ON Semiconductor NCP336, NCP337 User Manual
NCP336, NCP337
Controlled Load Switch with
Auto-Discharge Path, 3 A
Description
The NCP336 and NCP337 are very low Ron MOSFET controlled
by external logic pin, allowing optimization of battery life, and
ortable device autonomy.
p
Indeed, thanks to a current consumption optimization with PMOS
structure, leakage currents are eliminated by isolating connected IC on
the battery when not used.
Output discharge path is also embedded to eliminate residual
voltages on the output rail for the NCP337 part only.
Proposed in a wide input voltage range from 1.2 V to 5.5 V, in a
small 1 x 1.5 mm WLCSP6, pitch 0.5 mm.
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WLCSP6
FC SUFFIX
CASE 567FH
Features
• 1.2 V − 5.5 V Operating Range
• 21 mW P MOSFET at 4.5 V
• DC Current up to 3 A
• Output Auto−Discharge
• Active High EN Pin
• WLCSP6 1 x 1.5 mm
• This Device is Pb−Free, Halogen Free/BFR Free and is RoHS
Compliant
Applications
• Mobile Phones
• Tablets
• Digital Cameras
• GPS
• Portable Devices
VCC
SMPS
V+
DCDC Converter
or
LDO
ENx
LS
1μF
PIN CONNECTIONS
21
A
B
C
OUT
OUT
GND
(Top View)
IN
IN
EN
ORDERING INFORMATION
See detailed ordering and shipping information on page 8 of
this data sheet.
NCP336 or NCP337
ENy
A2
IN
B2
IN
C2
EN
OUT
OUT
C1
GND
0
A1
B1
100n
Platform IC’n
© Semiconductor Components Industries, LLC, 2012
September, 2012 − Rev. 2
LS
Figure 1. Typical Application Circuit
1 Publication Order Number:
Platform IC’n+1
NCP336/D
NCP336, NCP337
Table 1. PIN FUNCTION DESCRIPTION
Pin Name Pin Number Type Description
IN A2, B2 POWER
GND C1 POWER Ground connection.
EN C2 INPUT Enable input, logic high turns on power switch.
OUT A1, B1 OUTPUT
Load−switch input voltage; connect a 1 mF or greater ceramic capacitor from IN to GND
as close as possible to the IC.
Load−switch output; connect a 1 mF ceramic capacitor from OUT to GND as close as
possible to the IC is recommended.
Figure 2. Block Diagram
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NCP336, NCP337
Table 2. MAXIMUM RATINGS
Rating Symbol Value Unit
IN, OUT, EN, Pins: (Note 1) V
From IN to OUT Pins: Input/Output (Note 1) V
Maximum Junction Temperature T
Storage Temperature Range T
Moisture Sensitivity (Note 2) MSL Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. OPERATING CONDITIONS
Symbol Parameter Conditions Min Typ Max Unit
V
IN
V
EN
T
A
T
J
C
IN
C
OUT
R
q
JA
I
OUT
P
D
1. According to JEDEC standard JESD22−A108.
2. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
3. The R
4. The maximum power dissipation (
q
PD+
Operational Power Supply 1.2 5.5 V
Enable Voltage 0 5.5
Ambient Temperature Range −40 25 +85 °C
Junction Temperature Range −40 25 +125 °C
Decoupling input capacitor 1
Decoupling output capacitor 1
Thermal Resistance Junction to Air WLCSP package (Note 3) 100 °C/W
Maximum DC current 3 A
Power Dissipation Rating (Note 4)
TA ≤ 25°C WLCSP package 0.66 W
TA = 85°C WLCSP package 0.26 W
is dependent of the PCB heat dissipation and thermal via.
JA
T
* T
JMAX
A
R
qJA
) is given by the following formula:
PD
EN, VIN,
IN,
STG
V
OUT
J
V
OUT
−0.3 to + 7.0 V
0 to + 7.0 V
−40 to + 125 °C
−40 to + 150 °C
mF
mF
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