First and foremost, the success of conduction soldering depends upon the
availability and controlled flow of thermal energy into the connection during
the two critical phases flux activation and intermetallic bond formation. Lead-
free alloys, with higher thermal demands, further heighten these
requirements. Conventional ceramic heaters attempt to control this process
by managing indirect parameters, such as the tip idle temperature. In contrast, SmartHeat technology senses the specific
thermal demand directly at the solder pad and delivers the precise quantity and flow of thermal energy during both phases to
ensure a reliable connection.
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Powered by
SmartHeat
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Precision Tip Selection – The Conductivity Factor
During the execution of a successful soldering
connection, the tip is the thermal energy “highway”
from the heater to the pad and, therefore, the choice
of tip geometry is critical to prevent power losses. In
addition to providing the most thermally efficient tip
designs, OK International has pioneered the tip
“Conductivity Factor” rating system providing
operators with quantifiable guidance in the selection
of the optimum tip geometry. Additionally, our
proprietary Power Meter can quantify exact pad
energy requirements, further refining the tip selection
process. Lead-free alloys, with tighter thermal
demands, make these tools mandatory.
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T h e r m a l P e r f o r m a n c e
637A 670A 642A
637A 670A 642A
CF=.89
CF=.50 CF=.25
Heavy
Light
2
Temperature Stability – No Need for Calibration
Nearly all industry
standards associated with
CERAMIC HEATER
TECHNOLOGY
conduction soldering
performance cite
temperature stability as a
key requirement. To meet
C
D E G
5
+ / -
SMARTHEAT
TECHNOLOGY
the demands of
temperature stability,
conventional ceramic
heater systems depend on
the sensor, heater and
3 MOS 6 MOS 9 MOS 12 MOS
operator set point controls.
Each of these elements is
subject to drift and instability requiring frequent calibration and certification to ensure compliance. By contrast, the repeatability of
SmartHeat technology is inherently determined by the molecular properties of the heater material and does not shift over time,
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ensuring long term stability without the need for calibration.
Reduced Risk of Overshoot
Conventional soldering stations strive to control the process with tip temperature using thermocouple sensors and ceramic
heaters. Inherent with this technology will be significant temperature variances throughout the tip body and consequently thermal
overshoot/undershoot. The risk is unreliable solder connections or damaged components. SmartHeat technology, on the other
hand, detects and controls the energy requirement of the pad, avoiding thermal delivery variances thereby eliminating the risk of
component damage.
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S m a r t H e a tT e c h n o l o g y
Perfect for Lead-Free
The steps required for reliable lead-free
connections parallel those for traditional
alloys except that the thermal demands
are greater. The typical operator response
to the higher thermal demand is to
increase tip idle temperature,
unfortunately at higher temperatures the
contribution to thermal performance is
negligible. More importantly, the increase
in tip idle temperature comes dangerously
close to component and substrate
damage levels making process control
critical. Compared to conventional
technology, SmartHeat , combined with
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°C
400
350
300
OPTIMUM REFLOW ZONE
250
LOW ENERGY FAIL ZONE
200
FLUX ACTIVATION ZONE
150
100
50
0
P S
Pb-Sn vs. SAC Process Window
FR-4 PAD DELAMINATION ZONE
EXCESSIVE ENERGY FAIL ZONE
OPTIMUM REFLOW ZONE
LOW ENERGY FAIL ZONE
FLUX ACTIVATION ZONE
n
b-
CA
S
Solder Melting Temperature
our Precision Tip Selection tools delivers precise process control assuring consistently reliable connections at low operating
temperatures which provide the thermal performance necessary for lead-free.
Increase Tip Life and Value
The useful life of a tip is dependent upon many factors including flux corrosion, oxidation and tin dissolution. With higher tip idle
temperatures, the contribution from these factors is dramatically increased. The resultant de-wetting from these chemical surface
interactions causes many operators to increase tip force, which significantly accelerates tip life deterioration. With the advantages
of SmartHeat technology operators can solder at lower temperatures and, combined with proper tip selection and care,
dramatically extend tip life and value.
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3
M F R S e r i e s M u l t i F u n c t i o n R e w o r k S y s t e m s
MFR Multi Function Rework Systems
The All in One Solution
Imagine performing all of your production soldering, rework and desoldering tasks with just one tool. The new Multi Function
Rework Systems (MFR) not only expertly perform rework, they also have tools for SMT and through-hole soldering. These flexible
systems feature two switchable outputs with a comprehensive choice of tools that support today's complex PCB and component
technologies.
Systems are configured with the following tools:
Soldering and Rework Production Soldering Adjustable Desoldering Hand-Piece
Standard Tweezer Precision Tweezer
Perfect for Lead-Free
The MFR Series uses SmartHeat Technology to
deliver the power required for lead-free
connections. SmartHeat Technology’s variable
power instantaneously senses and continuously
delivers the precise thermal energy to the pad,
yielding high quality solder joints while protecting
sensitive components from damage.
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4
Tip and Cartridge Options
With the MFR Series you can use heater tips or tip cartridges,
each filling a specific need. Heater tips are cost effective to meet
the demands of point to point, production soldering. While tip
cartridges are suited for high performance and rework
applications. Both options incorporate the popular quick change
design OK tips are well known for, which eliminates the
maintenance associated with traditional irons. The OK cartridge
tip has the slimmest diameter allowing access to the tightest
applications and its single piece design provides a secure