Optris OPTPI64ILTO60T150, OPTPI1MLOF50T1800, OPTPI05MOF25T2450, OPTPI64ILTO90T150, OPTPI1MLOF16T1800 User manual

Operator’s Manual

optris

®

PI

400i/ 450i/ 450i G7/ 640/ 640 G7/ 05M/ 08M/ 1M

Infrared camera

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Table of contents 3-

Table of contents

Table of contents .............................................................................................................................................. 3

1 General Notes ........................................................................................................................................... 7

1.1 Intended use ....................................................................................................................................... 7

1.2 Warranty ............................................................................................................................................. 8

1.3 Scope of delivery ................................................................................................................................ 9

1.4 Maintenance ....................................................................................................................................... 9

1.4.1 Cleaning ...................................................................................................................................... 9

1.5 Model overview ................................................................................................................................. 10

2 Technical Data ........................................................................................................................................ 11

2.1 General specifications ...................................................................................................................... 11

2.2 Electrical specifications ..................................................................................................................... 15

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2.3 Measurement specifications ............................................................................................................. 16

2.4 Optical specifications ........................................................................................................................ 20

3 Mechanical Installation .......................................................................................................................... 29

3.1 Dimensions ....................................................................................................................................... 29

3.2 Changing the lens ............................................................................................................................. 36

3.3 Fixing the focus of the lens (only for PI 05M/ 08M/ 1M) ................................................................... 37

3.4 Mounting accessories (optional) ....................................................................................................... 39

3.5 High temperature accessories .......................................................................................................... 40

3.5.1 CoolingJacket Advanced .......................................................................................................... 40

3.5.2 Laminar air purge for CoolingJacket ......................................................................................... 44

3.5.3 Outdoor protective housing ....................................................................................................... 45

4 Electrical Installation .............................................................................................................................. 46

4.1 Process interface .............................................................................................................................. 47

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Table of contents 5-

4.1.1 PIN allocation ............................................................................................................................ 49

4.1.2 Industrial Process Interface (optional) ...................................................................................... 51

4.2 Example for a Fail-Safe monitoring of the PI with a PLC ................................................................. 54

4.3 USB cable extension ........................................................................................................................ 56

5 IRmobile App ........................................................................................................................................... 58

6 Software PIX Connect ............................................................................................................................ 60

6.1 Installation and initial start-up ........................................................................................................... 61

6.2 Software window ............................................................................................................................... 63

6.2.1 Basis features of the software PIX Connect ............................................................................. 65

7 Basics of Infrared Thermometry ........................................................................................................... 68

8 Emissivity ................................................................................................................................................ 74

8.1 Definition ........................................................................................................................................... 74

8.2 Determination of unknown emissivity ............................................................................................... 76

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8.3 Characteristic emissivity ................................................................................................................... 78

Appendix A – Table of emissivity for metals ............................................................................................... 79

Appendix B – Table of emissivity for non-metals ....................................................................................... 81

Appendix C – Quick start for serial communication ................................................................................... 82

Appendix D – Interprocess Communication (IPC) ...................................................................................... 84

Appendix E – PIX Connect Resource Translator ........................................................................................ 85

Appendix F – Wiring diagrams PIF ............................................................................................................... 86

Appendix G – Declaration of Conformity ..................................................................................................... 90

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General Notes 7-

The PI is a precise instrument and contains an extremely sensitive infrared detector and a high­quality lens.

The alignment of the camera to intensive energy sources (e.g. devices which emit laser
radiation or reflections of such equipment) can cause an irreparable defect of the infrared
detector. This is also valid if the camera is switched off.

Such kinds of damages are excluded from warranty.

Read the manual carefully before the initial start-up. The producer reserves the right to change
the herein described specifications in case of technical advance of the product.

1 General Notes

1.1 Intended use

Thank you for choosing the optris® PI infrared camera.
The optris PI calculates the surface temperature based on the emitted infrared energy of objects
[►7 Basics of Infrared Thermometry]. The two-dimensional detector (FPA - focal plane array) allows a
measurement of an area and will be shown as thermal image using standardized palettes. The radiometric
processing of the picture data enables the user to do a comfortable detailed analysis with the software
PIX Connect.

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 Avoid abrupt changes of the ambient temperature.
 Avoid static electricity, arc welders, and induction heaters. Keep away from very strong EMF

(electromagnetic fields).

 In case of problems or questions which may arise when you use the infrared camera, please

contact our service department.

► All accessories can be ordered according to the referred part numbers in brackets [ ].

1.2 Warranty

Each single product passes through a quality process. Nevertheless, if failures occur contact the customer
service at once. The warranty period covers 24 months starting on the delivery date. After the warranty is
expired the manufacturer guarantees additional 6 months warranty for all repaired or substituted product
components. Warranty does not apply to damages, which result from misuse or neglect. The warranty also
expires if you open the product. The manufacturer is not liable for consequential damage or in case of a non­intended use of the product.
If a failure occurs during the warranty period the product will be replaced, calibrated or repaired without
further charges. The freight costs will be paid by the sender. The manufacturer reserves the right to
exchange components of the product instead of repairing it. If the failure results from misuse or neglect the
user has to pay for the repair. In that case you may ask for a cost estimate beforehand.

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General Notes 9-

 PI 400i, PI 450i, PI 450i G7, PI 640, PI 640 G7, PI 05M, PI 08M or PI 1M incl. 1 lens

 USB-cable:

1 m (standard scope of supply, no IP67 protection class)
1 m, 3 m, 5 m, 10 m, 20 m (optional, for industrial applications, with IP67)

 Table tripod

 Process interface cable incl. terminal block (1 m)

 Software package PIX Connect

 Operators manual

 Aluminum case

 PI 450i/ 450i G7/ 640/ 640 G7 only: robust hard transport case (IP67)

Never use cleaning compounds which contain solvents (neither for the lens nor for the housing).

1.3 Scope of delivery

1.4 Maintenance

1.4.1 Cleaning

Blow off loose particles using clean compressed air. The lens surface can be cleaned with a soft, humid
tissue (moistened with water) or a lens cleaner (e.g. Purosol or B+W Lens Cleaner).

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Model

Model code

Temperature range

Spectral range

Frame rate

Typical applications

PI 400i/ PI 450i

IR

-20 to 900 °C
200 to 1500 °C (optional)

8 – 14 µm

80 Hz

Real-time thermographic images in high speed;
Detection of smallest temperature differences (PI 450i)

PI 450i G7

IR

200 to 1500 °C
150 to 900 °C

7.9 µm

80 Hz/ 27 Hz

Measurement of glass (with Line-Scanning mode)

PI 640

IR

-20 to 900 °C
200 to 1500 °C (optional)

8 – 14 µm

32 Hz

Pin-sharp radiometric recordings in real time

PI 640 G7

IR

200 to 1500 °C
150 to 900 °C

7.9 µm

32 Hz

Measurement of glass (with Line-Scanning mode)

PI 05M

IR

900 to 2450 °C

500 – 540 nm

Up to 1 kHz

Measurement of metallic surfaces, graphite or ceramics
with short wavelengths

PI 08M

IR

575 to 1900 °C

780 – 820 nm

Up 1 kHz

Measurement of metallic surfaces, graphite or ceramics
with short wavelengths, especially for laser applications

PI 1M

IR

450 to 1800 °C

0.85 – 1.1 µm

Up to 1 kHz

Measurement of metallic surfaces, graphite or ceramics
with short wavelengths

1.5 Model overview

The cameras of the PI series are available in the following basic versions:

Table 1: Model overview

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Technical Data 11-

Environmental rating:

IP67 (NEMA-4)

Ambient temperature:

0...50 °C [PI 400i/ PI 640/ PI 640 G7]
5…50 °C [PI 05M/ PI 08M/ PI 1M]

0...70 °C [PI 450i/ PI 450i G7]

Storage temperature:

-40...70 °C (-40...85 °C [PI 450i/ PI 450i G7])

Relative humidity:

10...95 %, non-condensing

Material (housing):

Aluminum, anodized

Dimensions:

PI 400i/ PI 450i (450i G7): 46 x 56 x 68 - 77 mm (depending on lens and focus position)
PI 640 (640 G7): 46 x 56 x 76 - 100 mm (depending on lens and focus position)
PI 640 microscope optics: 46 x 56 x 119 – 126 mm (depending on focus position)
PI 05M/ PI 08M/ PI 1M: 46 x 56 x 88 - 129 mm (depending on lens and focus position)

Weight:

PI 400i/ PI 450i (450i G7): 237-251 g (depending on lens)
PI 640 (640 G7): 269-340 g (depending on lens)
PI 05M/ PI 08M/ PI 1M: 253-311 g (depending on lens)
PI 640 microscope optics: 370 g

2 Technical Data

2.1 General specifications

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Cable length (USB 2.0):

1 m (standard), 3 m, 5 m, 10 m, 20 m

Vibration1):

IEC 60068-2-6 (sinus shaped)
IEC 60068-2-64 (broadband noise)

Shock1):

IEC 60068-2-27 (25 G and 50 G)

1)

Used standards for vibration and shock:

Figure 1: Used standards

Stress program (camera in operation):

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Technical Data 13-

Shock, half sinus 25 G – testing Ea 25 G (acc. IEC 60068-2-27)

Acceleration

245 m/s2

(25 G)

Pulse duration

11 ms

Number of directions

6

(3 axes with 2 directions each)

Duration

600 Shocks

(100 Shocks each direction)

Shock, half sinus 50 G – testing Ea 50 G (acc. IEC 60068-2-27)

Acceleration

490 m/s2

(50 G)

Pulse duration

11 ms

Number of directions

6

(3 axes with two directions each)

Duration

18 Shocks

(3 Shocks each direction)

Vibration, sinus shaped – testing Fc (acc. IEC60068-2-6)

Frequency range

10 - 500 Hz

Acceleration

29.42 m/s2

(3 G)

Frequency change

1 Octave/ min

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Number of axes

3

Duration

1:30 h

(3 x 0.30 h)

Vibration, broadband noise – testing Fh (acc. IEC60068-2-64)

Frequency range

10 - 2000 Hz

Acceleration

39.3 m/s2

(4.01 G

RMS

))

Frequency spectrum

10 - 106 Hz

0.9610 (m/s2)2/Hz

(0.010 G2/Hz)

106 - 150 Hz

+6 dB/ Octave

150 - 500 Hz

1.9230 (m/s2)2/Hz

(0.020 G2/Hz)

500 - 2000 Hz

-6 dB/ Octave

2000 Hz

0.1245 (m/s2)2/Hz

(0.00126 G2/Hz)

Number of axes

3

Duration

3 h

(3 x 1 h)

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Technical Data 15-

Power Supply:

5 VDC (powered via USB 2.0 interface)

Current draw:

Max 500 mA

AO: Output Standard Process Interface
(PIF out)

0 - 10 V (Main measure area, measure area, internal temperature, flag status, recording status, line scan status,
alarm, frame sync, fail-safe, external communication)
[►Appendix F – Wiring diagrams PIF]

AI: Input Standard Process Interface
(PIF in)

0 - 10 V (Emissivity, ambient temperature, reference temperature, uncommitted value, flag control, triggered
snapshots, triggered recording, triggered linescanner, triggered event grabber, reset peak-/value-hold, switch

temperature range)

[►Appendix F – Wiring diagrams PIF]

DI: Digital Input Standard Process
Interface

Flag control, , triggered snapshots, triggered recording, triggered linescanner, triggered event grabber,
reset peak-/value-hold, switch temperature range
[►Appendix F – Wiring diagrams PIF]

Digital interface:

USB 2.0

2.2 Electrical specifications

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PI 400i

PI 450i

PI 450i G7

Temperature ranges

-20...100 °C; 0...250 °C; (20) 150...900 °C1); Option: 200…1500 °C

200…1500 °C

150…900 °C

Sighting range / low energy range 2)

-

0…250 °C

Spectral range

8 - 14 µm

7.9 µm

Detector

UFPA,

382 x 288 pixel @ 80 Hz (switchable to 27 Hz)

Lenses (FOV)

18° x 14° (F-number=1,1), 29° x 22° (F-number=0,9), 53° x 38° (F-number=0,9); 80° x 54° (F-number=0,9)

System accuracy 3)

±2°C or ±2 %

Temperature coefficient 4)

± 0,05 %/K

Thermal sensitivity (NETD):

75 mK5) with 29°, 53° and 80°;

0.1 K5) with 18°

40 mK5) with 29°, 53° and 80°;
60 mK5) with 18°

150 mK (T

obj

= 650 °C) with 29°, 53°, 80°

175 mK (T

obj

= 650 °C) with 18°

Warm-up time

10 min

Emissivity

0.100...1.100

Software / App

PIX Connect / IRmobile

2.3 Measurement specifications

1)

Accuracy statement effective from 150 °C

2)

The sighting range is used to align the G7 cameras; at ε<1 and activation of the extended temperature range a temperature

measurement up to 1500 °C is possible

3)

At ambient temperature 235 °C; whichever is greater

4)

For T

5)

Value is valid at 40 Hz and 25 °C room temperature

10...50 °C and T

Amb

≤ 500 °C; otherwise: ± 0.1 K/K or 0.1%/K (whichever is greater)

Obj

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Technical Data 17-

PI 640

PI 640 G7

Temperature ranges

-20...100 °C; 0...250 °C; (20) 150...900 °C1)

Option: 200…1500 °C

200…1500 °C

150…900 °C

Sighting range / low energy range 2)

-

0…250 °C

Spectral range

8 - 14 µm

7,9 µm

Detector

UFPA,

640 x 480 Pixel @ 32 Hz

640 x 120 Pixel @ 125Hz

Lenses (FOV)

15° x 11° (F-number=1); 33° x 25° (F-number=0,8); 60° x 45° (F-number=0,8); 90° x 64° (F-number=0,8)

Microscope lens (FOV)

12° x 9° (F=1,1)

-

System accuracy 3)

±2°C or ±2 %

Temperature coefficient 4)

± 0,05 %/K

Thermal sensitivity (NETD):

75 mK with 33°, 60° and 90°
85 mK with 15°

130 mK (T

obj

= 650 °C) with 33°, 60°, 90°

150 mK (T

obj

= 650 °C) with 15°

Warm-up time

10 min

Emissivity

0.100...1.100

Software / App

PIX Connect / IRmobile

1)

Accuracy statement effective from 150 °C

2)

The sighting range is used to align the G7 cameras; at ε<1 and activation of the extended temperature range a temperature

measurement up to 1500 °C is possible

3)

At ambient temperature 235 °C; whichever is greater

4)

For T

10...50 °C and T

Amb

≤ 500 °C; otherwise: ± 0.1 K/K or 0.1%/K (whichever is greater)

Obj

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PI 05M

PI 08M

PI 1M

Temperature ranges

900 … 2450 °C (27 Hz mode)
950 … 2450 °C (80 Hz and 32 Hz mode)
1100 … 2450 °C (1 kHz mode)

575 …1900 °C (27 Hz mode)
625 … 1900 °C (80 Hz- and 32 Hz-mode)
750 … 1900 °C (1 kHz mode)

4501)…1800 °C (27 Hz mode)

5001)…1800 °C (80 Hz and 32 Hz mode)

6001)…1800 °C (1 kHz mode)
Spectral range

500 - 540 nm

780 – 820 nm

0,85 - 1,1 µm

Detector

CMOS,

764 x 480 pixel @ 32 Hz

382 x 288 pixel @ 80 Hz/ (switchable to 27 Hz)

72x56 pixel @ 1 kHz (1 ms real-time analog output (0-10 V) from 8x8 pixel (freely selectable))

764 x 8 Pixel @ 1 kHz (fast line scanning-mode, 1 ms real-time analog output (0-10 V) from 8x8 pixel (freely selectable))

Lenses (FOV) 2)

FOV@764x480 px: 26°x 16° (F­number=1,4)

FOV@382x288 px: 13°x 10°

FOV@764x480 px: 26°x 16° (F-

number=1,4), 39°x 25° (F-number=1,4)

FOV@382x288 px: 13°x 10°, 20°x 15°

FOV@764x480 px: 9°x 5° (F-number=2,8),

13°x 8° (F-number=2,4), 26°x16° (F­number=1,4), 39°x 25° (F-number=1,4)
FOV@382x288 px: 4°x 3°, 7°x 5°,
13°x 10°, 20°x 15°

System accuracy 3)

For object temperature < 2000 °C:
±1 % of reading for 27/32/80 Hz
±1,5 % of reading for 1 kHz

For object temperature > 2000 °C:
±2 % of reading for 27/32/80 Hz
±2,5 % of reading for 1 kHz

For object temperature < 1500 °C:
±1 % of reading for 27/32/80 Hz
±1,5 % of reading for 1 kHz

For object temperature > 1500 °C:
±2 % of reading for 27/32/80 Hz
±2,5 % of reading for 1 kHz

For object temperature < 1400 °C:
±1 % of reading for 27/32/80 Hz
±1,5 % of reading for 1 kHz

For object temperature < 1600 °C:
±2 % of reading for 27/32/80 Hz
±2,5 % of reading for 1 kHz

Thermal sensitivity
(NETD) 4):

< 2 K (< 1400 °C)
< 4 K (< 2100 °C)

< 2 K (< 1000 °C)
< 4 K (< 1600 °C)

< 2 K (< 900 °C)
< 4 K (< 1400 °C)

Warm-up time

10 min

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Technical Data 19-

Emissivity

0.100...1.100

Software / App

PIX Connect / IRmobile

1)

+75 °C start temperature for optics with focal length f= 50 mm, f= 75 mm

2)

An additionally purchased lens for the PI 05M/ 08M/ 1M camera comes with the corresponding protective tube

3)

At an ambient temperature of 25 ° C

4)

Specified NETD value applies to all frequencies

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Make sure that the focus of thermal channel is adjusted correctly. If necessary, focus the thermal
imaging camera with the optics (Figure 2). The turning out of the optics leads to the focus setting
"near" and the turning in of the lens to the focus setting "infinity".

Figure 2: Focusing by turning the exterior
lens ring of camera

Figure 3: PI 05M/ PI 08M / PI 1M

For the PI 05M, PI 08M and PI 1M camera, you must first unscrew the protective tube in order to
be able to focus the camera (Figure 3).

2.4 Optical specifications

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Technical Data 21-

The variety of different lenses offers the possibility to precisely measure objects in different distances. We
offer lenses for close, standard distances and large distances. Different parameters are important if using
infrared cameras. They display the connection between the distance of the measured object and the size of
the pixel (Table 2).

Figure 4: Measurement field of the infrared camera optris® PI 640 representing the 33° x 25° lens

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■

HFOV: Horizontal enlargement of the total measuring at object level

■

VFOV: Vertical enlargement of the total measuring at object level

■

IFOV: Size at the single pixel at object level

■

DFOV: Diagonal dimension of the total measuring field at object level

■

MFOV: Recommended, smallest measured object size of 3 x 3 pixel

Geometric resolution for ideal temperature measurement

When designing optics for measuring IR cameras, special attention must be paid to the quality of detail
contrast with which an object can be represented in the image. This is described by the modulation transfer
function (MTF). Since in contrast to visual cameras, with IR cameras the thermal contrast is of more interest,
this is used together with the slit response function (SRF). The result is determined by the number of pixels
an object needs to fill to allow its temperature be to be measured exactly. In high-performance infrared
optical systems as used by Optris, this is 3×3 pixels, with lower quality optical systems, in some
circumstances as many as 10×10 pixels may be required, to receive 90 % of the energy. A high-performance
camera lens also allows a larger measuring distance with the same number of pixels of the detector, or the

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Technical Data 23-

The following tables with examples showing what spot sizes and
pixel sizes will be reached in which distance. For individual
configuration there are different lenses available. Wide angle
lenses have a radial distortion due to their large opening angle;
the software PIX Connect has an algorithm which corrects this
distortion. As an alternative to the tables below, the optics

calculator can also be used on the optris website or via the
optris calculator app. The app can be downloaded for free from

the Google Play Store (see QR code).

precise temperature measurement of smaller structures and objects. The 3×3 pixel geometry is described as

MFOV (measurement field of view) - one single pixel on the object surface is described as IFOV
(instantaneous field of view). The MFOV is comparable with the measuring spot definition with infrared

thermometers.

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Table 2:

* Note: The accuracy of measurement can be outside of the specifications for distances below the defined minimum distance.

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Technical Data 25-

* Note: The accuracy of measurement can be outside of the specifications for distances below the defined minimum distance.

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* Note: The accuracy of measurement can be outside of the specifications for distances below the defined minimum distance.

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Technical Data 27-

* Note: The accuracy of measurement can be outside of the specifications for distances below the defined minimum distance.

1)

PI 05M is only available with OF25 optics and PI 08M is only available with OF16 and OF25 optics

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* Note: The accuracy of measurement can be outside of the specifications for distances below the defined minimum distance.

1)

PI 05M is only available with OF25 optics and PI 08M is only available with OF16 and OF25 optics

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Mechanical Installation 29-

The tightening torque of the M4 screws for mounting the PI camera should be between

1 ... 1.5 Nm and must not exceed 2 Nm.

3 Mechanical Installation

3.1 Dimensions

The PI is equipped with two metric M4 thread holes on the bottom side (6 mm depth) and can be installed
either directly via these threads or with help of the tripod mount (also on bottom side).

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Figure 5: PI 400i/ PI 450i/ PI 450i G7, dimensions [mm]

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Mechanical Installation 31-

Figure 6: PI 640/ PI 640 G7, optics 29°/33° & 53°/60°, dimensions [mm]

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Figure 7: PI 640/ PI 640 G7, optics 13°/15°, dimensions [mm]

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Mechanical Installation 33-

Figure 8: PI 640/ PI 640 G7, optics 80°/90°, dimensions [mm]

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Figure 9: PI 640, microscope optics 10°/12°, dimensions [mm]

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Mechanical Installation 35-

Figure 10: PI 05M/ PI 08M/ PI 1M, dimensions [mm]

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Figure 11: Change lens for PI 160/
2xx/ 4xxi/ 640

Figure 12: Change lens for PI 05M/
08M/ 1M

Figure 13: Inserting the lens

3.2 Changing the lens

The PI camera is offered with several different lenses1) (lenses depending on the camera variant). To change
a lens, rotate it as shown below. For the PI 05M, PI 08M and PI 1M, the protective tube must first be turned
off (see Figure 3).

To get the best possible measurements when inserting the lens into the camera body, make sure that the
label on the lens is screwed in at the same height as the label from the housing (see Figure 13).

1)

An additionally purchased lens for the PI 05M/ 08M/ 1M camera comes with the corresponding protective tube

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Mechanical Installation 37-

Figure 14: Lens for PI 05M/ 08M/ 1M

Figure 15: Fixing the focus for PI 05M/ 08M/ 1M

3.3 Fixing the focus of the lens (only for PI 05M/ 08M/ 1M)

With the PI 05M, PI 08M and PI 1M, it is possible to fix the focus of the lens. To do this, unscrew the
protective tube of the camera (see Figure 3). There are three small holes on the lens. Take the three screws
that are included and attach them to the three holes. The focus of the lens is now fixed. Alternatively, the two

knurled screws supplied can also be used.

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Figure 16: Focusing screws for focus ring

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Mechanical Installation 39-

3.4 Mounting accessories (optional)

Figure 17: Mounting base, stainless steel, adjustable in 2 axes [Part No.: ACPIMB]

Figure 18: Protective housing, stainless steel, Incl. Mounting base [Part No.: ACPIPH]

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 The CoolingJacket Advanced is available as Standard Version and Extended Version.
 The IR camera can be used at ambient temperature up to 50 °C (up to 70 °C with PI 450i/

PI 450i G7). For higher temperatures (up to 315 °C) the CoolingJacket Advanced is
provided.

 For detailed information see installation manual.

3.5 High temperature accessories

3.5.1 CoolingJacket Advanced

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Mechanical Installation 41-

Standard Version

Figure 19: CoolingJacket Advanced [Part No.: ACPIxxxCJAS], Standard Version - Dimensions

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The Extended Version is provided for applications of the PI series with the PI Netbox and
industrial PIF or the USB Server Gigabit and industrial PIF. Both PI Netbox and industrial PIF or
USB Server Gigabit and industrial PIF can be integrated in the CoolingJacket.

Figure 20: Cooling Jacket Advanced (Extended
Version) with PI Netbox and industrial PIF

Figure 21:Cooling Jacket Advanced (Extended Version)
with USB-Server and industrial PIF

Extended Version

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Mechanical Installation 43-

Figure 22: CoolingJacket Advanced [Part No.: ACPIxxxCJAE], Extended Version – Dimensions

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Laminar air purge for front mounting of the
CoolingJacket Advanced (Standard and Extended).
Two different versions are available: One for
standard IR camera applications [Part-No.:
ACCJAAPLS] and the other for line scanning
applications [Part-No.: ACCJAAPLL].

Those two versions are fitting to all focusing units

with production date ≥01/2018. A protective window

(67 x 3 mm) has to be ordered separately. If you like
to mount the air purge on an older CJ, the focusing
unit should be exchanged to the current version.

3.5.2 Laminar air purge for CoolingJacket

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Mechanical Installation 45-

 The infrared camera PI and the USB server can also be used for outdoor applications by

using the outdoor protective housing.

 The outdoor protective housing can be used for any PI camera (lenses up to 90° FOV)
 In addition, the industrial PIF can be installed as an accessory without housing
 Also available for CSlaser LT or CTlaser LT
 For detailed information see installation manual.

3.5.3 Outdoor protective housing

Figure 23: Outdoor protective housing for PI camera, USB server and industrial PIF

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1

Plug for USB cable

2

Plug for PIF cable

4 Electrical Installation

At the back side of the PI there are the two connector plugs. The left plug is for the USB cable. The right
connector plug is only used for the process interface.

Figure 24: Backside of the camera with connectors

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Electrical Installation 47-

The process interface (electronics within cable as well as industrial interface) must be powered
separately (5-24 VDC). Before switching on the power the PIF cable must be connected to the
camera.

The PI is equipped with a process interface (cable with integrated
electronics and terminal block), which can be programmed via the
software as an Analog Input (AI) and Digital Input (DI) in order to
control the camera or as an Analog Output (AO) in order to control
the process. The signal level is always 0-10 V (DI = 24 V).

Analog Input (AI):

Emissivity, ambient temperature, reference temperature, uncommitted value, flag control, triggered recording,
triggered snapshots, triggered linescanner, triggered event grabber, reset peak-/value-hold, switch temperature
range

Analog Output (AO):

Main measure area, measure area, internal temperature, flag status, recording status, line scan status, alarm,
frame sync, fail-safe, external communication

Digital Input (DI):

Flag control, triggered snapshots, triggered recording, triggered linescanner, triggered event grabber, reset peak­/value-hold, switch temperature range

4.1 Process interface

The process interface can be activated choosing the following options:

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Name

Description

max range1)/ status

AI

Analog input

0-10 V 2)

DI

Digital input
(active-low = 0…0,6 V)

24 V

AO

Analog output
Alarm output

0-10 V
0/ 10 V

Figure 25: Configuration Standard Process Interface (PIF)

The standard process interface provides the following inputs and outputs:

1)

Depending on supply voltage; for 0-10 V on the AO the PIF has to be powered with min. 12 V.

2)

The AI is designed for max. 24 V, the voltage level above 10 V is not interpreted

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Electrical Installation 49-

USB

PIF

1 VCC

1 INT

2 GND

2 SDA (I²C)

3 SCL (I²C)

4 D -

4 DGND

5 D +

5 3.3 V (Out)

4.1.1 PIN allocation

Figure 26: Rear side of the camera

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Consider that the input of the PIF is not protected if there is a direct PIF connection!
A voltage > 3 V on the INT pin will destroy the device!

If the process interface of the camera is directly connected to external hardware1) (without using the supplied
PIF cable) an activation of the field „Support proprietary PIF cable” in the menu Tools/
Configuration/ Device (PIF) in the PIX Connect software is necessary.

Figure 27: Support proprietary PIF cable

1)

We recommend using only a switching contact between INT and DGND as external hardware (button, relay).

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Electrical Installation 51-

GREY

Interrupt

GREEN

SCL (I²C)

YELLOW

SDA (I²C)

WHITE

3.3 V

BROWN

GND

SHIELD

GND

4.1.2 Industrial Process Interface (optional)

For use in industrial environment the industrial process interface with 500 V ACRMS isolation voltage between
PI and process is available (connection box with IP65, 5 m, 10 m or 20 m standard or high temperature cable
for camera connection, terminal for process integration). [►Appendix F – Wiring diagrams PIF]

Pin assignment PIF cable (industrial process interface)

Figure 28: Connections of the industrial Process Interface

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Name

Description

max range1)/ status

A IN 1 / 2

Analog input 1 and 2

0-10 V 2)

D IN 1

Digital input
(active-low = 0…0,6 V)

24 V

AO1 / 2 / 3

Analog output 1, 2 and 3
Alarm output 1, 2 and 3

0/4-20 mA
DO1 / 2/ 3

Relay output 1, 2 and 3 3)

open/ closed (red LED on) / 0...30 V, 400 mA

FS

Fail-safe relay

open/ closed (green LED on)/ 0...30 V, 400 mA

The alarm output can be configured as a threshold between 0-4 mA for no alarm and between
10-20 mA as alarm. For values outside the respective range, the relay does not switch on the

DO.

The industrial process interface provides the following inputs and outputs:

1)

depending on supply voltage; for 0-20 mA on the AO the PIF has to be powered with min. 5V < (1.5 + working resistance * 0.021) <

24 V; Example: R

2)

the AI is designed for max. 24 V, the voltage level above 10 V is not interpreted

3)

active if AO1, 2 or 3 is/ are programmed as alarm output

= 500 ohm → U

Load

= 1.5 + 500 * 0.021 = 12 V, R

min

= 100 ohm → U

Load

= 1.5 + 100 * 0.021 = 3.6 V → min. 5 V

min

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Electrical Installation 53-

Controlled conditions on camera and software

Standard Process interface

ACPIPIF

Industrial Process interface

ACPIPIFMACBxx

Interruption USB cable to camera





Interruption data cable camera - PIF





Interruption power supply PIF





Shut-down of PIX Connect software





Crash of PIX Connect software

-



Fail-Safe-Output

0 V at analog output (AO)

open contact (fail-safe relay)/ green LED off

The process interface has an integrated fail-safe mode. This allows to control conditions like interruption of
cables, shut-down of the software etc. and to give out these conditions as an alarm. The time constant of the
fail-safe is 1.5 seconds.

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Fail-Safe monitoring states

[1]

Breakdown of PIF power supply

[4]

Malfunction of PI

[2]

Cable break of fail-safe cable

[5]

Breakdown of PI power supply/ Interruption of USB cable

[3]

Interruption of cable PI-PIF

[6]

Malfunction of PIX Connect software

4.2 Example for a Fail-Safe monitoring of the PI with a PLC

Figure 29: Fail-Safe monitoring states

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Electrical Installation 55-

Fail-Safe monitoring states

[1]

Breakdown of PIF power supply

[5]

Malfunction of PI

[2]

Cable break of fail-safe cable

[6]

Breakdown of PI power supply/ Interruption of USB cable

[3]

Short circuit of fail-safe cable

[7]

Malfunction of PIX Connect software

[4]

Interruption of cable PI-PIF

Figure 30: Fail-Safe monitoring states

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4.3 USB cable extension

The maximum USB cable length is 20 m. For greater distances between PI and computer or for stand-alone
solutions the optional PI NetBox or the USB Server Gigabit is provided:

Figure 31: Ethernet direct communication with PI Netbox

Figure 32: Ethernet network communication with PI Netbox

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Electrical Installation 57-

Figure 33: Stand-Alone operation with PI Netbox

Figure 34: USB Server Gigabit

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5 IRmobile App

The PI imagers have a direct connection to an Android smartphone or tablet. All you have
to do is download the IRmobile app for free in the Google Play Store. This can also be
done via the QR code. An IRmobile app connector is recommended for connection to the
device (Part-No.: ACPIIACM (micro USB) or ACPIIACC (USB-C)).

With IRmobile you can monitor and analyze your infrared temperature measurement directly on a connected
smartphone or tablet. All you need is an Optris infrared camera. This app runs on most Android (5 or higher)
devices with a micro USB port or USB-C port that supports USB OTG (On The Go). The app is easy to use:
After you have connected your camera to the micro USB port or USB-C port of your smartphone or tablet,

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IRmobile App 59-

the app launches automatically. The calibration files are automatically downloaded from the internet. The
device is powered by your smartphone. A hotspot indicates the hottest pixel in the image and a coldspot the
coldest pixel in the image.

IRmobile app features:

 Live infrared image with automatic hot-/ and coldspot search
 Changing the color palette, scaling and temperature range
 Change of temperature unit: Celsius or Fahrenheit
 Setting of temperature range scaling (Manual, Min/Max, 3 sigma)
 Creating a snapshot
 Integrated simulator

IRmobile supported for:

 Optris IR cameras: PI and Xi series
 Optris pyrometers: Compact series, high performance series and video

thermometers

 For Android 5 (or higher) devices with a micro USB port or USB C port

that supports USB OTG (On The Go)

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Minimum system requirements:

 Windows 7, Windows 8, Windows 10
 USB interface
 Hard disc with at least 30 MByte of free space
 At least 128 MByte RAM

A detailed description is provided in the software manual on the USB stick. See also Help menu
in the PIX Connect software (Help → Documentation).

Alternatively, the software can also be downloaded via the Optris website under the following
link: https://www.optris.global/pix

6 Software PIX Connect

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Software PIX Connect 61-

 All drivers are booted via Windows OS automatically. A driver installation is not necessary.
 By default the program starts automatically in the installed language.

6.1 Installation and initial start-up

1. Insert the included USB stick into the according port on your computer.

2. Please start Setup.exe. Follow the instructions of the wizard until the installation is finished.

The installation wizard places a launch icon on the desktop and in the start menu:
Start\Programs\Optris GmbH\PIX Connect

3. To connect the camera to the PC, plug the USB cable to the camera first. Afterwards connect it with
the PC (to disconnect the camera and the computer remove the USB cable from the computer first
and then disconnect it from the camera).

4. Start the software.

At the initial start the software asks for the calibrations files which are available via internet or on the USB
stick.

5. Install the calibration files at first start of the software.

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Figure 35: Calibration data transfer

After the calibration files have been installed the live image from the camera is shown inside a window on
your PC screen.

6. Choose the desired language in the menu Tools → Language.

7. Adjust the focus of the image by turning the exterior lens ring at the camera.

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Software PIX Connect 63-

1

2

2

2

3

4

5

6

7 8 9

10

11

6.2 Software window

Figure 36: Software window

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1

IR image from the camera

2

Temperature profile: Shows the temperatures along max. 2 lines at any size and position in the image.

3

Reference bar: Shows the scaling of temperature within the color palette.

4

Temperature of measure area: Analyses the temperature according to the selected shape, e.g. average temperature of the
rectangle. The value is shown inside the IR image and the control displays.

5

Control displays: Displays all temperature values in the defined measure areas like Cold Spots, Hot Spots, temperature at
cursor, internal temperature and chip temperature.

Alarm settings: Bar showing the defined temperature thresholds for low alarm value (blue arrow) and high alarm value (red
arrow). The color of numbers within control displays changes to red (when temp. above the high alarm value) and to blue
(when temp. below the low alarm value).

6

Temperature time diagram: Shows the temperature curves over time for selectable region of interest (ROI)

7

Histogram: Shows the statistic distribution of single temperature values.

8

Automatic / manual scaling of the palette (displayed temperature range): Man., </> (min, max), 1σ : 1 Sigma, 3σ : 3 Sigma,
OPT: Palette optimization

9

Menu and Toolbar (Icons)

10

Icon enabling switching between color palettes

11

Status bar: Serial number, optic, temperature range, cursor position, device framerate/ display framerate, emissivity, ambient
temperature, flag status

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Software PIX Connect 65-

Extensive infrared camera software

 No restrictions in licensing
 Modern software with intuitive user interface
 Remote control of camera via software
 Display of multiple camera images in different windows
 Compatible with Windows 7, 8 and 10

High level of individualization for customer specific display

 Various language option including a translation tool
 Temperature display in °C or °F
 Different layout options for an individual setup (arrangement of

windows, toolbar)

 Range of individual measurement parameter fitting for each application
 Adaption of thermal image (mirror, rotate)
 Individual start options (full screen, hidden, etc.)

6.2.1 Basis features of the software PIX Connect

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Video recording and snapshot function

 Recording of video sequences and detailed frames for further analysis

or documentation

 Adjustment of recording frequency to reduce data volume
 Display of snapshot history for immediate analysis

Extensive online and offline data analysis

 Analysis supported by measurement fields, hot and cold spot

searching, image subtraction

 Real time temperature information within main window as digital or

graphic display (line profile, temperature time diagram)

 Slow motion repeat of radiometric files and analysis without camera

being connected

 Editing of sequences such as cutting and saving of individual images
 Various color palettes to highlight thermal contrasts

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Software PIX Connect 67-

Automatic process control

 Individual setup of alarm levels depending on the process
 Definition of visual or acoustic alarms and analog data output
 Analog and digital signal input (process parameter)
 External communication of software via COM-Ports and DLL
 Adjustment of thermal image via reference values

Temperature data analysis and documentation

 Triggered data collection
 Radiometric video sequences (*.ravi) radiometric snapshots (*.tiff)
 Text files including temp. information for analysis in Excel (*.csv, *.dat)
 Data with color information for standard programs such as Photoshop

or Windows Media Player (*.wmv, *.tiff)

 Data transfer in real time to other software programs DLL or COM-Port

interfaces

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7 Basics of Infrared Thermometry

Depending on the temperature each object emits a certain amount of infrared radiation. A change in the
temperature of the object is accompanied by a change in the intensity of the radiation.

Searching for new optical material William Herschel by chance found the infrared radiation in 1800.

Figure 37: William Herschel (1738-1822)

He blackened the peak of a sensitive mercury thermometer. This thermometer, a glass prism that led sun
rays onto a table made his measuring arrangement. With this, he tested the heating of different colors of the
spectrum. Slowly moving the peak of the blackened thermometer through the colors of the spectrum, he

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Basics of Infrared Thermometry 69-

noticed the increasing temperature from violet to red. The temperature rose even more in the area behind
the red end of the spectrum. Finally he found the maximum temperature far behind the red area.

Nowadays this area is called “infrared wavelength area”.

Figure 38: The electromagnetic spectrum and the area used for temperature measurement

For the measurement of “thermal radiation” infrared thermometry uses a wave-length ranging between 1 µm
and 20 µm. The intensity of the emitted radiation depends on the material. This material contingent constant
is described with the help of the emissivity which is a known value for most materials (►8 Emissivity).

Infrared thermometers are optoelectronic sensors. They calculate the surface temperature on the basis of
the emitted infrared radiation from an object. The most important feature of infrared thermometers is that
they enable the user to measure objects contactless. Consequently, these products help to measure the
temperature of inaccessible or moving objects without difficulties.

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Figure 39: Main principle of non-contact thermometry

Infrared thermometers basically consist of the following components:

 Lens
 Spectral filter
 Detector
 Electronics (amplifier/ linearization/ signal processing)

The specifications of the lens decisively determine the optical path of the infrared thermometer, which is
characterized by the ratio Distance to Spot size. The spectral filter selects the wavelength range, which is
relevant for the temperature measurement. The detector in cooperation with the processing electronics
transforms the emitted infrared radiation into electrical signals.

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Basics of Infrared Thermometry 71-

The advantages of non-contact thermometry are clear - it supports:

 temperature measurements of moving or overheated objects and of objects in hazardous

surroundings

 very fast response and exposure times
 measurement without inter-reaction, no influence on the
 measuring object
 non-destructive measurement
 long lasting measurement, no mechanical wear

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Figure 40: Non-contact thermometry

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Basics of Infrared Thermometry 73-

Monitoring of electronic
cabinets

R&D of electronics

R&D of electronic parts

Process control extruding
plastic parts

Process control
manufacturing solar
modules

Process control at
calendering

R&D of mechanical parts

Monitoring of cables

Application field:

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I

IR radiation

ε

Emission

ρ

Reflection

τ

Transmission

ε + ρ+ τ = 1

8 Emissivity

8.1 Definition

The intensity of infrared radiation, which is emitted by each body, depends on the temperature as well as on
the radiation features of the surface material of the measuring object. The emissivity (ε – Epsilon) is used as
a material constant factor to describe the ability of the body to emit infrared energy. It can range between 0

and 100 %. A “blackbody” is the ideal radiation source with an emissivity of 1.0 whereas a mirror shows an

emissivity of 0.1.

Figure 41: Composition of IR radiation

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Emissivity 75-

Figure 42: Spectral emissivity of several materials: 1 Enamel, 2 Plaster, 3 Concrete, 4 Chamotte

If the emissivity chosen is too high, the infrared thermometer may display a temperature value which is much
lower than the real temperature – assuming the measuring object is warmer than its surroundings. A low
emissivity (reflective surfaces) carries the risk of inaccurate measuring results by interfering infrared radiation
emitted by background objects (flames, heating systems, chamottes). To minimize measuring errors in such
cases, the handling should be performed very carefully and the unit should be protected against reflecting
radiation sources.

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8.2 Determination of unknown emissivity

► First determine the actual temperature of the measuring object with a thermocouple or contact sensor.

Second, measure the temperature with the infrared thermometer and modify the emissivity until the
displayed result corresponds to the actual temperature.

► If you monitor temperatures of up to 380 °C you may place a special plastic sticker (emissivity dots – Part

No.: ACLSED) onto the measuring object, which covers it completely.

Figure 43: Plastic sticker at metal surface

Set the emissivity to 0.95 and take the temperature of the sticker. Afterwards, determine the temperature
of the adjacent area on the measuring object and adjust the emissivity according to the value of the
temperature of the sticker.

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Emissivity 77-

► Cove a part of the surface of the measuring object with a black, flat paint with an emissivity of 0.98. Adjust

the emissivity of your infrared thermometer to 0.98 and take the temperature of the colored surface.
Afterwards, determine the temperature of a directly adjacent area and modify the emissivity until the
measured value corresponds to the temperature of the colored surface.

Figure 44: Shiny metal surface left and blackened metal surface right

CAUTION: On all three methods the object temperature must be different from ambient temperature.

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8.3 Characteristic emissivity

In case none of the methods mentioned above help to determine the emissivity you may use the emissivity
table ► Appendix A and Appendix B. These are average values, only. The actual emissivity of a material
depends on the following factors:

 temperature
 measuring angle
 geometry of the surface
 thickness of the material
 constitution of the surface (polished, oxidized, rough, sandblast)
 spectral range of the measurement
 transmissivity (e.g. with thin films)

Figure 45: Adjustment of the emissivity in the software PIX Connect (menu Tools/ Configuration/ Device)

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Appendix A – Table of emissivity for metals 79-

Appendix A – Table of emissivity for metals

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Appendix B – Table of emissivity for non-metals 81-

Appendix B – Table of emissivity for non-metals

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Appendix C – Quick start for serial communication

Introduction

One special feature of the PIX Connect software contains the possibility to communicate via a serial COM­Port interface. This can be a physical COM-Port or a virtual COM-Port (VCP). It must be available on the
computer where the PIX Connect software is installed.

Setup of the interface

1. Open the Configurations dialog and enter the tab “External Communication” to enable the
software for the serial communication.

2. Select the mode “COM-Port” and choose the appropriate port.

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Appendix C – Quick start for serial communication 83-

The command list is provided on the USB stick and in the PIX Connect software
(Help → SDK). Every command must expire with CR/LF (0x0D, 0x0A).

3. Select the baud rate that matches the baud rate of the other communication device. The other
interface parameters are 8 data bits, no parity and one stop bit (8N1).

These parameters are used in many other communication devices too. The other station must support 8 bit
data.

4. Connect the computer with the communication device. If this is a computer too, use a null modem
cable.

Command list

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The description of the initialization procedure as well as the necessary command list is provided
on the USB stick and in the PIX Connect software (Help → SDK).
2 SDK packages are available (included on USB stick):

1. Connect SDK: requires the PIX Connect software

2. Direct SDK: no PIX Connect software required, supports Linux and Windows

Appendix D – Interprocess Communication (IPC)

The communication to the process imager device is handled by the PIX Connect software (Imager.exe)
only. A dynamic link library (ImagerIPC2.dll) provides the interprocess communication (IPC) for other
attached processes. The DLL can be dynamically linked into the secondary application. Or it can be done
static by a lib file too. Both Imager.exe and ImagerIPC2.dll are designed for Windows 7/ 8/ 10 only.
The application must support call-back functions and polling mode.

The ImagerIPC2.dll will export a bunch of functions that are responsible for initiating the communication,
retrieving data and setting some control parameters.

The main difference to the former Version 1 (ImagerIPC.dll) is the support of more than one Optris PI via
multiple instances of Optris PIX Connect.

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Appendix E – PIX Connect Resource Translator 85-

A detailed tutorial is provided on the USB stick.

Appendix E – PIX Connect Resource Translator

PIX Connect is a .Net Application. Therefore it is ready for localization. Localization as a Microsoft
idiom means a complete adaption of resources to a given culture. Learn more about the internationalization
topics consult Microsoft’s developer documentation on

If desired the localization process can be illustrated in detail. Also the resizing of buttons or other visible
resources and the support of right-to-left-languages are supported. Experts who have the appropriate tools

should handle it. Nevertheless we have developed the small tool “Resource Translator” to make the

translation of the resources of the PIX Connect application possible for everybody.
This tool helps to translate any visible text within the PIX Connect application.

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Appendix F – Wiring diagrams PIF

Analog Output:

The maximum load impedance is 500 Ohm.
The analog output can be used as a digital output too. The current value for “no alarm” and “alarm on” is

set within the software.

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Appendix F – Wiring diagrams PIF 87-

Digital Input:

Figure 46: Digital input

The digital input can be activated with a button to the PI GND-Pin or with a low level CMOS/TTL signal: Low
level 0…0.6 V; High level 2…24 V

Example Button:

Figure 47: Button

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REL1-3 (DO1-DO3):

U

max

= 30 VDC

I

max

= 400 mA

Analog input (usable voltage range: 0 … 10 V):

Figure 48: Analog input

Relay output at industrial PIF [Part No.: ACPIPIFMACBxx]

The analog output must be set to “Alarm”. The range for AO1-AO3 can be set in the software (no alarm: 0-4 mA/ alarm:
10-20 mA).

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Appendix F – Wiring diagrams PIF 89-

Figure 49: Relay output at industrial PIF

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Appendix G – Declaration of Conformity

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