This series of Zener diodes is packaged in a SOD−323 surface
mount package that has a power dissipation of 200 mW. They are
designed to provide voltage regulation protection and are especially
attractive in situations where space is at a premium. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Specification Features:
• Standard Zener Breakdown Voltage Range − 2.4 V to 75 V
• Steady State Power Rating of 200 mW
• Small Body Outline Dimensions:
0.067” x 0.049” (1.7 mm x 1.25 mm)
• Low Body Height: 0.035” (0.9 mm)
• Package Weight: 4.507 mg/Unit
• ESD Rating of Class 3 (>16 kV) per Human Body Model
FINISH: All External Surfaces are Corrosion Resistant
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
LEADS: Plated with Pb−Sn or Sn Only (Pb−Free)
POLARITY: Cathode Indicated by Polarity Band
FLAMMABILITY RATING: UL 94 V−0
MOUNTING POSITION: Any
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1
Cathode
2
1
SOD−323
CASE 477
STYLE 1
MARKING DIAGRAM
M
xx G
G
2
Anode
MAXIMUM RATINGS
RatingSymbolMaxUnit
Total Device Dissipation FR−5 Board,
(Note 1) @ TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range TJ, T
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
2. Zener voltage is measured with a pulse test current IZ at an ambient temperature of 25°C.
C
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2
MM3Z2V4T1 SERIES
Z
, DYNAMIC IMPEDANCE ( )
2
C, CAPACITANCE (pF)
0
TYPICAL CHARACTERISTICS
1000
Ω
100
10
ZT
1.0
VZ, NOMINAL ZENER VOLTAGE
TJ = 25°C
I
Z(AC)
f = 1 kHz
IZ = 1 mA
103.0
= 0.1 I
Z(DC)
5 mA
Figure 1. Effect of Zener Voltage on Zener Impedance
1000
TA = 25°C
100
10
1.0
VZ, NOMINAL ZENER VOLTAGE (V)
0 V BIAS1 V BIAS
BIAS AT
50% OF VZ NOM
104.0
80
0.00001
70
1000
100
10
, FORWARD CURRENT (mA)
F
I
1.0
1000
100
10
1.0
0.1
0.01
0.001
, LEAKAGE CURRENT ( A)μ
R
I
0.0001
150°C
75°C 25°C0°C
VF, FORWARD VOLTAGE (V)
Figure 2. Typical Forward Voltage
VZ, NOMINAL ZENER VOLTAGE (V)
+150°C
+25°C
−55°C
1.
1.11.00.90.80.70.60.50.4
7
6050403020100
Figure 3. Typical Capacitance
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3
Figure 4. Typical Leakage Current
MM3Z2V4T1 SERIES
TYPICAL CHARACTERISTICS
100
10
1.0
0.1
, ZENER CURRENT (mA)
Z
I
0.01
TA = 25°C
108.06.04.02.00
VZ, ZENER VOLTAGE (V)
Figure 5. Zener Voltage versus Zener Current
(V
Up to 12 V)
Z
100
80
12
100
10
1
0.1
, ZENER CURRENT (mA)
Z
I
0.01
1030507090
VZ, ZENER VOLTAGE (V)
Figure 6. Zener Voltage versus Zener Current
(12 V to 75 V)
TA = 25°C
POWER DISSIPATION (%)
60
40
20
0
250
5075100125150
TEMPERATURE (°C)
Figure 7. Steady State Power Derating
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4
MM3Z2V4T1 SERIES
SOD−323
PACKAGE DIMENSIONS
CASE 477−02
ISSUE G
C
NOTE 3
1
L
NOTE 5
H
E
D
E
2b
A3
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
MILLIMETERS
DIM MIN NOM MAX
A 0.80 0.90 1.00
A1 0.00 0.05 0.10
A30.15 REF
b0.25 0.320.4
C 0.089 0.12 0.177
D 1.60 1.70 1.80
E 1.151.25 1.35
0.08
L
H
2.30 2.50 2.70
E
STYLE 1:
PIN 1. CATHODE
2. ANODE
INCHES
MIN NOM MAX
0.031 0.035 0.040
0.000 0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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For additional information, please contact your local
Sales Representative
MM3Z2V4T1/D
5
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