NXP Semiconductors UM10972 User Manual

UM10972
TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
Rev. 1.1 — 8 June 2018 User manual
COMPANY PUBLIC
Document information
Keywords TEA1916DB1262, TEA19161T, TEA19162T TEA1995T 240 W, LLC,
resonant, half-bridge, PFC, controller, converter, burst mode, power supply, demo board, high efficiency, 80+ certification
Abstract The TEA19161T is a digital LLC controller. It is used in combination with the
PFC controller TEA19162T.Combining these two ICs with the SR controller TEA1995T at the secondary side results in a high-efficient resonant converter over the whole output power range. This document describes such a resonant power supply design with a 240 W (12 V/20 A) typical output power. It operates in normal mode for high and medium power levels, in low-power mode at medium and low power levels, and in burst mode at (very) low power levels. Low-power mode and burst mode operation provide a reduction of power losses, resulting in a higher efficiency at lower output power levels. Power levels for switching over from one mode to another mode can be selected by adjusting component values. The efficiency at high power levels is well above 90 %. No-load power consumption is well below 100 mW. At 250 mW output power, the input power is well below the 500 mW (complies easily with EUP lot6).
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TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
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Table 1. Revision history
Rev Date Description
v.1.1 20180608 second, updated issue
Modifications: Section 7 "Bill of Materials" has been updated.
Section 9.2 "PFC coil" has been updated.
v.1 20171201 first issue
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TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
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1 Introduction
Warning
The non-insulated high voltages that are present when operating this product, constitute a risk of electric shock, personal injury, death and/or ignition of fire.
This product is intended for evaluation purposes only. It shall be operated in a designated test area by personnel qualified according to local requirements and labor laws to work with non-insulated mains voltages and high-voltage circuits. This product shall never be operated unattended.
This user manual describes the TEA1916DB1262 240 W power supply board using the TEA19161T, TEA19162T, and TEA1995T. The user manual contains a functional description and a set of preliminary measurements to show the main characteristics.
1.1 TEA19161T and TEA19162T
The TEA19161T is a Half-Bridge Converter (HBC). The TEA19162T is a controller for Power Factor Correction (PFC). Both ICs provide drive functionality for the related discrete MOSFETs.
The resonant controller part (TEA19161T) is a high-voltage controller for a zero voltage switching LLC resonant converter. The resonant controller includes:
A high-voltage shift circuit
A high-voltage internal start-up switch
Several protection features, like OverCurrent Protection (OCP), Open-Loop Protection
(OLP), Capacitive Mode Protection (CMP), and a general purpose latched protection input
The TEA19162T is a PFC controller. To ensure efficient operation of the PFC, the TEA19162T incorporates quasi-resonant operation at high power levels and quasi­resonant operation with valley skipping at lower power levels. OCP, OverVoltage Protection (OVP), and demagnetization sensing ensure safe operation under all conditions. To improve the overall performance significantly, the TEA19161T and TEA19162T work together.
With the TEA1995T as a synchronized rectifier controller at the secondary side, MOSFETs can be used instead of rectifying diodes, improving the overall efficiency of the complete system even more.
The combination of PFC, resonant controller, and SR controller makes these devices suitable for all kinds of applications. Especially for application requiring high efficiency over the whole power range from no load to maximum output load.
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TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
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1.1.1 Pinning
IC
SUPIC SNSBOOST
SNSFB SNSCAP
SNSOUT SNSCUR
GND
SNSSET
SUPREG n.c.
GATELS HB
n.c. SUPHS
SUPHV GATEHS
aaa-017286
1
2
3
4
5
6
7
8
10
9
12
11
14
13
16
15
IC
GATEPFC SNSAUX
GND PFCCOMP
SNSCUR SNSMAINS
SUPIC SNSBOOST
aaa-017287
1
2
3
4
6
5
8
7
a. TEA19161T b. TEA19162T
Figure 1. Pinning diagrams
1.2 TEA1995T
The TEA1995T is the first product of a new generation of Synchronous Rectifier (SR) controller ICs for switched-mode power supplies. It incorporates an adaptive gate drive method for maximum efficiency at any load.
The TEA1995T is a dedicated controller IC for synchronous rectification on the secondary side of resonant converters. It includes two driver stages for driving the SR MOSFETs, which rectify the outputs of the central tap secondary transformer windings. The two-gate driver stages have their own sensing inputs and operate independently.
IC
GDB GDA
GND V
CC
DSB DSA
SSB SSA
aaa-016990
1
2
3
4
6
5
8
7
Figure 2. TEA1995T pinning diagram
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UM10972
TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
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2 Safety warning
The board must be connected to mains voltage. Avoid touching the demo board while it is connected to the mains voltage. An isolated housing is obligatory when used in uncontrolled, non-laboratory environments. Galvanic isolation of the mains phase using a variable transformer is always recommended. Figure 3 shows the symbols that identify the isolated and non-isolated devices.
019aab173
019aab174
a. Isolated b. Not isolated
Figure 3. Isolation symbols
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TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
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3 Specifications
Table 2. Specifications
Symbol Description Value Conditions
Input
V
i
input voltage 90 V (RMS) to
264 V (RMS)
AC
f
i
input frequency 47 Hz to 63 Hz
P
i(noload)
no-load input power < 100 mW at 230 V/50 Hz
P
i(load=250mW)
standby power consumption
< 450 mW at 230 V/50 Hz
Output
V
o
output voltage 12 V
I
o
output current 0 A to 20 A continuous
I
o(max)
maximum output current
25 A with OPP
I
o(peak)max
maximum peak output current
30 A t < 50 ms
t
hold
hold time > 10 ms at 115 V/60 Hz;
full load
t
start
start time ≤ 0.5 s at 115 V/60 Hz
η efficiency ≥ 89 % average according to
CoC
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TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
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4 Board photographs
a. Top view
b. Bottom view
Figure 4.  TEA1916DB1262 prototype 240 W demo board
The board can operate at a mains input voltage between 90 V (RMS) and 264 V (RMS; universal mains).
The TEA1916DB1262demo board contains two subcircuits:
A BCM-type PFC converter
A resonant LLC-type HBC converter
To achieve an optimized resonant power board, the converters are working together.
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TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
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The purpose of the TEA1916DB1262 prototype demo board is to evaluate the operation of the combination of converters (TEA19161T, TEA19162T, and TEA1995T) in a single output supply, which includes all modes. The performance passes general standards, including the EuP lot6 requirements. It can be used as a starting point for further development.
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TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
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5 Performance measurements
5.1 Test facilities
Oscilloscope: Yokogawa DL9140L
AC Power Source: Agilent 6812B
Electronic load: Agilent 6063B
Digital power meter: Yokogawa WT210
5.2 Start-up behavior
The rise time of the output voltage (measured from 10 % to 90 % point of the nominal output) is between 6 ms and 10 ms. The rise time depends on the output current load.
a. Start-up at 230 V mains and no load (0 A) b. Start-up at 115 V mains and nominal load (20 A)
(1) PFC (2) HBC (3) V
out
(4) I
out
Figure 5. Start-up behavior
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TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
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a. Start-up time = 381 ms at V
mains
= 230 V (RMS) mains
(I
out
= 20 A)
b. Start-up time = 495 ms at V
mains
= 115 V (RMS) mains
(I
out
= 20 A)
(1) V
SUPIC
(2) V
out
(3) V
bulk
(4) I
out
Figure 6. Start-up time at different mains voltages
Table 3. Start-up time
Condition Start-up time (ms)
115 V/60 Hz 470
230 V/50 Hz 380
requirement < 500
5.3 Efficiency
5.3.1 Efficiency characteristics
To determine the efficiency, the output voltage (not taking into account the losses in an output connection cable) on the TEA1916DB1262 demo board was measured.
Table 4. Efficiency results
Condition CoC efficiency
average requirement (%)
Average 25 % load 50 % load 75 % load 100 % load
115 V/60 Hz > 89 91.17 90.12 91.97 91.84 90.77
230 V/50 Hz > 89 92.6 91.06 93.29 93.2 92.71
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TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
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aaa-022160
10 25 40 55 70 85 100
85
87
89
91
93
95
Load (%)
ηη
(%)(%)
(1)(1)
(2)(2)
1. V
mains
= 230 V (RMS)
2. V
mains
= 115 V (RMS)
Figure 7. Efficiency curve
aaa-022161
0 50 100 150 200 250
25
75
125
175
225
275
P
out
(W)
PinP
in
(W)(W)
(2)(2)
(1)(1)
1. V
mains
= 230 V (RMS)
2. V
mains
= 115 V (RMS)
Figure 8. Power consumption
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TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
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5.3.2 No-load power consumption
Power consumption performance of the total application board at no load was measured with a Yokogawa WT210 digital power meter. To measure the power consumption over a long time, the integration time function was used.
Table 5. Output voltage and power consumption at no load
Condition ENERGY STAR 2.0
requirement
Output voltage Power consumption
115 V/60 Hz ≤ 500 mW 12.2 V 46 mW
230 V/50 Hz ≤ 500 mW 12.2 V 51 mW
5.3.3 Standby load power consumption
Power consumption performance of the total application board at standby load was measured with a Yokogawa WT210 digital power meter. To measure the power consumption over a long time, the integration time function was used.
Table 6. Output voltage and power consumption at no load
Condition ENERGY STAR 2.0
requirement
Output voltage Power consumption
115 V/60 Hz 250 mW 12.2 V 356 mW
230 V/50 Hz 250 mW 12.2 V 357 mW
Requirement < 500 mW
5.3.4 Power factor correction
Table 7. Output voltage and power consumption at no load
Condition ENERGY STAR 2.0
requirement
Output power Power factor
115 V/60 Hz ≥ 0.9 mW 240 W 0.992
115 V/60 Hz - 120 W 0.976
230 V/50 Hz - 240 W 0.945
230 V/50 Hz - 120 W 0.911
5.4 Low-power mode and burst mode operation
To reach a high efficiency at medium/low and standby output power, the low-power mode and burst mode are introduced.
In low-power mode, the behavior of the half-bridge converter is changed compared to the standard behavior at maximum output power. The result is a higher efficiency that is close to the expected efficiency at maximum load.
The power level for leaving the high-power mode and entering the low-power mode can be adjusted. Here the power level is set at 53.4 W.
Below 21.3 W, the HBC converter enters burst mode, which improves the overall efficiency at lower output loads.
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Finally, when the output power level is further reduced, the PFC converter enters burst mode.
The power supply consumes more power without low-power mode and burst mode.
a. PFC continues switching until regulation level is reached, swaps after that to normal mode when P
out
is low. The
measurement example shows the result at Pout = 13.8 W.
b. FC continues switching until regulation level is reached, then swaps to burst mode when P
out
is very low. The
measurement example shows the result at P
out
= 6.6 W.
(1) PFC (2) HBC (3) V
out
Figure 9. HBC burst mode operation after initial start-up
a. The “wait” time increases at lower output power when the HBC operates in low-power mode. The measurement example shows the result at P
out
= 22.5 W.
b. The “wait” time decreases at higher output power when the HBC operates in low-power mode. The measurement example shows the result at P
out
= 39.7 W.
(1) PFC (2) HBC (3) V
out
(4) I
out
Figure 10. HBC low-power mode operation
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5.5 Operation mode transitions
(1) GATELS (2) GATEPFC (3) HBC (4) V
out(ripple)
(5) I
out
Figure 11. Transitions HP - LP - BM
Table 8. Mode transitions
Transition Power level
HP - LP 53.4 W
LP - BM 21.3 W
BM - LP 21.3 W
LP - HP 60.2 W
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5.6 Output voltage ripple
(1) V
out
(AC)
(2) I
out
Figure 12. Maximum output voltage ripple in burst mode at 50 % duty cycle
The maximum output voltage ripple is 114 mV (peak-to-peak).
5.7 Dynamic load response
The dynamic load response test shows the result of constant load steps across the output. Output current of the converter is changed in steps of between 0 A and 20 A at a repetition frequency of 1 Hz, 10 Hz, 100 Hz, and 1000 Hz.
Table 9. Minimum and maximum output voltage at minimum-maximum load steps
Condition Load Minimum to maximum output
voltage
115 V/60 Hz Io: 0 % to 100 % 11.48 V to 12.47 V
230 V/50 Hz Io: 0 % to 100 % 11.48 V to 12.47 V
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a. Basic sequential load step test is done at 1 Hz b. Basic sequential load step test is done at 10 Hz
c. Basic sequential load step test is done at 100 Hz d. Basic sequential load step test is done at 1 kHz
(1) V
out
(2) I
out
Figure 13. Output voltage during dynamic load test
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TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
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5.8 OverPower Protection (OPP)
Tested with a higher current (dynamic overload) on the output voltage, OPP is activated when the current exceeds 25 A (300 W). This current corresponds with a load condition that is 25 % higher than the rated power for continuous use.
OPP allows a typical continuously maximum output current of 25 A during 50 ms. Any higher current, intended to run longer than 50 ms, triggers an OPP. After the 50 ms, a safe restart follows (OPP protection is reset).
The SNSCAP function of the TEA19161 detects OPP. This function monitors the voltage across the series capacitor (C211) of the half bridge.
The power capability limitation protection limits the maximum power to 360 W as long as the time is shorter than 50 ms.
a. OPP protection is triggered at I
out
≈ 27 A (output power is
lost during a safe restart)
b. OPP is not triggered at I
out
≈ 26 A
(1) V
out
(2) GATELS (3) HBC (4) I
out
Figure 14. Overpower protection
The power capability limitation level limits the maximum output power to typically 360 W as long as the time fits within the selected OPP timer. In this example, the time is shorter than 50 ms. So, when more output current is requested than accepted by the power capability limitation level, the output voltage drops.
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TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
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(1) V
out
(2) HBC (3) I
out
(4) GATELS
Figure 15. Power capability level
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TEA1916DB1262 digital resonant 240 W/12 V power supply demo board
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5.9 Hold time
The output was set to full load and the mains supply voltage of 115 V disconnected. The time that passes before the output voltage falls below 90 % of its initial value was measured. The hold time is 29 ms.
(1) V
line
(2) V
out
(3) I
out
(4) HBC
Figure 16. Hold time at V
MAINS
= 115 V and nominal load
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5.10 Short-Circuit Protection (SCP)
The output was shorted before the resonant converter was connected to the mains. A short circuit across the output of the resonant converter increases primary current. The SNSCUR pin detects the increase. When this voltage exceeds ±1.5 V, the safe-restart protection is triggered. Approximately 4 ms after the HBC is started, the protection level is reached. Removing the short across the output resets the protection.
(1) SUPIC (2) HBC (3) SNSCUR
Figure 17. Safe-restart protection during shorted output
Table 10 shows the input power when the output is shorted.
Table 10. Input power when output power is shorted
Condition Pin (W)
115 V; 60 Hz 1.75
230 V; 50 Hz 1.70
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5.11 OverVoltage Protection (OVP)
(1) V
out
(2) I
out
(3) SNSOUT
Figure 18. Overvoltage protection at V
out
= 14.1 V (SNSOUT triggers latched protection)
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5.12 X-capacitor discharge time
The power line was unplugged at no-load. The discharge time was measured at the X­capacitor (470 nF + 470 nF).
Table 11. X-capacitor discharge time test results
Condition From 264 * √2 to 135 V
X-capacitor discharge time 505 ms
(1) V
xcap
(2) V
out
(3) GATEPFC
Figure 19. X-capacitor discharge at 264 V (RMS)/50 Hz and no load
5.13 ElectroMagnetic Compatibility (EMC)
The conducted ElectroMagnetic Interference (EMI) of the TEA1916DB1262 prototype demo board was measured under the following conditions:
Load resistor: 0.6 Ω; V
out
= 12.1 V; I
out
=20.1 A
V
line
= 230 V/50 Hz or 120 V/50 Hz
The conducted EMI was measured both in the Line and Neutral. The product complies with the EMC standard.
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a. Line b. Neutral
Figure 20. Conducted EMI at V
line
= 230 V
RMS
a. Line b. Neutral
Figure 21. Conducted EMI at V
line
= 120 V
RMS
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6 Schematic
aaa-022069
GATEPFC
GND
SUPREG
R101 10 MΩ 1 %
C104 470 nF 450 V
C103
1 µF
450 V
n.m.
C105 470 nF 450 V n.m.
C106 1 µF 450 V
CX101 470 nF
310 VAC
CX102 470 nF 310 VAC
14
2
3
LF102
6.8 mH
GDT4 n.m. 2051-20
GDT3 n.m. DSP-201M
GDT2 2051-20
BD101 GBU806
BD101
on heatsink
L103
100 µH, 5 A
GDT5 n.m. DSP-201M
GDT6 2051-20
GDT1 n.m. DSP-201M
431
2
R121
R102 10 MΩ 1 %
SNSCUR
SUPIC
SUPIC
SNSAUX
U101
TEA19162
PFCCOMP
SNSMAINS
SNSBOOST
1
2
3
4
8
7
6
5
360 kΩ
n.m.
F101
SS-5H-4A-APH
R198
0 Ω
D104
BAS416
R110
5.1 kΩ
R107
0.05 Ω
C107 47 pF 1 kV
R114 750 kΩ 1 %
C115 180 µF 450 V
R115
7.5 MΩ 1 %
R116
7.5 MΩ 1 %
C114 1 nF 50 V
R118 100 kΩ 1 %
C116 47 nF 630 V
C117 47 nF 630 V
on heat sink Q101 IPA60R190P6
R108
0.2 Ω
SNSBOOST
VBOOST
PG3
PG3
PG1 PG1
PG1
R120
3.9 kΩ 1 %
R113 100 kΩ
C110 470 nF 50 V
C109 150 nF 50 V
C111 10 pF 50 V n.m.
C112 10 nF 50 V
C113 100 nF 50 V
R112 33 kΩ
R111
3.6 kΩ n.m.
C108 100 pF 50 V
R103
4.7 Ω
D105
1N5408
WB102
923345-10
923345-04
WB101
L104
PQ32/20
10
14
13
3
9
PG3
PG1
PG3
4
R106
1 kΩ
R104
20 Ω
R196
0 Ω
D103
BAS316
D102
MURS360T3G
R197
0 Ω
R199
0 Ω
earth wire
E101 AWG18 earth
E103
AWG15
L
E104
AWG15
N
PE
E102 mounting hole earth casing earth
L
N
PG3
PG3
PG3 PG3 PG1
Figure 22. Schematic TEA1916DB1262 240 W prototype demo board (PFC)
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aaa-022070
VBOOST
SNSBOOST
WB201
WB202
C216 10 nF 500 V
923345-10 923345-03
R214
6.2 kΩ
R213
6.2 kΩ
WB208
923345-03
R231
6.2 kΩ
R202
10 Ω
R201
22 Ω
D201
BAS316
BAS316
R232
6.2 kΩ CY201
2.2 nF 250 V
SUPHV
TEA1916T
NC1
GATELS
SUPREG
GND
SNSOUT
SNSFB
SUPIC
9
U201
10
11
12
13
14
15
16
8
7
6
5
4
3
2
1
GATEHS
PG1
D206
C213
330 nF
50 V
C218 680 pF 50 V
WB206
923345-05
R209 R208
WB205
923345-10
2.7 MΩ 2.2 MΩ
C222
R298
0 Ω
R206
56 kΩ, 1 %
R296
0 Ω
R299
0 Ω
120 pF
50 V n.m.
C209
1 nF 1 kV
R208
33 pF
1 kV
WB209
923345-05
n.m.
C210
2.2 nF 50 V
R229
Q203 BS170
R212
61.9 kΩ 1 %C212
33 nF
50 V
R211
6.8 kΩ 1 %
WB207
U202B VOL618A-3X001T
U203A VOL618A-3X001T
923345-05
3
SUPREG
4
2
1
0 Ω
R230
27 kΩ
MURS160
SUPHS
HB
NC2
SNSSET
SNSCUR
SNSCAP
SNSBOOST
PG1
C207
5.1 nF 50 V
PG1
C219 680 pF 100 V
PG1
C203 47 pF
50 V
C204 470 nF 50 V
C214 1 µF 50 V
C215 10 µF 63 V
923345-06
WB203
R297 0 Ω
R207 10 kΩ 1 %
C206 47 µF 35 V
D203
BAS316
T1A
3
1 2
1
6
5
4
T1B D204 ES1D
D205 ES1D
PG1
SUPIC
PG1 PG1
SUPREG
PG1PG1
C221 10 nF 50 V
C211 33 nF 1 kV
C220 47 nF 1 kV n.m.
PG1
PG1
D208 BAS316 n.m.
PG1
PG1
R215 20 kΩ 1 %
PG2
PG1
R210
5.6 Ω
D207 BAS316 n.m.
PG1
PG1
0 Ω
n.m.
R234
180 kΩ
n.m.
R233
R204
10 Ω
R203
22 Ω
R205 180 kΩ 1 %
C201 330 pF 1 kV
Q201 and Q202
on heat sink
SG1
sparkgap
6.0 mm
HS for BD101, Q101, Q201 and Q202 TEA1916DB1252-PRI HS101
Lp = 600 µH Ls = 100 µH 35:3:3:2:2 prim: aux 1: aux 2: sec 1: sec 2
750315374 ETD34
Q201 SPA12N50C3
PG1
PG1
PG1
PG2 PG1
PG2
D202
923345-04
WB204
C202 330 pF 1 kV
Q202 SPA12N50C3
PG1
Figure 23. Schematic TEA1916DB1262 240 W prototype demo board (LLC)
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aaa-022072
8
10
T1C
9
11
GATEB
GND DSB SSB
GATEA
U301
R302
C302 2200 µF 16 V
WB301 923345-03
WB302 923345-04
mounting hole for wire; 20 A
mounting hole for wire; 20 A
AWG16 Vo
AWG16 GND
WB303 923345-03
C303 2200 µF 16 V
L302
Option:
replace coil by wire
L301
900 nH
900 nH
R304
0 Ω
0 Ω
TEA1995T
VCC DSA SSA
1 2 3 4
8 7 6 5
R301
R303
0 Ω
C301
100 nF, 50 V
0 Ω
R306
20-2137
D301
BZX384-C3V3
U202B VOL618A-3X001T
U202A VOL618A-3X001T
D302 BAS316
Q301
PSMN1R8-40YLC
Q306 n.m.
PSMN2R2-40PS
Q302 PSMN1R8-40YLC Q307 n.m. PSMN2R2-40PS
R305
1.8 kΩ
AWG18
earth
wire
1
2
4
3
100 kΩ
C304 2200 µF 16 V
R307 39 kΩ
R309 51 Ω
C305
1.5 nF,50 V
R308
47 kΩ
C306
47 nF 50 V
R310 47 Ω
U302
AS431IBNTR-G1
R311 10 kΩ
Vout
mounting hole for wire; 20 A
mounting hole for wire; 20 A
CN302
22-23-2021
fan
Vout
1
2
Figure 24. Schematic TEA1916DB1262 240 W prototype demo board (synchronous rectifier)
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7 Bill Of Materials (BOM)
Table 12. Bill Of Materials (BOM)
Reference Description and values Part number Manufacturer
BD101 bridge rectifier; 600 V; 8 A - -
C103 capacitor; not mounted; 1 μF; 10 %;
450 V; PET; THT
- -
C104 capacitor; 470 nF; 10 %; 450 V; PET;
THT
- -
C105 capacitor; not mounted; 470 nF; 10 %;
450 V; PET; THT
- -
C106 capacitor; 1 μF; 10 %; 450 V; PET;
THT
- -
C107 capacitor; 47 pF; 5 %; 1 kV; C0G;
1206
- -
C108 capacitor; 100 pF; 10 %; 50 V; X7R;
0603
- -
C109 capacitor; 150 nF; 10 %; 50 V; X7R;
0603
- -
C110 capacitor; 470 nF; 10 %; 50 V; X7R;
0805
- -
C111 capacitor; not mounted; 10 pF; 10 %;
50 V; X7R; 0603
- -
C112 capacitor; 10 nF; 10 %; 50 V; X7R;
0603
- -
C113 capacitor; 100 nF; 10 %; 50 V; X7R;
0603
- -
C114 capacitor; 1 nF; 10 %; 50 V; X7R;
0603
- -
C115 capacitor; 180 μF; 20 %; 450 V; ALU;
THT
- -
C116; C117 capacitor; 47 nF; 10 %; 630 V; X7R;
1210
- -
C201; C202 capacitor; 330 pF; 5 %; 1 kV; C0G;
1206
- -
C203 capacitor; 47 pF; 10 %; 50 V; X7R;
0805
- -
C204 capacitor; 470 nF; 10 %; 50 V; X7R;
0805
- -
C206 capacitor; 47 μF; 20 %; 35 V; ALU;
THT
- -
C207 capacitor; 5.1 nF; 5 %; 50 V; COG;
0603
- -
C208 capacitor; 33 pF; 5 %; 1 kV; C0G;
1206
- -
C209 capacitor; 1 nF; 5 %; 1 kV; C0G; 1812 - -
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Reference Description and values Part number Manufacturer
C210 capacitor; 2.2 nF; 10 %; 50 V; X7R;
0603
- -
C211 capacitor; 33 nF; 20 %; 1 kV; MKP - -
C212 capacitor; 33 nF; 10 %; 50 V; X7R;
0603
- -
C213 capacitor; 330 nF; 10 %; 50 V; X7R;
0805
- -
C214 capacitor; 1 μF; 10 %; 50 V; X7R;
0805
- -
C215 capacitor; 10 μF; 20 %; 63 V; ALU;
THT
- -
C216 capacitor; 10 nF; 10 %; 500 V; X7R;
1812
- -
C218 capacitor; 680 pF; 10 %; 50 V; X7R;
0603
- -
C219 capacitor; 680 pF; 5 %; 50 V; COG;
0603
- -
C220 capacitor; not mounted; 47 nF; 5 %;
1 kV; MKP
- -
C221 capacitor; 10 nF; 10 %; 50 V; X7R;
0805
- -
C222 capacitor; not mounted; 120 pF; 5 %;
50 V; COG; 0603
- -
C301 capacitor; 100 nF; 10 %; 50 V; X7R;
0603
- -
C302; C303; C304
capacitor; 2200 μF; 20 %; 16 V; ALU; THT
- -
C305 capacitor; 1.5 nF; 10 %; 50 V; X7R;
0603
- -
C306 capacitor; 47 nF; 10 %; 50 V; X7R;
0603
- -
CN302 header; straight; 2-way - -
CX101; CX102 capacitor; 470 nF; 20 %; 310 V (AC);
MKP; THT
- -
CY201 capacitor; 2.2 nF; 20 %; 250 V; CER;
THT
- -
D102 diode; 600 V; 3 A - -
D103; D201; D202; D203; D302
diode; 100 V; 250 mA - -
D104 diode; 85 V; 200 mA - -
D105 diode; 1 kV; 3 A - -
D204; D205 diode; 140 V; 1 A - -
D206 diode; 600 V; 1 A - -
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Reference Description and values Part number Manufacturer
D207; D208 diode; not mounted; 100 V; 250 mA - -
D301 diode; Zener; 3.3 V; 250 mA - -
F101 fuse; slow blow; 300 V (AC); 4 A - -
GDT2; GDT6 gas discharge tube; 200 V; THT - -
GDT4 gas discharge tube; not mounted - -
HS101 heat sink; primary - -
L103 inductor; 100 μH; 5 A 7447070 Würth Elektronik
L104 coil former; PQ32/20 750315487 Würth Elektronik
L301; L302 inductor; 900 nH - -
LF102 inductor; common mode; 6.8 mH;
3.2 A
- -
Q101 MOSFET-N; 600 V; 20.2 A - -
Q201; Q202 MOSFET-N; 560 V; 11.6 A - -
Q203 MOSFET-N; 60 V; 500 mA - -
Q301; Q302 MOSFET-N; 40 V; 100 A - -
Q306; Q307 MOSFET-N; not mounted; 40 V;
100 A
- -
R101; R102 resistor; 10 MΩ; 1 %; 250 mW; 1206 - -
R103 resistor; 4.7 Ω; 1 %; 63 mW; 0603 - -
R104 resistor; 20 Ω; 1 %; 63 mW; 0603 - -
R106 resistor; 1 kΩ; 1 %; 63 mW; 0603 - -
R107 resistor; 0.05 Ω; 1 %; 1 W; 2512 - -
R108 resistor; 0.2 Ω; 1 %; 1 W; 2512 - -
R110 resistor; 5.1 kΩ; 1 %; 63 mW; 0603 - -
R111 resistor; not mounted; 3.6 kΩ; 1 %;
63 mW; 0603
- -
R112 resistor; 33 kΩ; 1 %; 63 mW; 0603 - -
R113 resistor; NTC; 100 kΩ; 5 %; 500 mW - -
R114 resistor; 750 kΩ; 1 %; 250 mW; 1206 - -
R115; R116 resistor; 7.5 MΩ; 1 %; 250 mW; 1206 - -
R118 resistor; 100 kΩ; 1 %; 63 mW; 0603 - -
R120 resistor; 3.9 kΩ; 1 %; 63 mW; 0603 - -
R121 resistor; not mounted; 360 kΩ; 1 %;
63 mW; 0603
- -
R196; R197; R198; R199
resistor; jumper; 0 Ω; 250 mW; 1206 - -
R201; R203 resistor; 22 Ω; 1 %; 63 mW; 0603 - -
R202; R204 resistor; 10 Ω; 1 %; 63 mW; 0603 - -
R205 resistor; 180 kΩ; 1 %; 63 mW; 0603 - -
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Reference Description and values Part number Manufacturer
R206 resistor; 56 kΩ; 1 %; 63 mW; 0603 - -
R207 resistor; 10 kΩ; 1 %; 63 mW; 0603 - -
R208 resistor; 2.2 MΩ; 1 %; 250 mW; 1206 - -
R209 resistor; 2.7 MΩ; 1 %; 250 mW; 1206 - -
R210 resistor; 5.6 Ω; 1 %; 63 mW; 0603 - -
R211 resistor; 6.8 kΩ; 1 %; 63 mW; 0603 - -
R212 resistor; 61.9 kΩ; 1 %; 63 mW; 0603 - -
R213; R214; R231; R232
resistor; 6.2 kΩ; 1 %; 250 mW; 1206 - -
R215 resistor; 20 kΩ; 1 %; 63 mW; 0603 - -
R229 resistor; jumper; 0 Ω; 63 mW; 0603 - -
R230 resistor; 27 kΩ; 1 %; 63 mW; 0603 - -
R233 resistor; not mounted; 180 kΩ;
63 mW; 0603
- -
R234 resistor; jumper; not mounted; 0 Ω;
250 mW; 1206
- -
R296; R297; R298; R299
resistor; jumper; 0 Ω; 250 mW; 1206 - -
R301; R302; R303; R304
resistor; jumper; 0 Ω; 63 mW; 0603 - -
R305 resistor; 1.8 kΩ; 1 %; 63 mW; 0603 - -
R306 resistor; 100 kΩ; 1 %; 63 mW; 0603 - -
R307 resistor; 39 kΩ; 1 %; 63 mW; 0603 - -
R308 resistor; 47 kΩ; 1 %; 100 mW; 0603 - -
R309 resistor; 51 Ω; 1 %; 63 mW; 0603 - -
R310 resistor; 47 Ω; 1 %; 63 mW; 0603 - -
R311 resistor; 10 kΩ; 1 %; 63 mW; 0603 - -
SG1 spark gap; 6.0 mm - -
T1 transformer; ETD3 750315374 Würth Elektronik
U101 PFC driver; TEA19162T; SO8 - NXP Semiconductors
U201 LLC controller; TEA19161T; SO16 - NXP Semiconductors
U202; U203 optocoupler; NPN; 80 V; 60 mA - -
U301 synchronous rectifier controller; dual;
TEA1995T; SO8
- NXP Semiconductors
U302 Regulator; AS431 - -
WB102; WB201; WB205
wire bridge; 0.8 mm; P = 25.40 mm - -
WB101; WB204; WB302
wire bridge; 0.8 mm; P = 10.16 mm - -
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Reference Description and values Part number Manufacturer
WB202; WB208; WB301; WB303
wire bridge; 0.8 mm; P = 7.62 mm - -
WB203 wire bridge; 0.8 mm; P = 15.24 mm - -
WB206; WB207 wire bridge; 0.8 mm; P = 12.10 mm - -
WB209 wire bridge; not mounted; 0.8 mm;
P = 12.10 mm
- -
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8 Layout
a. Layout
b. Components
Figure 25. Demo board layout and components (copper tracks and areas)
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9 Transformer specifications
9.1 Resonant transformer
term numbers for reference only
36 max
dot locates term #1
26.5 max
1
2
3
4
5
6
12
11
10
9
8
7
2.5 min
36 max
lot code and date code
8
10
12 V, 10 A
12 V, 10 A
dimensions in mm
70-120 kHz,
360-400 V
18 V, 30 mA
18 V, 30 mA
9
11
4
5
6
1
3
N2
N3
N4
N4
N5
aaa-022216
Ø 0.8 (x12) part must insert fully to surface A in recommended grid
28
5.5
Ø 1.6 (x12)
A
Figure 26. Resonant transformer
Table 13. Resonant transformer specifications
Parameter Values Test conditions
DC resistance; 3-1 0.152 Ω; ±10 % at 20 °C
DC resistance; 8-10 maximum 0.005 Ω at 20 °C
DC resistance; 9-11 maximum 0.005 Ω at 20 °C
DC resistance; 6-5 0.122 Ω; ±10 % at 20 °C
DC resistance; 5-4 0.122 Ω; ±10 % at 20 °C
inductance; 3-1 600 μH; ±10 % 10 kHz; 100 mV; L
s
saturation current; 3-1 1.7 A 20 % roll-off from initial
leakage inductance; 3-1 100 μH; ±10 % tie(4+5+6, 8+9+10+11);
100 kHz; 100 mV; L
s
dielectric; 1-11 3200 V (AC); 1 minute tie(3+4, 10+11); 4000 V (AC);
1 s
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Parameter Values Test conditions
(3-1):(9-11)turns ratio 17.5:1; ±1 %
(3-1):(8-10)
(3-1):(6-5)turns ratio 11.67:1; ±1 %
(3-1):(5-4)
9.2 PFC coil
dimensions in mm
aaa-022217
dot locates term #1
lot code and date code
Ø 0.8 (x12) part must insert fully to surface A in recommended grid
term numbers for reference only
30.48
5.08
7.62
Ø 1.6 (x12)
4
3
10
9
auxiliaryprimary
recommended
P.C. pattern component side
1
2
3
4
5
6
12
11
10
9
8
7
37.34 max
35.56 max
24.13 max
2.8 min
A
Note: Pin 4 is connected to the core. Marking PFC: "750315487"
Figure 27. PFC coil
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Table 14. PFC coil specifications
Parameter Value Condition
Electric specifications
DC resistance; 3-4 0.048 Ω; ±20 % at 20 °C
DC resistance; 9-10 0.060 Ω; ±20 % at 20 °C
inductance; 9-10 130 μH; ±5 % 10 kHz; 100 mV; L
s
saturation current; 9-10 13 A 20 % roll-off from initial
leakage inductance; 9-10 52 μH (typical);
maximum 75 μH
tie(3+4); 100 kHz; 100 mV; L
s
dielectric; 3-10 1500 V (AC); 1 s
turns ratio 30:1; ±1 % (9-10):(4-3)
General specifications
operating temperature −40 °C to +125 °C including temperature rise
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10 Abbreviations
Table 15. Abbreviations
Acronym Description
BCM Boundary Conduction Mode
CMP Capacitive Mode Protection
EMC ElectroMagnetic Compatibility
EMI ElectroMagnetic Interference
HBC Half-Bridge Converter
MOSFET Metal-Oxide Semiconductor Field-Effect Transistor
OCP OverCurrent Protection
OPP OverPower Protection
OVP OverVoltage Protection
OLP Open-Loop Protection
PCB Printed-Circuit Board
PFC Power Factor Correction
RMS Root Mean Square
SOI Silicon-On Insulator
ZVS Zero-Voltage Switching
11 References
1 TEA19161T data sheet Digital controller for high-efficiency resonant power supply; 2016,
NXP Semiconductors
2 TEA19162T data sheet PFC controller; 2016, NXP Semiconductors 3 TEA1995T data sheet GreenChip dual synchronous rectifier controller; 2015, NXP
Semiconductors
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12 Legal information
12.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.
12.2 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.
Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose.
Safety of high-voltage evaluation products — The non-insulated high voltages that are present when operating this product, constitute a risk of electric shock, personal injury, death and/or ignition of fire. This product is intended for evaluation purposes only. It shall be operated in a designated test area by personnel that is qualified according to local requirements and labor laws to work with non-insulated mains voltages and high-voltage circuits. The product does not comply with IEC 60950 based national or regional safety standards. NXP Semiconductors does not accept any liability for damages incurred due to inappropriate use of this product or related to non-insulated high voltages. Any use of this product is at customer’s own risk and liability. The customer shall fully indemnify and hold harmless NXP Semiconductors from any liability, damages and claims resulting from the use of the product.
Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
12.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
GreenChip — is a trademark of NXP B.V.
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Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'.
© NXP B.V. 2018. All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 June 2018
Document identifier: UM10972
Contents
1 Introduction ......................................................... 3
1.1 TEA19161T and TEA19162T ............................ 3
1.1.1 Pinning ............................................................... 4
1.2 TEA1995T .......................................................... 4
2 Safety warning .................................................... 5
3 Specifications ...................................................... 6
4 Board photographs .............................................7
5 Performance measurements .............................. 9
5.1 Test facilities ...................................................... 9
5.2 Start-up behavior ............................................... 9
5.3 Efficiency ..........................................................10
5.3.1 Efficiency characteristics ................................. 10
5.3.2 No-load power consumption ............................ 12
5.3.3 Standby load power consumption ....................12
5.3.4 Power factor correction ....................................12
5.4 Low-power mode and burst mode operation ....12
5.5 Operation mode transitions ............................. 14
5.6 Output voltage ripple ....................................... 15
5.7 Dynamic load response ................................... 15
5.8 OverPower Protection (OPP) ...........................17
5.9 Hold time ......................................................... 19
5.10 Short-Circuit Protection (SCP) ......................... 20
5.11 OverVoltage Protection (OVP) .........................21
5.12 X-capacitor discharge time .............................. 22
5.13 ElectroMagnetic Compatibility (EMC) .............. 22
6 Schematic .......................................................... 24
7 Bill Of Materials (BOM) .....................................27
8 Layout .................................................................32
9 Transformer specifications .............................. 33
9.1 Resonant transformer ...................................... 33
9.2 PFC coil ...........................................................34
10 Abbreviations .................................................... 36
11 References ......................................................... 36
12 Legal information ..............................................37
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