ON Semiconductor NTMFS5C604NL User Manual
MOSFET – Power, Single,
N-Channel
60 V, 1.2 mW, 287 A
NTMFS5C604NL
Features
• Small Footprint (5x6 mm) for Compact Design
• Low R
• Low Q
to Minimize Conduction Losses
DS(on)
and Capacitance to Minimize Driver Losses
G
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (T
Parameter
Drain−to−Source Voltage V
Gate−to−Source Voltage V
Continuous Drain
Current R
(Notes 1, 3)
Power Dissipation
R
q
JC
Continuous Drain
Current R
(Notes 1, 2, 3)
Power Dissipation
R
q
JA
Pulsed Drain Current
Operating Junction and Storage Temperature TJ, T
Source Current (Body Diode) I
Single Pulse Drain−to−Source Avalanche
Energy (I
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
q
JC
(Note 1)
q
JA
(Notes 1 & 2)
= 22 A)
L(pk)
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
= 25°C unless otherwise noted)
J
Symbol Value Unit
TC = 25°C
Steady
State
Steady
State
TA = 25°C, t
TC = 100°C 203
TC = 25°C
TC = 100°C 100
TA = 25°C
TA = 100°C 28
TA = 25°C
TA = 100°C 1.9
= 10 ms
p
P
P
I
E
R
q
R
q
2
, 2 oz. Cu pad.
DSS
GS
I
D
D
I
D
D
DM
S
AS
T
L
JC
JA
stg
60 V
±20 V
287
200
40
3.9
900 A
−55 to
+175
203 A
776 mJ
260 °C
0.75
39
A
W
A
W
°C
°C/W
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V
(BR)DSS
60 V
G (4)
R
MAX ID MAX
DS(ON)
1.2 mW @ 10 V
1.7 mW @ 4.5 V
D (5)
S (1,2,3)
N−CHANNEL MOSFET
287 A
MARKING
DIAGRAM
D
DFN5 (SO−8FL)
CASE 506EZ
1
5C604L = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
G
S
S
S
5C604L
AYWZZ
D
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
D
D
© Semiconductor Components Industries, LLC, 2016
April, 2021 − Rev. 7
1 Publication Order Number:
NTMFS5C604NL/D
NTMFS5C604NL
ELECTRICAL CHARACTERISTICS (T
Parameter
= 25°C unless otherwise specified)
J
Symbol Test Condition Min Ty p Max Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
Drain−to−Source Breakdown Voltage
V
V
Temperature Coefficient
Zero Gate Voltage Drain Current I
Gate−to−Source Leakage Current I
(BR)DSS
(BR)DSS
T
J
DSS
GSS
VGS = 0 V, ID = 250 mA
/
VGS = 0 V,
V
= 60 V
DS
TJ = 25°C 10
TJ = 125°C 250
VDS = 0 V, VGS = 20 V 100 nA
60 V
22.9
mV/°C
mA
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
Threshold Temperature Coefficient V
Drain−to−Source On Resistance R
V
GS(TH)
GS(TH)/TJ
DS(on)
Forward Transconductance g
Gate Resistance R
FS
VGS = VDS, ID = 250 mA
VGS = 10 V ID = 50 A 0.93 1.2
VGS = 4.5 V ID = 50 A 1.25 1.7
VDS = 15 V, ID = 50 A 180 S
G
TA = 25°C 3.4
1.2 2.0 V
−5.9 mV/°C
mW
W
CHARGES AND CAPACITANCES
Input Capacitance
Output Capacitance C
Reverse Transfer Capacitance C
Total Gate Charge Q
Total Gate Charge Q
Threshold Gate Charge Q
Gate−to−Source Charge Q
Gate−to−Drain Charge Q
Plateau Voltage V
C
ISS
OSS
RSS
G(TOT)
G(TOT)
G(TH)
GS
GD
GP
VGS = 0 V, f = 1 MHz, VDS = 25 V
VGS = 4.5 V, VDS = 30 V; ID = 50 A 52
VGS = 10 V, VDS = 30 V; ID = 50 A 120
VGS = 4.5 V, VDS = 30 V; ID = 50 A
8900
3750
40
6.4
21.4
12.7
2.8 V
pF
nC
SWITCHING CHARACTERISTICS (Note 5)
Turn−On Delay Time
t
d(ON)
Rise Time t
Turn−Off Delay Time t
d(OFF)
Fall Time t
r
f
VGS = 4.5 V, VDS = 30 V,
= 50 A, RG = 2.5 W
I
D
32.9
29.9
60.3
25.2
ns
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
Reverse Recovery Time t
Charge Time t
Discharge Time t
Reverse Recovery Charge Q
V
SD
RR
a
b
RR
VGS = 0 V,
I
= 50 A
S
VGS = 0 V, dIS/dt = 100 A/ms,
IS = 50 A
TJ = 25°C 0.78 1.2
TJ = 125°C 0.64
98
45
53
190 nC
V
ns
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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NTMFS5C604NL
TYPICAL CHARACTERISTICS
200
180
160
140
120
100
80
60
, DRAIN CURRENT (A)
D
I
40
20
0
VDS, DRAIN−TO−SOURCE VOLTAGE (V) VGS, GATE−TO−SOURCE VOLTAGE (V)
Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics
4
3
2
10 V to 3.4 V
3.2 V
3.0 V
VGS = 2.8 V
TJ = 25°C
= 50 A
I
D
200
180
160
140
120
100
80
60
, DRAIN CURRENT (A)
D
I
40
20
2.01.51.00.50
0
2.0
1.5
VDS ≤ 10 V
TJ = 25°C
TJ = 25°C
TJ = 125°C
VGS = 4.5 V
TJ = −55°C
3.5
4.03.02.52.01.51.00.50
1
, DRAIN−TO−SOURCE RESISTANCE (mW)
0
DS(on)
R
, NORMALIZED DRAIN−TO−
SOURCE RESISTANCE
DS(on)
R
2
VGS, GATE VOLTAGE (V) ID, DRAIN CURRENT (A)
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
VGS = 10 V
= 40 A
I
D
50
TJ, JUNCTION TEMPERATURE (°C) VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 5. On−Resistance Variation with
Temperature
1.0
, DRAIN−TO−SOURCE RESISTANCE (mW)
109876543
0.5
DS(on)
R
VGS = 10 V
130110 1509070503010
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
100
TJ = 125°C
10
, LEAKAGE (mA)
1
DSS
I
175
15012510075250−25−50
0.1
TJ = 85°C
55453525155
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
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