This document is intended to be a guide to explain the
connectivity and usage of the evaluation kit described in the
table below. The evaluation kit is designed to quickly
perform benchmarking or product evaluation at specific
operating conditions in a lab environment. The product
should only be operated and handled by qualified personnel
with sufficient electrical engineering training and
experience.
Applies to the following parts.
Table 1.
NVG800A75L4DSC−EVK750 V, 800 A based 3−ph
Evaluation kit
Figure 1. NVG800A75L4DSC−EVK
INTRODUCTION
The VE−Trac Dual Evaluation Kit consists of three
VE−Trac Dual power modules (NVG800A75L4DSC)
mounted on dual side cooling heatsink, with a 6−ch Gate
driver board, DC Link capacitor and external hall−effect
current sense feedback for motor control. The kit does not
include a PWM controller. The user must user their on PWM
controller to operate the system. The evaluation kit allows
the customers to evaluate VE−Trac Dual power module
performances in their early stage of inverter development.
The kit can be used as a double pulse tester to measure key
switching parameters or used as a 3−ph inverter for motor
control.
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EVAL BOARD USER’S MANUAL
VE−Trac Dual evaluation kit features:
• Inverter evaluation Hardware kit for EV/HEV Traction
Inverter applications (up to 150 kW)
• VE−Trac Dual NVG800A75L4DSC with 800 A, 750 V
Field stop 4 IGBT/Diode chipset
• Automotive Isolated high current and high efficiency
IGBT gate driver with internal galvanic isolation,
NCD57000
• Implementation of Faster and simpler OCP enabled by
On−Chip Current Sensing feature in the power modules
• Implementation of faster and closer to true Tvj OTP with
integrated to On−Chip Temperature Sensing feature in the
power modules
• Custom designed dual side cooler offers low pressure
drop with excellent thermal performance
• Custom Film DC Link capacitor rated up to 500 VDC,
500 mF.
TECHNICAL DETAILS
ON Semiconductor’s latest generation of IGBTs and
Diodes are incorporated into the VE−Trac Dual products.
The 750 V products use the latest 4
IGBTs from ON Semiconductor.
Block Diagram
In this section, we describe the evaluation kit in detail,
including block diagram, operating conditions, key
components, On−chip current/temperature sensing and
protection features.
The simplified block diagram gives a quick overview of
the evaluation kit. The dotted lines show the different
isolated sections of the system.
exposed high voltage and high temperatures that when
accidentally contacted can result in electrical shock or
severe burns. Therefore, it should only be handled by
professionals with sufficient electrical engineering training
Maximum Ratings
The VE−Trac Dual Evaluation kit is intended to be
operated in a lab testing environment and should not be
regarded as a protected system. Parts of the design have
Table 2. SUMMARY OF OPERATING CONDITIONS
ParameterSymbolMinMaxConditions
Gate Driver Board Control PowerV
DC Link VoltageV
Peak Collector Phase Current (1 ms)I
Maximum IGBT/FWD Junction TemperatureT
Wait time after short circuitSC1 s−
PCB TemperatureT
Switching frequencyF
Coolant TemperatureT
Driv
BUS
CPEAK
VJ_Max
PCB
SW
c
and experience. Moreover, the operating conditions
especially the thermal limits described below should be
followed strictly.
9 V15 V
0 V500 VLimited by Capacitor
−1600 A1600 ALimited by Tvj_Max
−40°C175°C
−85°C
−12 kHz
−40°C65°C
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EVBUM2704
Key Components
The evaluation kit is shipped in a hard plastic case with the
following contents:
n Full assembled evaluation kit hardware
n USB Drive containing all the required documentation
Figure 3. Shipping Contents in Case
The assembled evaluation kit assembly itself consists of
the following major components.
Figure 4. Major Components that Make Up the Evaluation Kit
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EVBUM2704
Table 3. SUPPLIERS FOR THE MAJOR COMPONENTS OF THE EVALUATION HARDWARE
Dual side coolerON SemiconductorON Semi design with outsourced manufacturing.
700A321SBE
HAH3DR 900−S00−BBLEMHall Current Transducer. ±900 A
On−chip Current Sensing and Temperature Sensing
One of the kay advantage of the VE−Trac Dual power
modules is the integrated On−chip current sensing and
On−chip temperature sensing. The Evaluation kit offers
users the option of monitoring the junction temperature and
ON SemiconductorAutomotive VE−Trac Dual power module with FS4 750 V 800 A
IGBT and Diode
DC Link Capacitor 500 V, 500 mF
current of all six IGBTs in real time. OCP/OTP protections
is implemented using the on−chip sensors. Below
schematics show how On−chip current sensing is
implemented as well as test points for verification purpose.
Figure 5. Schematics of Implementing On−chip Current Sensing
Figure 6. Test Points for On−chip Current and Temperature Sense
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Test points for
current/temp
sense, of which
all 6 switches
are available
EVBUM2704
Protection Features
Over Current Protection (OCP) and Over Temperature
Protection (OTP) are implemented by sensing the On−chip
current sensor and On−chip temperature sensor respectively.
Besides this, the traditional desaturation protection is also
implemented to allow users to compare it with the On−chip
current sense protection. The protection trigger levels are set
as below:
• Over Current Protection (OCP) for all phases set to
1600 A
Table 4. FAULT INDICATION LED MATRIX
OCP_FAULT_
Phases
Phase_U_HSD12D10D28
Phase_U_LSD13D11D40
Phase_V_HSD16D14D61
Phase_V_LSD17D15D64
Phase_W_HSD20D18D34
Phase_W_LSD21D19D54
LED
• Over Temperature Protection (OTP) for all phases set to
150°C
• DC Link Over Voltage Fault Threshold set to 550 VDC
NOTE: All faults are the latching type and requires a
reset to clear the fault latch to start operating
again. During a fault incident, a LED is lit to
help the user to identify the cause of the fault.
Below is Fault Indication LED Matrix for the
VE−Trac Dual evaluation kit. Normal operation
indication LEDs are off when fault occurs, refer
to Figure 11 for locations of fault LEDs
DRVER_
OTP_FAULT_LED
FAULT_LED
PCBs AND CONNECTORS
There is a total of five (5) PCBs in the evaluation kit
assembly.
1. Power Module interface boards (3)
2. Gate driver board (1)
3. Current sensor board (1)
Power Module Interface boards are not accessible to the
user and is soldered to the signal pins of each of the three
VE−Trac Dual modules. An interface cable with a signal
connector extends from the interface boards to connect to
the gate driver board. The purpose this arrangement is to
make it easy to remove the driver board for replacement or
for trouble shooting purpose.
Gate driver board is the main PCB with several
connectors on it. It interfaces with the user’s Motor Control
Unit (MCU), the hall−effect current sensors, Power modules
and aux. power input.
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