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NUF6406MN

Datasheet NUF6406MN Datasheet (ON Semiconductor)

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NUF6406MN
Low Capacitance 6 Line EMI Filter with ESD Protection
Features
• EMI Filtering and ESD Protection
• Integration of 30 Discrete Components
• Compliance with IEC61000−4−2 (Level 4)
> 8.0 kV (Contact)
• DFN Package, 1.35 x 3.0 mm
• Moisture Sensitivity Level 1
• ESD Ratings: Machine Model = C
Human Body Model = 3B
• This is a Pb−Free Device*
Benefits
• Reduces EMI/RFI Emissions on a Data Line
• Integrated Solution Offers Cost and Space Savings in a DFN Package
• Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
• Integrated Solution Improves System Reliability
• Compatible Footprint to BGA or Flip−Chip Package
Applications
• EMI Filtering and ESD Protection for Data Lines
• Wireless Phones
• PDAs and Handheld Products
• Notebook Computers
• LCD Displays
4321
GND
65
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1
Cd Cd
2
Cd Cd
3
Cd Cd
4
Cd Cd
5
Cd Cd
6
Cd Cd
(Top View)
MARKING
12
1
DFN12
CASE 506AD
6406 = Specific Device Code M
= Month G = Pb−Free Package (Note: Microdot may be in either location)
DIAGRAM
1
M
12
11
10
9
8
7
64 06
G
G
(Bottom View)
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2005
June, 2005 − Rev. 2
9101112 8 7
1 Publication Order Number:
ORDERING INFORMATION
Device Package Shipping
NUF6406MNT1G DFN12
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD801 1/D.
3000 / Tape & Ree
NUF6406MN/D
†
NUF6406MN
MAXIMUM RATINGS (T
ESD Discharge IEC61000−4−2 Contact Discharge V Operating Temperature Range T Storage Temperature Range T Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) T
= 25°C unless otherwise noted)
J
Parameter
Symbol Value Unit
PP
OP
STG
L
8.0 kV
−40 to 85 °C
−55 to 150 °C 260 °C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously . If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
ELECTRICAL CHARACTERISTICS (T
Parameter
Maximum Reverse Working Voltage V Breakdown Voltage V Leakage Current I Resistance R
= 25°C unless otherwise noted)
J
Symbol Test Conditions Min Typ Max Unit
RWM
BR R
A
IR = 1.0 mA 6.0 7.0 V
V
= 3.0 V 1.0
RWM
IR = 20 mA 85 100 115
5.0 V
A
Capacitance (Notes 1 and 2) Cd VR = 2.5 V, f = 1.0 MHz 13 16 pF Cut−Off Frequency (Note 3) f
3dB
Above this frequency,
appreciable attenuation occurs
138 MHz
1. Measured at 25°C, VR = 2.5 V, f = 1.0 MHz.
2. Total line capacitance is 2 times the Diode Capacitance (Cd).
3. 50 source and 50 load termination.
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2
NUF6406MN
0
−5
−10
−15
−20
−25
S21 (dB)
−30
−35
−40
−45
1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 FREQUENCY (Hz)
Figure 1. Insertion Loss Characteristic
2
1.5
1
0.5
NORMALIZED CAPACITANCE
0
012345
REVERSE VOLTAGE (V)
0
10
−20
−30
−40
S41 (dB)
−50
−60
−70
−80
1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 FREQUENCY (Hz)
Figure 2. Analog Crosstalk
110 108 106 104 102 100
98
RESISTANCE ()
96 94 92 90
−40 −20 0 20 40 60 80 TEMPERATURE (°C)
Figure 3. Typical Capacitance vs.
Reverse Biased Voltage
(Normalized Capacitance, Cd @ 2.5 V)
Figure 4. Typical Resistance over
Temperature
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3
2 X
0.15 C
PIN ONE
REFERENCE
0.10 C
12 X
0.08 C
2 X
0.2 X 0.25 MM NOTE 5
L
12 X
2 X
A
D
B
E
TOP VIEW
(A3)
SIDE VIEW
A1
D2
e
16
EXPOSED PAD
E2
0.15 C
EXPOSED Cu
A
C
NUF6406MN
PACKAGE DIMENSIONS
DFN12 3.0*1.35*0.85
CASE 506AD−01
ISSUE F
(A3)
SEATING PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
5. EXPOSED PADS CONNECTED TO DIE FLAG. USED AS TEST CONTACTS.
MILLIMETERS
DIM MIN MAX
A 0.80 1.00 A1 0.00 0.05 A3 0.20 REF
b 0.18 0.30
D 3.00 BSC D2 2.10 2.30
E 1.35 BSC E2 0.20 0.40
e 0.50 BSC
K 0.20 −−−
L 0.20 0.40
12 X
K
BOTTOM VIEW
712
b
12 X
SOLDERING FOOTPRINT*
2.352
0.093
0.10 B
0.05ACC
NOTE 3
0.351
0.014
0.265
0.01
0.479
0.019
SCALE 16:1
ǒ
inches
mm
Ǔ
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com
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USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
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4
ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your local Sales Representative.
NUF6406MN/D
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