ON Semiconductor MBR120ESFT1 Technical data

MBR120ESFT1
l
l
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l
l
s
Surface Mount Schottky Power Rectifier
Plastic SOD−123 Package
Features
Guardring for Stress Protection
Low Leakage
150°C Operating Junction Temperature
Epoxy Meets UL 94 V−0 @ 0.125 in
Package Designed for Optimal Automated Board Assembly
ESD Ratings: Machine Model, C
ESD Ratings: Human Body Model, 3B
Pb−Free Packages are Available
Mechanical Characteristics
Reel Options: MBR120ESFT1 = 3,000 per 7″ reel/8 mm tape
MBR120ESFT3 = 10,000 per 13 reel/8 mm tape
Device Marking: L2E
Polarity Designator: Cathode Band
Weight: 11.7 mg (approximately)
Case: Epoxy, Molded
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
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SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES 20 VOLTS
SOD−123FL
CASE 498
PLASTIC
MARKING DIAGRAM
M
L2E
G
G
L2E = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location
ORDERING INFORMATION
Device Package Shipping
MBR120ESFT1 SOD−123FL MBR120ESFT1G SOD−123FL
(Pb−Free) MBR120ESFT3 SOD−123FL 10000/Tape & Ree MBR120ESFT3G SOD−123FL
(Pb−Free) †For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
3000/Tape & Ree 3000/Tape & Ree
10000/Tape & Ree
© Semiconductor Components Industries, LLC, 2005
July, 2005 − Rev. 2
1 Publication Order Number:
MBR120ESFT1/D
MBR120ESFT1
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TL = 140°C) I Peak Repetitive Forward Current
(At Rated V
, Square Wave, 20 kHz, TL = 125°C)
R
Non−Repetitive Peak Surge Current
(Non−Repetitive peak surge current, halfwave, single phase, 60 Hz) Storage Temperature T Operating Junction Temperature T Voltage Rate of Change (Rated VR, TJ = 25°C) dv/dt 10,000
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Resistance − Junction−to−Lead (Note 1) Thermal Resistance − Junction−to−Lead (Note 2) Thermal Resistance − Junction−to−Ambient (Note 1) Thermal Resistance − Junction−to−Ambient (Note 2)
1. Mounted with minimum recommended pad size, PC Board FR4.
2. Mounted with 1 in. copper pad (Cu area 700 mm2).
V V
RRM RWM
V
I
FRM
I
FSM
R
R R R
stg
20 V
R
O
1.0 A
2.0 A
40 A
−65 to 150 °C
J
−65 to 150 °C V/ms
tjl tjl tja tja
26 21
325
82
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3), See Figure 2 (IF = 0.1 A)
(IF = 1.0 A) (IF = 2.0 A)
Maximum Instantaneous Reverse Current (Note 3), See Figure 4 (VR = 20 V)
(VR = 10 V) (VR = 5.0 V)
3. Pulse Test: Pulse Width 250 ms, Duty Cycle ≤ 2%.
V
F
I
R
TJ = 25°C TJ = 100°C
0.455
0.530
0.595
0.360
0.455
0.540
TJ = 25°C TJ = 100°C mA
10
1.0
0.5
1600
500 300
V
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