ON Semiconductor NCP51705 User Manual
EVBUM2528/D
NCP51705 Mini Evaluation
Board User'sManual
NCP51705 SiC Driver Evaluation Board
for Existing or New PCB Designs
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INTRODUCTION
Purpose
This document describes the use and applications for the
NCP51705 SiC driver mini EVB. The EVB is designed on
a four layer PCB and includes the NCP51705 driver and all
the necessary drive circuitry. The EVB also includes an
on−board digital isolator and the ability to solder any
MOSFET or SiC MOSFET in a T0247 high voltage
package. The EVB does not include a power stage and is
generic from the point of view that it is not dedicated to any
particular topology. It can be used in any low−side or
high−side power switching application. For bridge
configurations two or more of these EVBs can be configured
in a totem pole type drive configuration. The EVB can be
considered as an isolator+driver+T0247 discrete module.
NCP51705 Description
The NCP51705 driver is designed to primarily drive SiC
MOSFET transistors. To achieve the lowest possible
EVAL BOARD USER’S MANUAL
conduction losses, the driver is capable of delivering the
maximum allowable gate voltage to the SiC MOSFET
device. By providing high peak current during turn−on and
turn−off, switching losses are also minimized. For improved
reliability, dV/dt immunity and even faster turn−off, the
NCP51705 can utilize its on−board charge pump to generate
a user selectable negative voltage rail.
For full compatibility and to minimize the complexity of
the bias solution in isolated gate drive applications the
NCP51705 also provides an externally accessible 5V rail to
power the secondary side of digital or high speed opto
isolators.
The NCP51705 offers important protection functions
such as under−voltage lockout monitoring for the bias power
and thermal shutdown based on the junction temperature of
the driver circuit.
© Semiconductor Components Industries, LLC, 2017
December, 2017 − Rev. 0
1 Publication Order Number:
EVBUM2528/D
NCP51705 Block Diagram
EVBUM2528/D
NCP51705
V5V
UVSET
IN+
IN-
XEN
SGND
23
25
mA
5V REG
DESAT /
CURRENT
SENSE
24
UVLO
TSD
21
22
20
19
SVDD
DESAT
/CS
VDD
VDD
5V_OK
VDD_OK
VEE_OK
1
PROTECTION
LOGIC
INPUT LOGIC
2
3
RUN
DRIVER
LOGIC
&
LEVEL
SHIFT
18
17
14
13
OUTSRC
OUTSRC
OUTSNK
OUTSNK
CHARGE
4
PUMP REG
CPCLK
CHARGE PUMP
POWER STAGE
5
VEESET
6
VCH
7
C+
8
C-
11 12 9 10
VEE
VEE
PGND
PGND
PGND
16
PGND
15
Figure 1. NCP51705 Functional Block Diagram
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SUMMARY OF EVB
EVB Photos
EVBUM2528/D
Figure 2. NCP51705 EVB (35 mm x 15 mm x 5 mm) − Top and Bottom View (T0−247 Shown for Scale)
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EVB Schematic
EVBUM2528/D
Figure 3. NCP51705 EVB Schematic
Table 1. BILL OF MATERIALS
Item Qty Reference Value Part Number Description Manufacturer Pkg Type
1 2 C1 C10
2 2 C2 C13 100 nF C1005X7R1H104M050BE CAP, SMD, CERAMIC, 50 V,
3 1 C3 47 nF GRM155R71E473KA88D CAP, SMD, CERAMIC, 25 V,
4 2 C4−5 470 nF GRM188R71E474KA12D CAP, SMD, CERAMIC, 25 V,
5 1 C6 470 nF C1005X5R1E474K050BB CAP, SMD, CERAMIC, 25 V,
6 3 C7 C9
C12
7 1 C8
8 1 C11 10 pF GRM1555C1H100JA01D CAP, SMD, CERAMIC, 50 V,
9 1 D1 RS1MWF Diode, Fast, 1 A, 1000 V,
10 1 D2 MBR0540 Diode, Shottky, 40 V,
11 1 Q1 DNI MOSFET, N−CH, 600 V,
12 4 R1 R5
R9−10
2.2 mF
100 nF C0603C104K8RACTU CAP, SMD, CERAMIC, 10 V,
2.2 mF
CGA4J3X7R1H225M125AE CAP, SMD, CERAMIC, 50 V,
X7R
X7R
X7R
X7R
X5R
X7R
LMK107B7225KA−T CAP, SMD, CERAMIC, 10 V,
X7R
NPO
Std. Rec.
500 mA, 510 mV
20 A, 190 mW
0 RC0603JR−070RL RES, SMD, 1/10 W STD 603
STD 805
STD 402
STD 402
STD 603
STD 402
STD 603
STD 603
STD 402
Vishay SOD123F
ON
Semiconductor
ON
Semiconductor
SOD−123
TO−247
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EVBUM2528/D
Table 1. BILL OF MATERIALS
Item Pkg TypeManufacturerDescriptionPart NumberValueReferenceQty
13 1 R2 113k RC0402FR−07200KL RES, SMD, 1/16 W STD 402
14 1 R3 3.01 RMCF0805FT3R01
15 1 R4 1 RMCF0805FT1R00
16 3 R6−8 DNI RES, SMD, 1/10 W STD 603
17 1 R11 4.99k RC0805FR−074K99L
18 1 R12 10k RC0805FR−0710KL RES, SMD, 1/8 W STD 805
19 1 U1 NCP51705 SiC Driver, Single, 6 A,
20 1 U2 ADuM142E1WBRQZ Digital Isolator, RF, 4−Chan-
RES, SMD, 1/8 W
RES, SMD, 1/8 W
RES, SMD, 1/8 W
Single
nel
PCB Assembly and Layers
Figure 4 through Figure 9 shows the top and bottom
assembly and the four−layers of the PCB. The PCB is 35 mm
x 15 mm x 5 mm (length x width x height) where the width
of the PCB is approximately the width of a T0−247 body.
STD 805
STD 805
STD 805
ON
Semiconductor
Analog
Devices
WQFN−24
QSOP−16
Figure 4. Top Assembly
Figure 5. Bottom Assembly
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