The NCS2023x series of op amps feature a wide supply range of
2.7 V to 36 V with an input offset voltage as low as ±0.95 mV max.
These op amps are available in single, dual, and quad channel
configurations. Automotive qualified options are available under the
NCV prefix with an optional extended operating temperature range
from −40°C to 150°C. All other versions are specified over the
operating temperature range from −40°C to 125°C.
Features
• Supply Voltage Range: 2.7 V to 36 V
• Temperature Range: −40°C to 150°C
• Unity Gain Bandwidth: 3 MHz
• Input Offset Voltage: ±1.5 mV max, T
= −40 to 150°C
A
• Input Offset Voltage Drift: ±2 mV/°C max
• Common−Mode Input Voltage Range
♦ Optimal: V
♦ Functional: V
– 0.1 to VDD − 2 V
SS
– 0.1 to VDD + 0.1 V
SS
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Telecom Equipment
• Power Supply Designs
• Diesel Injection Control
• Automotive
• Motor Control
5
1
SC−88A / SC70−5
CASE 419A−02
SOT−553, 5 LEAD
CASE 463B
14
1
SOIC−14 NB
CASE 751A−03
14
TSSOP−14 WB
CASE 948G
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 2 of this data sheet.
PIN CONNECTIONS
See pin connections on page 3 of this data sheet.
5
1
TSOP−5
CASE 483
1
UDFN8
CASE 517AW
8
1
SOIC−8 NB
CASE 751−07
1
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per JEDEC standard JS−001−2017 (AEC−Q100−002)
ESD Charged Device Model tested per JEDEC standard JS−002−2014 (AEC−Q100−011)
3. Latch−up Current tested per JEDEC standard JESD78E (AEC−Q100−004)
4. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
SymbolValueUnit
S
CM
ID
I
O
D
J(max)
STG
T
SLD
−0.3 to 40V
VSS – 0.2 to VDD + 0.2V
±V
S
±10mA
±100mA
200mW
150°C
−65 to 150°C
260°C
V
THERMAL CHARACTERISTICS
ParameterSymbolPackageValueUnit
Thermal Resistance, Junction−to−Air
(Note 5)
q
JA
TSOP−5TBD
SC88−5TBD
°C/W
UDFN−8TBD
SOIC−8TBD
SOIC−14TBD
TSSOP−14TBD
5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate
RECOMMENDED OPERATING RANGES (Note 6)
Parameter
Supply Voltage (VDD − VSS)V
Differential Input VoltageV
Input Common−Mode RangeV
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area