查询NUP4301MR6T1供应商
NUP4301MR6T1
Low Capacitance Diode
Array for ESD Protection in
Four Data Lines
NUP4301MR6T1 is a MicroIntegration device designed to
provide protection for sensitive components from possible harmful
electrical transients; for example, ESD (electrostatic discharge).
Features
• Low Capacitance (1.5 pf Maximum Between I/O Lines)
• Single Package Integration Design
• Provides ESD Protection for JEDEC Standards JESD22
Machine Model = Class C
Human Body Model = Class 3B
• Protection for IEC61000-4-2 (Level 4)
8.0 kV (Contact)
15 kV (Air)
• Ensures Data Line Speed and Integrity
• Fewer Components and Less Board Space
• Direct the Transient to Either Positive Side or to the Ground
Applications
• USB 1.1 and 2.0 Data Line Protection
• T1/E1 Secondary IC Protection
• T3/E3 Secondary IC Protection
• HDSL, IDSL Secondary IC Protection
• Video Line Protection
• Microcontroller Input Protection
• Base Stations
2
• I
C Bus Protection
http://onsemi.com
PIN CONFIGURATION
AND SCHEMATIC
64
6 I/O
5 V
4 I/O
d
I/O 1
2
V
N
1/O 3
4
5
6
2
1
TSOP-6
CASE 318F
PLASTIC
ORDERING INFORMATION
Device Package Shipping
MARKING DIAGRAM
3
64 = Specific Device Code
d
= Date Code
P
MAXIMUM RATINGS (Each Diode) (T
Rating
Reverse Voltage V
Forward Current I
Peak Forward Surge Current I
Repetitive Peak Reverse Voltage V
Average Rectified Forward
Current (Note 1)
(averaged over any 20 ms period)
Repetitive Peak Forward Current I
Non-Repetitive Peak Forward Current
t = 1.0 s
t = 1.0 ms
t = 1.0 S
1. FR-5 = 1.0 0.75 0.062 in.
Semiconductor Components Industries, LLC, 2003
February, 2003 - Rev. 2
= 25°C unless otherwise noted)
J
Symbol Value Unit
R
F
FM(surge)
RRM
I
F(AV)
FRM
I
FSM
70 Vdc
200 mAdc
500 mAdc
70 V
715 mA
450 mA
A
2.0
1.0
0.5
1 Publication Order Number:
NUP4301MR6T1 TSOP-6 3000/Tape & Reel
NUP4301MR6T1/D
NUP4301MR6T1
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance Junction-to-Ambient R
Lead Solder Temperature
Maximum 10 Seconds Duration
Junction Temperature T
Storage Temperature T
JA
T
L
J
stg
556 °C/W
260 °C
-40 to +85 °C
-55 to +150 °C
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted) (Each Diode)
J
Characteristic
OFF CHARACTERISTICS
Reverse Breakdown Voltage (I
= 100 A) V
(BR)
Reverse Voltage Leakage Current (VR = 70 Vdc)
(VR = 25 Vdc, TJ = 150°C)
(V
= 70 Vdc, TJ = 150°C)
R
Capacitance (between I/O pins)
(VR = 0 V, f = 1.0 MHz)
Capacitance (between I/O pin and ground)
(VR = 0 V, f = 1.0 MHz)
Forward Voltage (IF = 1.0 mAdc)
(IF = 10 mAdc)
(I
= 50 mAdc)
F
= 150 mAdc)
(I
F
1. FR-5 = 1.0 0.75 0.062 in.
2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.
Symbol Min Typ Max Unit
(BR)
I
R
C
C
V
D
D
F
70 - - Vdc
-
-
-
-
-
-
2.5
30
50
Adc
- 0.8 1.5 pF
- 1.6 3 pF
-
-
-
-
-
-
-
-
715
855
1000
1250
mV
dc
http://onsemi.com
2
NUP4301MR6T1
Curves Applicable to Each Cathode
100
10
1.0
, FORWARD CURRENT (mA)
F
I
0.1
0.2 0.4
10
T
= 150°C
A
T
= 85°C
A
T
A
= 25°C
T
= −40°C
A
1.0
0.1
, REVERSE CURRENT (µA)
R
0.01
I
T
= 125°C
A
T
A
T
= 55°C
A
T
= 25°C
A
= 85°C
0.001
0.6 0.8 1.0
VF, FORWARD VOLTAGE (VOLTS)
1.2
0
10 20 30 40
V
, REVERSE VOLTAGE (VOLTS)
R
Figure 1. Forward Voltage Figure 2. Leakage Current
1.75
1.5
1.25
50
, DIODE CAPACITANCE (pF)
1.0
D
C
0.75
0
2468
V
, REVERSE VOLTAGE (VOLTS)
R
Figure 3. Capacitance
http://onsemi.com
3
0.05 (0.002)
NUP4301MR6T1
PACKAGE DIMENSIONS
TSOP-6
CASE 318F-04
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
A
L
456
S
1
23
B
D
G
M
C
H
K
J
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM
LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 318F-01, -02, -03 OBSOLETE. NEW
STANDARD 318F-04.
DIM MIN MAX MIN MAX
A 0.1142 0.1220 2.90 3.10
B 0.0512 0.0669 1.30 1.70
C 0.0354 0.0433 0.90 1.10
D 0.0098 0.0197 0.25 0.50
G 0.0335 0.0413 0.85 1.05
H 0.0005 0.0040 0.013 0.100
J 0.0040 0.0102 0.10 0.26
K 0.0079 0.0236 0.20 0.60
L 0.0493 0.0649 1.25 1.65
M 0 10 0 10
S 0.0985 0.1181 2.50 3.00
MILLIMETERSINCHES
MicroIntegration is a trademarks of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make
changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
Email: ONlit@hibbertco.com
N. American Technical Support: 800-282-9855 Toll Free USA/Canada
http://onsemi.com
JAPAN: ON Semiconductor, Japan Customer Focus Center
2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051
Phone: 81-3-5773-3850
ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local
Sales Representative.
NUP4301MR6T1/D
4
Loading...