10.0±0.2
5.5±0.2
7.5±0.2
16.7±0.3
0.7±0.1
14.0±0.5
Solder Dip
4.0
0.5
+0.2
–0.1
1.4±0.1
1.3±0.2
0.8±0.1
2.54±0.25
5.08±0.5
213
2.7±0.2
4.2±0.2
4.2±0.2
φ3.1±0.1
Po wer Transistors
2SB950, 2SB950A
Silicon PNP epitaxial planar type Darlington
For power amplification and switching
Complementary to 2SD1276 and 2SD1276A
Features
■
●
High foward current transfer ratio h
●
High-speed switching
●
Full-pack package which can be installed to the heat sink with
one screw
Absolute Maximum Ratings (T
■
Parameter
Collector to
base voltage
Collector to
emitter voltage
2SB950
2SB950A
2SB950
2SB950A
Emitter to base voltage
Peak collector current
Collector current
Collector power
dissipation
TC=25°C
Ta=25°C
Junction temperature
Storage temperature
Electrical Characteristics (T
■
Parameter
Collector cutoff
current
Collector cutoff
current
Emitter cutoff current
Collector to emitter
voltage
Forward current transfer ratio
Base to emitter voltage
Collector to emitter saturation voltage
Transition frequency
Turn-on time
Storage time
Fall time
*
h
Rank classification
FE2
Rank Q P
h
FE2
2000 to 5000
Symbol
2SB950
2SB950A
2SB950
2SB950A
2SB950
2SB950A
4000 to 10000
V
V
V
I
CP
I
C
P
C
T
j
T
stg
CBO
CEO
EBO
C
Symbol
I
CBO
I
CEO
I
EBO
V
CEO
h
FE1
*
h
FE2
V
BE
V
CE(sat)1
V
CE(sat)2
f
T
t
on
t
stg
t
f
FE
=25˚C)
C
Ratings
–60
–80
–60
–80
–5
–8
–4
40
2
150
–55 to +150
=25˚C)
Unit
V
V
V
A
A
W
˚C
˚C
Conditions
VCB = –60V, IE = 0
VCB = –80V, IE = 0
VCE = –30V, IB = 0
VCE = –40V, IB = 0
VEB = –5V, IC = 0
IC = –30mA, IB = 0
VCE = –3V, IC = – 0.5A
VCE = –3V, IC = –3A
VCE = –3V, IC = –3A
IC = –3A, IB = –12mA
IC = –5A, IB = –20mA
VCE = –10V, IC = – 0.5A, f = 1MHz
IC = –3A, IB1 = –12mA, IB2 = 12mA,
VCC = –50V
TO–220 Full Pack Package(a)
Internal Connection
B
min
–60
–80
1000
2000
typ
20
0.3
0.5
Unit: mm
1:Base
2:Collector
3:Emitter
C
E
max
–200
–200
–500
–500
Unit
µA
µA
–2
mA
V
10000
–2.5
–2
–4
V
V
V
MHz
µs
2
µs
µs
1
Po wer Transistors 2SB950, 2SB950A
PC—Ta IC—V
50
)
W
(
40
C
30
20
10
Collector power dissipation P
(4)
0
0 16040 12080 14020 10060
Ambient temperature Ta (˚C
)
–100
V
(
–30
CE(sat)
–10
–3
–1
– 0.3
– 0.1
– 0.03
– 0.01
Collector to emitter saturation voltage V
– 0.01
– 0.03
(1) TC=Ta
(2) With a 100 × 100 × 2mm
Al heat sink
(3) With a 50 × 50 × 2mm
Al heat sink
(4) Without heat sink
(P
=2W)
C
(1)
(2)
(3)
V
CE(sat)—IC
IC/IB=250
TC=100˚C
25˚C
– 0.1 –1 –10
– 0.3 –3
Collector current IC (A
)
–25˚C
)
CE
–6
–5
)
A
(
–4
C
–3
–2
TC=25˚C
IB=–3.0mA
–2.5mA
–2.0mA
–1.5mA
Collector current I
–1
0
0–5–4–1 –3–2
Collector to emitter voltage VCE (V
hFE—I
C
6
10
FE
5
10
4
10
3
10
VCE=–3V
TC=100˚C
–25˚C
Forward current transfer ratio h
2
10
– 0.01
– 0.1 –1 –10
– 0.03
– 0.3 –3
Collector current IC (A
–1.0mA
– 0.5mA
– 0.4mA
– 0.3mA
– 0.2mA
25˚C
)
IC—V
–10
–8
)
A
(
C
Collector current I
)
–6
–4
–2
0
0 –3.2– 0.8 –2.4–1.6
TC=100˚C –25˚C
Base to emitter voltage VBE (V
Cob—V
10000
)
pF
3000
(
ob
1000
300
100
30
10
3
Collector output capacitance C
1
– 0.1 –1 –10 –100– 0.3 –3 –30
Collector to base voltage VCB (V
BE
25˚C
CB
VCE=–3V
IE=0
f=1MHz
T
=25˚C
C
)
)
Area of safe operation (ASO) R
–100
–30
)
I
CP
–10
A
(
C
I
–3
C
–1
– 0.3
– 0.1
Collector current I
– 0.03
– 0.01
–1 –10 –100 –1000–3 –30 –300
Non repetitive pulse
=25˚C
T
C
t=1ms
10ms
DC
2SB950A
2SB950
Collector to emitter voltage VCE (V
)
3
10
)
2
10
˚C/W
(
(t)
th
10
1
–1
10
Thermal resistance R
–2
10
–4
10
–3
10
2
—t
th(t)
(1) Without heat sink
(2) With a 100 × 100 × 2mm Al heat sink
(1)
(2)
–1
–2
10
Time t (s
1010
110
10
)
3
2
4
10