Page 1
For board-to-FPC
AXE7, 8
2.5mm
Socket Header
2.0mm
RoHS compliant
Narrow pitch connectors
(0.35mm pitch)
FEATURES
1. Small size (Terminal pitch: 0.35 mm,
width: 2.5 mm and Mated height: 0.8
mm)
When mated, the footprint is reduced by
approx. 10% from A4S series (60 pin
contacts), contributing to the functionality
enhancement and size reduction of end
equipment.
Suction face: 0.7mm
Socket
2.5mm
2.0mm
12.85 mm (60 pin contacts)
A4S 14.50 mm (60 pin contacts)
Suction face: 0.7mm
12.15 mm (60 pin contacts)
A4S 13.8 mm (60 pin contacts)
Soldering terminals
at each corner
Soldering terminals
at each corner
Header
A35S Series
2. “ ”
ensures high resistance to various
environments in lieu of its spacesaving footprint.
Ni barrier
construction
(Against solder rise!)
V notch and Double contact constructions
(Against foreign particles and flux!)
3. Low-profile connector with up to
120 pin contacts.
4. Soldering terminals at each corner
enhance mounting strength.
5. Simple lock structure provides
tactile feedback to ensure excellent
mating/unmating operation feel.
6. Gull-wing-shaped terminals to
facilitate visual inspections.
Bellows contact
construction
(Against dropping!)
Porosity treatment
(Against corrosive gases!)
ORDERING INFORMATION
AXE 421
7: Narrow Pitch Connector A35S (0.35 mm pitch) Socket
8: Narrow Pitch Connector A35S (0.35 mm pitch) Header
Number of pins (2 digits)
Mated height
<Socket> / <Header>
1: For mated height 0.8 mm
Functions
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket>
4: Base: Ni plating, Surface: Au plating (for Ni barrier available)
<Header>
4: Base: Ni plating, Surface: Au plating
APPLICATIONS
Suitable for board-to-FPC connections
in mobile equipment that requires size
and thickness reduction and
functionality enhancement.
ACCTB2E 201201-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
Page 2
AXE7, 8
PRODUCT TYPES
Mated height Number of pins
24 AXE724124 AXE824124
30 AXE730124 AXE830124
34 AXE734124 AXE834124
0.8mm
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
Samples for mounting check: 50-connector units. Please contact our sales office.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
sales office.
3. Please contact us for connectors having a number of pins other than those listed above.
50 AXE750124 AXE850124
60 AXE760124 AXE860124
64 AXE764124 AXE864124
100 AXE700124 AXE800124
120 AXE7A2124 AXE8A2124
Socket Header Inner carton (1-reel) Outer carton
SPECIFICATIONS
1. Characteristics
Item Specifications Conditions
Rated current 0.25A/pin contact (Max. 4 A at total pin contacts)
Rated voltage 60V AC/DC
Electrical
characteristics
Mechanical
characteristics
Environmental
characteristics
Lifetime
characteristics
Unit weight 60 pin contact type: Socket: 0.03 g Header: 0.02 g
2. Material and surface treatment
Part name Material Surface treatment
Molded
portion
Contact and
Post
Breakdown voltage 150V AC for 1 min.
Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 100mΩ
Composite insertion force Max. 0.981N/pin contacts × pin contacts (initial)
Composite removal force Min. 0.165N/pin contacts × pin contacts
Contact holding force
(Socket contact)
Ambient temperature –55°C to +85°C No freezing at low temperatures. No dew condensation.
Soldering heat resistance
Storage temperature
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H2S resistance
(header and socket mated)
Insertion and removal life 30 times
LCP resin
(UL94V-0)
Copper alloy
—
Contact portion:
Te r minal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Min. 0.20N/pin contacts
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec. Soldering iron
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
48 hours,
contact resistance max. 100mΩ
Base: Ni plating, Surface: Au plating
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)
Part number Packing
5,000 pieces 10,000 pieces
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
Infrared reflow soldering
No freezing at low temperatures. No dew condensation.
Sequence
0
1. –55 °C, 30 minutes
−3
2. ~ , Max. 5 minutes
+3
3. 85 °C, 30 minutes
0
4. ~ , Max. 5 minutes
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwater concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
ACCTB2E 201201-T
Page 3
AXE7, 8
DIMENSIONS (Unit: mm)
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e
Socket (Mated height: 0.8 mm)
CAD Data
Te rminal coplanar ity
0.08
(Contact and soldering terminals)
2.50
1.72
(0.39)
0.70 (Suction face)
Y note
Z note
0.35±0.05
0.12±0.03
0.30±0.03
A
B±0.1
C±0.1
0.77
2.20
(0.90)
2.50
1.06
General tolerance: ±0.2
Note: Since the soldering terminals has a single-piece construction, sections Y and Z are electrically connected.
Header (Mated height: 0.8 mm)
CAD Data
Te rminal coplanar ity
0.08
(Post and soldering terminals)
2.00
1.28
0.70 (Suction face)
B±0.1
0.35±0.05
0.12±0.03
A
1.42
0.65
Dimension table (mm)
Number of pins/
dimension
24 6.55 3.85 5.45
30 7.60 4.90 6.50
34 8.30 5.60 7.20
50 11.10 8.40 10.00
60 12.85 10.15 11.75
64 13.55 10.85 12.45
100 19.85 17.15 18.75
120 23.35 20.65 22.25
A B C
Soldering terminals
• Socket and Header are mated
Header
Socket
0.80±0.1
0.12±0.03
C±0.1
(0.31)
0.84
1.46
Soldering terminals
(0.36)
General tolerance: ±0.2
Dimension table (mm)
Number of pins/
dimension
24 5.85 3.85 5.25
30 6.90 4.90 6.30
34 7.60 5.60 7.00
50 10.40 8.40 9.80
60 12.15 10.15 11.55
64 12.85 10.85 12.25
100 19.15 17.15 18.55
120 22.65 20.65 22.05
A B C
ACCTB2E 201201-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
Page 4
AXE7, 8
EMBOSSED TAPE DIMENSIONS (Unit: mm)
• Specifications for taping
(In accordance with JIS C 0806-1999. However, not applied to
the mounting-hole pitch of some connectors.)
Tape I Tape II
Leading direction after packaging
+0.3
(A )
−0.1
(C)
(1.75)
1.5
8.0 (2.0) (4.0)
+0.1
0
dia.
(A±0.3)
(B)
(C)
(1.75)
1.5
8.0 (2.0) (4.0)
+0.1
0
dia.
• Dimension table (Unit: mm)
Type/Mated height Number of pins Type of taping A B C D Quantity per reel
24 Tape I 16.0 — 7.5 17.4 5,000
Common for sockets and headers
0.8mm
30 to 64 Tape I 24.0 — 11.5 25.4 5,000
100 Tape II 32.0 28.4 14.2 33.4 5,000
120 Tape II 44.0 40.4 20.2 45.4 5,000
• Connector orientation with respect to embossed tape feeding direction
Direction
of tape progress
Type
Socket Header
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
(D±1)
380 dia.
Common for A35S
Top cover tape
Embossed carrier tape
Embossed mounting-hole
Taping reel
NOTES
Design of PC board patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder bridges and
other issues make sure the proper levels
of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
Note: There is no indication on this product regarding top-bottom or left-right orientation.
• Socket (Mated height: 0.8 mm)
Recommended PC board pattern (TOP VIEW)
0.35±0.03
0.20±0.03
(0.92)
1.06±0.03
2.90±0.03
0.90±0.03
1.35±0.03
Recommended metal mask opening pattern
Metal mask thickness: When 120µm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
0.35±0.01
2.90±0.01
1.06±0.01
0.18±0.01
(0.92)
0.90±0.01
1.35±0.01
(0.50)
C 0.30
: Insulatin
area
(0.39)
C 0.30
0.20±0.03
2.02±0.01
• Header (Mated height: 0.8 mm)
Recommended PC board pattern (TOP VIEW)
0.35±0.03
0.20±0.03
1.90±0.03
2.80±0.01
0.60±0.03
1.66±0.03
(0.53)
0.45±0.03
0.70±0.03
Recommended metal mask opening pattern
Metal mask thickness: When 120µm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
0.35±0.01
0.18±0.01
(0.53)
0.60±0.01
1.66±0.01
0.45±0.01
0.70±0.01
(0.65)
(0.50)
1.10±0.03
1.30±0.01
2.40±0.03
2.30±0.01
Please refer to the latest product
specifications when designing your
product.
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
ACCTB2E 201201-T
Page 5
NO TES FOR USING ADVANCED SERIES
NARROW -PITCH CONNECT ORS
Connector mounting
Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
Soldering
1) Manual soldering.
• Due to the connector’s low profile, if an
excessive amount of solder is applied
during manual soldering, the solder may
creep up near the contact points, or
solder interference may cause imperfect
contact.
• Make sure that the soldering iron tip is
heated within the temperature and time
limits indicated in the specifications.
• Flux from the solder wire may adhere to
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any flux before use.
• Be aware that a load applied to the
connector terminals while soldering may
displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for
printing paste solder.
• To determine the relationship between
the screen opening area and the PCboard foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting. A v oid an excessiv e
amount of solder from being applied,
otherwise, interference by the solder will
cause an imperfect contact.
Terminal
Paste
solder
PC board
foot pattern
• Consult us when using a screen-printing
thickness other than that recommended.
• Depending on the size of the connector
being used, self alignment may not be
possible. Accordingly, carefully position
the terminal with the PC board pattern.
• The recommended reflow temperature
profile is given in the figure below
Recommended reflow temperature profile
Upper limit (Soldering heat resistance)
Temperature
Lower limit (Solder wettability)
260°C
230°C
180°C
150°C
Preheating
60 to 120 sec.
Peak temperature
220°C
200°C
25 sec.
70 sec.
Time
• The temperature is measured on the
surface of the PC board near the
connector terminal.
• Some solder and flux types may cause
serious solder creeping. Solder and flux
characteristics should be taken into
consideration when setting the reflow
soldering conditions.
• When performing reflow soldering on
the back of the PC board after reflow
soldering the connector, secure the
connector using, for example, an
adhesive (Double reflow soldering on the
same side is possible)
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use
a soldering iron with a flat tip. Do not add
flux, otherwise, the flux may creep to the
contact parts.
• Use a soldering iron whose tip
temperature is within the temperature
range specified in the specifications.
Do not drop or handle the
connector carelessly. Otherwise, the
terminals may become deformed due
to excessive force or applied
solderability may be degraded during
reflow.
Do not insert or remove the
connector when it is not soldered.
Forcibly applied external pressure on
the terminals can weaken the
adherence of the terminals to the
molded part or cause the terminals to
lose their evenness.
Excessive prying-force applied to
one end may cause product breakage
and separation of the solder joints at
the terminal.
When removing the connector, be
sure not to tilt the connector
exceeding 15 degrees widthwise.
Excessive force applied for insertion
in a pivot action as shown may also
cause product breakage.
Align the header and socket positions
before connecting them.
or less
15 degrees
When cutting or bending the PC
board after mounting the connector,
be careful that the soldered sections
are subjected to excessive forces.
The soldered areas should not be subjected to forces.
Notes when using a FPC.
• When the connector is soldered to an
FPC board, during insertion and removal
forces may be applied to the terminals
and cause the soldering to come off. It is
recommended to use a reinforcement
board on the backside of the FPC board
to which the connector is being
connected. Mak e sure that the reinforcing
plate is larger than the outline of the
recommended PC board pattern (Outline
+ approx. 1 mm). The reinforcing plate is
made of SUS, glass epoxy or polyimide
that is 0.2 to 0.3 mm thick.
This connector employs a simple locking
structure. However, the connector may
come off depending on the size and
weight of the FPC, layout and reaction
force of FPC, or by drop impact. Make
sure to fully check the equipment’s
condition. To prevent any problem with
loose connectors, adopt measures to
prevent the connector from coming off
inside the equipment.
Other Notes
When coating the PC board after
soldering the connector (to prevent the
deterioration of insulation), perform the
coating in such a way so that the coating
does not get on the connector.
The connectors are not meant to be used
for switching.
Please refer to the latest product
specifications when designing your
product.
(Common)
ACCTB11E 201201-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
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