
• Depending on the size of the connector being used, self alignment may not be possible. Accordingly, carefully position the terminal with the PC board pattern.
Paste solder
PC board foot pattern
• The recommended reflow temperature profile is given in the figure below
Recommended reflow temperature profile
Upper limit (Soldering heat resistance)
Temperature
Lower limit (Solder wettability)
260°C 230°C
180°C 150°C
Preheating
60 to 120 sec.
Peak temperature
220°C 200°C
25 sec. 70 sec.
Time
• The temperature is measured on the surface of the PC board near the connector terminal.
• Certain solder and flux types may cause serious solder creeping. Solder and flux characteristics should be taken into consideration when setting the reflow soldering conditions.
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use a soldering iron with a flat tip. Do not add flux, otherwise, the flux may creep to the contact parts.
• Use a soldering iron whose tip temperature is within the temperature range specified in the specifications.
Do not drop or handle the connector carelessly. Otherwise, the terminals may become deformed due to excessive force or applied solderability may be degraded during reflow. Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. Excessive prying-force applied to one end may cause product breakage and separation of the solder joints at the terminal. When removing the connector, be sure not to tilt the connector exceeding 15 degrees widthwise. Excessive force applied for insertion in a pivot action as shown may also cause product breakage. Align the header and socket positions before connecting them.
or less
15 degrees
AXE1/AXE2
When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive forces.
The soldered areas should not be subjected to forces.
Notes when using a FPC.
When the connector is soldered to an FPC board, during insertion and removal forces may be applied to the terminals and cause the soldering to come off. It is recommended to use a reinforcement board on the backside of the FPC board to which the connector is being connected. Mak e sure that the reinforcing plate is larger than the outline of the recommended PC board pattern (Outline + approx. 1 mm). The reinforcing plate is made of glass epoxy or polyimide that is
0.2 to 0.3 mm thick. This connector employs a simple locking structure. However, the connector may come off depending on the size and weight of the FPC, layout and reaction force of FPC, or by drop impact. Make sure to fully check the equipment’s condition. To prevent any problem with loose connectors, adopt measures to prevent the connector from coming off inside the equipment.
Other Notes
When coating the PC board after soldering the connector (to prevent the deterioration of insulation), perform the coating in such a way so that the coating does not get on the connector. The connectors are not meant to be used for switching.
Please refer to the latest product specifications when designing your product.
ACCTB4E 201201-T1
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Page 7
NO TES FOR USING ADVANCED SERIES NARROW -PITCH CONNECT ORS
Connector mounting
Excessive mounter chucking force may deform the molded or metal part of the connector. Consult us in advance if chucking is to be applied.
Soldering
1) Manual soldering.
• Due to the connector’s low profile, if an excessive amount of solder is applied during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact.
• Make sure that the soldering iron tip is heated within the temperature and time limits indicated in the specifications.
• Flux from the solder wire may adhere to the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any flux before use.
• Be aware that a load applied to the connector terminals while soldering may displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for printing paste solder.
• To determine the relationship between the screen opening area and the PC­board foot pattern area, refer to the diagrams in the recommended patterns for PC boards and metal masks. Make sure to use the terminal tip as a reference position when setting. A v oid an excessiv e amount of solder from being applied, otherwise, interference by the solder will cause an imperfect contact.
Terminal
Paste solder
PC board foot pattern
• Consult us when using a screen-printing thickness other than that recommended.
• Depending on the size of the connector being used, self alignment may not be possible. Accordingly, carefully position the terminal with the PC board pattern.
• The recommended reflow temperature profile is given in the figure below
Recommended reflow temperature profile
Upper limit (Soldering heat resistance)
Temperature
Lower limit (Solder wettability)
260°C 230°C
180°C 150°C
Preheating
60 to 120 sec.
Peak temperature
220°C 200°C
25 sec. 70 sec.
Time
• The temperature is measured on the surface of the PC board near the connector terminal.
• Some solder and flux types may cause serious solder creeping. Solder and flux characteristics should be taken into consideration when setting the reflow soldering conditions.
• When performing reflow soldering on the back of the PC board after reflow soldering the connector, secure the connector using, for example, an adhesive (Double reflow soldering on the same side is possible)
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use a soldering iron with a flat tip. Do not add flux, otherwise, the flux may creep to the contact parts.
• Use a soldering iron whose tip temperature is within the temperature range specified in the specifications.
Do not drop or handle the connector carelessly. Otherwise, the terminals may become deformed due to excessive force or applied solderability may be degraded during reflow. Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. Excessive prying-force applied to one end may cause product breakage and separation of the solder joints at the terminal. When removing the connector, be sure not to tilt the connector exceeding 15 degrees widthwise. Excessive force applied for insertion in a pivot action as shown may also cause product breakage. Align the header and socket positions before connecting them.
or less
15 degrees
When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive forces.
The soldered areas should not be subjected to forces.
Notes when using a FPC.
• When the connector is soldered to an FPC board, during insertion and removal forces may be applied to the terminals and cause the soldering to come off. It is recommended to use a reinforcement board on the backside of the FPC board to which the connector is being connected. Mak e sure that the reinforcing plate is larger than the outline of the recommended PC board pattern (Outline + approx. 1 mm). The reinforcing plate is made of SUS, glass epoxy or polyimide that is 0.2 to 0.3 mm thick. This connector employs a simple locking structure. However, the connector may come off depending on the size and weight of the FPC, layout and reaction force of FPC, or by drop impact. Make sure to fully check the equipment’s condition. To prevent any problem with loose connectors, adopt measures to prevent the connector from coming off inside the equipment.
Other Notes
When coating the PC board after soldering the connector (to prevent the deterioration of insulation), perform the coating in such a way so that the coating does not get on the connector. The connectors are not meant to be used for switching.
Please refer to the latest product specifications when designing your product.
(Common)
ACCTB11E 201201-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
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