ON Semiconductor NCV7693 User Manual

Controller for Automotive
LED Lamps

NCV7693

The NCV7693 is a device which drives multiple external switching
components for 3 independent functions. The average current in each
LED string can be regulated with a proper choice of duty−cycle and
battery voltage. The target application for this device is automotive
rear combination lamps. Each individual driver has its own diagnostic
to detect open load, short circuit to ground or to battery.

LED average brightness levels are easily programmed using
appropriate duty cycle control and external resistors in series with the
switching transistors.

Multiple strings of LEDs can be operated with a single NCV7693
device. The device is available in a TSSOP−14 package.

Features

• 3x Pulse Width Modulation (PWM) Control

• Independent Diagnostic Feedback per Function

• External Switching Device for Wide Current Range Flexibility

• External Resistors Define Maximum Current

• Open LED String Diagnostic

• Short−Circuit LED String Diagnostic

• Thermal Shut−down Diagnostic and Protection

• Protection against Short−Circuit on the PWM Input Pins

• Multiple LED String Control

• TSSOP−14 Package

• AEC−Q100 Qualified and PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Applications

• Rear Combination Lamps (RCL)

• Daytime Running Lights (DRL)

• Fog Lights

• Center High Mounted Stop Lamps (CHMSL) Arrays

• Turn Signal and Other Externally Modulated Applications

• General Automotive LED Driver

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14

1

TSSOP−14 WB

CASE 948G

MARKING DIAGRAM

14

NCV
7693

ALYWG

G

1

A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION

Device Package Shipping

NCV7693DB0R2G TSSOP−14

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.

2500 /

Tape & Reel

†

© Semiconductor Components Industries, LLC, 2017

December, 2019 − Rev. 1

1 Publication Order Number:

NCV7693/D

VSupply

NCV7693

PWM 1

PWM 2

PWM 3

VS

FB1

SW1

IO1

IO2

FB2

SW2

IO3

n.c.

FB3

SW3

TSTEN

n.c.

GND

Figure 1. Application Diagram

R1

R2

R3

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NCV7693

VS

VS

IOx

PIN FUNCTION DESCRIPTION

TSSOP−14 Package

Pin #

1 VS Automotive Battery input voltage

2 IO1 Logic input1 for output SW1 on / off control and diagnostic feedback. Pull high for output on.

3 IO2 Logic input2 for output SW2 on / off control and diagnostic feedback. Pull high for output on.

4 IO3 Logic input3 for output SW3 on / off control and diagnostic feedback. Pull high for output on.

5 NC Not connected

6 TSTEN Pin used for test purpose only, has to be connected to GND pin during the normal

7 NC Not connected

8 GND Ground

9 SW3 Switch Driver 3 for external transistor

10 FB3 Feedback pin for error detection on SW3

11 SW2 Switch Driver 2 for external transistor

12 FB2 Feedback pin for error detection on SW2

13 SW1 Switch Driver 1 for external transistor

14 FB1 Feedback pin for error detection on SW1

Label Description

Supply

Monitoring

Thermal

Monitoring

Protection

3.15V

7mA

operation.

OL

Error

Monitoring

Filtering

& decoding

SC _GND

SC _VS

Slew Rate

Control

Reference
Voltages
and Currents

Figure 2. Block Diagram

+

+

+

Refx

−

−

−

5.5V

FBx

Ref 1

Ref 2

Ref 3

SWx

GND

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MAXIMUM RATINGS

(Voltages are with respect to GND, unless otherwise specified)

NCV7693

Rating

Value Unit

Supply Voltage (VS)

DC
Peak Transient

−0.3 to 50
50

V
V

High Voltage Input−Output Pins (IO1, IO2, IO3) −40 to 50 V

High Voltage Input Pins (FB1, FB2, FB3) −0.3 to 50 V

Low Voltage Pins (SW1, SW2, SW3) −0.3 to 6.5 V

Junction Temperature, T

J

−40 to 150 °C

Peak Reflow Soldering Temperature: Pb−Free, 60 to 150 seconds at 217°C (Note 1) 260 peak °C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.

1. For additional information, please see or download the ON Semiconductor Soldering and Mounting Techniques Reference Manual,
SOLDERRM/D and Application Note AND8003/D.

ATTRIBUTES

Characteristic Value

ESD Capability

Human Body Model without any filter all Iox versus GND and VS versus GND
Charge Device Model

Moisture Sensitivity MSL2

Storage Temperature Range −55 to 150°C

Package Thermal Resistance − TSSOP−14 (Note 3)

Junction–to–Ambient, R
Junction–to–Case, R

q

JA

Y

JC

2. Minimum ±2 kV HBM for all pin combinations.

3. Values represent typical still air steady−state thermal performance on 1 oz. copper FR4 PCB with 650 mm

±6.0 kV (Note 2)

≥ ±750 V

135°C/W

45°C/W

2

copper area.

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