NXP Semiconductors JN5169M0V2, JN5169M6V2 User Manual

UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
Rev. 1.0 — 15 June 2016 User manual
Document information
Info Content Keywords JN5169, Zigbee, module Abstract JN5169-001-M0x-2 modules user manual
NXP Semiconductors
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
Revision history
Rev Date Description
1.0 20160613 Initial version
Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
User manual Rev. 1.0 — 15 June 2016 2 of 24
NXP Semiconductors

1. General description

The JN5169-001-M0x-2 (with x = 0, 3 or 6) module family provides designers with a ready-made component that provides a fully integr ated solution for applications, using the IEEE802.15.4 standard in the 2.4 GHz - 2.5 GHz ISM frequency band, including ZigBee Smart Energy, Home Automation and ZigBee 3.0 and can be quickly and easily included in product designs. The modules integrate all of the RF components required, removing the need to perform expensive RF design and test. Products can be designed by simply connecting sensors and switches to the module IO pins. The module uses NXP’s single chip IEEE802.15.4 wireless microcontroller, allowing designers to make use of the extensive chip development support material. Hence, these modules allow designers to bring wireless applications to market in the minimum time with significantly reduced development effort and cost.
3 variants are available: JN5169-001-M00-2, JN5169-001-M03-2 and JN5169-001-M06-2.
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
The variants available are described in the Table 1
.

1.1 Variants and identifications information

Table 1. Variants and identifications information
Type number Description FCCID IC ID ANATEL ID
JN5169-001-M00-2 Standard power, integrated printed antenna XXMJN5169M0V2 8764A-JN5169M0 <tbd> JN5169-001-M03-2 Standard power, FL connector XXMJN5169M3V2 8764A-JN5169M3 <tbd> JN5169-001-M06-2 High power, FL connector XXMJN5169M6V2 8764A-JN5169M6 <tbd>

1.2 Regulatory approvals

The JN5169-001-M0x-2 has been tested against the requirements of the following European standards.
Radio EN 300 328 v 1.9.1
EMC, EN 301 489-17 v 2.2.1, EN 62479 2010, EN 301 489-1 v 1.9.2
Basic Safety Assessment (BSA) EN 60950-1:2006
A Notified Body statement of opinion for this standard is available on request. The High-power module with M06 suffix is not ap proved for use in Europe. All module types have received FCC “Modular Approval”, in compliance with CFR 47 FCC
part 15 regulations and in accordance to FCC public notice DA00-1407. The modular approvals notice and test reports are available on request.
Additionally, all module types have also received ANATEL “Modular Approval”

2. Features and benefits

2.1 Benefits

Microminiature module solutions
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NXP Semiconductors
Ready to use in products
Minimises product development time
No RF test required for systems
Compliant with:
Temperature range: 40 C to +85 C
Lead-free and RoHS compliant

2.2 Features: modules

2.4 GHz IEEE 802.15.4, ZigBee Smart Energy and Home Automation compatible
JN5169-001-M00-2
JN5169-001-M03-2
JN5169-001-M06-2
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
FCC 47CFR Part 15CETSI EN 300-328 V1.9.1EN 301-489-17 V2.2.1EN60950-1-2006ANATEL
Dimensions: 16 mm 30 mmIntegrated printed antenna TX power 8.5 dBm/10 dBmReceiver sensitivity –96.5 dBmTX current 27.2 mA at 10 dBmTX current 23.6 mA at 8.5 dBmRX current 17.8 mA at maximum input level 10 dBmRX current 16.2 mA at maximum input level 0 dBm2.0 V/3.6 V operation
Dimensions: 16 mm 21 mmFl connectorTX power 8.5 dBm/10 dBmReceiver sensitivity –96.5 dBmTX current 27.2 mA at 10 dBmTX current 23.6 mA at 8.5 dBmRX current 17.8 mA at maximum input level 10 dBmRX current 16.2 mA at maximum input level 0 dBm2.0 V/3.6 V operation
Dimensions: 16 mm 30 mmFl connectorTX power 21 dBmReceiver sensitivity –100 dBm
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NXP Semiconductors

2.3 Features: microcontroller

Variable instruction width for high coding efficiency
Multi-stage instruction pipeline
512 kB Flash
32 kB RAM
4 kB EEPROM
Data EEPROM with guaranteed 100 k write operations
ZigBee PRO stack with Home Automation and Smart Energy profiles
2-wire I
5 PWM (4 timers, 1 timer/counter)
2 low-power sleep counters
2UARTs
SPI-bus Master and Slave port, 3 selects
Supply voltage monitor with 8 programmable thresholds
6-input 10-bit ADC, comparator
Battery and temperature sensors
Watchdog and Supply Voltage Monitor (SVM)
Up to 20 Digital IO (DIO) pins
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
TX current 181 mA at 21 dBmRX current 22.8 mA2.0 V/3.6 V operation
32-bit RISC CPU; 1 MHz to 32 MHz clock speed
2
C-bus compatible serial interface; can operate as either master or slave
UM11016

3. Applications

Robust and secure low-power wireless applications
ZigBee Smart Energy networks
ZigBee Home Automation networks
ZigBee 3.0 networks
Toys and gaming peripherals
Energy harvesting - for example, self-powered light switch

4. Overview

The JN5169-001-M0x-2 family is a range of ultra-low power, high performance surface mount modules targeted at IEEE 802.15.4, ZigBee Smart Energy, Home Automation and ZigBee 3.0 networking applications, enabling users to realize pro ducts with minimum time to market and at the lowest cost. It removes the need for expensive and lengthy development of custom RF board designs and test suites. The module uses NXP’s JN5169 wireless microcontroller to provide a comprehensive solution with large memory, high CPU and radio performance and all RF components included. All that is required to
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NXP Semiconductors
develop and manufacture wireless control or sensing products is to connect a power supply and peripherals such as switches, actuators and sensors, considerably simplifying product development.
3 module variants are available:
JN5169-001-M00-2 with an integrated printed antenna
JN5169-001-M03-2 with a FL antenna connector
JN5169-001-M06-2 with a FL antenna connector and also a power amplifier and

5. Marking

5.1 JN5169-001-M00-2 and JN5169-001-M03-2

UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
LNA for extended range
JN5169-001-M0x-2
NNNNN
ZbHYWW FCC ID:XXMJN5169MxV2 IC: 8764A-JN5169Mx
(1)
(1)
(1)
Fig 1. JN5169-001-M00-2 and JN5169-001-M03-2 packages marking (top view)
Table 2. Marking code
Line number Marking code
Line 1 NXP Logo: B&W outline logo Line 2 part ID: JN5169-001-M0x-2
[1]
Line 3 serial number: NNNNN Line 4 PMC code: ZbHYWW
Z: SSMC b: SPIL H: Halogen free Y: year
WW: week Line 5 FCC ID: XXMJN5169MxV2 Line 6 IC: 8764A-JN5169Mx
[1]
[1]
[1] With x = 0 or 3.
The JN5169-001-M0x-2 (with x = 0 or 3) family modules meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS) and of the Chinese RoHS requirements SJ/T11363-2006 which came into force on 1st March 2007.
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NXP Semiconductors

5.2 JN5169-001-M06-2

Fig 2. JN5169-001-M06-2 package marking (top view)
Table 3. Marking code
Line number Marking code
Line 1 NXP Logo: B&W outline logo Line 2 part ID: JN5169-001-M06-2 Line 3 serial number: NNNNN Line 4 PMC code: ZbHYWW
Line 5 FCC ID: XXMJN5169M6V2 Line 6
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
Z: SSMC
b: SPIL
H: Halogen free
Y: year
WW: week
IC: 8764A-JN5169M6
JN5169-001-M06-2
NNNNN
ZbHYWW FCC ID:XXMJN5169M6V2 IC: 8764A-JN5169M6
UM11016
The JN5169-001-M06-2 module meets the re quirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS) and of the Chinese RoHS requirements SJ/T11363-2006 which came into force on 1st March 2007.
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
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6. Block diagram

UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
integrated
antenna
external antenna
external antenna
CONNECTOR
CONNECTOR
µFL
Fig 3. Block diagram
µFL
PA/LNA
MATCHING
M00-2 option
MATCHING
M03-2 option
MATCHING
M06-2 option
XTAL
2.4 GHz RADIO
INCLUDING
DIVERSITY
POWER
MANAGEMENT
WATCHDOG
TIMER
VO LTAGE
BROWNOUT
O-QPSK MODEM
IEEE802.15.4
MAC
ACCELERATOR
128-BIT AES
ENCRYPTION
ACCELERATOR
RAM
32 kB
RISC CPU
EEPROM
32-BIT
4kB
FLASH 512 kB
SPI-BUS
MASTER AND SLAVE
2-WIRE SERIAL
(MASTER/SLAVE)
4 X PWM
PLUS TIMER
2 X UART
20 DIO
PLUS 2 DO
SLEEP
COUNTER
6 CHAN
10 BIT ADC
BATTERY AND
TEMP SENSORS
POWER
aaa-022823
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NXP Semiconductors

7. Pinning information

7.1 Pinning

UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
ADC1
DO0/SPICLK/PWM2
DO1/SPIMISO/PWM3
DIO18/SPIMOSI
DIO19/SPISEL0
DIO0/ADO/SPISEL1/ADC3
DIO1/ADE/SPISEL2/ADC4/PC0
DIO2/RFRX/TIM0CK_GT/ADC5
DIO3/RFTX/TIM0CAP/ADC6
1
2
3
4
5
6
7
8
9
10
11
DIO5/RTS0/JTAG_TMS/PWM1/PC1
DIO4/CTS0/JTAG_TCK/TIM0OUT/PC0
12
13
14
15
DIO7/RXD0/JTAG_TDI/PWM3
DIO8/TIM0CK_GT/PC1/PWM4
DIO6/TXD0/JTAG_TDO/PWM2
DIO9/TIM0CAP/32KXTALIN/RXD1/32KIN
Transparent top view
16
17
V
DIO10/TIM0OUT/32KXTALOUT
DD
VREF/ADC2
27
DIO17/SPISMISO/SIF_D/COMP1M/PWM4
26
DIO16/SPISMISO/SIF_CLK/COMP1P
25
(4)
DIO15
24
23
22
21
20
19
18
GND
(3)
DIO14
RESET_N
(2)
DIO13
(1)
DIO12
DIO11/PWM1/TXD1
The same basic pin configuration applies for all module designs. However, DIO2 (pin 8) and DIO3 (pin 9) are not available on
the JN5169-001-M06-2. (1) Multi-function: DIO12/PWM2/CTS0/JTAG_TCK/ADO/SPISMOSI. (2) Multi-function: DIO13/PWM3/RTS0/JTAG_TMS/ADE/SPISMISO. (3) Multi-function: DIO14/SIF_CLK/TXD0/TXD1/JTAG_TDO/SPISEL1/SPISSEL. (4) Multi-function: DIO15/SIF_D/RXD0/RXD1/JTAG_TDI/SPISEL2/SPISCLK.
Fig 4. Pin configuration

7.2 Pin description

Table 4. Pin description
Symbol Pin Type
ADC1 1 I ADC1 — ADC input
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[1]
Description
NXP Semiconductors
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
[2]
…continued
[1]
Description
2O DO0 — DO0
Table 4. Pin description
Symbol Pin Type
DO0/SPICLK/PWM2
SPICLK — SPI-bus master clock output PWM2 — PWM2 output
DO1/SPIMISO/PWM3
[3]
3I/O DO1 — DO1
SPIMISO — SPI-bus Master In, Slave Out input PWM3 — PWM3 output
DIO18/SPIMOSI 4 I/O DIO18 — DIO18
SPIMOSI — SPI-bus Master Out Slave In output
DIO19/SPISEL0 5 I/O DIO19 — DIO19
SPISEL0 — SPI-bus Master Select Output 0
DIO0/ADO/SPISEL1/ADC3 6 I/O DIO0 — DIO0
ADO — antenna diversity odd output SPISEL1 — SPI-bus master select output 1 ADC3 — ADC input: ADC3
DIO1/ADE/SPISEL2/ADC4/PC0 7 I/O DIO1 — DIO1
ADE — antenna diversity even output SPISEL2 — SPI-bus master select output 2 ADC4 — ADC input: ADC4 PC0 — pulse counter 0 input
DIO2/RFRX/TIM0CK_GT/ADC5
[4]
8I/O DIO2 — DIO2
RFRX — radio receives control output TIM0CK_GT — timer0 clock/gate input ADC5 — ADC input: ADC5
DIO3/RFTX/TIM0CAP/ADC6
[4]
9I/O DIO3 — DIO3
RFTX — radio transmit control output TIM0CAP — timer0 capture input ADC6 — ADC input: ADC6
DIO4/CTS0/JTAG_TCK/TIM0OUT/PC0 10 I/O DIO4 — DIO4
CTS0 — UART 0 clear to send input JTAG_TCK — JTAG CLK input TIM0OUT — timer0 PWM output PC0 — pulse counter 0 input
DIO5/RTS0/JTAG_TMS/PWM1/PC1 11 I/O DIO5 — DIO5
RTS0 — UART 0 request to send output JTAG_TMS — JTAG mode select input PWM1 — PWM1 output PC1 — pulse counter 1 input
DIO6/TXD0/JTAG_TDO/PWM2 12 I/O DIO6 — DIO6
TXD0 — UART 0 transmit data output JTAG_TDO — JTAG data output PWM2 — PWM2 data output
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NXP Semiconductors
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
Table 4. Pin description
Symbol Pin Type
…continued
[1]
Description
DIO7/RXD0/JTAG_TDI/PWM3 13 I/O DIO7 — DIO7
RXD0 — UART 0 receive data input JTAG_TDI — JTAG data input PWM3 — PWM 3 data output
DIO8/TIM0CK_GT/PC1/PWM4 14 I/O DIO8 — DIO8
TIM0CK_GT — timer0 clock/gate input PC1 — pulse counter1 input PWM4 — PWM 4 output
DIO9/TIM0CAP/32KXTALIN/RXD1/32KIN 15 I/O DIO9 — DIO9
TIM0CAP — Timer0 Capture input 32KXTALIN — 32 kHz External Crystal input RXD1 — UART1 Receive Data input 32KIN — 32 kHz External clock input
DIO10/TIM0OUT/32KXTALOUT 16 I/O DIO10 — DIO10
TIM0OUT — Timer0 PWM Output 32KXTALOUT — 32 kHz External Crystal output
V
DD
17 P VDD — supply voltage GND 18 GND ground DIO11/PWM1/TXD1 19 I/O DIO11 — DIO11
PWM1 — PWM1 output TXD1 — UART1 Transmit Data output
DIO12
[5]
20 I/O DIO12 — DIO12
PWM2 — PWM2 output CTS0 — UART0 clear to send input JTAG_TCK — JTAG CLK input ADO — antenna diversity odd output SPISMOSI — SPI-bus slave Master Out, Slave In input
DIO13
[6]
21 I/O DIO13 — DIO13
PWM3 — PWM3 output RTS0 — UART0 request to send output JTAG_TMS — JTAG mode select input ADE — antenna diversity even output SPISMISO — SPI-bus slave master in slave out output
RESET_N 22 I RESET_N — reset input DIO14
[7]
23 I/O DIO14 — DIO14
SIF_CLK — serial interface clock TXD0 — UART 0 transmit data output TXD1 — UART 1 transmit data output JTAG_TDO — JTAG data output SPISEL1 — SPI-bus master select output 1 SPISSEL — SPI-bus slave select input
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NXP Semiconductors
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
Table 4. Pin description
Symbol Pin Type
[8]
DIO15
DIO16/SPISMOSI/SIF_CLK/COMP1P 25 I/O DIO16 — DIO16
DIO17/SPISMISO/SIF_D/COMP1M 26 I/O DIO17 — DIO17
VREF/ADC2 27 P VREF — analog peripheral reference voltage
…continued
[1]
Description
24 I/O DIO15 — DIO15
SIF_D — serial interface data RXD0 — UART 0 receive data input RXD1 — UART 1 receive data input JTAG_TDI — JTAG data input SPISEL2 — SPI-bus master select output 2 SPISCLK — SPI-bus slave clock input
COMP1P — comparator positive input SIF_CLK — Serial Interface clock SPISMOSI — SPI-bus Slave Master Out Slave In input
COMP1M — COMP1M; comparator negative input SIF_D — Serial Interface Data SPISMISO — SPI-bus Slave Master In Slave Out output PWM4 — PWM 4 output
I ADC2 — ADC input 2
[1] P = power supply; G = ground; I = input, O = output; I/O = input/output. [2] JTAG programming mode: must be left floating high during reset to avoid entering JTAG programming mode. [3] UART programming mode: leave pin floating high during reset to avoid entering UART programming mode or hold it low to program. [4] Not available on the JN5169-001-M06-2 since they are used to control the front-end module. [5] Multi-function: DIO12/PWM2/CTS0/JTAG_TCK/ADO/SPISMOSI. [6] Multi-function: DIO13/PWM3/RTS0/JTAG_TMS/ADE/SPISMISO. [7] Multi-function: DIO14/SIF_CLK/TXD0/TXD1/JTAG_TDO/SPISEL1/SPISSEL. [8] Multi-function: DIO15/SIF_D/RXD0/RXD1/JTAG_TDI/SPISEL2/SPISCLK.

8. Functional description

8.1 JN5169 single chip wireless microcontroller

The JN5169-001-M0x-2 is constructed around the JN5169-001 sin gle chip wireless microcontroller, which includes the radio system, a 32-bit RISC CPU, Flash, RAM and EEPROM memory and a range of analogue and digital peripherals.
The chip is described fully in JN5169 Wireless Microcontroller Datasheet (see Ref. 2
).
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NXP Semiconductors
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

8.2 Peripherals

Table 5. Peripherals
Peripherals JN5169-001-M0x-2 Notes
Master SPI-bus port 3 selects 250 kHz - 16 MHz Slave SPI-bus port 1 250 kHz - 4 MHz UART 2 16550 compatible Two-wire serial I/F (compatible with SMbus and I PWM 16 MHz clock
timer 4
timer/counter 1 Programmable Sleep Timers 2 32 kHz clock Digital IO lines (multiplexed with UARTs, timers and SPI-bus
selects) Analog-to-Digital converter 4 10-bit, up to 100 ks/s Programmable analogue comparator 1 ultra low power mode for sleep Internal temperature sensor 1 Internal battery sensor 1
2
C-bus) 1 Up to 400kHz
20 DIO2 and DIO3 are not available
on JN5169-001-M06 modules
The performance of all peripherals is defined in the JN5169 Wireless Microcontroller Datasheet (see Ref. 2
).
NXP supplies all the development tools and networking stacks needed to enable end-product development to occur quickly and efficiently. These are all freely available from the NXP Wireless Connectivity TechZone (see Ref. 3
). A range of evaluation/developer kits is also available, allowing product s to be quickly bread bo arded. Efficient development of software applications is enabled by the provision of a complete, unlimited, software developer kit. Together with the available libraries for the IEEE802.15.4 MAC and ZigBee PRO network stacks, this package provides everything required to develop application code and to trial it with hardware represent ative of the final module.
The modules can be user programmed both in development and in production using software supplied by NXP. Access to the on-chip peripherals, MAC and network stack software is provided through specific APIs. This information is available on the NXP support website, together with many example applications, user guides, reference manuals and application notes.

9. Limiting values

Table 6. Limiting values
Symbol Parameter Conditions Min Max Unit
V
DD
V
VREF/ADC2
V
ADC1
supply voltage 0.3 +3.6 V voltage on pin VREF/ADC2 0.3 V
voltage on pin ADC1 0.3 V
+
DDA
0.3V
DDA
0.3V
V
+
V
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NXP Semiconductors
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
Table 6. Limiting values
…continued
Symbol Parameter Conditions Min Max Unit
V
IO(dig)
digital input/output voltage 0.3 V
DDD
+
V
0.3V
T
stg
V
ESD
storage temperature 40 +150 C electrostatic discharge voltage according to ETSI EN 301 489-17
4- kV 2012 V2.2.1 and ETSI EN 301 489-1 2011 V1.9.2

10. Recommended operating conditions

Table 7. Op erating conditions
Symbol Parameter Conditions Min Max Unit
V
DD
T
amb
[1] To reach the maximum TX power, 2.8 V is the minimum.
supply voltage ambient temperature standard range 40 +85 C
[1]
23.6V

11. Characteristics

11.1 DC current

Table 8. Active processing
= 2 V to 3.6 V; T
V
DD
Symbol Parameter Conditions Min Typ Max Unit
I
DD
supply current M00
=40C to +85C; unless otherwise specified.
amb
radio in receive mode; maximum input level at 10 dBm - 17.8 - mA radio in receive mode; maximum input level at 0 dBm - 16.7 - mA radio in transmit mode 10 dBm radio in transmit mode 8.5 dBm
M03
radio in receive mode; maximum input level at 10 dBm - 17.8 - mA radio in receive mode; maximum input level at 0 dBm - 16.7 - mA radio in transmit mode 10 dBm radio in transmit mode 8.5 dBm
M06
radio in receive mode - 22.8 - mA radio in transmit mode
[1]
- 27.2 - mA
[1]
- 23.6 - mA
[1]
- 27.2 - mA
[1]
- 23.6 - mA
[1]
- 181 - mA
[1] To reach the maximum TX power, 2.8 V is the minimum.
Table 9. Sleep mod e
VDD= 2 V to 3.6 V; T
=40C to +85C; unless otherwise specified.
amb
Symbol Parameter Conditions Min Typ Max Unit
I
DD(IO)
input/output supply current
User manual Rev. 1.0 — 15 June 2016 14 of 24
in sleep mode; with I/O and RC oscillator timer wake-up; T
amb
=25C
-0.73-A
NXP Semiconductors
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
Table 10. Deep sleep mode
VDD= 2 V to 3.6 V; T
=40C to +85C; unless otherwise specified.
amb
Symbol Parameter Conditions Min Typ Max Unit
I
DD
[1] Waiting on chip RESET or I/O event.
supply current deep sleep mode; measured at 25 C
[1]
-70-nA

11.2 AC characteristics

11.2.1 Radio transceiver

These modules meet all the requirements of the IEEE802.15.4 standard over 2.0 V to 3.6 V and offers the improved RF characteristics shown in Table 11 characteristics are measured single ended.
Table 11. RF port characteristics
Single-ended; Impedance = 50
Symbol Parameter Conditions Min Typ Max Unit
f
range
[1] With external matching inductors and assuming PCB layout.
frequency range 2.4 - 2.485 GHz
Table 12. Radio transceiver characteristics: +25 C
= 2 V to 3.6 V; unless otherwise specified.
V
DD
Symbol Parameter Conditions Min Typ Max Unit
Receiver
M00
S
RX
P
i(RX)(max)
receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 96.5 - dBm maximum receiver input
power

RSSI
RSSI variation 95 dBm to 10 dBm; available through
M03
S
RX
P
i(RX)(max)
receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 96.5 - dBm maximum receiver input
power

RSSI
RSSI variation 95 dBm to 10 dBm; available through
M06
S
RX
P
i(RX)(max)
receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 100 - dBm maximum receiver input
power

RSSI
RSSI variation 100 dBm to 25 dBm; available through
Transmitter
[1]
; VDD= 2 V to 3.6 V; T
1 % PER, measured as sensitivity; supply
=40C to +85C; unless otherwise specified.
amb
-10-dBm
current at 17.8 mA 1 % PER, measured as sensitivity; supply
-0-dBm
current at 16.2 mA
4- +4dB
UM11016 Integrated Peripherals API
1 % PER, measured as sensitivity; supply
-10-dBm
current at 17.8 mA 1 % PER, measured as sensitivity; supply
-0-dBm
current at 16.2 mA
4- +4dB
UM11016 Integrated Peripherals API
1 % PER, measured as sensitivity - 5 - dBm
4- +4dB
UM11016 Integrated Peripherals API
. All RF
User manual Rev. 1.0 — 15 June 2016 15 of 24
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UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
Table 12. Radio transceiver characteristics: +25 C …continued
VDD= 2 V to 3.6 V; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
M00
P
o
P
o(cr)
M03
P
o
P
o(cr)
M06
P
o
[1] To reach the maximum TX power, 2.8 V is the minimum on VDD. [2] Up to an extra 2.5 dB of attenuation is available if required.
output power IDD = 27.2 mA
= 23.6 mA
I
DD
control range output power
output power IDD = 27.2 mA
control range output power
output power
in 6 major steps and then 4 fine steps
= 23.6 mA
I
DD
in 6 major steps and then 4 fine steps
[1]
-10-dBm
[1]
-8.5-dBm
[2]
- 42 - dB
[1]
-10-dBm
[1]
-8.5-dBm
[2]
- 42 - dB
[1]
-21-dBm

12. Federal Communication Commission Statement

This equipment has been tested and found to comply with the limits for a Class B
igital device, pursuant to Part 15 of the FCC Rules see Ref. 4
d d
esigned to provide reasonable protection against harmful interferen residential inst frequency energy and, if not installed and used in accordance with the instructions, m
ay cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to cor
rect the interference by one of the following measures:
Reorient or relocate the receiving antennaIncrease the separation between the equipment and receiverConnect the equipment into an outlet on a circuit different from that
receiver is
Consult the dealer or an experienced radio/TV technician for help
OEM integrators instructions
The OEM integrators are responsible for ensuring that the e nd-user has no manual
instructions to remove or install module
– The module is limited to installation in mobile or fixed applications, according
CFR
– Separate approval is required for all other operating configurations, including
portable configurations with respect to CFR 47 Part 2.1093 and different antenn co
nfigurations
User guide mandatory statements
allation. This equipment generates, uses, and can radiate radio
connected
47 Part 2.1091(b)
. These limits are
ce in a
this equipment
try to
to which the
to
a
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
User manual Rev. 1.0 — 15 June 2016 16 of 24
NXP Semiconductors
FCC RF Exposure requirements
The J operate with antennas having a maximum gain of 2 dBi. Antennas having a gain greater than 2 dBi are strictly prohibited for use with these devices. The required antenna impedance is 50 ohms. The JN5169-001-M00-2 integrates a printed antenna. The maximum gain of the printed antenna is 1 dBi.
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
User's instructions of the host device must contain the following statements in
addition to operation instructions: * “This device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that
may cause undesired operation” * “Changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate the equipment”
– User's instructions of the host device must contain the following instructions in
addition to operation instructions: Avoid direct contact to the antenna, or keep it to a 20 cm minimum distance while
using this equipment. This device must not be collocated or operating in conjunction with another antenna or transmitter.
N5169-001-M03-2 and JN5169-001-M06-2 modules have been designed to

12.1 FCC end product labelling

The final ‘end product’ should be labelled in a visible area with the following:
“Contains TX FCC ID: XXMJN5169M0V2, XXMJN5169M3V2 or XXMJN5169M6V2” to reflect the version of the module being used inside the product.

13. Industry Canada statement

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
This device complies with Industry Canada RF radiation exposure limits set forth for general population (uncontrolled exposure). This device must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: (1) il ne doit pas produire de brouillage, et (2) l’utilisateur du dispositif doit être prêt a accepter tout brouillage radioélectrique reçu, même si ce brouillage est susceptible de compromettre le fonctionnement du dispositif.
Le présent appareil est conforme aux niveaux limites d’exigences d’exposition RF aux personnes définies par Industrie Canada. Cet appareil doit être installé afin d’offrir une distance de séparation d’au moins 20 cm avec l’utilisateur, et ne doit pas être installé à proximité ou être utilisé en conjonction avec une autre antenne ou un autre émetteur.
To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropic radiated power (e.i.r.p.) is not more than that permitted for successful communication.
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
User manual Rev. 1.0 — 15 June 2016 17 of 24
NXP Semiconductors
The J operate with antennas having a maximum gain of 2 dBi. Antennas having a gain greater than 2 dBi are strictly prohibited for use with these devices. The required antenna impedance is 50 ohms.
The JN5169-001-M00-2 integrates a printed antenna. The maximum gain of the printed antenna is 1 dBi.
As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc).

13.1 Industry Canada end product labelling

For Industry Canada purposes the following should be used:
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
N5169-001-M03-2 and JN5169-001-M06-2 modules have been designed to
14.
“Contains Industry Canada ID IC: 8764A-JN5169Mx” (with x = 0 or 3 or 6).

Footprint information for reflow soldering

2.54
2.54
All modules have the same footprint.
Fig 5. Module PCB footprint
16
1.27
Ø 1
1.5
3.30
1
aaa-022825Dimensions in mm
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
User manual Rev. 1.0 — 15 June 2016 18 of 24
NXP Semiconductors

15. Package outline

UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
16
30
1.27
2.54
Thickness: 3.5 mm
Dimensions in mm
Fig 6. Package outline JN5169-001-M00-2
21
2.54
3.30
aaa-022826
16
10.85
2.53
1.27
2.54
2.54
Thickness: 3.5 mm
Dimensions in mm
3.30
aaa-022827
Fig 7. Package outline JN5169-001-M03-2
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
User manual Rev. 1.0 — 15 June 2016 19 of 24
NXP Semiconductors
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
16
8
2.81
30
1.27
2.54
Thickness: 3.5 mm
Dimensions in mm
Fig 8. Package outline JN5169-001-M06-2
2.54
3.30
aaa-022828
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
User manual Rev. 1.0 — 15 June 2016 20 of 24
NXP Semiconductors

16. Abbreviations

Table 13. Abbreviations
Acronym Description
API Application Program Interface ADC Analog to Digital Converter FCC Federal Communication Commission IO Input Output OEM Original Equipment Manufacturer PCB Printed Circuit Board PER Packet Error Rate PWM Pulse Width Modulation R&TTE Radio and Telecommunications Terminal Equipment RF Radio Frequency RISC Reduce Instruction Set Computing RSSI Receive Signal Strength Indicator RTS Request-To-Send SPI Serial Peripheral Interface SVM Supply Voltage Monitor SYNTH SYNTHesizer UART Universal Asynchronous Receiver/Transmitter
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

17. References

[1] IEEE Std 802.15.4-2011 — IEEE Std 802.15.4-2011 IEEE Standard for Information
Technology.
[2] JN5169 — JN5169 wireless microcontroller datasheet. [3] Wireless Connectivity —
http://www.nxp.com/products/interface-and-connectivity/wireless-connectivity:WIRE LESS-CONNECTIVITY
[4] Part 15 of the FCC Rules —
http://www.ecfr.gov/cgibin/textidx?SID=d01e00935bfcb0d53b914e7c8e63f383 &node=47:1.0.1.1.16&rgn=div5
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
User manual Rev. 1.0 — 15 June 2016 21 of 24
NXP Semiconductors

18. Legal information

UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

18.1 Definitions

Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

18.2 Disclaimers

Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the cu stome r’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Customers are responsible for the design and operation of their appli cations and products using NXP Semiconductors product s, and NXP Semiconductors accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.
Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whet her express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer.
In no event shall NXP Semiconductors, its affiliates or their supplie rs be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for l oss of bu siness, busi ness interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory , even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoin g limitatio ns, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose.
Translations — A non-English (t ranslated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

18.3 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
2
I
C-bus — logo is a trademark of NXP Semiconductors N.V.
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
User manual Rev. 1.0 — 15 June 2016 22 of 24
NXP Semiconductors

19. Tables

UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
Table 1. Variants and identifications information . . . . . . .3
Table 2. Marking code . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Table 3. Marking code . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Table 4. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .9
Table 5. Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Table 6. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .13
Table 7. Operating conditions . . . . . . . . . . . . . . . . . . . .14

20. Figures

Fig 1. JN5169-001-M00-2 and JN5169-001-M03-2
packages marking (top view). . . . . . . . . . . . . . . . .6
Fig 2. JN5169-001-M06-2 package marking (top view). .7
Fig 3. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Fig 4. Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . .9
Fig 5. Module PCB footprint. . . . . . . . . . . . . . . . . . . . . .18
Fig 6. Package outline JN5169-001-M00-2. . . . . . . . . .19
Fig 7. Package outline JN5169-001-M03-2. . . . . . . . . .19
Fig 8. Package outline JN5169-001-M06-2. . . . . . . . . .20
Table 8. Active processing . . . . . . . . . . . . . . . . . . . . . . 14
Table 9. Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 10. Deep sleep mode . . . . . . . . . . . . . . . . . . . . . .15
Table 11. RF port characteristics . . . . . . . . . . . . . . . . . . 15
Table 12. Radio transceiver characteristics: +25 °C . . . . 15
Table 13. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 21
User manual Rev. 1.0 — 15 June 2016 23 of 24
NXP Semiconductors
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

21. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 3
1.1 Variants and identifications information . . . . . . 3
1.2 Regulatory approvals . . . . . . . . . . . . . . . . . . . . 3
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 3
2.1 Benefits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Features: modules . . . . . . . . . . . . . . . . . . . . . . 4
2.3 Features: microcontroller . . . . . . . . . . . . . . . . . 5
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1 JN5169-001-M00-2 and JN516 9-001-M03-2 . . 6
5.2 JN5169-001-M06-2. . . . . . . . . . . . . . . . . . . . . . 7
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 8
7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 9
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 9
8 Functional description . . . . . . . . . . . . . . . . . . 12
8.1 JN5169 single chip wireless microcontroll er. . 12
8.2 Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13
10 Recommended operating conditions. . . . . . . 14
11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 14
11.1 DC current . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
11.2 AC characteristics. . . . . . . . . . . . . . . . . . . . . . 15
11.2.1 Radio transceiver . . . . . . . . . . . . . . . . . . . . . . 15
12 Federal Communication Commission Statement
16
12.1 FCC end product labelling . . . . . . . . . . . . . . . 17
13 Industry Canada statement. . . . . . . . . . . . . . . 17
13.1 Industry Canada end product labelling. . . . . . 18
14 Footprint information for reflow soldering . . 18
15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19
16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 21
17 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 22
18.1 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
18.2 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
18.3 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
19 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
20 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
UM11016
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016. All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 June 2016
Document identifier: UM11016
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