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NCV4263-2C
User Manual
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ON Semiconductor NCV4263-2C User Manual

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NCV4263-2C
LDO Regulator - Enable,
Reset, Watchdog
200 mA
Features
• Output Voltage Option: 5 V
• Output Voltage Accuracy: ±2%
• Output Current up to 200 mA
• Very Low Dropout Voltage
• Enable Function (10 mA Max Quiescent Current when Disabled)
• Microprocessor Compatible Control Functions:
− Reset with Adjustable Threshold and Adjustable Power−on Delay
− Watchdog Function
• Wide Input Voltage Operation Range: up to 40 V
• Protection Features:
− Current Limitation
− Thermal Shutdown
− Reverse Output Current
• AEC−Q100 Grade 1 Qualified and PPAP Capable
• These are Pb−Free Devices
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MARKING
DIAGRAMS
8
8
1
14
1
(Note: Microdot may be in either location)
See detailed ordering and shipping information on page 12 of this data sheet.
SOIC−8 EP PD SUFFIX
CASE 751AC
14
SOIC−14
D SUFFIX
CASE 751A
A = Assembly Location L, WL = Wafer Lot Y = Year W, WW = Work Week G = Pb−Free Package
ORDERING INFORMATION
V632C5
ALYWX
1
NCV4263−2C50G
AWLYWWG
1
Typical Applications
• Body Control Module
• Instruments and Clusters
• Occupant Protection and Comfort
• Powertrain
V
in
100 nF
OFF
ON
*−optional if Reset function is needed
© Semiconductor Components Industries, LLC, 2015
September, 2019 − Rev. 1
V
C
in
NCV4263−2C
EN
Figure 1. Application Schematic
in
GND
V
out
RADJ
RO
WDI
D
C
out
22 mF
C
100 nF
D
RRO*
5.6 kW
V
DD
Microprocessor
RESET I/O
1 Publication Order Number:
NCV4263−2C/D
NCV4263−2C
V
EN
GND
V
in
VOLTAGE
REFERENCE
V
REF
SP
ENABLE
out
RO
WDI
RESET
SATURATION
PROTECTION
THERMAL
SHUTDOWN
SP
TSD
TSD
V
REF
GENERATOR
and
WATCHDOG
D
RADJ
Figure 2. Simplified Block Diagram
114
18
Vin
EN
RO
GND
SOIC−8 EP
Vout
WDI
RADJ
D
RO
NC
GND
GND GND
GND
D
RADJ
EN
Vin
GND
GND
Vout
WDI
SOIC−14
Figure 3. Pin Connections
(Top View)
PIN FUNCTION DESCRIPTION
Pin No.
SO−8 EP
1 13 V
2 14 EN Enable Input. Low level disables the chip. Connect to Vin if this function is not needed.
3 1 RO
4
5 6 D
6 7 RADJ
7 8 WDI
8 9 V
EPAD −
− 2 NC Not connected. No internally bonded.
Pin No.
SO−14
3, 4, 5,
10, 11, 12
Pin Name Description
in
Positive Power Supply. Connect ceramic capacitor to ground.
Reset Output; Open Collector connected to the V leave open if the function is not needed
via an internal 30 kW pull−up resistor;
out
GND Power Supply Ground. Connect pins to heat sink area with GND potential.
DelayTiming. Connect to GND via ceramic capacitor for adjusting reset delay timing and watchdog trigger time or leave open if this function is not needed.
Reset Adjust Threshold. Connect to GND (VRT = 93% of V adjust the reset threshold.
) or to output voltage divider to
out
Watchdog Input. Rising edge triggered Input for watchdog pulses. Connect to GND if this function is not needed.
out
Exposed
Pad
Regulated Output Voltage. Connect a C
Connect to ground potential or leave unconnected.
≥ 22 mF capacitor to ground.
out
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2
NCV4263−2C
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Min Max Unit
Input Voltage (Note 1) V
Enable Input V
Output Voltage V
Reset Output Voltage V
Watchdog Input Voltage V
Reset Adjust Threshold V
Delay Timing Output Voltage V
Maximum Junction Temperature T
Storage Temperature T
in
EN
out
RO
WDI
RADJ
D
J
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
ESD CAPABILITY (Note 2)
Rating Symbol Min Max Unit
ESD Capability, Human Body Model ESD
ESD Capability, Charged Device Model ESD
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010) ESD Charged Device Model tested per AEC−Q100−011 (EIA/JESD22−C101)
HBM
CDM
−42 45 V
−42 45 V
−1 7 V
−0.3 7 V
−0.3 7 V
−0.3 7 V
−0.3 7 V
−40 150 °C
−55 150 °C
− 2 kV
− 1 kV
LEAD SOLDERING TEMPERATURE AND MSL (Note 3)
Rating
Moisture Sensitivity Level
SOIC−14 SOIC−8 EP
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions
3. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
Symbol Min Max Unit
MSL
1 2
T
SLD
− 265 peak
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, SOIC−8 Exposed Pad (Note 4)
Thermal Resistance, Junction−to−Air (Note 5) Thermal Reference, Junction−to−Pad (Note 5)
Y
R
θJA
ψJPad
65.1
8.7
Thermal Characteristics, SOIC−14 (Note 4)
Thermal Resistance, Junction−to−Air (Note 5) Thermal Reference, Junction−to−Pin4 (Note 5)
4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
5. Values based on copper area of 645 mm
2
(or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
Y
R
θJA
ψJP4
94.8
18.3
OPERATING RANGES (Note 6)
Rating
Input Voltage V
Junction Temperature T
6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
Symbol Min Max Unit
in
J
5.5 40 V
−40 150 °C
−
°C
°C/W
°C/W
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3
NCV4263−2C
ELECTRICAL CHARACTERISTICS V
f
= 1 kHz. Min and Max values are valid for temperature range *40°C v TJ v 150°C unless otherwise noted and are guaranteed by
WDI
test design or statistical correlation. Typical values are referenced to T
Parameter
= 13.5 V, VEN = 5 V, Cin = 100 nF, C
in
= 25°C. (Notes 7 and 8)
J
Test Conditions Symbol Min Typ Max Unit
= 22 mF, ESR = 1.5 W, WDI = 5 V pulses,
out
REGULATOR OUTPUT
Output Voltage Accuracy
Line Regulation I
Load Regulation I
Dropout Voltage (Note 9) I
Vin = 6 V to 40 V, I
= 150 mA, Vin = 6 V to 28 V Reg
out
= 5 mA to 150 mA Reg
out
= 150 mA V
out
= 5 to 150 mA V
out
out
DO
line
load
4.90 5.0 5.10 V
−25 3 25 mV
−25 − 25 mV
− 300 500 mV
DISABLE AND QUIESCENT CURRENTS
Disable Current
Quiescent Current, Iq = Iin − I
out
VEN = 0 V,TJ < 125°C I
I
= 0 mA
out
I
= 150 mA
out
I
= 150 mA, Vin = 4.5 V
out
DIS
I
q
− 0.066 10
−
0.275
−
−
3
11.3
1.3 18 23
mA
mA
CURRENT LIMIT PROTECTION
Current Limit
= 0.96 x V
out
out_nom
I
LIM
200 418 500 mA
V
PSRR
Power Supply Ripple Rejection (Note 10)
f = 100 Hz, 0.5 V
p−p
PSRR − 80 − dB
ENABLE
Enable Input Threshold Voltage
Logic High Logic Low
V
w 0.9 x V
out
V
v 0.1 V
out
out_nom
V
Enable Input Current VEN = 5 V I
th(EN)
EN
−
0.8
2.0
1.74
5 10 25
3.5
−
V
mA
WATCHDOG INPUT
Watchdog Input Low Time
CD = 100 nF, V
Watchdog Trigger Time CD = 100 nF, V
> VRT, no WDI signal t
out
> VRT, no WDI signal t
out
WL
WTT
1 2 3.5 ms
16 20.8 27 ms
DELAY TIMING
Charge Current
VD = 1 V, no WDI signal I
Discharge Current VD = 1 V, no WDI signal I
Saturation Voltage V
< VRT, no WDI signal V
out
Switching Threshold
Upper Lower
D_charge
D_disch
D_sat
V
thH(D)
V
thL(D)
40 66.8 95
4.40 6.54 9.40
− 6 100 mV
1.45
0.2
1.70
0.34
2.05
0.55
mA
mA
V
RESET OUTPUT
V
Output Voltage Reset Threshold (Note 11)
Reset Adjust Threshold (70% of V
decreasing, V
out
out_nom
Reset Adjustment Range (Note 12) V
Reset Output Low Voltage IRO = 1 mA V
Reset Delay Time CD = 100 nF t
= 0 V V
RADJ
) v V
< (VRT) V
out
RT
th(RADJ)
RT_range
ROL
RD
90 93 96 % V
1.26 1.36 1.44 V
70 − 93 % V
− 0.01 0.4 V
1.3 2.6 4.1 ms
out
out
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product per­formance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
8. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at T cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
9. Measured when output voltage falls 100 mV below the regulated voltage at V
10.Values based on design and/or characterization.
= 13.5 V.
in
[TJ. Low duty
A
11.See APPLICATION INFORMATION section for Reset Threshold Adjustment
12.V
limits are guaranteed by VRT and V
RT_range
th(RADJ)
parameters.
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4
NCV4263−2C
ELECTRICAL CHARACTERISTICS V
f
= 1 kHz. Min and Max values are valid for temperature range *40°C v TJ v 150°C unless otherwise noted and are guaranteed by
WDI
test design or statistical correlation. Typical values are referenced to T
= 13.5 V, VEN = 5 V, Cin = 100 nF, C
in
= 25°C. (Notes 7 and 8)
J
= 22 mF, ESR = 1.5 W, WDI = 5 V pulses,
out
Parameter UnitMaxTypMinSymbolTest Conditions
RESET OUTPUT
Reset Reaction Time
CD = 100 nF t
RR
0.5 1.2 4
ms
THERMAL SHUTDOWN
Thermal Shutdown Temperature (Note 10)
I
= 1 mA T
out
SD
150 177 195 °C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product per­formance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
8. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at T cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
9. Measured when output voltage falls 100 mV below the regulated voltage at V
10.Values based on design and/or characterization.
= 13.5 V.
in
[TJ. Low duty
A
11.See APPLICATION INFORMATION section for Reset Threshold Adjustment
12.V
limits are guaranteed by VRT and V
RT_range
th(RADJ)
parameters.
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5
NCV4263−2C
TYPICAL CHARACTERISTICS
0.32
Vin = 13.5 V
= 0 mA
0.30
I
out
0.28
0.26
0.24
0.22
, QUIESCENT CURRENT (mA)
q
I
0.20 40 120 160
TJ, TEMPERATURE (°C) Vin, INPUT VOLTAGE (V)
Figure 4. Quiescent Current vs. Temperature Figure 5. Quiescent Current vs. Input Voltage
10
9
Vin = 13.5 V
= 25°C
T
8
J
7
6
5
4
3
2
, QUIESCENT CURRENT (mA)
q
I
1 0
I
, OUTPUT CURRENT (mA) TJ, TEMPERATURE (°C)
out
Figure 6. Quiescent Current vs. Output
Current
16
14
TJ = 25°C R
= 25 W
out
12
10
8
6
4
, QUIESCENT CURRENT (mA)
q
2
I
0
1401008060200−20−40
35302520151050
40
5.10
5.08
5.06
Vin = 13.5 V
= 5 mA
I
out
5.04
5.02
5.00
4.98
4.96
, OUTPUT VOLTAGE (V)
4.94
out
V
4.92
4.90
250200150100500
40 120 160
1401008060200−20−40
Figure 7. Output Voltage Accuracy
6
5
4
3
2
, OUTPUT VOLTAGE (V)
out
1
V
0
600
TJ = 150°C
TJ = 25°C R
= 25 W
out
500
400
300
200
, DROPOUT VOLTAGE (mV)
100
DO
V
TJ = 125°C
TJ = 25°C
TJ = −40°C
0
6543210
Vin, INPUT VOLTAGE (V) I
, OUTPUT CURRENT (mA)
out
Figure 8. Output Voltage vs. Input Voltage Figure 9. Dropout Voltage vs. Output Current
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6
250200150100500
NCV4263−2C
TYPICAL CHARACTERISTICS
600
I
= 150 mA
out
500
400
300
200
, DROPOUT VOLTAGE (mV)
100
DO
V
0
40 120 160
TJ, TEMPERATURE (°C) Vin, INPUT VOLTAGE (V)
Figure 10. Dropout Voltage vs. Temperature Figure 11. Output Current Limit vs. Input
550
500
450
400
350
300
250
, OUTPUT CURRENT LIMIT (mA)
200
LIM
I
150
Vin = 13.5 V
= 0.96 x V
V
out
out_nom
20 120 160
TJ, TEMPERATURE (°C) I
Figure 12. Output Current Limit vs.
Temperature
600
V
= 0.96 x V
out
out_nom
550
TJ = 25°C
500
450
TJ = 125°C
TJ = −40°C
400
350
, OUTPUT CURRENT LIMIT (mA)
LIM
I
300
1401008060200−20−40
TJ = 150°C
35302520151050
40
Voltage
100
Unstable Region
10
1
Vin = 13.5 V C
= 22 mF
out
T
= 25°C
J
ESR, OUTPUT CAPACITOR ESR (W)
0.1
0.01
1401008060400−20−40
Stable Region
, OUTPUT CURRENT (mA)
out
250200150100500
Figure 13. Output Capacitor ESR Stability
Region vs. Output Current
120
110
100
90
80
70
PSRR (dB)
60
50
40
30
Vin = 13.5 V DC + 0.5 Vpp AC C
= 22 mF, TA = 25°C
out
45
40
VEN = 13.5 V
35
30
25
Vin = 13.5 V
= 0 mA
I
out
20
50
I
= 1 mA
out
I
out
= 100 mA
100,00010,000100010010
, ENABLE INPUT CURRENT (mA)
EN
I
15
10
5 0
VEN = 5 V
VEN = 3.3 V
12040 60
FREQUENCY (Hz) TJ, TEMPERATURE (°C)
Figure 14. PSRR vs. Frequency Figure 15. Enable Input Current vs.
Temperature
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7
16014010080200−20−40
NCV4263−2C
TYPICAL CHARACTERISTICS
1.44
1.42
1.40
1.38
1.36
1.34
1.32
1.30
, RESET ADJUST THRESHOLD (V)V
1.28
1.26
th(RADJ)
V
Vin = 13.5 V
= 0.7 x V
V
out
40 120 160
TJ, TEMPERATURE (°C) V
Figure 16. Reset Adjust Threshold vs.
Temperature
1.8
1.6
Upper Threshold
1.4
1.2
1.0 Vin = 13.5 V
0.8
0.6
0.4
, RESET DELAY THRESHOLDS (V)
0.2
th(D)
0
Lower Threshold
20 100 160
TJ, TEMPERATURE (°C) TJ, TEMPERATURE (°C)
Figure 18. Delay Timing Switching Thresholds
vs. Temperature
out_nom
1.44
1.42
1.40
1.38
1.36
1.34
1.32
1.30
, RESET ADJUST THRESHOLD (V)
Vin = 13.5 V
= 25°C
T
J
1.28
1.26
1401008060200−20−40
th(RADJ)
V
, OUTPUT VOLTAGE (V)
out
5.04.54.03.53.02.52.0
Figure 17. Reset Adjust Threshold vs. Output
Voltage
80
70
Charge Current
60
50
, RESET DELAY
(disch)
40
30
Vin = 13.5 V
= 1 V
V
D
20
D(charge),
I
10
0
1401208060400−20−40
CHARGE / DISCHARGE CURRENT (mA)
Discharge Current
20 120 160
1401008060400−20−40
Figure 19. Reset Delay Charge / Discharge
Current vs. Temperature
27
26
25
24
23
22
21
20
19
18
, WATCHDOG TRIGGER TIME (ms)
17
WTT
t
16
40 120 160
TJ, TEMPERATURE (°C)
Figure 20. Watchdog Trigger Time vs.
Temperature
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Vin = 13.5 V
> V
V
out
RT
CD = 100 nF no WDI signal
1401008060200−20−40
8
V
NCV4263−2C
in
V
V
V
V
1 V
V
thH(D)
thL(D)
V
V
out
RT
D
RO
1 V
ROL
t
RD
Thermal
Shutdown
t
RD
Voltage Dip
Input
t
Under
Voltage
RR
Figure 21. Reset Operation Timing Diagram
Output
Voltage Spike
t < t
Overload
RR
t
t
t
t
V
WDI
V
D
V
thH(D)
V
thL(D)
V
RO
V
ROL
t
WTT
t
WL
t
WP
t
t
t
Figure 22. Watchdog Operation Timing Diagram
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NCV4263−2C
DEFINITIONS
General
All measurements are performed using short pulse low duty cycle techniques to maintain junction temperature as close as possible to ambient temperature.
Output Voltage
The output voltage parameter is defined for specific temperature, input voltage and output current values or specified over Line, Load and Temperature ranges.
Line Regulation
The change in output voltage for a change in input voltage measured for specific output current over operating ambient temperature range.
Load Regulation
The change in output voltage for a change in output current measured for specific input voltage over operating ambient temperature range.
Dropout Voltage
The input to output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. It is measured when the output drops 100 mV below its nominal value. The junction temperature, load current, and minimum input supply requirements affect the dropout level.
Quiescent and Disable Currents
Quiescent Current (Iq) is the difference between the input current (measured through the LDO input pin) and the output load current. If Enable pin is set to LOW the regulator reduces its internal bias and shuts off the output, this term is called the disable current (I
DIS
).
Current Limit and Short Circuit Current Limit
Current Limit is value of output current by which output voltage drops below 96% of its nominal value. It means that the device is capable to supply minimum 200 mA without sending Reset signal to microprocessor.
Short Circuit Current Limit is output current value measured with output of the regulator shorted to ground.
PSRR
Power Supply Rejection Ratio is defined as ratio of output voltage and input voltage ripple. It is measured in decibels (dB).
Line Transient Response
Typical output voltage overshoot and undershoot response when the input voltage is excited with a given slope.
Load Transient Response
Typical output voltage overshoot and undershoot response when the output current is excited with a given slope between low−load and high−load conditions.
Thermal Protection
Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 177°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating.
Maximum Package Power Dissipation
The power dissipation level is maximum allowed power dissipation for particular package or power dissipation at which the junction temperature reaches its maximum operating value, whichever is lower.
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10
NCV4263−2C
APPLICATIONS INFORMATION
The NCV4263−2C regulator is self−protected with internal thermal shutdown and internal current limit. Typical characteristics are shown in Figures 4 to 22.
Input Decoupling (Cin)
A ceramic or tantalum 0.1 mF capacitor is recommended and should be connected close to the NCV4263−2C package. Higher capacitance and lower ESR will improve the overall line and load transient response. If extremely fast input voltage transients are expected then appropriate input filter is recommended to use in order to decrease rising and/or falling edges below 50 V/ms for proper operation. The filter can be composed of several capacitors in parallel.
Output Decoupling (C
out
)
The NCV4263−2C is a stable component and requires a minimum Equivalent Series Resistance (ESR) for the output capacitor. Stability region of ESR versus Output Current is shown in Figure 13. The minimum output decoupling value is 22 mF and can be augmented to fulfill stringent load transient requirements. Larger values improve noise rejection and load transient response.
Enable Operation
The Enable pin will turn the regulator on or off. The threshold limits are covered in the electrical characteristics table in this data sheet.
Delay Timing
The Delay Timing pin is current source. Current from Delay Timing pin charges connected capacitor. The value of this capacitor determines the Reset Delay Time by Equation 1 and Watchdog Trigger Time by Equation 4.
t
CD+
ǒ
RD_des
t
RD
Ǔ
100 nF
(eq. 1)
where: C
D
t
RD_des
t
RD
is capacitance of Delay capacitor is desired Reset Delay Time is Reset Delay Time specified in datasheet
Reset Operation
A reset signal is provided on the Reset Output pin to provide feedback to the microprocessor of an out of regulation condition. The timing diagram of reset function is shown in Figure 21. This is in the form of a logic signal on Reset Output. Output voltage conditions below the Reset Threshold causes Reset Output to go low. The Reset Output integrity is maintained down to V
= 1.0 V. The Reset
out
Output circuitry is open collector output with internal 30 kW pull−up resistor. Leave open this output if the Reset function is not needed else an external pull−up resistor (5.6 kW) connect to the output (V
out
).
Reset Threshold is default set to 93% of nominal Output Voltage (V
= 0 V). Reset Threshold can be varied in
RADJ
range of Output Voltage 70% ≤ V
< VRT by external
out
resistor output voltage divider, see schematic on Figure 23 and specification of Reset Output.
V
V
in
C
in
100 nF
NCV4263−2C
OFF
ON
Figure 23. Application Schematic with Adjustable
EN
out
C
22 mF
RADJ
RO
WDI
D
GND
Reset Threshold
out
C
D
100 nF
R
RADJ1
R
RADJ2
R
RO
5.6 kW
V
DD
Microprocessor
RESET
I/O
Desired Reset Threshold is given by Equation 2.
V
RT_des
+
R
ǒ
RADJ1
R
) R
RADJ2
RADJ2
Ǔ
V
th(RADJ)
(eq. 2)
where: V
RT_ des
R
RADJ1
V
th(RADJ)
, R
is desired Reset Threshold are resistance of resistor divider
RADJ2
is Reset Adjust Threshold specified in datasheet
Use R
≤ 50 kW to avoid significant Reset Threshold
RADJ2
error due to RADJ bias current.
Watchdog Operation
Watchdog Input monitors a signal from microprocessor. This input is positive edge sensitive. The timing diagram of watchdog function is shown in Figure 22. When watchdog signal is not received during Watchdog Trigger Time, Reset Output goes low for a Watchdog Input Low Time and is periodically generated with period given by Equation 3. Capacitance of Delay capacitor for setting the desired Watchdog Trigger Time is given by Equation 4.
tWP+ tWL) t
ǒ
CD+
t
WTT_des
t
WTT
WTT
Ǔ
100 nF
(eq. 3)
(eq. 4)
where: C
D
t
WTT_des
t
WTT
is capacitance of Delay capacitor is desired Watchdog Trigger Time is Watchdog Trigger Time specified in datasheet
t
WL
t
WP
Thermal Considerations
is Watchdog Input Low Time is Watchdog Input Period
As power in the NCV4263−2C increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent
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11
NCV4263−2C
upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. When the NCV4263−2C has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power applications. The maximum dissipation the NCV4263−2C can handle is given by:
P
D(MAX)
+
ƪ
T
J(MAX)
R
qJA
* T
ƫ
A
(eq. 5)
Since TJ is not recommended to exceed 150°C, then the
NCV4263−2C soldered on 645 mm
2
, 1 oz copper area, FR4 can dissipate up to 1.3 W in SOIC−14 package and 1.9 W in SOIC−8 EP package, when the ambient temperature (T 25°C. See Figures 24 and 25 for R
versus PCB area. The
JA
q
) is
A
power dissipated by the NCV4263−2C can be calculated from the following equations:
PD[ V
in
ǒ
Iq@I
out
ǒ
Ǔ
) I
Vin* V
out
out
Ǔ
(eq. 6)
or
I
out
Ǔ
(eq. 7)
Hints
V
in(MAX)
[
P
D(MAX)
)ǒV
I
out
) I
out
q
Vin and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the NCV4263−2C and make traces as short as possible.
160
150
140
130
120
110
100
90
80
70
, THERMAL RESISTANCE (°C/W)
JA
60
q
R
50
SOIC−14 − 1 OZ Cu
SOIC−14 − 2 OZ Cu
300 600
COPPER HEAT SPREADER AREA (mm2)
7005004002001000
Figure 24. Thermal Resistance vs. PCB Copper Area
for SOIC−14
160
150
140
130
120
110
100
90
80
70
, THERMAL RESISTANCE (°C/W)
JA
60
q
R
50
SOIC−8 EP − 1 OZ Cu
SOIC−8 EP − 2 OZ Cu
300 600
COPPER HEAT SPREADER AREA (mm2)
7005004002001000
Figure 25. Thermal Resistance vs. PCB Copper Area
for SOIC−8 EP
ORDERING INFORMATION
Device Output Voltage Marking Package Shipping
NCV4263−2CD250R2G 5.0 V NCV4263−2C50G SOIC−14
(Pb−Free)
NCV4263−2CPD50R2G 5.0 V V632C5 SOIC−8 EP
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
2500 / Tape & Reel
2500 / Tape & Reel
†
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12
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
14
1
SCALE 1:1
SOIC−14 NB
CASE 751A−03
ISSUE L
DATE 03 FEB 2016
14
H
M
0.25 B
0.10
14X
0.58
D
M
13X
e
SOLDERING FOOTPRINT*
6.50
1
A B
8
E
71
b
M
0.25 B
S
A
C
A
A1
SEATING
C
PLANE
14X
1.18
S
1.27 PITCH
DETAIL A
h
X 45
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
A3
L
DETAIL A
M
PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
DIM MIN MAX MIN MAX
A 1.35 1.75 0.054 0.068 A1 0.10 0.25 0.004 0.010 A3 0.19 0.25 0.008 0.010
b 0.35 0.49 0.014 0.019
D 8.55 8.75 0.337 0.344
E 3.80 4.00 0.150 0.157
e 1.27 BSC 0.050 BSC
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.019
L 0.40 1.25 0.016 0.049
M 0 7 0 7
__ __
INCHESMILLIMETERS
GENERIC
MARKING DIAGRAM*
14
XXXXXXXXXG
AWLYWW
1
XXXXX = Specific Device Code A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week G = Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present.
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
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SOIC−14
CASE 751A−03
ISSUE L
DATE 03 FEB 2016
STYLE 1:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. NO CONNECTION
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. NO CONNECTION
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 5:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. NO CONNECTION
7. COMMON ANODE
8. COMMON CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 2:
CANCELLED
STYLE 6:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. ANODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
STYLE 3:
PIN 1. NO CONNECTION
2. ANODE
3. ANODE
4. NO CONNECTION
5. ANODE
6. NO CONNECTION
7. ANODE
8. ANODE
9. ANODE
10. NO CONNECTION
11. ANODE
12. ANODE
13. NO CONNECTION
14. COMMON CATHODE
STYLE 7:
PIN 1. ANODE/CATHODE
2. COMMON ANODE
3. COMMON CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. ANODE/CATHODE
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. COMMON CATHODE
12. COMMON ANODE
13. ANODE/CATHODE
14. ANODE/CATHODE
STYLE 4:
PIN 1. NO CONNECTION
2. CATHODE
3. CATHODE
4. NO CONNECTION
5. CATHODE
6. NO CONNECTION
7. CATHODE
8. CATHODE
9. CATHODE
10. NO CONNECTION
11. CATHODE
12. CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 8:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. ANODE/CATHODE
7. COMMON ANODE
8. COMMON ANODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. NO CONNECTION
12. ANODE/CATHODE
13. ANODE/CATHODE
14. COMMON CATHODE
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
8
1
SCALE 1:1
SOIC−8 EP
CASE 751AC
ISSUE D
DATE 02 APR 2019
GENERIC
MARKING DIAGRAM*
8
XXXXX
AYWWG
G
1
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2018
XXXXXX = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package
98AON14029D
SOIC−8 EP
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
*This information is generic. Please refer to
device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present and may be in either location. Some products may not follow the Generic Marking.
PAGE 1 OF 1
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ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
. ON Semiconductor reserves the right to make changes without further notice to any products herein.
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