NXP Semiconductors KIT33771TPLEVB User Manual
NXP Semiconductors
User’s Guide
Document Number: KT33771TPLUG
KIT33771TPLEVB evaluation board
Featuring the MC33771 battery cell controller IC
Rev. 2.0, 10/2016
Figure 1. KIT33771TPLEVB
© 2016 NXP B.V.
Table of Contents
1 Important notice. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
2 Getting started. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
3 Getting to know the hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
4 Accessory transceiver board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
5 Configuring the hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
6 Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
7 Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
8 Board bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
9 Accessory item bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
10 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
KIT33771TPLEVB evaluation board, Rev. 2.0
2 NXP Semiconductors
1 Important notice
NXP provides the enclosed product(s) under the following conditions:
This evaluation kit is intended for use of ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY.
It is provided as a sample IC pre-soldered to a printed circuit board to make it easier to access inputs, outputs, and
supply terminals. This evaluation board may be used with any development system or other source of I/O signals
by simply connecting it to the host MCU or computer board via off-the-shelf cables. This evaluation board is not a
Reference Design and is not intended to represent a final design recommendation for any particular application.
Final device in an application will be heavily dependent on proper printed circuit board layout and heat sinking
design as well as attention to supply filtering, transient suppression, and I/O signal quality.
The goods provided may not be complete in terms of required design, marketing, and or manufacturing related
protective considerations, including product safety measures typically found in the end product incorporating the
goods. Due to the open construction of the product, it is the user's responsibility to take any and all appropriate
precautions with regard to electrostatic discharge. In order to minimize risks associated with the customers
applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or
procedural hazards. For any safety concerns, contact NXP sales and technical support services.
Should this evaluation kit not meet the specifications indicated in the kit, it may be returned within 30 days from the
date of delivery and will be replaced by a new kit.
NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty,
representation or guarantee regarding the suitability of its products for any particular purpose, nor does NXP
assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and
all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary
in different applications and actual performance may vary over time. All operating parameters, including “Typical”,
must be validated for each customer application by customer’s technical experts.
NXP does not convey any license under its patent rights nor the rights of others. NXP products are not designed,
intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the NXP product
could create a situation where personal injury or death may occur.
Should the Buyer purchase or use NXP products for any such unintended or unauthorized application, the Buyer
shall indemnify and hold NXP and its officers, employees, subsidiaries, affiliates, and distributors harmless against
all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any
claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges
NXP was negligent regarding the design or manufacture of the part. NXP™ and the NXP logo are trademarks of
NXP Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2016
NXP Semiconductors, B.V.
Important notice
KIT33771TPLEVB evaluation board, Rev. 2.0
NXP Semiconductors 3
Getting started
Jump Start Your Design
2 Getting started
2.1 Kit contents/packing list
The KIT33771TPLEVB contents include:
• Assembled and tested evaluation board/module in anti-static bag
• Quick start guide
2.2 Jump start
NXP’s analog product development boards serve as an easy-to-use platform for evaluating NXP products. They support a range of analog,
mixed-signal and power solutions. The boards incorporate monolithic ICs and system-in-package devices that use proven high-volume
SMARTMOS technology. NXP products enable longer battery life, smaller form factor, component count reduction, ease of design, lower
system cost and improved performance in powering state of the art systems.
•Go to www.nxp.com/KIT33771TPLEVB
• Review your Tool Summary Page
• Look for
• Download the documents, software, and other information
Once the files are downloaded, review the user guide in the bundle. The user guide includes setup instructions, BOM and schematics.
Jump start bundles are available on each tool summary page with the most relevant and current information. The information includes
everything needed for design.
2.3 Required equipment and software
To use this kit, you need:
• Power supply with a range of 10 V to 70 V and a current limit set initially to 1.0 A
• Oscilloscope (preferably four-channel)
• KIT33664AEVB isolated network high speed transceiver (optional)
KIT33771TPLEVB evaluation board, Rev. 2.0
4 NXP Semiconductors
Getting to know the hardware
3 Getting to know the hardware
3.1 Board overview
The KIT33771TPLEVB evaluation board serves as a hardware evaluation tool in support of NXP’s MC33771 device. The MC33771 is a
battery cells controller that accommodates up to fourteen lithium-Ion batteries. It is designed for use in both automotive and industrial
applications. The device performs ADC conversion on the differential cell voltage and currents. It is also capable of battery charge coulomb
counting and battery temperature measurements.The KIT33771TPLEVB evaluation board is an ideal platform for rapid prototyping of
MC33771-based applications that involve current, voltage, and temperature sensing.
The KIT33771TPLEVB includes a transformer enabling communication in a high speed isolated communication network. The information
is digitally transmitted to a microcontroller for processing. The evaluation board can be used in conjunction with a transceiver physical
layer transformer driver (MC33664) to convert MCU SPI data bits to pulse bit information for the MC33771.
3.2 Board features
This KIT33771TPLEVB evaluation board’s main features are as follows:
• Daisy chain device connection
• LED indicator for operation mode
• Cell-balancing resistor
• Transformer isolation
• Cell sense input with RC filter
• GPIO: digital I/O, wake-up inputs, convert trigger inputs, ratiometric analog inputs, analog inputs with absolute measurements
• Interface I²C link to an external local EEPROM to store user-defined calibration parameters
• Fault detection pin report
KIT33771TPLEVB evaluation board, Rev. 2.0
NXP Semiconductors 5
Getting to know the hardware
Battery Cell
Controller
MC33771
84LQFP
Connector Battery/Cells
EEPROM
Isolation
Transformer
Isolation
Transformer
VPWR
GPIO_0
RDTX_OUT
RDTX_IN
RDTX_IN
RDTX_OUT
FAULT_OUT
FAULT_RTN
SDA
SDL
NTC[1...7]
TEMP
INT
GPIO
PHY
I
2
C
PHY
TPL
PHY
COMM_IN
Connector
COMM_OUT
Connector
GND/VBAT
Cell Balancing
Output
[CB_1...CB_14]
Current Sense
Input
ISENSEL /
ISENSEH
Voltage Sense
Input
[CT_REF...CT_14]
GND/
T
C
e
Inp
/
H
O
[CB_
]
V
e
I
]
3.3 Block diagram
urrent Sens
ISENSEL
ISENSE
VBA
ut
Cell Balancing
utput
1...CB_14
oltage Sens
nput
[CT_REF...CT_14
Figure 2. Block diagram
6 NXP Semiconductors
KIT33771TPLEVB evaluation board, Rev. 2.0
Getting to know the hardware
3.4 Device features
The MC33771 is a battery cell controller IC designed to monitor battery characteristics, such as voltage, current and temperature. The
MC33771 contains all the circuit blocks necessary to perform synchronous battery voltage/current measurement, coulomb counting, cell
temperature measurement and integrated cell balancing. The device supports the following functions:
Table 1. MC33771 device features
Device Description Features
• 9.6 V VPWR, 61.6 V operation, 70 V transient
• SPI or isolated 2.0 MHz differential communication
• Synchronized cell voltage/current measurement with coulomb count
• Total stack voltage measurement
• Seven ADC/GPIO/temperature sensor inputs
• Addressable on initialization
MC33771 Battery cell controller
• 5.0 V at 5.0 mA reference supply output
• Integrated sleep mode over/undervoltage and temperature monitoring
• Over/undervoltage, over/undertemperature fault verification
• Onboard 300 mA passive cell balancing with diagnostics
• Open cell pin detection
• Internal diagnostics
• Hot plug capable
• Operational low-power mode
KIT33771TPLEVB evaluation board, Rev. 2.0
NXP Semiconductors 7
Getting to know the hardware
1
2 3
4
5
3.5 Board overview
The KIT33771TPLEVB circuit board allows the user to exercise all the functions of the MC33771 battery controller cell.
Table 2. Board description
Number Description
1 Cells terminal filters — Connection to battery cells through low pass filters
2 MC33771 — Battery cell controller IC
3 Transformer isolated communication
4 Fault detection
5 GPIO:NYC[1…7]
Figure 3. Board description
KIT33771TPLEVB evaluation board, Rev. 2.0
8 NXP Semiconductors
3.6 VCOM LED
VCOM LED
The VCOM LED is located on the board as shown in Figure 4.
Getting to know the hardware
Figure 4. VCOM LED
The VCOM LED indicates when the device is in normal mode. Upon reset, the MC33771 enters into normal mode (VCOM lights). If there
is no activity on the bus after a timeout period of 60 seconds, the device enters low-power idle mode (VCOM turns off). Once the device
is initialized, if no communication occurs on the TPL bus after 1 second, the device switches to sleep mode and the LED turns off (VCOM
off). Depending on the device settings, the VCOM LED may flash every second during cyclic acquisition.
KIT33771TPLEVB evaluation board, Rev. 2.0
NXP Semiconductors 9
Getting to know the hardware
RDTX_OUT_N
RDTX_IN_N
RDTX_IN_P
NEG_BATT
RDTX_OUT_P
POS_BATT
3.7 Test point definitions
Figure 5 shows the location of the test points on the board.
Figure 5. Test points
The following test points provide access to various signals to and from the board.
Table 3. Test points
Test point name Signal name Description
RTDX_IN_N SI/RDTX_IN-
RTDX_IN_P SCLK/RTDX_IN+
RTDX_OUT_N RTDX_OUT-
RTDX_OUT_P RTDX_OUT+
NEG_BATT GNDREF Ground reference of the device
POS_BATT
V
BAT
Measures the isolated pulse communication sent to the device
Positive V
BAT
KIT33771TPLEVB evaluation board, Rev. 2.0
10 NXP Semiconductors
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