OKI KGF1323 Datasheet

E2Q0030-38-72
This version: Jul. 1998
Previous version: Jan. 1998
KGF1323¡ electronic components
¡ electronic components
KGF1323
Power FET(Plastic Package Type)
GENERAL DESCRIPTION
FEATURES
• High output power: 33 dBm (min.)
• High efficiency: 70% (typ.)
• Low thermal resistance: 23°C/W (typ.)
• Package: 3PMMP (SOT-89 type)
PACKAGE DIMENSIONS
4.5±0.1
+0.15
1.6
–0.10
+0.08
0.48
–0.05
3±0.1
0.4
+0.08 –0.05
1.5±0.1 1.5±0.1
0.4
+0.08 –0.05
0.11
±
2.5
0.2
±
0.2
±
4
±
0.05
0.39
(Unit: mm)
1.5±0.1
Package material
Lead frame material
Pin treatment
Solder plate thickness
Epoxy resin
Cu
Solder plating
5 mm or more
1/7
MARKING
KGF1323¡ electronic components
CIRCUIT
(1)
(2)
(3)
Gate(1)
P2
XX
PRODUCT TYPE
LOT NUMBER (NUMERICAL or ALPHABETICAL)
Drain(3)
(1) Gate (2) Source (3) Drain
Source(2)
2/7
ABSOLUTE MAXIMUM RATINGS
KGF1323¡ electronic components
Item
Drain-source voltage
Gate-source voltage
Drain current I
Total power dissipation
Channel temperature
Storage temperature T
Symbol Condition Max.Unit
V
DS
V
GS
DS
P
tot
T
ch
stg
Ta = 25°C
Ta = 25°C
V
V
Ta = 25°C 3.0A
Ta = Tc = 25°C
W
°C
125°C
Min.
–6.0
–45
ELECTRICAL CHARACTERISTICS
Item
Gate-source leakage current 100mA—VGS = –6 V
Gate-drain leakage current 500mA—VGD = –16 V
Drain-source leakage current 1500mA—VDS = 10 V, VGS = –6 V
Drain current A 2.0VDS = 1.5 V, VGS = 0 V
Gate-source cut-off voltage –2.8V –3.8VDS = 3 V, IDS = 4.8 mA
Output power dBm
Linear gain G
Thermal resistance R
*1 Condition: f = 850 MHz, V
Symbol Condition Max.Unit
I
GSS
I
GDO
I
DS(off)
I
DSS
V
GS(off)
P
O
D
LIN
th
= 5.8 V, I
DS
(*1), P
(*1), P
= 22 dBm
IN
= 22 dBm %
IN
= 0 dBm
IN
= 240 mA
DSQ
dB
°C/W —14Channel to case
Min.
33.0
60
Typ.
33.5
70Drain efficiency h
10
0.4
5
150
(Ta = 25°C)
15.0(*1), P
3/7
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