Safety Controller for
Infra-Red LED Illumination
to Complement the Image
Sensor for Automotive
Applications
NCV7694
The NCV7694 is a device which can drive a string of infra−red
LEDs using an external mosfet. The IR LEDs are used to illuminate
the surroundings of the image sensor. Since these LEDs can damage
the end users’ eyes, the power feed to the LEDs needs to be turned off
during a fault condition.
The NCV7694 driver features prevents the IR LEDs from being on
too long due to an inappropriate exposure time or being turned on too
frequently using external resistors. The value of the R
defines the maximum T
value of the R
resistor defines the maximum frequency of the
FRL
time of the emitted light intensity and the
ON
FLASH signal from the image sensor.
A LED driver with hardware interlocks helps protect the users’ eyes
in cases where the control signal has failed or a fault in the LED power
path has occurred.
LED brightness level is easily programmed using an external
resistor in series with the mosfet transistor.
The device can also detect Open Load, Short Circuit to GND and
VS. Faults are reported to the DIAG pin, which can directly disable the
DC/DC converter to prevent possible damage.
The device is available in 10 pin DFN package.
Features
• Constant Current Output for LED String Drive
• FLASH Input Pin
• Open LED Diagnostic Detection
• Short LED to GND and VS Detection
• Safety Feature Prevent Being ON too long
• Safety Feature Prevent Being ON too frequently
• External Resistor Defining max ON time
• External Resistor Defining min OFF time
• Protection against Short to Ground and Open of the External Resistors
• Detection and Protection Against Under−Voltage and over
Temperature
• AEC−Q100 Qualified and PPAP Capable
• ASIL−A safety design, ISO26262 compliant
• 10 Pin Packaging
• Wettable Flank Package for Enhanced Optical Inspection
• These are Pb−Free Devices
Applications
• In−Cabin Monitoring Sensor
• Infrared Illumination for Automotive Cameras
• Machine Vision Systems
• Surveillance Systems
ETL
resistor
www.onsemi.com
1
DFNW10, 3x3, 0.5P
CASE 507AG
MARKING DIAGRAM
NV76
94−0
ALYW
S
NV7694−0= Specific Device Code
A= Assembly Location
L= Wafer Lot
Y= Year
W= Work Week
S= Pb−Free Package
PIN CONNECTIONS
1
VS
DIAG
FLASH
R
ETL
R
FRL
ORDERING INFORMATION
DevicePackageShipping
NCV7694MW0R2GDFN10
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Figure 1. Application Diagram − Powered Directly from Battery
V
BAT
C
SUPPLY
VDD_MCU
Micro−
controller /
DSP
GND
Supply for MCU and Image Sensor
Data
interface
VDD_AR
VDD_AR
Image Sensor
VDD_MCU
AR 0135
Diag detection
GND
exposure time
VDD_MCU
20k
FLASH
Define max
R2
FLASH
R3
R4
DIAG
R
ETL
R
FRL
Define max
frequency
VS
NCV7694
GND
EN
C1
DC /DC
NCV898031
VString
R
VSTR
DET
GATE
FB
EMC1
1 kW
R
EMC2
1 kW
R
EMC3
200 W
R
EMC4
750 W
Note1: 4x optional
EMC shield resistors
Note2: Optional Zener diode
for Mosfet Gate protection
NVTFS5C478NL
ZD
R1
Figure 2. Application Diagram − using DC/DC
RECOMMENDED EXTERNAL COMPONENTS FOR THE APPLICATION DIAGRAM
ComponentFunctionMinTypMaxUnit
C1Decoupling capacitor100nF
R1FB current sense resistor100
R2DIAG pull−up resistor20
R3Resistor for Exposure Time Limitation0.815
R4Resistor for Frame Rate Limitation0.815
REMC1Optional EMC shield resistor for VSTR pin1000
REMC2Optional EMC shield resistor for DET pin1000
REMC3Optional EMC shield resistor for GATE pin200
REMC4Optional EMC shield resistor for FB pin750
(Note 1) Optional EMC serial resistor shall be used in case
if the LEDs are detached far away from the NCV7694
device. The resistors improves the EMC susceptibility of the
application.
(Note 2) Optional Zener diode may be used if the VS
supply is higher than V
voltage of the external transistor.
GS
In case of Open Load on the LEDs, the GATE voltage will
go high, the Zener diode will limit the maximum voltage
Figure 1 shows an example of the typical output drive
configuration. The current through the external LEDs is
equal to
I
= VFB / R
LEDs
1
Where:
• V
is internal feedback reference = 300 mV
FB
• R
is feedback resistor which set the current
1
during eventual Open Load condition.
mW
kW
kW
kW
W
W
W
W
www.onsemi.com
2
Block Diagram
Exposure
Time Limit
FLASH
DIAG
R
ETL
VS
Supply
monitoring
R
FLASH
R
=
t
ETL
K
ETL
ETL
NCV7694
Controlling,
Monitoring,
Filtering &
decoding
SC
= V
th
str
Short Circuit
LED − Vstr
Short Circuit
LED − GND
V
SVth
1.22 V
− 1.22 V
V
SGth
R
350 mV
GATE
V
STRING
DETPull−up
R
DET
GATE
R
FRL
Frame Rate
Limit
t
f
RTL
FRL
R
=
K
= 1/ t
FRL
FRL
FRL
Open Load
GND
Figure 3. Simplified Block Diagram
FB
reference
V
FBref
300mV
V
FB
150 mV
OLth
www.onsemi.com
3
Timing Characteristics
e.g.: 45 Hz = 22 .2 ms period
NCV7694
FLASH
ET threhsold
Exposure Time
Counter
FR threshold
Frame Rate
Counter
Typical pulse
t
ETL
Too long pulse
Short pulseTypical pulse
Double frequency pulse
t
FRL
LED output
Typical pulseShort pulse
Figure 4. Simplified Internal Timing Characteristic of the Internal ETL, FRL Counter
Safety Feature Behavior
External Resistor Approach
The resistor (RETL, RFRL) creates bias voltage on the
pins. Internal oscillator speed is derived from value of the
resistors. While FLASH signal is high, internal ETL counter
is counting and when the threshold is exceeded, the output
is disabled. When FLASH pin is low, the Frame Rate timer
is starting to count. The next rising edge of the FLASH
signal is propagated to the output only if FRL timer expires.
Rest of the pulse
is cut−OFF because “ET”
counter exceed the
threshold
The period of the internals counters can be adjusted by
external resistors.
Total tolerance of the maximum T
Rate limits will be affected by internal accuracy and
accuracy of the external resistor by following equation:
Using 1% external resistor approximately 13% tolerance
can be achieved.
a
TOTAL
Driver is activated with
next rising edge of
FLASH pulse
2
Ǹ
+ a
device
) a
2
+ 13.02) 1
resistor
Second pulse is cut off
because “FR” counter is
not reach the threshold
or maximum Frame
ON
Ǹ
2
+ 13.04 %
www.onsemi.com
4
NCV7694
PIN FUNCTION DESCRIPTION
10−pin DFN10
Package
Pin #LabelDescription
1VSSupply voltage of the device
2DIAGDiagnostic output
3FLASHLogic input for flash exposure time
4R
5R
ETL
FRL
6GNDGround
7FBFeedback reference input 300 mV.
8GATEGate drive for external mosfet
9DETLED short detection input
10V
STRING
MAXIMUM RATINGS
Symbol Parameter Min. Max. Unit
Vmax_VSContinuous supply voltage
Vmax_FLASHLow Voltage Input pin−0.3+3.6V
Vmax_GATEOutput voltage (during Open Load condition)−0.3+VSV
Vmax_R
ETL
, R
FRL
Vmax_FBLow Voltage Input pin−0.3+3.6V
Vmax_DIAGOpen Drain pin−0.3+40V
Vmax_DET,
V
STRING
TjmaxJunction Temperature, T
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not
implied, damage may occur and reliability may be affected.
Transient Voltage (t < 500 ms, “load dump”)
DC voltage on Resistors−0.3+3.6V
High Voltage Input pin−0.3+40V
External resistor defines maximum Exposure Time Limit
External resistor defines maximum Frame Rate Limit
Short circuit reference voltage
−0.3
−
J
−40+125
+40
+40
V
V
°C
ATTRIBUTES
ParameerValueUnit
ESD Capability (Note 2)
HBM (Human Body Model)
CDM (Charge Device Model)
MM (Machine Model)
≥ ±4.0
≥ ±1.0
≥ ±200
kV
kV
V
Moisture Sensitivity (DFN10−EP) (Note 3)1MSL
Storage Temperature Range−40 to 150°C
Package Thermal Resistance (DFN10−EP) (Note 4)
− Junction to Ambient, R
− Junction to Board, R
− Junction to Case (Top), R
q
q
JB
JA
q
JC
62.5
5.5
2.7
°C/W
°C/W
°C/W
Ambient Temperature−40 to 105°C
2. This device series incorporates ESD protection and is tested by the following methods:
ESD HBM tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD CDM tested per EIA/JES D22/C101, Field Induced Charge Model
ESD MM according to AEC−Q100
3. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D,
and Application Note AND8003/D.
4. Values represent thermal resistances under natural convection are obtained in a simulation on a JEDEC−standard, 2S2P; High Effective
Thermal Conductivity Test Board as specified in JESD51−7, in an environment described in JESD51−2a.