ON Semiconductor NUP4302MR6 Technical data

查询NUP4302MR6供应商

NUP4302MR6

Schottky Diode Array for
Four Data Line
ESD Protection

The NUP4302MR6 is designed to protect high speed data line

interface from ESD, EFT and lighting.

http://onsemi.com

Features

• Very Low Forward Voltage Drop

• Fast Switching

• PN Junction Guard Ring for Transient and ESD Protection

• ESD Rating of Class 3B (Exceeding 16 kV) per Human Body Model

and Class C (Exceeding 400 V) per Machine Model

• IEC 61000−4−2 Level 4 ESD Protection

• Flammability Rating: UL 94 V−0

Applications

• Ultra High−Speed Switching

• USB 1.1 and 2.0 Power and Data Line Protection

• Digital Video Interface (DVI)

• Monitors and Flat Panel Displays

PIN CONFIGURATION

AND SCHEMATIC

I/O 1

GND 2

1/O 3

MARKING DIAGRAM

1

TSOP−6

CASE 318G

PLASTIC

STYLE 12

67 = Specific Device Code

M

= Date Code

ORDERING INFORMATION

Device Package Shipping

6 I/O

5 V

CC

4 I/O

M

67

1

†

 Semiconductor Components Industries, LLC, 2004

December, 2004 − Rev. 2

NUP4302MR6T1 TSOP−6 3000/Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.

1 Publication Order Number:

NUP4302MR6/D

NUP4302MR6

MAXIMUM RATINGS (T

= 25°C unless otherwise noted)

J

Rating Symbol Value Unit

Peak Reverse Breakdown Voltage V

Forward Power Dissipation (TA = 25°C) P

Forward Continuous Current I

Junction Operating Temperature T

Storage Temperature Range T

BR

F

F

J

stg

30 V

225 mW

200 mA

−55 to +125 °C

−55 to +150 °C

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.

ELECTRICAL CHARACTERISTICS (T

= 25°C unless otherwise noted)

J

Parameter Symbol Conditions Min Typ Max Unit

Reverse Breakdown Voltage V

Reverse Leakage I

Forward Voltage V

Forward Voltage V

Forward Voltage V

Forward Voltage V

Total Capacitance C

Reverse Recovery Time t

IR = 100 A

BR

VR = 25 V 30

R

IF = 0.1 mAdc 0.28 V

F

IF = 1.0 mAdc 0.35 V

F

IF = 10 mAdc 0.45 V

F

IF = 100 mAdc 1.00 V

F

VR = 0 V, f = 1.0 MHz, I/O to Ground

T

VR = 0 V, f = 1.0 MHz, I/O to I/O

IF = IR = 10 mA, I

rr

= 1.0 mA (Figure 1) 5.0 ns

R(REC)

30 V

28
18

A

pF

+10 V

50  OUTPUT

PULSE

GENERATOR

820 

2 k

100 H

0.1 F

I

F

0.1 F
t

t

r

p

t

I

F

10%

DUT

50  INPUT

SAMPLING

OSCILLOSCOPE

V

90%

R

INPUT SIGNAL

I

R

(IF = IR = 10 mA; measured

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.

Notes: 2. Input pulse is adjusted so I
Notes: 3. tp » t

rr

is equal to 10 mA.

R(peak)

Figure 1. Recovery Time Equivalent Test Circuit

t

rr

i

R(REC)

OUTPUT PULSE

at i

R(REC)

= 1 mA)

t

= 1 mA

http://onsemi.com

2

NUP4302MR6

1000

TA = 1 25°C

100

10

, FORWARD CURRENT (mA)

F

I

1

0

0.2 0.4 0.6

VF, FORWARD VOLTAGE (VOLTS)

Figure 2. Forward Current as a Function of

Forward Voltage; Typical Values

25°C

85°C

40

35

30

25

0.8

1.0

10,000

1000

100

, REVERSE CURRENT (A)

R

I

0.1

TA = 1 25°C

85°C

10

1

0

5101520

25°C

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Reverse Current as a Function of

Reverse Voltage; Typical Values

f = 1 MHz
TA = 25°C

25

30

20

15

10

, DIODE CAPACITANCE (pF)

D

5

C

0

0

510 15 30

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Diode Capacitance as a Function of

Reverse Voltage; Typical Values

2520

http://onsemi.com

3

0.05 (0.002)

NUP4302MR6

PACKAGE DIMENSIONS

TSOP−6

CASE 318G−02

ISSUE M

NOTES:

1. DIMENSIONING AND TOLERANCING PER

A

L

456

S

1

23

B

D

G

M

C

H

K

J

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.

DIM MIN MAX MIN MAX

A 0.1142 0.12202.90 3.10
B 0.0512 0.06691.30 1.70
C 0.0354 0.04330.90 1.10
D 0.0098 0.01970.25 0.50
G 0.0335 0.04130.85 1.05
H 0.0005 0.00400.013 0.100
J 0.0040 0.01020.10 0.26
K 0.0079 0.02360.20 0.60
L 0.0493 0.06101.25 1.55
M 0 10 0 10

____

S 0.0985 0.11812.50 3.00

STYLE 12:

PIN 1. I/O

2. GROUND

3. I/O

4. I/O

5. VCC

6. I/O

INCHESMILLIMETERS

SOLDERING FOOTPRINT

2.4

0.094

0.95

0.037

1.9

0.075

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

0.95

0.037

1.0

0.039

0.7

0.028

SCALE 10:1

ǒ

inches

mm

Ǔ

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA

Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: [e-mail]

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Japan: ON Semiconductor, Japan Customer Focus Center

2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051

Phone: 81−3−5773−3850

http://onsemi.com

4

ON Semiconductor Website: http://onsemi.com

Order Literature: http://www.onsemi.com/litorder

For additional information, please contact your
local Sales Representative.

NUP4302MR6/D