DAN222
Common Cathode Silicon
Dual Switching Diode
This Common Cathode Silicon Epitaxial Planar Dual Diode is
designed for use in ultra high speed switching applications. This
device is housed in the SOT–416/SC–90 package which is designed
for low power surface mount applications, where board space is at a
premium.
• Fast t
• Low C
• Available in 8 mm T ape and Reel
rr
D
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SOT–416/SC–90 PACKAGE
COMMON CATHODE
DUAL SWITCHING DIODE
SURFACE MOUNT
MAXIMUM RATINGS (TA = 25°C)
Rating Symbol Value Unit
Reverse Voltage V
Peak Reverse Voltage V
Forward Current I
Peak Forward Current I
Peak Forward Surge Current I
THERMAL CHARACTERISTICS
Rating Symbol Max Unit
Power Dissipation P
Junction Temperature T
Storage Temperature Range T
1. t = 1 µS
R
RM
F
FM
(1) 2.0 Adc
FSM
D
J
stg
80 Vdc
80 Vdc
100 mAdc
300 mAdc
150 mW
150 °C
–55 to +150 °C
CATHODE
3
12
ANODE
3
2
1
SOT–416
CASE 463
STYLE 3
DEVICE MARKING
Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev . 2
N9
ORDERING INFORMATION
Device Package Shipping
DAN222 SOT–416 3000/Tape & Reel
1 Publication Order Number:
DAN222/D
DAN222
ELECTRICAL CHARACTERISTICS (T
Characteristic
Reverse Voltage Leakage Current I
Forward Voltage V
Reverse Breakdown Voltage V
Diode Capacitance C
= 25°C)
A
Symbol Condition Min Max Unit
R
F
R
D
VR = 70 V — 0.1 µAdc
IF = 100 mA — 1.2 Vdc
IR = 100 µA 80 — Vdc
VR = 6.0 V, f = 1.0 MHz — 3.5 pF
Reverse Recovery Time trr(2) IF = 5.0 mA, VR = 6.0 V, RL = 100 Ω, Irr = 0.1 I
2. trr Test Circuit on following page.
— 4.0 ns
R
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DAN222
TYPICAL ELECTRICAL CHARACTERISTICS
100
10
1.0
, FORWARD CURRENT (mA)
F
I
0.1
0.2 0.4
TA = 85°C
TA = –40°C
TA = 25°C
0.6 0.8 1.0
VF, FORWARD VOLTAGE (VOLTS)
1.2
, REVERSE CURRENT (µA)
R
I
1.0
0.1
0.01
0.001
10
0
10 20 30 40
TA = 150°C
TA = 125°C
TA = 85°C
TA = 55°C
TA = 25°C
, REVERSE VOLTAGE (VOLTS)
V
R
Figure 1. Forward Voltage Figure 2. Reverse Current
1.0
0.9
0.8
50
, DIODE CAPACITANCE (pF)
D
C
0.7
0.6
0
2468
, REVERSE VOLTAGE (VOLTS)
V
R
Figure 3. Diode Capacitance
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