Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
Specification Features
• 500 mW Rating on FR−4 or FR−5 Board
• Wide Zener Reverse Voltage Range − 2.4 V to 56 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Peak Power − 225 W (8 X 20 ms)
• Pb−Free Packages are Available
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
http://onsemi.com
1
Cathode
1
SOD−123
CASE 425
STYLE 1
MARKING DIAGRAM
2
Anode
2
MAXIMUM RATINGS
RatingSymbolMaxUnit
Peak Power Dissipation @ 20 ms (Note 1)
@ TL ≤ 25°C
Total Power Dissipation on FR−5 Board,
(Note 2) @ TL = 75°C
Derated above 75°C
Thermal Resistance, Junction−to−Ambient
(Note 3)
Thermal Resistance, Junction−to−Lead
(Note 3)
Junction and Storage Temperature RangeTJ, T
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Nonrepetitive current pulse per Figure 11
2. FR−5 = 3.5 X 1.5 inches, using the ON minimum recommended footprint
3. Thermal Resistance measurement obtained via infrared Scan Method
P
pk
P
D
R
q
JA
R
q
JL
stg
225W
500
6.7
340°C/W
150°C/W
−55 to +150°C
mW
mW/°C
xxxMG
G
xxx = Device Code
M= Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
DevicePackageShipping
MMSZxxxET1SOD−123
(Pb−Free)
MMSZxxxET3SOD−123
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
3000/Tape & Reel
10,000/Tape & Ree
†
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 o
this data sheet.
4. The type numbers shown have a standard tolerance of ±5% on the nominal Zener Voltage.
5. Tolerance and Voltage Designation: Zener Voltage (VZ) is measured with the Zener Current applied for PW = 1 ms.
6. ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for
I
Z(AC)
= 0.1 I
with the AC frequency = 1 kHz.
Z(DC),
Devices listed in bold, italic are ON Semiconductor Preferred devices. Preferred devices are recommended choices for future use and
best overall value.
7. The type numbers shown have a standard tolerance of ±5% on the nominal Zener Voltage.
8. Tolerance and Voltage Designation: Zener Voltage (VZ) is measured with the Zener Current applied for PW = 1 ms.
9. ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for
I
Z(AC)
= 0.1 I
with the AC frequency = 1 kHz.
Z(DC),
Devices listed in bold, italic are ON Semiconductor Preferred devices. Preferred devices are recommended choices for future use and
best overall value.
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
HALF VALUE I
t, TIME (ms)
RSM
@ 8 ms
RSM
/2 @ 20 ms
Figure 11. 8 × 20 ms Pulse Waveform
VZ, ZENER VOLTAGE (V)
(12 V to 91 V)
http://onsemi.com
6
MMSZ2V4ET1 Series
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE E
D
1
H
E
2
E
b
A
A1
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
MILLIMETERSINCHES
DIM MINNOMMAX
A0.941.171.35 0.037
A10.000.050.10 0.000
b0.510.610.71 0.020
−−−
3.56H
2. ANODE
−−−
1.60
3.680.140
−−−−−−
c
E2.542.692.84 0.100
E
L0.25
STYLE 1:
PIN 1. CATHODE
MINNOMMAX
0.15
0.055D1.401.80
3.86
0.010
0.046
0.002
0.024
−−−−−−
0.063
0.106
0.145
−−−−−−
0.053
0.004
0.028
0.006
0.071
0.112
0.152
C
SOLDERING FOOTPRINT*
0.91
0.036
1.22
0.048
2.36
0.093
4.19
0.165
mm
ǒ
SCALE 10:1
inches
Ǔ
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867Toll Free USA/Canada
Email: orderlit@onsemi.com
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
http://onsemi.com
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MMSZ2V4ET1/D
7
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