3.4 A, Step−Up/Down/
Inverting 50−300 kHz
Switching Regulator
The NCP3163 Series is a performance enhancement to the popular
MC33163 and MC34163 monolithic DC−DC converters. These
devices consist of an internal temperature compensated reference,
comparator, controlled duty cycle oscillator with an active current
limit circuit, driver and high current output switch. This controller was
specifically designed to be incorporated in step−down, step−up, or
voltage−inverting applications with a minimum number of external
components. The NCP3163 comes in an exposed pad package which
can greatly increase the power dissipation of the built in power switch.
Features
• Output Switch Current in Excess of 3.0 A
• 3.4 A Peak Switch Current
• Frequency is Adjustable from 50 kHz to 300 kHz
• Operation from 2.5 V to 40 V Input
• Externally Adjustable Operating Frequency
• Precision 2% Reference for Accurate Output Voltage Control
• Driver with Bootstrap Capability for Increased Efficiency
• Cycle−by−Cycle Current Limiting
• Internal Thermal Shutdown Protection
• Low Voltage Indicator Output for Direct Microprocessor Interface
• Exposed Pad Power Package
• Low Standby Current
• NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
• These are Pb−Free Devices
Current
8
V
in
7
+
V
C
in
CC
6
Oscillator
Limit
−
+
9
10
11
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MARKING
DIAGRAMS
16
1
SOIC−16W
EXPOSED PAD
PW SUFFIX
CASE 751AG
18
1
NCx3163x = Specific Device Code
A= Assembly Location
WL= Wafer Lot
YY= Year
WW= Work Week
G or G= Pb−Free Package
(Note: Microdot may be in either location)
18−LEAD DFN
MN SUFFIX
CASE 505
16
NCx3163yPW
AWLYYWWG
1
11
NCP3163y
AWLYYWW G
G
x = P or V
y = blank or B
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 18 of this data sheet.
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
NCP3163/D
NCP3163, NCV3163
Thermal
+
+
−
Current
Limit
−
+
45 k
+
+
−
1.25 V
1.125 V
(Bottom View)
R
Q
S
Latch
V
CC
2.0 mA
Feedback
Comparator
15 k
9
Driver Collector
10
Switch Collector
11
Q1
Q2
12
60
13
14
Switch Emitter
15
7.0 V
V
CC
16
Bootstrap Input
+
= Sink Only
−
Positive True Logic
Shutdown
I
PKsense
R
SC
V
CC
Timing Capacitor
C
T
R
DT
Gnd
Voltage Feedback 1
Voltage Feedback 2
LVI Output
0.25 V
8
7
V
CC
6
Oscillator
5
4
3
2
1
LVI
Figure 2. Representative Block Diagram
PIN FUNCTION DESCRIPTION
SOIC16DFN18PIN NAMEDESCRIPTION
115LVI OutputThis pin will sink current when FB1 and FB2 are less than the LVI threshold (Vth).
216Voltage Feedback 2Connecting this pin to a resistor divider off of the output will regulate the application
317Voltage Feedback 1Connecting this pin directly to the output will regulate the device to 5.05 V.
418GNDGround pin for all internal circuits and power switch.
61Timing CapacitorConnect a capacitor to this pin to set the frequency. The addition of a parallel resis-
1614Bootstrap InputConnect this pin to VCC for operation at low VCC levels. For some topologies, a
5,12,132No ConnectThese pins have no connection.
Exposed
Pad
Exposed
Pad
Exposed PadThe exposed pad beneath the package must be connected to GND (pin 4). Addi-
according to the V
design equation in Figure 22.
out
tor will decrease the maximum duty cycle and increase the frequency.
Power pin for the IC.
) > 250 mV the circuit resets the output driver on a pulse by
pulse basis.
IPKsense
series resistor and capacitor can be utilized to improve the converter efficiency.
tionally, using proper layout techniques, the exposed pad can greatly enhance the
power dissipation capabilities of the NCP3163.
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2
NCP3163, NCV3163
MAXIMUM RATINGS (Note 1)
Rating
Power Supply VoltageV
Switch Collector Voltage RangeV
Switch Emitter Voltage RangeV
Switch Collector to Emitter VoltageV
Switch CurrentI
Driver Collector Voltage (Pin 8)V
Driver Collector Current (Pin 8)I
Bootstrap Input Current RangeI
Current Sense Input Voltage RangeV
Feedback and Timing Capacitor Input Voltage RangeV
Low Voltage Indicator Output Voltage RangeV
Low Voltage Indicator Output Sink CurrentI
Power Dissipation and Thermal Characteristics
Thermal Characteristics
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Air
Storage Temperature RangeT
Maximum Junction TemperatureT
Operating Ambient Temperature (Note 3)
NCP3163PW
NCP3163BPW
NCV3163PW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 1500 V per MIL−STD−883, Method 3015.
Machine Model Method 150 V.
2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78.
3. Maximum package power dissipation limits must be observed. Maximum Junction Temperature must not be exceeded.
4. The pins which are not defined may not be loaded by external signals.
−55−250255075100125
TA, AMBIENT TEMPERATURE (°C)
Figure 14. Current Limit Comparator Threshold
Voltage vs. Temperature
8.0
6.0
4.0
1.6
μ
1.4
1.2
1.0
INPUT BIAS CURRENT ( A)
,
0.8
IB (Sense)
I
0.6
−55−250255075100125
TA, AMBIENT TEMPERATURE (°C)
VCC = 15 V
V
Ipk (Sense)
= 15 V
Figure 15. Current Limit Comparator Input Bias
Current vs. Temperature
7.2
VCC = 15 V
Pins 7, 8, 16 = V
6.4
5.6
Pins 4, 6, 14 = GND
Remaining Pins Open
CC
, SUPPLY CURRENT (mA)
2.0
CC
I
0
0 10203040
VCC, SUPPLY VOLTAGE (V)
Pins 7, 8, 16 = V
Pins 4, 6, 14 = GND
Remaining Pins Open
TA = 25°C
CC
Figure 16. Standby Supply Current
vs. Supply Voltage
3.0
2.6
2.2
1.8
1.4
, MINIMUM OPERATING SUPPLY VOLTAGE (V)
1.0
CC(min)
V
Pin 16 Open
Pin 16 = V
−55−250255075100125
CC
TA, AMBIENT TEMPERATURE (°C)
Figure 18. Minimum Operating Supply
Voltage vs. Temperature
, SUPPLY CURRENT (mA)
4.8
CC
I
4.0
−55−250255075100125
CT = 620 pF
Pins 7,8 = V
Pins 4, 14 = GND
Pin 9 = 1.0 kW to 15 V
Pin 10 = 100 W to 15 V
CC
TA, AMBIENT TEMPERATURE (°C)
Figure 17. Standby Supply Current
vs. Temperature
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7
NCP3163, NCV3163
INTRODUCTION
The NCP3163 is a monolithic power switching regulator
optimized for DC−to−DC converter applications. The
combination of its features enables the system designer to
directly implement step−up, step−down, and voltage−
inverting converters with a minimum number of external
components. Potential applications include cost sensitive
consumer products as well as equipment for the automotive,
computer, and industrial markets. A representative block
diagram is shown in Figure 2.
OPERATING DESCRIPTION
The NCP3163 operates as a fixed on−time, variable
off−time voltage mode ripple regulator. In general, this
mode of operation is somewhat analogous to a capacitor
charge pump and does not require dominant pole loop
compensation for converter stability. The Typical Operating
Waveforms are shown in Figure 19. The output voltage
waveform shown is for a step−down converter with the
ripple and phasing exaggerated for clarity. During initial
converter startup, the feedback comparator senses that the
output voltage level is below nominal. This causes the
output switch to turn on and off at a frequency and duty cycle
controlled by the oscillator, thus pumping up the output filter
capacitor. When the output voltage level reaches nominal,
the feedback comparator sets the latch, immediately
terminating switch conduction. The feedback comparator
will inhibit the switch until the load current causes the output
voltage to fall below nominal. Under these conditions,
output switch conduction can be inhibited for a partial
oscillator cycle, a partial cycle plus a complete cycle,
multiple cycles, or a partial cycle plus multiple cycles.
Oscillator
The oscillator frequency and on−time of the output switch
are programmed by the value selected for timing capacitor
CT. Capacitor CT is charged and discharged by a 9 to 1 ratio
internal current source and sink, generating a negative going
sawtooth waveform at Pin 6. As CT charges, an internal
pulse is generated at the oscillator output. This pulse is
connected to the NOR gate center input, preventing output
switch conduction, and to the AND gate upper input,
allowing the latch to be reset if the comparator output is low .
Thus, the output switch is always disabled during ramp−up
and can be enabled by the comparator output only at the start
of ramp−down. The oscillator peak and valley thresholds are
1.25 V and 0.55 V, respectively, with a charge current of
225 mA and a discharge current of 25 mA, yielding a
maximum on−time duty cycle of 90%. A reduction of the
maximum duty cycle may be required for specific converter
configurations. This can be accomplished with the addition
of an external deadtime resistor (RDT) placed across CT. The
resistor increases the discharge current which reduces the
on−time of the output switch. The converter output can be
inhibited by clamping CT to ground with an external NPN
small−signal transistor. To calculate the frequency when
only CT is connected to Pin 6, use the equations found in
Figure 22. When RT is also used, the frequency and
maximum duty cycle can be calculated with the NCP3163
design tool found at www.onsemi.com.
Comparator Output
1.25 V
Timing Capacitor C
0.55 V
Oscillator Output
Output Switch
Nominal Output
Voltage Level
Output Voltage
1
0
T
t
1
0
On
Off
Figure 19. Typical Operating Waveforms
9t
StartupQuiescent Operation
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8
NCP3163, NCV3163
Feedback and Low Voltage Indicator Comparators
Output voltage control is established by the Feedback
comparator. The inverting i nput i s i nternally b iased a t 1 .25 V
and is not pinned out. The converter output voltage is
typically divided down with two external resistors and
monitored b y t he h igh i mpedance n oninverting i nput a t Pin 2.
The maximum i nput b ias c urrent i s ±0.4 mA, w hich c an c ause
an output voltage error t hat i s e qual to the p roduct o f t he i nput
bias current and the upper divider resistance value. For
applications that require 5.0 V, the converter output can be
directly c onnected t o t he n oninverti ng i nput a t P in 3 . T he h igh
impedance input, Pin 2, must be grounded to prevent noise
pickup. The internal resistor divider is set for a nominal
voltage of 5.05 V. The additional 50 mV compensates for a
1.0% voltage drop in the cable and connector from the
converter output to the load. The Feedback comparator’s
3
+
+
−
1.25 V
+
+
−
1.125 V
Low Voltage
Indicator Output
2
R
LVI
1
C
DLY
LVI
output state is controlled by the highest voltage applied to
either of the two noninverting inputs.
The Low V oltage Indicator (LVI) comparator is designed
for use as a reset controller in microprocessor−based
systems. The inverting input is internally biased at 1.125 V,
which sets the noninverting input thresholds to 90% of
nominal. The LVI comparator has 15 mV of hysteresis to
prevent erratic reset operation. The Open Collector output is
capable of sinking in excess of 6.0 mA (see Figure 13). An
external resistor (R
program a reset delaytime (t
below, where V
) and capacitor (C
LVI
DLY
is the microprocessor reset input
th(MPU)
DLY
) by the formula shown
)can be used to
threshold. Refer to Figure 20.
1
V
1 −
V
out
th(MPU)
V
out
Feedback
Comparator
(Bottom View)
t
DLY
= R
LVI
14
15
16
⋅ C
DLY
L
⋅ In
C
O
Ǔǒ
Figure 20. Partial Application Schematic Showing
Implementation of LVI Delay with R
Current Limit Comparator, Latch and Thermal
Shutdown
With a voltage mode ripple converter operating under
normal conditions, output switch conduction is initiated by
the oscillator and terminated by the Voltage Feedback
comparator. Abnormal operating conditions occur when the
converter output is overloaded or when feedback voltage
sensing is lost. Under these conditions, the Current Limit
comparator will protect the Output Switch.
The switch current is converted to a voltage by inserting
a fractional ohm resistor, RSC, in series with VCC and output
switch transistor Q2. The voltage drop across RSC is
monitored by the Current Sense comparator. If the voltage
drop exceeds 250 mV with respect to VCC, the comparator
will set the latch and terminate output switch conduction on
a cycle−by−cycle basis. This Comparator/Latch
configuration ensures that the Output Switch has only a
single on−time during a given oscillator cycle. The
calculation for a value of RSC is:
R
SC
0.25 V
+
Ipk(Switch)
Figures 14 and 15 show that the Current Sense comparator
threshold is tightly controlled over temperature and has a
typical input bias current of 1.0 mA. The propagation delay
from the comparator input to the Output Switch is typically
and C
LVI
DLY
200 ns. The parasitic inductance associated with RSC and the
circuit layout should be minimized. This will prevent
unwanted voltage spikes that may falsely trip the Current
Limit comparator.
Internal thermal shutdown circuitry is provided to protect
the IC in the event that the maximum junction temperature
is exceeded. When activated, typically at 170°C, the Latch
is forced into the “Set” state, disabling the Output Switch.
This feature is provided to prevent catastrophic failures from
accidental device overheating. It is not intended to be used
as a replacement for proper heatsinking.
Driver and Output Switch
To aid in system design flexibility and conversion
efficiency, the driver current source and collector, and
output switch collector and emitter are pinned out
separately. This allows the designer the option of driving the
output switch into saturation with a selected force gain or
driving it near saturation when connected as a Darlington.
The output switch has a typical current gain of 70 at 2.5 A
and is designed to switch a maximum of 40 V collector to
emitter, with up to 3.4 A peak collector current. The
minimum value for RSC is:
R
SC(min)
+
0.25 V
3.4 A
+ 0.0735 W
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9
NCP3163, NCV3163
When configured for step−down or voltage−inverting
applications (see application notes at the end of this
document) the inductor will forward bias the output rectifier
when the switch turns off. Rectifiers with a high forward
voltage drop or long turn−on delay time should not be used.
If the emitter is allowed to go sufficiently negative, collector
current will flow, causing additional device heating and
reduced conversion efficiency.
Figure 12 shows that by clamping the emitter to 0.5 V , the
collector current will be in the range 10 mA over
temperature. A 1N5822 or equivalent Schottky barrier
rectifier is recommended to fulfill these requirements.
A bootstrap input is provided to reduce the output switch
saturation voltage in step−down and voltage−inverting
converter applications. This input is connected through a
series resistor and capacitor to the switch emitter and is used
to raise the internal 2.0 mA bias current source above VCC.
An internal zener limits the bootstrap input voltage to V
CC
+7.0 V. The capacitor’s equivalent series resistance must
limit the zener current to less than 100 mA. An additional
series resistor may be required when using tantalum or other
Vias to 2nd Layer Metal
for Maximum Heat Sinking
low ESR capacitors. The equation below is used to calculate
a minimum value bootstrap capacitor based on a minimum
zener voltage and an upper limit current source.
C
B(min)
+ I
Dt
+ 4.0 mA
DV
t
on
4.0 V
+ 0.001 t
on
Parametric operation of the NCP3163 is guaranteed over
a supply voltage range of 2.5 V to 40 V. When operating
below 3.0 V, the Bootstrap Input should be connected to
VCC. Figure 18 shows that functional operation down to
1.7 V at room temperature is possible.
Package
The NCP3163 is contained in a heatsinkable 16−lead
plastic package in which the die is mounted on a special heat
tab copper alloy pad. This pad is designed to be soldered
directly to a GND connection on the printed circuit board to
improve thermal conduction. Since this pad directly
contacts the substrate of the die, it is important that this pad
be always soldered to GND, even if surface mount heat
sinking is not being used. Figure 21 shows recommended
layout techniques for this package.
Exposed Pad
0.175
0.188
0.145
Flare Metal for Maximum Heat Sinking
Figure 21. Layout Guidelines to Obtain Maximum
Package Power Dissipation
Minimum
Recommended
Exposed Copper
APPLICATIONS
Figures 23 through 30 show the simplicity and flexibility
of the NCP3163. Three main converter topologies are
demonstrated with actual test data shown below each of the
circuit diagrams. Figure 22 gives the relevant design
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equations for the key parameters. Additionally, a complete
application design aid for the NCP3163 can be found at
www.onsemi.com.
10
NCP3163, NCV3163
The following Converter Characteristics must be chosen:
CalculationStep−DownStep−UpVoltage−Inverting
(See Notes 1,2,3)
t
on
t
off
V
out
Vin* V
) V
sat
F
* V
out
V
out
) VF–V
Vin–V
in
sat
|V
| ) V
out
Vin* V
F
sat
t
on
C
T
I
L(avg)
I
pk (Switch)
R
SC
L
V
ripple(pp)
V
out
32.143 · 10
f
Vin* V
ǒ
DI
L
t
ǒ
ƒ
t
*6
I
L(avg)
I
pk (Switch)
1
ǒ
ƒ
8C
V
ref
t
on
t
off
on
) 1
off
* 20@ 10
I
out
)
0.25
* V
sat
DI
L
2
Ǔ
) (ESR)
O
R
2
ǒ
) 1
R
1
DI
Ǔ
2
*12
L
out
Ǔ
Ǔt
on
2
32.143 · 10
f
ǒ
ƒ
*6
I
out
I
L(avg)
I
pk (Switch)
Vin* V
ǒ
[
V
ref
t
on
t
off
t
on
) 1
t
off
* 20@ 10
t
on
ǒ
) 1
t
off
)
0.25
sat
DI
L
tonI
out
C
O
R
2
ǒ
) 1
R
1
DI
Ǔ
2
Ǔt
*12
Ǔ
L
on
Ǔ
32.143 · 10
f
ǒ
ƒ
*6
I
out
I
L(avg)
I
pk (Switch)
Vin* V
ǒ
[
V
ref
t
on
t
off
t
on
) 1
t
off
* 20@ 10
t
on
ǒ
) 1
t
off
)
0.25
sat
DI
L
tonI
out
C
O
R
2
ǒ
) 1
R
1
DI
Ǔt
Ǔ
*12
Ǔ
L
2
on
Ǔ
Vin −
Nominal operating input voltage.
V
−
Desired output voltage.
out
I
−
Desired output current.
out
DI
−
Desired peak−to−peak inductor ripple current. For maximum output current it is suggested that DIL be chosen to be less
L
than 10% of the average inductor current I
threshold set by RSC. If the design goal is to use a minimum inductance value, let DIL = 2(I
proportionally reduce converter output current capability.
p −
V
ripple(pp)
NOTES: 1. V
NOTES: 2. VF − Output rectifier forward voltage drop. Typical value for 1N5822 Schottky barrier rectifier is 0.5 V.
NOTES: 3. The calculated ton/t
NOTES: 3. operating input voltage.
Maximum output switch frequency.
−
Desired peak−to−peak output ripple voltage. For best performance the ripple voltage should be kept to a low value
since it will directly affect line and load regulation. Capacitor CO should be a low equivalent series resistance (ESR)
electrolytic designed for switching regulator applications.
− Saturation voltage of the output switch, refer to Figures 10 and 11.
sat
must not exceed the minimum guaranteed oscillator charge to discharge ratio of 8, at the minimum
off
. This will help prevent I
L(avg)
Figure 22. Design Equations
pk (Switch)
from reaching the current limit
L(avg)
). This will
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11
NCP3163, NCV3163
0.25 V
8
R
SC
V
in
R
T
7
C
in
C
T
6
V
CC
Oscillator
5
Thermal
4
3
R
1
R
2
+
+
1
2
LVI
−
Figure 23. Typical Buck Application Schematic
Value of Components
NameValue
L
D2 A, 40 V Schottky Rectifier
C
in
C
out
C
t
R
t
47 mH
47 mF, 35 V
100 mF, 10 V
270 pF ±10%
15 kW
−
+
45 k
1.125 V
Current
+
+
−
Limit
Latch
V
CC
Feedback
Comparator
15 k1.25 V
(Bottom View)
9
10
11
Q
1
Q
R
Q
S
2
12
60
13
14
15
D
2.0 mA
16
7.0 V
V
CC
R
C
B
B
L
V
C
O
out
NameValue
R
1
R
2
R
sc
C
b
R
b
15 kW
24.9 kW
80 mW, 1 W
4.7 nF
200 W
Test Results for V
= 3.3 V
out
TestConditionResults
Line RegulationVin = 8.0 V to 24 V, I
Load RegulationVin = 12 V, I
Output RippleVin = 12 V, I
EfficiencyV
Short Circuit Current
Test Results for V
= 5.05 V
out
= 12 V, I
in
V
= 12 V, RL = 0.1 W
in
= 0 to 2.5 A25 mV
out
= 0 to 2.5 A100 mVpp
out
= 2.5 A70.3%
out
TestConditionResults
Line RegulationVin = 10.2 V to 24 V, I
Load RegulationVin = 12 V, I
Output RippleVin = 12 V, I
EfficiencyV
Short Circuit Current
= 12 V, I
in
V
= 12 V, RL = 0.1 W
in
= 0 to 2.5 A28 mV
out
= 0 to 2.5 A150 mVpp
out
= 2.5 A75.5%
out
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12
= 2.5 A13 mV
out
= 2.5 A54 mV
out
3.1 A
3.1 A
NCP3163, NCV3163
Figure 24. Buck Layout
APPLICATION SPECIFIC CHARACTERISTICS
85
80
75
70
65
EFFICIENCY (%)
60
55
50
I
out
Figure 25. Efficiency vs. Output Current for the
Buck Demo Board at V
5.0 V Eff
3.3 V Eff
(A)
= 12 V, TA = 255C
in
2.52.01.51.00.50
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13
NCP3163, NCV3163
−
+
Thermal
Current
Limit
Q
1
R
Q
S
Q
60
Latch
V
CC
0.25 V
8
R
SC
V
in
R
T
7
+
C
in
C
T
6
V
CC
Oscillator
5
4
3
L
9
10
11
2
12
13
D
14
45 k
+
2
+
+
1
−
LVI
R
2
R
1
+
−
1.25 V
1.125 V
(Bottom View)
Feedback
Comparator
15 k
15
2.0 mA
7.0 V
V
CC
16
V
+
C
O
out
Figure 26. Typical Boost Application Schematic
Value of Components for V
out
= 24 V
NameValue
L
33 mH
D2 A, 40 V Schottky Rectifier
C
in
C
t
R
t
Test Results for V
330 mF, 35 V
270 pF ±10%
15 kW
= 24 V
out
TestConditionResults
Line RegulationVin = 10 V to 20 V, I
Load RegulationVin = 12 V, I
Output RippleVin = 12 V, I
EfficiencyV
Short Circuit Current
out
out
= 12 V, I
in
V
in
out
= 12 V, RL = 0.1 W
NameValue
R
1
R
2
C
out
R
sc
= 700 mA90 mV
out
42.2 kW
2.32 kW
330 mF, 25 V
80 mW, 1 W
= 0 to 700 mA80 mV
= 0 to 700 mA300 mVpp
= 700 mA83%
3.1 A
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14
NCP3163, NCV3163
Figure 27. Boost Demo Board Layout
86
84
82
80
78
EFFICIENCY (%)
76
74
I
(A)
out
Figure 28. Efficiency vs. Output Current for the
Boost Demo Board at V
= 12 V, TA = 255C
in
0.6
0.70.50.40.30.20.1
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15
NCP3163, NCV3163
−
+
Thermal
Current
Limit
9
10
11
Q
1
Q
R
Q
S
Latch
V
CC
2
12
60
13
14
0.25 V
R
V
in
R
T
8
SC
7
+
C
in
C
T
6
V
CC
Oscillator
5
4
3
45 k
+
2
+
+
1
−
LVI
R
1
R
2
+
−
1.125 V
(Bottom View)
Feedback
Comparator
15 k1.25 V
15
2.0 mA
7.0 V
V
CC
16
Figure 29. Typical Voltage Inverting Application Schematic
L
R
B
C
B
D
V
C
O
+
out
Value of Components for V
= −15 V
out
NameValue
L
47 mH
D2 A, 40 V Schottky Rectifier
C
in
C
out
C
t
Test Results for V
270 mF, 16 V
2 X 270 mF, 16 V
150 pF ±10%
= −15 V
out
TestConditionResults
Line RegulationVin = 7.0 V to 16 V, I
Load RegulationVin = 12 V, I
Output RippleVin = 12 V, I
EfficiencyV
Short Circuit Current
out
out
= 12 V, I
in
V
in
out
= 12 V, RL = 0.1 W
NameValue
R
1
R
2
R
sc
C
b
R
b
= 500 mA35 mV
out
1.07 kW
80 mW, 1 W
200 mW
= 0 to 500 mA20 mV
= 0 to 500 mA100 mVpp
= 500 mA68%
3.1 A
11.8 kW
4.7 nF
http://onsemi.com
16
NCP3163, NCV3163
Figure 30. Voltage Inverting Demo Board Layout
70
66
62
58
EFFICIENCY (%)
54
50
0.350.30.250.20.150.1
I
(A)
out
Figure 31. Efficiency vs. Output Current for the
Voltage Inverting Demo Board at V
= 12 V, TA = 255C
in
0.50.450.4
http://onsemi.com
17
NCP3163, NCV3163
ORDERING INFORMATION
DevicePackageShipping
NCP3163PWGSOIC−16 W Exposed Pad
NCP3163PWR2GSOIC−16 W Exposed Pad
NCP3163BPWGSOIC−16 W Exposed Pad
NCP3163BPWR2GSOIC−16 W Exposed Pad
NCP3163MNR2GDFN18
NCP3163BMNR2GDFN18
NCV3163PWGSOIC−16 W Exposed Pad
NCV3163PWR2GSOIC−16 W Exposed Pad
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
47 Units / Rail
1000 / Tape & Reel
47 Units / Rail
1000 / Tape & Reel
2500 / Tape & Reel
2500 / Tape & Reel
47 Units / Rail
1000 / Tape & Reel
†
http://onsemi.com
18
0.25 (0.010)W
M
PIN 1 I.D.
0.10 (0.004) T
SOIC 16 LEAD WIDE BODY, EXPOSED PAD
A
169
P
1
M
TOP SIDE
D16 PL
0.25 (0.010)T UW
H
−U−
8
G
14 PL
M
NCP3163, NCV3163
PACKAGE DIMENSIONS
PW SUFFIX
CASE 751AG−01
ISSUE O
B
−W−
C
K
SS
−T−
SEATING
PLANE
R x 45
_
DETAIL E
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
M
F
J
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL BE
0.13 (0.005) TOTAL IN EXCESS OF THE D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
C
L
Exposed
Pad
0.188
0.376
http://onsemi.com
19
NCP3163, NCV3163
PACKAGE DIMENSIONS
DFN18
CASE 505−01
ISSUE D
PIN 1 LOCATION
2X
2X
18X
18X
D
A
B
E
C0.15
C0.15
TOP VIEW
C0.10
(A3)
A
C0.08
SIDE VIEW
A1
C
SEATING
PLANE
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MINMAX
A0.801.00
A10.000.05
A30.20 REF
b0.180.30
D6.00 BSC
D23.984.28
E5.00 BSC
E22.983.28
e0.50 BSC
K0.20−−−
L0.450.65
SOLDERING FOOTPRINT*
D2
L
e
19
1
5.30
18X
0.75
0.50
K18X
1018
BOTTOM VIEW
E2
b18X
0.05 C
4.19
A0.10BC
NOTE 3
PITCH
18X
0.30
3.24
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867Toll Free USA/Canada
Email: orderlit@onsemi.com
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCP3163/D
20
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