NXP Semiconductors KIT912J637EVME User Manual

Freescale

User’s Guide

KIT912J637EVME User’ s Guide

Document Number: KT912J637UG

Rev. 1.0, 2/2012

Figure 1. KIT912J637EVME Evaluation Board

Table of Contents

KIT912J637EVME Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Required Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Setup Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Hardware Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Software Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Board Layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

© Freescale, Inc., 2012. All rights reserved.

Kit Contents / Packing List

1 Kit Contents / Packing List

• MM912J637 Evaluation Board (EVB)

•Cable, 6 FT. USB 2.0 A-M to B-M

• Warranty Card, Freescale

• CD912J637 - Contains CodeWarrior Code Template and CodeWarrior software

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KIT912J637EVME, Rev. 1.0

2 Important Notice

Freescale provides the enclosed product(s) under the following conditions:
This evaluation kit is intended for use of ENGINEERING DEVELOPMENT OR EVALUATION

PURPOSES ONLY. It is provided as a sample IC pre-soldered to a printed circuit board to make
it easier to access inputs, outputs, and supply terminals. This EVB may be used with any
development system or other source of I/O signals by simply connecting it to the host MCU or
computer board via off-the-shelf cables. This EVB is not a Reference Design and is not intended
to represent a final design recommendation for any particular application. Final device in an
application will be heavily dependent on proper printed circuit board layout and heat sinking
design as well as attention to supply filtering, transient suppression, and I/O signal quality.

The goods provided may not be complete in terms of required design, marketing, and or
manufacturing related protective considerations, including product safety measures typically
found in the end product incorporating the goods. D ue to the open construction of the product, it
is the user's responsibility to take any and all appropriate precautions with regard to electrostatic
discharge. In order to minimize risks associated with the customers applications, adequate design
and operating safeguards must be provided by the customer to mini mize inherent or procedural
hazards. For any safety concerns, contact Freescale sales and technical support services.

Should this evaluation kit not meet the specifications indicated in the kit, it may be returned within
30 days from the date of delivery and will be replaced by a new kit.

Freescale reserves the right to make changes without further notice to any products herein.
Freescale makes no warranty, representation or guarantee regarding the suitability of its products
for any particular purpose, nor does Freescale assume any liability arising out of the applicati on
or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications and actual performance may vary over time. All operating parameters, including
“Typical”, must be validated for each customer application by customer’s technical experts.

Freescale does not convey any license under its patent rights nor the rights of others. Freescale
products are not designed, intended, or authorized for use as components in systems intended
for surgical implant into the body, or other applications intended to support or sustain life, or for
any other application in which the failure of the Freescale product could crea te a situation where
personal injury or death may occur.

Should the Buyer purchase or use Freescale products for any such unintended or unauthori zed
application, the Buyer shall indemnify and hold Freescale and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal
injury or death associated with such unintended or unauthorized use, e ven if such clai m alleges
that Freescale was negligent regarding the design or manufacture of the part.Freescale™ and the
Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service
names are the property of their respective owners. © Freescale Semiconductor, Inc., 2011. All
rights reserved.

Important Notice

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KT912J637UG, Rev. 1.0

KIT912J637EVME Introduction

3 KIT912J637EVME Introduction

Freescale Semiconductor’s KIT912J637EVME is a system solution that gives the user the capability to easily
evaluate most of the features provided by the MM912J637 - Xtrinsic Battery Sensor. The 912J637 feature s two
die in a single package. The 16-bit core and the analog die are connected via the die to die interface that
provides direct address access to the registers on the analog die. The analog die contains three 16-bit sigma
delta converters and enables simultaneous sampling of battery volt age and current, timer module, SCI module,
LIN physical interface, and other general registers. All external signals are accessible via header connectors,
and most of the signals can also be checked via test points. The evaluation module board also includes the
TBDML programming/debugging interface, so n o exte rnal interface is neede d. The board is powere d fr om two

4.0 mm banana connectors. For quick familiarization with the device, a CodeWarrior Template is provided
together with the EVB.

3.1 MM912J637 Features

• Battery voltage measurement

• Battery current measurement in up to eight ranges

• On-chip temperature measurement

• Normal and two low-power modes

• Current threshold detection and current averaging in standby => wake-up from low-power mode

• Triggered wake-up from LIN and periodic wake-up

• Signal low pass filtering (current, voltage)

• PGA (programmable low-noise gain amplifier) with automatic gain control feature

• Accurate internal oscillator (an external quartz oscillator may be used for extended accuracy)

• Communication via a LIN 2.1, LIN 2.0 bus interface

• S12 microcontroller with 128 kByte flash, 6.0 kByte RAM, 4.0 kByte data flash

• Background debug module

• External temperature sensor option (T

• Optional 2nd external voltage sense input (VOPT)

•4 x 5.0 V GPIO including one wake-up capable high voltage input (PTB3/L0)

• 8 x MCU general purpose I/O including SPI functionality

• Industry standard EMC compliance

SUP

, V

TEMP

)

3.2 Warnings

When working with the kit, always use an isolated laboratory power supply.
Keep in mind all ESD rules when handling the board. Avoid touching the connector pins. They are directly

connected to the device pins. Even though the device pins are ESD protected, this protection has its limits.
Some ESD events can destroy or damage the device, or cause its malfun ction.

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KIT912J637EVME, Rev. 1.0

KIT912J637EVME Introduction

3.3 Acronyms

Table 1. Acronyms

Acronym Explanation Acronym Explanation

D2D Die to Die bus interface MCU Microcontroller Unit

BDM Background Debug Module LIN Local Interconnect Network

EVB Evaluation Board LS Low Side (switch)
ESD Electrostatic Discharge, Electrostatic Sensitive Device SCI Serial Communication Interface

GND In the document: main supply ground TBDML Turbo BDM Lite

GPIO General Purpose Input/Output

GUI Graphical User Interface

ADC Analog to Digital Conversion

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KT912J637UG, Rev. 1.0

Required Equipment

4 Required Equipment

• PC Computer running Windows XP or higher

•12 V Power Supply

• USB Cable (supplied)

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KIT912J637EVME, Rev. 1.0

Setup Guide

5 Setup Guide

5.1 Hardware Setup

Setup and connections for the KIT912J637EVME are straightforward.
The KIT912J637EVME requires a connection to the power sup

the USB cable. Figure
Follow these steps to set up the board:

1. Plug the USB cable into the connector CON13 and connect the othe

2. Connect a laboratory power supply via banana connectors to the board, using CON5 (VBATT supply) and
N6 (GND). The supply voltage has to be in the range of 8.0 to 18 V.

CO

2 depicts a complete setup.

ply and a connection to the PC or notebook via

r end of the cable to the PC or notebook.

Figure 2. KIT912J637EVME Basic Hardware Setup

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KT912J637UG, Rev. 1.0

Hardware Description

6 Hardware Description

6.1 Board Description

Figure 3 is a snapshot of the EVB with key co mponent and conn ector locations. Th e following list cor responds

with the numbers listed on the picture.

1. Input power connectors

2. MCU Port A & Port E connector

3. TBDML interface

4. TEST SPI to USB Interface

5. PTB3/L0 Reset button (requires software configuration)

6. BDM connector for external programming/debugging BDM interface

7. MM912J637CV1AE

The board is protected against reverse battery volt ag
current. The board operation is straightforward. As well as the TDBML interface (3), the board contains the
active and passive components required for pro per operation of the 912J637. Connectors and test points

ovide access to the device for important signals.

pr

e by diode D1, which can withstand up to 3.0 A continuous

Figure 3. KIT912J637EVME Evaluation Module Board

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KIT912J637EVME, Rev. 1.0

Hardware Description

6.1.1 MCU

The MM912J637 enables precision measurement of key battery parameters in automotive and other
applications.

The device integrates an HCS12 microcontroller and a SMARTMOS analog control IC into a single package
solution. The analog die combines system basis and application specific functions, including a Local
Interconnect Network (LIN) transceiver, and 3 dedicated16-bit sigma delta analog to digital converters (ADC)
for synchronous measurement of battery voltage, current, and temperature.

An integrated temperature sensor combined with battery mounting allows for measurement of battery
temperature. Control of the analog die is via a n ew high performa nce internal die-to-die interface (D2D), which
seamlessly integrates the analog IC registers into the MCU register map, providing faster access than
SPI-based systems. The MM912J637 also includes an internal oscillator, 128 k Bytes of Flash memory, and

6.0

k bytes of RAM. An optional external temperature sensor is also supported.

The 912J637 has three main operating modes: Normal (all functions available) ; Sleep (VDD off, Wake-up via:
the LIN bus, PTB3/L0 input, current threshold, current averaging, calibration request, lifetime counter, internal
timer, or external reset), and Stop (V
input, current threshold, current averaging, calibration request, life time counter , internal timer , or external reset).

on with limited current capability, Wake-up via: the LIN bus, PTB3/L0

DD

6.1.2 TBDML

The Turbo BDM Light interface is a programming and debugging tool, and constitutes an interface between a
PC and the BDM debugging port of Freescale microcontr ollers. It enables the debugger and other soft ware tools
to communicate with the microcontroller, and download code into its on-chip flash, etc. Among the benefits of
using the TBDML on the EVB is a much higher communicatio n speed than other USB/BDM interfaces. It is also
unnecessary to connect external devices to the EVB when programming/debugging is needed.

A BDM connector (CON9) is placed on the EVB to allow the connection of another BDM tool, such as the P&E
USB BDM Multilink. In this case, DIP switches S2-1 and S2-2 should be set to “OFF”, to disable the TBDML
interface.

In either case, S2-3 should be set to “OFF” during programming to disconnect RESET from RESET_A.

6.1.2.1 Switch Settings

Figure 4 summarizes the location of all DIP switches and settings.

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