ON Semiconductor MBR0540T1, MBR0540T3 Technical data

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MBR0540T1, MBR0540T3
Surface Mount Schottky Power Rectifier
SOD−123 Power Surface Mount Package
Features
Guardring for Stress Protection
Very Low Forward Voltage
Epoxy Meets UL 94 V−0 @ 0.125 in
Package Designed for Optimal Automated Board Assembly
Pb−Free Packages are Available
Mechanical Characteristics
Reel Options: 3,000 per 7 inch reel/8 mm tape
Reel Options: 10,000 per 13 inch reel/8 mm tape
Device Marking: B4
Polarity Designator: Cathode Band
Weight: 11.7 mg (approximately)
Case: Epoxy Molded
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C max. for 10 Seconds
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SCHOTTKY BARRIER
RECTIFIER
0.5 AMPERES, 40 VOLTS
SOD−123
CASE 425
STYLE 1
MARKING DIAGRAM
B4 M
B4 = Device Code M = Date Code
Semiconductor Components Industries, LLC, 2005
March, 2005 − Rev. 5
ORDERING INFORMATION
Device Package Shipping
MBR0540T1 SOD−123 3000/Tape & Reel MBR0540T1G SOD−123
(Pb−Free)
MBR0540T3 SOD−123 10,000/Tape & Reel MBR0540T3G SOD−123
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
1 Publication Order Number:
3000/Tape & Reel
10,000/Tape & Reel
MBR0540T1/D
MBR0540T1, MBR0540T3
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage DC Blocking Voltage
Average Rectified Forward Current
(At Rated V
, TC = 115°C)
R
Peak Repetitive Forward Current
(At Rated V
, Square Wave, 20 kHz, TC = 115°C)
R
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave,
Single Phase, 60 Hz) Storage/Operating Case Temperature Range T Operating Junction Temperature T Voltage Rate of Change
(Rated V
, TJ = 25°C)
R
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously . If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Resistance − Junction−to−Lead (Note 1) Thermal Resistance − Junction−to−Ambient (Note 2)
V
V
I
I
stg
RRM
RWM
V
R
I
O
FRM
FSM
, T
J
C
40 V
0.5 A
1.0 A
5.5 A
−55 to +150 °C
−55 to +150 °C
dv/dt 1000 V/s
R
tjl
R
tja
118 206
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3) (iF = 0.5 A)
(i
= 1 A)
F
Maximum Instantaneous Reverse Current (Note 3) (VR = 40 V)
(V
= 20 V)
R
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 X 0.5 inch for each lead) on FR4 board.
3. Pulse Test: Pulse Width ≤ 250 s, Duty Cycle ≤2.0%.
v
F
I
R
TJ = 25°C TJ = 100°C
0.51
0.62
0.46
0.61
TJ = 25°C TJ = 100°C
20 10
13,000
5,000
V
A
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2
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