ON Semiconductor NCP3163, NCV3163 Technical data

NCP3163, NCV3163
8
3.4 A, Step−Up/Down/ Inverting 50−300 kHz Switching Regulator
Features
Output Switch Current in Excess of 3.0 A
3.4 A Peak Switch Current
Frequency is Adjustable from 50 kHz to 300 kHz
Operation from 2.5 V to 40 V Input
Externally Adjustable Operating Frequency
Precision 2% Reference for Accurate Output Voltage Control
Driver with Bootstrap Capability for Increased Efficiency
Cycle−by−Cycle Current Limiting
Internal Thermal Shutdown Protection
Low Voltage Indicator Output for Direct Microprocessor Interface
Exposed Pad Power Package
Low Standby Current
NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
These are Pb−Free Devices
Current
8
V
in
7
+
V
C
in
CC
6
Oscillator
Limit
+
9
10
11
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MARKING
DIAGRAMS
16
1
SOIC−16W
EXPOSED PAD
PW SUFFIX
CASE 751AG
18
1
NCx3163x = Specific Device Code
A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G or G = Pb−Free Package
(Note: Microdot may be in either location)
18−LEAD DFN
MN SUFFIX
CASE 505
16
NCx3163yPW
AWLYYWWG
1
11
NCP3163y
AWLYYWW G
G
x = P or V y = blank or B
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 18 of this data sheet.
5
Thermal
4
3
2
LVI
+ +
1
+ +
R
S
V
CC
(Bottom View)
Figure 1. Typical Buck Application Circuit
© Semiconductor Components Industries, LLC, 2007
January, 2007 − Rev. 4
Q
V
CC
12
13
14
15
16
V
out
+
C
O
1 Publication Order Number:
*For additional information on our Pb−Free strategy
and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
NCP3163/D
NCP3163, NCV3163
Thermal
+ +
Current
Limit
+
45 k
+ +
1.25 V
1.125 V
(Bottom View)
R
Q
S
Latch
V
CC
2.0 mA
Feedback
Comparator
15 k
9
Driver Collector
10
Switch Collector
11
Q1
Q2
12
60
13
14
Switch Emitter
15
7.0 V
V
CC
16
Bootstrap Input
+
= Sink Only
Positive True Logic
Shutdown
I
PKsense
R
SC
V
CC
Timing Capacitor
C
T
R
DT
Gnd
Voltage Feedback 1
Voltage Feedback 2
LVI Output
0.25 V
8
7
V
CC
6
Oscillator
5
4
3
2
1
LVI
Figure 2. Representative Block Diagram
PIN FUNCTION DESCRIPTION
SOIC16 DFN18 PIN NAME DESCRIPTION
1 15 LVI Output This pin will sink current when FB1 and FB2 are less than the LVI threshold (Vth). 2 16 Voltage Feedback 2 Connecting this pin to a resistor divider off of the output will regulate the application
3 17 Voltage Feedback 1 Connecting this pin directly to the output will regulate the device to 5.05 V. 4 18 GND Ground pin for all internal circuits and power switch. 6 1 Timing Capacitor Connect a capacitor to this pin to set the frequency. The addition of a parallel resis-
7 3 V
CC
8 4 Ipk Sense When (VCC−V
9 5 Drive Collector Voltage driver collector 10,11 6,7,8,9 Switch Collector Internal switch transistor collector 14,15 10,11,12,13 Switch Emitter Internal switch transistor emitter
16 14 Bootstrap Input Connect this pin to VCC for operation at low VCC levels. For some topologies, a
5,12,13 2 No Connect These pins have no connection.
Exposed
Pad
Exposed
Pad
Exposed Pad The exposed pad beneath the package must be connected to GND (pin 4). Addi-
according to the V
design equation in Figure 22.
out
tor will decrease the maximum duty cycle and increase the frequency. Power pin for the IC.
) > 250 mV the circuit resets the output driver on a pulse by
pulse basis.
IPKsense
series resistor and capacitor can be utilized to improve the converter efficiency.
tionally, using proper layout techniques, the exposed pad can greatly enhance the power dissipation capabilities of the NCP3163.
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NCP3163, NCV3163
MAXIMUM RATINGS (Note 1)
Rating
Power Supply Voltage V Switch Collector Voltage Range V Switch Emitter Voltage Range V Switch Collector to Emitter Voltage V Switch Current I Driver Collector Voltage (Pin 8) V Driver Collector Current (Pin 8) I Bootstrap Input Current Range I Current Sense Input Voltage Range V Feedback and Timing Capacitor Input Voltage Range V Low Voltage Indicator Output Voltage Range V Low Voltage Indicator Output Sink Current I
Power Dissipation and Thermal Characteristics
Thermal Characteristics
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Air Storage Temperature Range T Maximum Junction Temperature T Operating Ambient Temperature (Note 3)
NCP3163PW
NCP3163BPW
NCV3163PW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. This device series contains ESD protection and exceeds the following tests: Human Body Model 1500 V per MIL−STD−883, Method 3015. Machine Model Method 150 V.
2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78.
3. Maximum package power dissipation limits must be observed. Maximum Junction Temperature must not be exceeded.
4. The pins which are not defined may not be loaded by external signals.
Symbol Value Unit
CC CSW ESW
CESW
SW
CC
CC
BST
IPKSNS
in
CLVI
CLVI
(VCC − 7.0) to (VCC + 1.0) V
0 to +40 V
−1.0 to +40 V
−2.0 to +40 V +40 V
3.4 A
−1.0 to +40 V 150 mA
−100 to +100 mA
−1.0 to +7.0 V
−1.0 to +40 V
10 mA
°C/W
R
R
Jmax
q
JC
q
JA
stg
T
A
15 56
−65 to +150 °C +150 °C
°C
0 to +70
−40 to +85
−40 to +125
LVI Output
Voltage Feedback 2
Voltage Feedback 1
GND
N/C
Timing Capacitor
V
Ipk Sense
PIN CONNECTIONS
116
2
3
4
5
6
7
CC
8
(Top View)
Bootstrap Input
15
14
13
12
11
10
9
Driver Collector
Switch Emitter
N/C
Switch Collector
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Timing Capacitor
Driver Collector Switch Collector Switch Collector Switch Collector Switch Collector
3
1
N/C
V
Ipk Sense
2 3
CC
4
GND
5 6 7
EP Flag
8 9
Note: Pin 18 must be tied to EP Flag on PCB
18
17 16 15 14 13 12 11 10
GND Voltage Feedback 1 Voltage Feedback 2
LVI Output Bootstrap Input Switch Emitter Switch Emitter Switch Emitter Switch Emitter
NCP3163, NCV3163
ELECTRICAL CHARACTERISTICS (V
values T
is the operating ambient temperature range that applies (Note 7), unless otherwise noted.)
A
Characteristic
= 15 V, Pin 16 = VCC, CT = 270 pF, RT = 15 kW, for typical values TA = 25°C, for min/max
CC
Symbol Min Typ Max Unit
OSCILLATOR
Frequency
T
= 25°C, VCC = 15 V
A
Total Variation over V
= 2.5 V to 40 V and Temperature
CC
Charge Current I Discharge Current I Charge to Discharge Current Ratio I Sawtooth Peak Voltage V Sawtooth Valley Voltage V
f
OSC
chg
dischg
chg/Idischg
OSC(P) OSC(V)
225 212
250 250
225
25
8.0 9.0 10.5
1.25 V
0.55 V
FEEDBACK COMPARATOR 1
Threshold Voltage
TA = 25°C Total Variation over VCC = 2.5 V to 40 V and Temperature
Threshold Voltage
Line Regulation (VCC = 2.5 V to 40 V, TA = 25°C)
Input Bias Current (V
= 5.05 V) I
FB1
V
th(FB1)
REGline
IB(FB1)
(FB1)
4.9
4.85
5.05
0.008 0.03
100 200
5.25
FEEDBACK COMPARATOR 2
Threshold Voltage
TA = 25°C, VCC = 15 V Total Variation over VCC = 2.5 V to 40 V and Temperature
Threshold Voltage
Line Regulation (VCC = 2.5 V to 40 V, TA = 25°C)
Input Bias Current (V
= 1.25 V) I
FB2
V
th(FB2)
REGline
IB(FB2)
(FB1)
1.225
1.213
1.25
1.275
1.287
0.008 0.03
− 0.4 0.4
CURRENT LIMIT COMPARATOR
Threshold Voltage
TA = 25°C Total Variation over VCC = 2.5 V to 40 V, and Temperature
Input Bias Current (V
Ipk (Sense)
= 15 V) I
V
th(Sense)
IB(Sense)
225
250
1.0 20
DRIVER AND OUTPUT SWITCH (Note 6)
Saturation Voltage (ISW = 2.5 A, Pins 14, 15 grounded)
NCP3163 − Non−Darlington (R NCV3163 − Non−Darlington (R
= 110 W to VCC, ISW/I
Pin 9
= 110 W to VCC, ISW/I
Pin 9
DRV DRV
20) 20)
Darlington Connection (Pins 9, 10, 11 connected) Collector Off−State Leakage Current (VCE = 40 V) I Bootstrap Input Current Source (VBS = VCC + 5.0 V) I Bootstrap Input Zener Clamp Voltage (IZ = 25 mA) V
V
CE(sat)
C(off)
source(DRV)
Z
0.6
0.6
1.0
0.02 100
0.5 2.0 4.0 mA
VCC + 6.0 VCC + 7.0 VCC + 9.0 V
LOW VOLTAGE INDICATOR
Input Threshold (V Input Hysteresis (V Output Sink Saturation Voltage (I Output Off−State Leakage Current (VOH = 15 V) I
Increasing) V
FB2
Decreasing) V
FB2
= 2.0 mA) V
sink
th H
OL(LVI)
OH
1.07 1.125 1.18 V
15 mV
0.15 0.4 V
0.01 5.0
TOTAL DEVICE
Standby Supply Current (VCC = 2.5 V to 40 V, Pin 8 = VCC,
I
CC
6.0 10 mA
Pins 6, 14, 15 = GND, remaining pins open)
5. Maximum package power dissipation limits must be observed.
6. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
7. T
=0°C for NCP3163 T
low
=−40°C for NCP3163B = + 85°C for NCP3163B
=+70°C for NCP3163
high
=−40°C for NCV3163 = + 125°C for NCV3163
275
kHz
288
mA mA
V
5.2
%/V
mA
V
%/V
mA
mV
270
mA
V
1.0
1.2
1.4
mA
mA
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NCP3163, NCV3163
2.0
−2.0
300
250
200
150
FREQUENCY (kHz)
100
Rt = open
50
0
100 200 300 400 500 600 700
CT, TIMER CAPACITANCE (pF)
VCC = 15 V TA = 25°C
Rt = 15 kW
Figure 3. Oscillator Frequency vs. Timer
Capacitance (C
VCC = 15 V CT = 620 pF
0
4.0
2.0
−2.0
−4.0
)
T
VCC = 15 V CT = 230 pF RT = 20 kW
0
−4.0
, OSCILLATOR FREQUENCY CHANGE (%)Δ
−6.0
OSC
f
−55
−25 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C)
Figure 4. Oscillator Frequency Change vs.
Temperature when only C
140
120
100
80
, INPUT BIAS CURRENT (A)μ
IB
I
60
−55
−25 0 25 50 75 100 125
TA, AMBIENT TEMPERATURE (°C)
Figure 6. Feedback Comparator 1 Input Bias
Current vs. Temperature
is connected to Pin 6
T
VCC = 15 V V
= 5.05 V Vth Max = 1275 mV
FB1
−6.0
−8.0
, OSCILLATOR FREQUENCY CHANGE (%)Δ
−10
OSC
f
−50
−25 0 25 50 75 100 125 TEMPERATURE (°C)
Figure 5. Oscillator Frequency Change vs.
Temperature when C
1300
VCC = 15 V
1280
1260
1240
1220
1200
, COMPARATOR 2 THRESHOLD VOLTAGE (mV)
th(FB2)
V
−55
−25 0 25 50 75 100 125
Figure 7. Feedback Comparator 2 Threshold
and RT are connected to Pin 6
T
Vth Typ = 1250 mV
Vth Min = 1225 mV
TA, AMBIENT TEMPERATURE (°C)
Voltage vs. Temperature
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NCP3163, NCV3163
A
5
V
2.8
VCC = 15 V
2.4
2.0
1.6
, BOOTSTRAP INPUT CURRENT SOURCE (m
1.2
−55 −25 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C)
source (DRV)
I
−0.4
−0.8
−1.2
, SOURCE SATURATION (V)
−1.6
CE (sat)
V
−2.0
0
Figure 8. Bootstrap Input Current
Source vs. Temperature
V
CC
Bootstrapped, Pin 16 = VCC + 5.0 V
Non−Bootstrapped, Pin 16 = V
0 0.8 2.4 3.2
IE, EMITTER CURRENT (A)
Pin 16 = VCC + 5.0 V
Darlington Configuration Emitter Sourcing Current to GND Pins 7, 8, 10, 11 = V Pins 4, 5, 12, 13 = GND TA = 25°C, (Note 2)
CC
1.6
CC
Figure 10. Output Switch Source Saturation
vs. Emitter Current
7.6
IZ = 25 mA
7.4
7.2
7.0
6.8
−55 −25 0 25 50 75 100 12
, BOOTSTRAP INPUT ZENER CLAMP VOLTAGE (
Z
V
TA, AMBIENT TEMPERATURE (°C)
Figure 9. Bootstrap Input Zener Clamp
Voltage vs. Temperature
1.2
Darlington, Pins 9, 10, 11 Connected
1.0
0.8
Grounded Emitter Configuration Collector Sinking Current From V
0.6 Pins 7, 8 = VCC = 15 V
, SINK SATURATION (V)
CE (sat)
V
Pins 4, 5, 12, 13, 14, 15 = GND
0.4 TA = 25°C, (Note 2)
0.2
0
0 0.8 2.4 3.21.6
CC
Saturated Switch, R
GND
IC, COLLECTOR CURRENT (A)
= 110 W to V
Pin9
Figure 11. Output Switch Sink Saturation
vs. Collector Current
CC
0
GND
−0.4
−0.8
−1.2
, EMITTER VOLTAGE (V)
E
V
−1.6
−2.0
−55 −25 0 25 50 75 100 125
IC = 10 mA
IC = 10 mA
VCC = 15 V Pins 7, 8, 9, 10, 16 = V Pins 4, 6 = GND Pin 14 Driven Negative
TA, AMBIENT TEMPERATURE (°C)
Figure 12. Output Switch Negative Emitter
Voltage vs. Temperature
0.5
0.4
0.3
0.2
CC
, OUTPUT SATURATION VOLTAGE (V)
V
OL (LVI)
0.1
0
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VCC=5 V TA=25°C
0 2.0 4.0 6.0 8.0
I
, OUTPUT SINK CURRENT (mA)
sink
Figure 13. Low Voltage Indicator Output Sink
Saturation Voltage vs. Sink Current
NCP3163, NCV3163
254
VCC = 15 V
252
250
, THRESHOLD VOLTAGE (mV
248
th (Ipk Sense)
V
246
−55 −25 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C)
Figure 14. Current Limit Comparator Threshold
Voltage vs. Temperature
8.0
6.0
4.0
1.6
μ
1.4
1.2
1.0
INPUT BIAS CURRENT ( A) ,
0.8
IB (Sense)
I
0.6
−55 −25 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C)
VCC = 15 V V
Ipk (Sense)
= 15 V
Figure 15. Current Limit Comparator Input Bias
Current vs. Temperature
7.2 VCC = 15 V
Pins 7, 8, 16 = V
6.4
5.6
Pins 4, 6, 14 = GND Remaining Pins Open
CC
, SUPPLY CURRENT (mA)
2.0
CC
I
0
0 10203040
VCC, SUPPLY VOLTAGE (V)
Pins 7, 8, 16 = V Pins 4, 6, 14 = GND Remaining Pins Open TA = 25°C
CC
Figure 16. Standby Supply Current
vs. Supply Voltage
3.0
2.6
2.2
1.8
1.4
, MINIMUM OPERATING SUPPLY VOLTAGE (V)
1.0
CC(min)
V
Pin 16 Open
Pin 16 = V
−55 −25 0 25 50 75 100 125
CC
TA, AMBIENT TEMPERATURE (°C)
Figure 18. Minimum Operating Supply
Voltage vs. Temperature
, SUPPLY CURRENT (mA)
4.8
CC
I
4.0
−55 −25 0 25 50 75 100 125
CT = 620 pF Pins 7,8 = V Pins 4, 14 = GND Pin 9 = 1.0 kW to 15 V Pin 10 = 100 W to 15 V
CC
TA, AMBIENT TEMPERATURE (°C)
Figure 17. Standby Supply Current
vs. Temperature
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NCP3163, NCV3163
INTRODUCTION
The NCP3163 is a monolithic power switching regulator optimized for DC−to−DC converter applications. The combination of its features enables the system designer to directly implement step−up, step−down, and voltage− inverting converters with a minimum number of external components. Potential applications include cost sensitive consumer products as well as equipment for the automotive, computer, and industrial markets. A representative block diagram is shown in Figure 2.
OPERATING DESCRIPTION
The NCP3163 operates as a fixed on−time, variable off−time voltage mode ripple regulator. In general, this mode of operation is somewhat analogous to a capacitor charge pump and does not require dominant pole loop compensation for converter stability. The Typical Operating Waveforms are shown in Figure 19. The output voltage waveform shown is for a step−down converter with the ripple and phasing exaggerated for clarity. During initial converter startup, the feedback comparator senses that the output voltage level is below nominal. This causes the output switch to turn on and off at a frequency and duty cycle controlled by the oscillator, thus pumping up the output filter capacitor. When the output voltage level reaches nominal, the feedback comparator sets the latch, immediately terminating switch conduction. The feedback comparator will inhibit the switch until the load current causes the output voltage to fall below nominal. Under these conditions, output switch conduction can be inhibited for a partial
oscillator cycle, a partial cycle plus a complete cycle, multiple cycles, or a partial cycle plus multiple cycles.
Oscillator
The oscillator frequency and on−time of the output switch are programmed by the value selected for timing capacitor CT. Capacitor CT is charged and discharged by a 9 to 1 ratio internal current source and sink, generating a negative going sawtooth waveform at Pin 6. As CT charges, an internal pulse is generated at the oscillator output. This pulse is connected to the NOR gate center input, preventing output switch conduction, and to the AND gate upper input, allowing the latch to be reset if the comparator output is low . Thus, the output switch is always disabled during ramp−up and can be enabled by the comparator output only at the start of ramp−down. The oscillator peak and valley thresholds are
1.25 V and 0.55 V, respectively, with a charge current of 225 mA and a discharge current of 25 mA, yielding a maximum on−time duty cycle of 90%. A reduction of the maximum duty cycle may be required for specific converter configurations. This can be accomplished with the addition of an external deadtime resistor (RDT) placed across CT. The resistor increases the discharge current which reduces the on−time of the output switch. The converter output can be inhibited by clamping CT to ground with an external NPN small−signal transistor. To calculate the frequency when only CT is connected to Pin 6, use the equations found in Figure 22. When RT is also used, the frequency and maximum duty cycle can be calculated with the NCP3163 design tool found at www.onsemi.com.
Comparator Output
1.25 V
Timing Capacitor C
0.55 V
Oscillator Output
Output Switch
Nominal Output
Voltage Level
Output Voltage
1
0
T
t
1
0
On
Off
Figure 19. Typical Operating Waveforms
9t
Startup Quiescent Operation
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NCP3163, NCV3163
Feedback and Low Voltage Indicator Comparators
Output voltage control is established by the Feedback comparator. The inverting i nput i s i nternally b iased a t 1 .25 V and is not pinned out. The converter output voltage is typically divided down with two external resistors and monitored b y t he h igh i mpedance n oninverting i nput a t Pin 2. The maximum i nput b ias c urrent i s ±0.4 mA, w hich c an c ause an output voltage error t hat i s e qual to the p roduct o f t he i nput bias current and the upper divider resistance value. For applications that require 5.0 V, the converter output can be directly c onnected t o t he n oninverti ng i nput a t P in 3 . T he h igh impedance input, Pin 2, must be grounded to prevent noise pickup. The internal resistor divider is set for a nominal voltage of 5.05 V. The additional 50 mV compensates for a
1.0% voltage drop in the cable and connector from the converter output to the load. The Feedback comparator’s
3
+ +
1.25 V
+ +
1.125 V
Low Voltage
Indicator Output
2
R
LVI
1
C
DLY
LVI
output state is controlled by the highest voltage applied to either of the two noninverting inputs.
The Low V oltage Indicator (LVI) comparator is designed for use as a reset controller in microprocessor−based systems. The inverting input is internally biased at 1.125 V, which sets the noninverting input thresholds to 90% of nominal. The LVI comparator has 15 mV of hysteresis to prevent erratic reset operation. The Open Collector output is capable of sinking in excess of 6.0 mA (see Figure 13). An external resistor (R program a reset delay time (t below, where V
) and capacitor (C
LVI
DLY
is the microprocessor reset input
th(MPU)
DLY
) by the formula shown
) can be used to
threshold. Refer to Figure 20.
1
V
1 −
V
out
th(MPU)
V
out
Feedback Comparator
(Bottom View)
t
DLY
= R
LVI
14
15
16
C
DLY
L
In
C
O
Ǔǒ
Figure 20. Partial Application Schematic Showing
Implementation of LVI Delay with R
Current Limit Comparator, Latch and Thermal Shutdown
With a voltage mode ripple converter operating under normal conditions, output switch conduction is initiated by the oscillator and terminated by the Voltage Feedback comparator. Abnormal operating conditions occur when the converter output is overloaded or when feedback voltage sensing is lost. Under these conditions, the Current Limit comparator will protect the Output Switch.
The switch current is converted to a voltage by inserting a fractional ohm resistor, RSC, in series with VCC and output switch transistor Q2. The voltage drop across RSC is monitored by the Current Sense comparator. If the voltage drop exceeds 250 mV with respect to VCC, the comparator will set the latch and terminate output switch conduction on a cycle−by−cycle basis. This Comparator/Latch configuration ensures that the Output Switch has only a single on−time during a given oscillator cycle. The calculation for a value of RSC is:
R
SC
0.25 V
+
Ipk(Switch)
Figures 14 and 15 show that the Current Sense comparator threshold is tightly controlled over temperature and has a typical input bias current of 1.0 mA. The propagation delay from the comparator input to the Output Switch is typically
and C
LVI
DLY
200 ns. The parasitic inductance associated with RSC and the circuit layout should be minimized. This will prevent unwanted voltage spikes that may falsely trip the Current Limit comparator.
Internal thermal shutdown circuitry is provided to protect the IC in the event that the maximum junction temperature is exceeded. When activated, typically at 170°C, the Latch is forced into the “Set” state, disabling the Output Switch. This feature is provided to prevent catastrophic failures from accidental device overheating. It is not intended to be used as a replacement for proper heatsinking.
Driver and Output Switch
To aid in system design flexibility and conversion efficiency, the driver current source and collector, and output switch collector and emitter are pinned out separately. This allows the designer the option of driving the output switch into saturation with a selected force gain or driving it near saturation when connected as a Darlington. The output switch has a typical current gain of 70 at 2.5 A and is designed to switch a maximum of 40 V collector to emitter, with up to 3.4 A peak collector current. The minimum value for RSC is:
R
SC(min)
+
0.25 V
3.4 A
+ 0.0735 W
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NCP3163, NCV3163
When configured for step−down or voltage−inverting applications (see application notes at the end of this document) the inductor will forward bias the output rectifier when the switch turns off. Rectifiers with a high forward voltage drop or long turn−on delay time should not be used. If the emitter is allowed to go sufficiently negative, collector current will flow, causing additional device heating and reduced conversion efficiency.
Figure 12 shows that by clamping the emitter to 0.5 V , the collector current will be in the range 10 mA over temperature. A 1N5822 or equivalent Schottky barrier rectifier is recommended to fulfill these requirements.
A bootstrap input is provided to reduce the output switch saturation voltage in step−down and voltage−inverting converter applications. This input is connected through a series resistor and capacitor to the switch emitter and is used to raise the internal 2.0 mA bias current source above VCC. An internal zener limits the bootstrap input voltage to V
CC
+7.0 V. The capacitor’s equivalent series resistance must limit the zener current to less than 100 mA. An additional series resistor may be required when using tantalum or other
Vias to 2nd Layer Metal for Maximum Heat Sinking
low ESR capacitors. The equation below is used to calculate a minimum value bootstrap capacitor based on a minimum zener voltage and an upper limit current source.
C
B(min)
+ I
Dt
+ 4.0 mA
DV
t
on
4.0 V
+ 0.001 t
on
Parametric operation of the NCP3163 is guaranteed over a supply voltage range of 2.5 V to 40 V. When operating below 3.0 V, the Bootstrap Input should be connected to VCC. Figure 18 shows that functional operation down to
1.7 V at room temperature is possible.
Package
The NCP3163 is contained in a heatsinkable 16−lead plastic package in which the die is mounted on a special heat tab copper alloy pad. This pad is designed to be soldered directly to a GND connection on the printed circuit board to improve thermal conduction. Since this pad directly contacts the substrate of the die, it is important that this pad be always soldered to GND, even if surface mount heat sinking is not being used. Figure 21 shows recommended layout techniques for this package.
Exposed Pad
0.175
0.188
0.145
Flare Metal for Maximum Heat Sinking
Figure 21. Layout Guidelines to Obtain Maximum
Package Power Dissipation
Minimum Recommended Exposed Copper
APPLICATIONS
Figures 23 through 30 show the simplicity and flexibility of the NCP3163. Three main converter topologies are demonstrated with actual test data shown below each of the circuit diagrams. Figure 22 gives the relevant design
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equations for the key parameters. Additionally, a complete application design aid for the NCP3163 can be found at www.onsemi.com.
10
NCP3163, NCV3163
The following Converter Characteristics must be chosen:
Calculation Step−Down Step−Up Voltage−Inverting
(See Notes 1,2,3)
t
on
t
off
V
out
Vin* V
) V
sat
F
* V
out
V
out
) VF–V
Vin–V
in
sat
|V
| ) V
out
Vin* V
F
sat
t
on
C
T
I
L(avg)
I
pk (Switch)
R
SC
L
V
ripple(pp)
V
out
32.143 · 10
f
Vin* V
ǒ
DI
L
t
ǒ
ƒ
t
*6
I
L(avg)
I
pk (Switch)
1
ǒ
ƒ
8C
V
ref
t
on
t
off
on
) 1
off
* 20@ 10
I
out
)
0.25
* V
sat
DI
L
2
Ǔ
) (ESR)
O
R
2
ǒ
) 1
R
1
DI
Ǔ
2
*12
L
out
Ǔ
Ǔt
on
2
32.143 · 10
f
ǒ
ƒ
*6
I
out
I
L(avg)
I
pk (Switch)
Vin* V
ǒ
[
V
ref
t
on
t
off
t
on
) 1
t
off
* 20@ 10
t
on
ǒ
) 1
t
off
)
0.25
sat
DI
L
tonI
out
C
O
R
2
ǒ
) 1
R
1
DI
Ǔ
2
Ǔt
*12
Ǔ
L
on
Ǔ
32.143 · 10
f
ǒ
ƒ
*6
I
out
I
L(avg)
I
pk (Switch)
Vin* V
ǒ
[
V
ref
t
on
t
off
t
on
) 1
t
off
* 20@ 10
t
on
ǒ
) 1
t
off
)
0.25
sat
DI
L
tonI
out
C
O
R
2
ǒ
) 1
R
1
DI
Ǔt
Ǔ
*12
Ǔ
L
2
on
Ǔ
Vin −
Nominal operating input voltage.
V
Desired output voltage.
out
I
Desired output current.
out
DI
Desired peak−to−peak inductor ripple current. For maximum output current it is suggested that DIL be chosen to be less
L
than 10% of the average inductor current I threshold set by RSC. If the design goal is to use a minimum inductance value, let DIL = 2(I proportionally reduce converter output current capability.
p
V
ripple(pp)
NOTES: 1. V
NOTES: 2. VF − Output rectifier forward voltage drop. Typical value for 1N5822 Schottky barrier rectifier is 0.5 V. NOTES: 3. The calculated ton/t NOTES: 3. operating input voltage.
Maximum output switch frequency.
Desired peak−to−peak output ripple voltage. For best performance the ripple voltage should be kept to a low value since it will directly affect line and load regulation. Capacitor CO should be a low equivalent series resistance (ESR) electrolytic designed for switching regulator applications.
− Saturation voltage of the output switch, refer to Figures 10 and 11.
sat
must not exceed the minimum guaranteed oscillator charge to discharge ratio of 8, at the minimum
off
. This will help prevent I
L(avg)
Figure 22. Design Equations
pk (Switch)
from reaching the current limit
L(avg)
). This will
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11
NCP3163, NCV3163
0.25 V
8
R
SC
V
in
R
T
7
C
in
C
T
6
V
CC
Oscillator
5
Thermal
4
3
R
1
R
2
+ +
1
2
LVI
Figure 23. Typical Buck Application Schematic
Value of Components
Name Value
L D 2 A, 40 V Schottky Rectifier C
in
C
out
C
t
R
t
47 mH
47 mF, 35 V
100 mF, 10 V
270 pF ±10%
15 kW
− +
45 k
1.125 V
Current
+ +
Limit
Latch
V
CC
Feedback Comparator
15 k1.25 V
(Bottom View)
9
10
11
Q
1
Q
R
Q
S
2
12
60
13
14
15
D
2.0 mA 16
7.0 V
V
CC
R
C
B
B
L
V
C
O
out
Name Value
R
1
R
2
R
sc
C
b
R
b
15 kW
24.9 kW
80 mW, 1 W
4.7 nF 200 W
Test Results for V
= 3.3 V
out
Test Condition Results
Line Regulation Vin = 8.0 V to 24 V, I Load Regulation Vin = 12 V, I Output Ripple Vin = 12 V, I Efficiency V Short Circuit Current
Test Results for V
= 5.05 V
out
= 12 V, I
in
V
= 12 V, RL = 0.1 W
in
= 0 to 2.5 A 25 mV
out
= 0 to 2.5 A 100 mVpp
out
= 2.5 A 70.3%
out
Test Condition Results
Line Regulation Vin = 10.2 V to 24 V, I Load Regulation Vin = 12 V, I Output Ripple Vin = 12 V, I Efficiency V Short Circuit Current
= 12 V, I
in
V
= 12 V, RL = 0.1 W
in
= 0 to 2.5 A 28 mV
out
= 0 to 2.5 A 150 mVpp
out
= 2.5 A 75.5%
out
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12
= 2.5 A 13 mV
out
= 2.5 A 54 mV
out
3.1 A
3.1 A
NCP3163, NCV3163
Figure 24. Buck Layout
APPLICATION SPECIFIC CHARACTERISTICS
85
80
75
70
65
EFFICIENCY (%)
60
55 50
I
out
Figure 25. Efficiency vs. Output Current for the
Buck Demo Board at V
5.0 V Eff
3.3 V Eff
(A)
= 12 V, TA = 255C
in
2.52.01.51.00.50
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13
NCP3163, NCV3163
− +
Thermal
Current
Limit
Q
1
R
Q
S
Q
60
Latch
V
CC
0.25 V
8
R
SC
V
in
R
T
7
+
C
in
C
T
6
V
CC
Oscillator
5
4
3
L
9
10
11
2
12
13
D
14
45 k
+
2
+ +
1
LVI
R
2
R
1
+
1.25 V
1.125 V
(Bottom View)
Feedback Comparator
15 k
15
2.0 mA
7.0 V
V
CC
16
V
+
C
O
out
Figure 26. Typical Boost Application Schematic
Value of Components for V
out
= 24 V
Name Value
L
33 mH D 2 A, 40 V Schottky Rectifier C
in
C
t
R
t
Test Results for V
330 mF, 35 V
270 pF ±10%
15 kW
= 24 V
out
Test Condition Results
Line Regulation Vin = 10 V to 20 V, I Load Regulation Vin = 12 V, I Output Ripple Vin = 12 V, I Efficiency V Short Circuit Current
out out
= 12 V, I
in
V
in
out
= 12 V, RL = 0.1 W
Name Value
R
1
R
2
C
out
R
sc
= 700 mA 90 mV
out
42.2 kW
2.32 kW
330 mF, 25 V
80 mW, 1 W
= 0 to 700 mA 80 mV = 0 to 700 mA 300 mVpp = 700 mA 83%
3.1 A
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14
NCP3163, NCV3163
Figure 27. Boost Demo Board Layout
86
84
82
80
78
EFFICIENCY (%)
76
74
I
(A)
out
Figure 28. Efficiency vs. Output Current for the
Boost Demo Board at V
= 12 V, TA = 255C
in
0.6
0.70.50.40.30.20.1
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15
NCP3163, NCV3163
+
Thermal
Current
Limit
9
10
11
Q
1
Q
R
Q
S
Latch
V
CC
2
12
60
13
14
0.25 V
R
V
in
R
T
8
SC
7
+
C
in
C
T
6
V
CC
Oscillator
5
4
3
45 k
+
2
+ +
1
LVI
R
1
R
2
+
1.125 V
(Bottom View)
Feedback Comparator
15 k1.25 V
15
2.0 mA
7.0 V
V
CC
16
Figure 29. Typical Voltage Inverting Application Schematic
L
R
B
C
B
D
V
C
O
+
out
Value of Components for V
= −15 V
out
Name Value
L
47 mH D 2 A, 40 V Schottky Rectifier C
in
C
out
C
t
Test Results for V
270 mF, 16 V
2 X 270 mF, 16 V
150 pF ±10%
= −15 V
out
Test Condition Results
Line Regulation Vin = 7.0 V to 16 V, I Load Regulation Vin = 12 V, I Output Ripple Vin = 12 V, I Efficiency V Short Circuit Current
out out
= 12 V, I
in
V
in
out
= 12 V, RL = 0.1 W
Name Value
R
1
R
2
R
sc
C
b
R
b
= 500 mA 35 mV
out
1.07 kW
80 mW, 1 W
200 mW
= 0 to 500 mA 20 mV = 0 to 500 mA 100 mVpp = 500 mA 68%
3.1 A
11.8 kW
4.7 nF
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16
NCP3163, NCV3163
Figure 30. Voltage Inverting Demo Board Layout
70
66
62
58
EFFICIENCY (%)
54
50
0.350.30.250.20.150.1
I
(A)
out
Figure 31. Efficiency vs. Output Current for the
Voltage Inverting Demo Board at V
= 12 V, TA = 255C
in
0.50.450.4
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17
NCP3163, NCV3163
ORDERING INFORMATION
Device Package Shipping
NCP3163PWG SOIC−16 W Exposed Pad
NCP3163PWR2G SOIC−16 W Exposed Pad
NCP3163BPWG SOIC−16 W Exposed Pad
NCP3163BPWR2G SOIC−16 W Exposed Pad
NCP3163MNR2G DFN18
NCP3163BMNR2G DFN18
NCV3163PWG SOIC−16 W Exposed Pad
NCV3163PWR2G SOIC−16 W Exposed Pad
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
47 Units / Rail
1000 / Tape & Reel
47 Units / Rail
1000 / Tape & Reel
2500 / Tape & Reel
2500 / Tape & Reel
47 Units / Rail
1000 / Tape & Reel
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18
0.25 (0.010) W
M
PIN 1 I.D.
0.10 (0.004) T
SOIC 16 LEAD WIDE BODY, EXPOSED PAD
A
16 9
P
1
M
TOP SIDE
D16 PL
0.25 (0.010) T UW
H
−U−
8
G
14 PL
M
NCP3163, NCV3163
PACKAGE DIMENSIONS
PW SUFFIX
CASE 751AG−01
ISSUE O
B
−W−
C
K
S S
−T−
SEATING PLANE
R x 45
_
DETAIL E
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
M
F
J
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE
0.13 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. 751R−01 OBSOLETE, NEW STANDARD 751R−02.
MILLIMETERS
DIMAMIN MAX MIN MAX
10.15 10.45 0.400 0.411
B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.50 0.90 0.020 0.035 G 1.27 BSC 0.050 BSC H 3.31 3.51 0.130 0.138 J 0.25 0.32 0.010 0.012 K 0.00 0.10 0.000 0.004 L 4.58 4.78 0.180 0.188 M 0 7 0 7 P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029
INCHES
____
EXPOSED PAD
18
L
16
9
BACK SIDE
SOLDERING FOOTPRINT*
0.350
0.175
0.050
C
L
0.200
0.074
0.024
0.145
DIMENSIONS: INCHES
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
C
L
Exposed Pad
0.188
0.376
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19
NCP3163, NCV3163
PACKAGE DIMENSIONS
DFN18
CASE 505−01
ISSUE D
PIN 1 LOCATION
2X
2X
18X
18X
D
A
B
E
C0.15
C0.15
TOP VIEW
C0.10
(A3)
A
C0.08
SIDE VIEW
A1
C
SEATING
PLANE
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.80 1.00 A1 0.00 0.05 A3 0.20 REF
b 0.18 0.30
D 6.00 BSC D2 3.98 4.28
E 5.00 BSC E2 2.98 3.28
e 0.50 BSC
K 0.20 −−−
L 0.45 0.65
SOLDERING FOOTPRINT*
D2
L
e
19
1
5.30
18X
0.75
0.50
K18X
1018
BOTTOM VIEW
E2
b18X
0.05 C
4.19
A0.10 BC
NOTE 3
PITCH
18X
0.30
3.24
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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For additional information, please contact your local Sales Representative
NCP3163/D
20
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