NXP Semiconductors FRDM-KW36 User Manual

© 2018 NXP B.V.

FRDM-KW36 Minimum BoM Development
Board User’s Guide

1. Introduction

This guide describes the hardware of KW36 Minimum Bill
of Material development board (reference X-UBluetooth
LEKWZ0-31417). The board is configurable, low-power,
and cost-effective. It is an evaluation and development
board for application prototyping and demonstration of the
KW36A/35A and KW36Z/35Z family of devices.

The KW36 is an ultra-low-power, highly integrated single­chip device that enables Bluetooth® Low Energy
(Bluetooth LE) or Generic FSK (at 250, 500 and 1000
kbps) for portable, extremely low-power embedded
systems.

The KW36 integrates a radio transceiver operating in

2.36 GHz to 2.48 GHz range supporting a range of GFSK,
an Arm® Cortex®-M0+ CPU, up to 512 KB Flash and up
to 64 KB SRAM. Bluetooth LE Link Layer hardware and
peripherals optimized to meet the requirements of the target
applications.

KW36 device is also available on the FRDM-KW36
Freedom Development Board. For more information about
the FRDM-KW36 Freedom Development Board, see the

NXP Semiconductor

Document Number: MiniBoMKW36UG

User’s Guide

Rev. 0

,

09/20187

Contents

1. Introduction ....................................................................... 1

2 Overview and description .................................................. 2

2.1 Overview .................................................................2

2.2 Feature description ..................................................3

3 Functional description........................................................ 5

3.1 Block diagram .........................................................5

3.2 Generic application schematic .................................6

3.3 RF Circuit ................................................................9

3.4 Clocks ......................................................................9

3.5 Power management ................................................ 10

3.6 User Application LEDs .......................................... 15

4 I/O .................................................................................... 16

4.1 I/O pin accessibility ............................................... 16

5 Schematic......................................................................... 18

6 Layout .............................................................................. 19

7 PCB ................................................................................. 20

8 Mounted PCB .................................................................. 20

9 Component positioning .................................................... 21

10 Bill of material ................................................................. 23

Buck mode ............................................................. 23

Bypass mode .......................................................... 25

11 References ....................................................................... 27

12 Revision history ............................................................... 27

Overview and description

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

2 NXP Semiconductos.

FRDM-KW36 Freedom Development Board User's Guide (document FRDMKW36ZUG). Find the
schematic and design files at this link (NXP web page).

2 Overview and description

The KW36 minimum BoM development board is an evaluation environment supporting NXP
KW35Z/36Z/35A/36A (KW36) Wireless Microcontrollers (MCU). The KW36 integrates a radio
transceiver operating in the 2.4 GHz band (supporting a range of GFSK and Bluetooth LE) and an Arm
Cortex-M0+ MCU into a single package. NXP supports the KW36 with tools and software that include
hardware evaluation and development boards, software development IDE, applications, drivers, and a
custom PHY with a Bluetooth LE Link Layer. The KW36 minimum BoM development board (31417)
consists of the KW36Z device with a 32 MHz reference oscillator crystal, RF circuitry (including antenna),
supplied with a coin cell CR2032 or an external power supply. The board is a standalone PCB and supports
application development with NXP’s Bluetooth Low Energy and Generic FSK libraries.

2.1 Overview

Figure 1 is a high-level block diagram of the KW36 Minimum BoM board (X-UBluetooth LEKWZ0-

31417) features:

Figure 1. KW36 Minimum BoM board block diagram

Overview and description

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

NXP Semiconductors 3

2.2 Feature description

The KW36 Minimum BoM development board is based on TPMS development platform. It is the most
diverse reference design containing the KW36Z device and all necessary I/O connections to use as a stand­alone board. Figure 2 shows the KW36 Minimum BoM development board.

Figure 2. KW36 Minimum BoM development board

The KW36 Minimum BoM development board includes following features:

• NXP’s ultra-low-power KW36Z Wireless MCU supporting Bluetooth LE and Generic FSK

• Reference design area with small-footprint, low-cost RF node:

o Single-ended input/output port
o Very low count of external components (minimum BoM)

• Ceramic antenna

• Selectable power sources (coin cell or external output power)

• DC-DC converter with Buck, and Bypass operation modes

• 32 MHz reference oscillator for RF operation

• 32.768 kHz reference oscillator mainly use for RTC operation and RF low-power operation

• 2.4 GHz frequency operation (ISM and MBAN)

• Coin cell connector to be able to work using a CR2032 coin cell

• Cortex 10-pin (0.05) SWD debug port for target MCU

• 1x6 Connector 6-pin UART port

• Three orange LED indicator for power and communication

• 20 available GPIOs

Overview and description

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

4 NXP Semiconductos.

Figure 3 shows the main board features and Input/Output headers for the KW36 Minimum BoM board:

Figure 3. KW36 Minimum BoM board component placement

Functional description

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

NXP Semiconductors 5

3 Functional description

The four-layer board provides the KW36 with its required RF circuitry, 32 MHz reference oscillator
crystal, and power supply with a DC-DC converter including Bypass and Buck (default) modes. The
layout for this base-level functionality can be used as a reference layout for your target board.

3.1 Block diagram

Figure 4. Block diagram (Buck mode)

Figure 5. Block diagram (Bypass mode)

Functional description

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

6 NXP Semiconductos.

3.2 Generic application schematic

3.2.1 Buck mode (auto-start)

Figure 6. Buck mode (auto start)

Functional description

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

NXP Semiconductors 7

3.2.2 Buck mode (manual-start)

Figure 7. Buck mode (manual start)

Functional description

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

8 NXP Semiconductos.

3.2.3 Bypass mode

Figure 8. Bypass mode

Functional description

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

NXP Semiconductors 9

3.3 RF Circuit

The KW36 Minimum BoM board RF circuit provides an RF interface for users to begin application
development. A minimum matching network to the MCU antenna pin is provided through C17 and L8.
Those two components match to the ceramic antenna through a 50 ohms controlled line. An additional
and optional matching component (R112 footprint), is provided to better filter harmonics.

Figure 9. KW36 Minimum BoM board RF circuit

3.4 Clocks

The KW36 Minimum BoM board provides two clocks. One 32 MHz for clocking MCU and Radio, and
a 32.768 kHz to provide an accurate low-power time base.

Figure 10. KW36 minimum BoM board 32 MHz reference oscillator circuit

Functional description

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

10 NXP Semiconductos.

• 32 MHz Reference Oscillator

o Figure 10 shows the 32 MHz external crystal Y3. The KW36Z requires the frequency to

be accurate less than 10 ppm. For more details, please refer to the device datasheet.

o Internal load capacitors provide the crystal load capacitance. The internal load capacitor

is adjustable which allows the center frequency of the crystal to be tuned.

o To measure the 32 MHz oscillator frequency, program the CLKOUT (PTB0) signal to

provide buffered output clock signal (TP29).

Figure 11. KW36 Minimum BoM Board 32.786 kHz oscillator circuit

• 32.768 kHz Crystal Oscillator (for accurate low-power time base)

o A secondary 32.768 kHz crystal QZ1 is provided (see Figure 6)
o Internal load capacitors provide the entire crystal load capacitance

3.5 Power management

There are two different ways to power the KW36 Minimum BoM board. The KW36 Minimum BoM
board power-management circuit is shown in Figure 12:

Functional description

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

NXP Semiconductors 11

Figure 12. KW36 Minimum BoM Board power management circuit.

The KW36 Minimum BoM Board can be powered by the following means:

• From an external battery (Coin-cell – CR2032). Use jumper J4 pins 1-2 or solder R234.

• From an external DC supply in the following ways:

o Connect two wires: a wire that can supply 1.71 to 3.6 VDC (BT1-1) and another wire to

the ground (BT1-2) in bypass mode. By default, KW36 DC-DC is configured in buck
mode, then, the voltage should be in the range of 2.1 V to 3.6 V.

Orange LED marked as D4 is available as a power indicator.

The KW36 Minimum BoM Board can be configured to use either of the DCDC converter operating
modes (default). These modes are Bypass or Buck (default). Moving the configuration from buck
(default) to bypass mode need to modify some components:

Table 1. : Buck or bypass mode table

Buck mode

Bypass mode

Figure

R1 x -

10

R2 - x

10

R3 - x

10

R4 x -

10

R5 - x

9

R6 x -

9

R7 - x

10

R9 x x

8

R10 - -

8

L3 x -

8

Functional description

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

12 NXP Semiconductos.

NOTE

x (populated component), - not populated component

Figure 13. Component configuration for Buck or Bypass mode – DCDC_CFG pin

Figure 14. Component configuration for Buck or Bypass mode – PSWITCH pin

Functional description

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

NXP Semiconductors 13

Figure 15. Component configuration for Buck or Bypass mode – supply pins

DCDC mode jumper configurations are described in Figure 16.

Figure 16. DCDC configurations.

Functional description

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

14 NXP Semiconductos.

VREFH/VREF_OUT

Circuit for VREF_OUT
VREF_OUT provides a 1.2V reference voltage that can be used as VREFH for ADC.

Figure 17. Circuit for VREF_OUT

Circuit for VREFH
VREFH is the high reference voltage for the ADC, in this circuit it will have the same values as
VDDA (Analog supply voltage).

Figure 18. Circuit for VREFH

Functional description

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

NXP Semiconductors 15

3.6 User Application LEDs

The KW36 Minimum BoM Board provides an orange LED for user applications. Figure 19 shows the
circuitry for the application controlled LEDs.

- LED_COM1: SCL

- LED_COM2: SDA

- LED_COM3: RF active

Figure 19. KW36 Minimum BoM Board Orange LED circuit.

NOTE

When operating in default Buck configuration, the MCU would be
operating at 1.8 V, which means that GPIO would be operating at 1.8 V.

I/O

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

16 NXP Semiconductos.

4 I/O

4.1 I/O pin accessibility

Figure 20 shows the I/O pinout (TPx). Each I/O pin has its own ground to facilitate the 2 wires
connection on the PCB.

Figure 20. KW36 Minimum BoM Board I/O pinout

I/O

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

NXP Semiconductors 17

Table 2 shows the signals that can be multiplexed to each pin.

Table 2. Test point description

TPx

Test Point (TPx)- Description

IC

Pin

TP20

PTA16/LLWU_P4/SPI1_SOUT/UART1_RTS_b/TPM0_CH0

4

TP21

PTC18/LLWU_P2/SPI0_IN/I2C1_SDA/UART0_TX/BSM_DATA/DTM_TX/UART1_TX

47

TP22

PTC17/LLWU_P1/RF_EXT_OSC_EN/SPI0_SOUT/I2C1_SCL/UART0_RX/BSM_FRAME/DTM_RX/UART1_RX

46

TP23

PTC19/LLWU_P3/RF_EARLY_WARNING/SPI0_PCS0/I2C0_SCL/UART0_CTS_b/BSM_CLK/UART1_CTS_b

48

TP25

PTC16/LLWU_P0/SPI0_SCK/I2C0_SDA/UART0_RTS_b/TPM0_CH3/UART1_RTS_b

45

TP26

PTC1/DIAG1/RF_EARLY_WARNING/ANT_B/I2C0_SDA/UART0_RTS_b/TPM0_CH2/SPI1_SCK/BSM_CLK

37

TP27

PTC2/LLWU_P10/TSI0_CH14/DIAG1/TX_SWITCH/I2C1_SCL/UART0_RX/CMT_IRO/DTEST6/DTM_RX

38

TP28

PTC3/DIAG3/LLWU_P11/RX_SWITCH/I2C1_SDA/UART0_TX/TPM0_CH1/DTM_TX/SPI1_SIN/CAN0_TX

39

TP29

PTB0/LLWU_P8/RF_RFOSC_EN/RF_DFT_RESET/I2C0_SCL/CMP0_OUT/TPM0_CH1/CLKOUT/CAN0_TX

16

TP30

PTB1/ADC0_SE1/CMP0_IN5/RF_PRIORITY/DTM_RX/I2C0_SDA/LPTMR0_ALT1/TPM0_CH2/CMT_IRO/CAN0_RX

17

TP31

PTC4/DIAG4/RF_ACTIVE/LLWU_P12/ANT_A/EXTRG_IN/UART0_CTS_b/TPM1_CH0/BSM_DATA/SPI1_PCS0/CAN0_RX

40

TP32

PTC5/LLWU_P13/RF_RF_OFF/ LPTMR0_ALT2/UART0_RTS_b/TPM1_CH1/BSM_CLK

41

TP34

PTA17/LLWU_P5/RF_DFT_RESET/SPI1_SIN/UART1_RX/CAN0_TX/TPM_CLKIN1

5

TP35

PTA18/LLWU_P6/SPI1_SCK/ UART1_TX/CAN0_RX/TPM2_CH0

6

TP36

PTA19/ADC0_SE5/LLWU_P7/SPI1_PSC0/UART1_CTS_b/TMP2_CH1

7

TP37

PTB2/ADC0_SE3/CMP0_IN3/RF_OFF/TPM1_CH0/DTEST13/DCDC_TESTO5

18

TP38

PTB3/ADC0_SE2/CMP0_IN4/CLKOUT/TPM1_CH1/DTEST9/RTC_CLKOUT/ERCLK32K

19

TP42

PTB18/DAC0_OUT/ADC0_SE4/CMP0_IN2/I2C1_CLK/TPM_CLKIN0/TPM0_CH0/DTEST8/NMI

23

TP46

ADC0_DP0/CMP0_IN0

24

TP47

ADC0_DP0/CMP0_IN1

25

Table 3. UART connector pinout (JP3)

HDR Pin

1x6 Connector (JP3) - Description

IC Pin

1

GND

-

2

FTDI cable CTS / PTC5

41

3

FTDI cable VCC / VBAT_PWR

-

4

FTDI cable TXD / UART0_RX

42

5

FTDI cable RXD / UART0_TX

43

6

FTDI cable RTS / PTC4

40

Table 4. SWD connector pinout (J14)

HDR Pin

2x5 Connector (J14) - Description

IC Pin

1

VDD_1P8F

-

2

PTA0_SWD_DIO

1

3

GND

-

4

PTA1_SWD_CLK

2

5

GND

-

6

NC

-

7

NC

-

8

NC

-

9

NC

-

10

RST_TGTMCU_b

3

Schematic

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

18 NXP Semiconductos.

5 Schematic

Layout

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

NXP Semiconductors 19

6 Layout

Figure 21. Layout

Mounted PCB

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

20 NXP Semiconductos.

7 PCB

Figure 22. PCB

8 Mounted PCB

Figure 23. Mounted PCB

Component positioning

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

NXP Semiconductors 21

9 Component positioning

Figure 24. Component positioning 1

Component positioning

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

22 NXP Semiconductos.

Figure 25. Component positioning 2

Bill of material

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

NXP Semiconductors 23

10 Bill of material

Buck mode

Table 5. Minimum BoM list for any application board in buck mode

Designator

Value

Manufacturer

Part Number

Purpose

L8

4.7nH

Coilcraft

0402HP-4N7XGE

RF Matching*

L1

100nH

Murata

LQW15ANR10J00D

DC filtering

L3

10µH

TDK

VLS4012ET-100M

DC-DC Inductor

L2

100nH

Murata

LQW15ANR10J00D

DC filtering

C21

3pF

Murata

GRM1555C1H3R0CZ01D

Decoupling Caps***

C22

3pF

Murata

GRM1555C1H3R0CZ01D

Decoupling Caps***

C23

3pF

Murata

GRM1555C1H3R0CZ01D

Decoupling Caps***

C24

3pF

Murata

GRM1555C1H3R0CZ01D

Decoupling Caps***

C1

12pF

Murata

GRM1555C1H120JZ01D

Decoupling Caps

C3

12pF

Murata

GRM1555C1H120JZ01D

Decoupling Caps

C17

0.8pF

Murata

GRM1555C1HR80WA01D

RF Matching*

C18

0.8pF

Murata

GRM1555C1HR80WA01D

RF Matching*

C7

10µF

TAIYO YUDEN

EMK107BBJ106MA-T

C4

0.1µF

KEMET

C0402C104K8PAC

Decoupling Caps

C10

10µF

TAIYO YUDEN

EMK107BBJ106MA-T

Decoupling Caps

C5

0.1µF

KEMET

C0402C104K8PAC

Decoupling Caps

C12

10µF

TAIYO YUDEN

EMK107BBJ106MA-T

Decoupling Caps

C9

0.1µF

KEMET

C0402C104K8PAC

DC filtering

C8

1µF

Murata

GRM188R61H105KAALD

DC filtering

R20

100KΩ

YAGEO AMERICA

RC0402FR-07102KL

Pswitch pull-down

(manual start only)

Y3

32MHz

NDK

EXS00A-CS07637

Main clock**

QZ1

32KHz

EPSON ELECTRONICS

FC-135 32.7680KA-A3

RTC clock

Bill of material

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

24 NXP Semiconductos.

* FRDM-KW41Z matching

** Refer to chapter 3.4 Clocks for alternate crystal frequencies and PNs
*** Add the decoupling capacitor if the associated pin is used into the application

Table 6. Minimum BoM list for 31417 application board in buck mode

BOM.Qty

Commodity

BOM.Ref Des

Values

List of components only used for the minimum BoM board 31417

18

Resistor

R160,R161,R174,R176,R204,R212,R213,R214,R215,

R216,R218,R219,R220,R221,R222,R226,R232,R233

0 ohm

1

Through-Hole

J4

connector

1

Capacitor

C2

12pF 2 Capacitor

C6,C55

0.1uF

1

Capacitor

C19

10uF

1

Capacitor

C70

1.5pF

1

Capacitor

C11

1uF 1 Inductor

L4

1nH 1 Resistor

R1 (buck)

0 ohm

3

Resistor

R4,R6(buck), R9

0 ohm

4

Resistor

R132,R133,R230,R231

4.7K

1

Connector

JP3

FTDI connector

1

Header

J14

SWD connector

1

ceramic antenna

E1

ceramic antenna

1

Bracket, Strap, Clamp

BT1- CR2450

Coin cell support

DNP

LED

D2, D3, D4

Leds

DNP

Resistor

R64, R120, R121

1K

DNP

Resistor

R5(buck), R10

ohm

DNP

Resistor

R2 (buck)

ohm

DNP

Resistor

R3 (buck)

ohm

DNP

Resistor

R7 (buck)

ohm

DNP

Resistor

R67,R68,R112,R119,R183, R234

ohm

DNP

Resistor

R98,R99,R134

10K

DNP=Do Not Populate

Bill of material

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

NXP Semiconductors 25

Bypass mode

Table 7. Minimum BoM list for any application board in bypass mode

Designator

Value

Manufacturer

Part Number

Purpose

L8

4.7nH

Coilcraft

0402HP-4N7XGE

RF Matching*

C21

3pF

Murata

GRM1555C1H3R0CZ01D

Decoupling Caps***

C22

3pF

Murata

GRM1555C1H3R0CZ01D

Decoupling Caps***

C23

3pF

Murata

GRM1555C1H3R0CZ01D

Decoupling Caps***

C24

3pF

Murata

GRM1555C1H3R0CZ01D

Decoupling Caps***

C1

12pF

Murata

GRM1555C1H120JZ01D

Decoupling Caps

C3

12pF

Murata

GRM1555C1H120JZ01D

Decoupling Caps

C17

0.8pF

MURATA

GRM1555C1HR80WA01D

RF Matching*

C18

0.8pF

MURATA

GRM1555C1HR80WA01D

DNP RF Matching*

C12

10µF

TAIYO YUDEN

EMK107BBJ106MA-T

C4

0.1µF

KEMET

C0402C104K8PAC

Decoupling Caps

C5

0.1µF

KEMET

C0402C104K8PAC

Decoupling Caps

C8

0.1µF

KEMET

C0402C104K8PAC

Decoupling Caps

C10

0.1µF

KEMET

C0402C104K8PAC

Decoupling Caps

C9

0.1µF

KEMET

C0402C104K8PAC

DC filtering

C19

10µF

TAIYO YUDEN

EMK107BBJ106MA-T

Power supply bulk cap

C28

10µF

TAIYO YUDEN

EMK107BBJ106MA-T

Power supply bulk cap

Y3

32MHz

NDK

EXS00A-CS07637

Main clock**

QZ1

32KHz

EPSON

ELECTRONICS

FC-135 32.7680KA-A3

RTC clock

* FRDM-KW35/36/A/Z matching

** Refer to chapter 3.4 Clocks for alternate crystal frequencies and PNs
*** Add the decoupling capacitor if the associated pin is used into the application

Bill of material

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

26 NXP Semiconductos.

Table 8. Minimum BoM list for 31417 application board in bypass mode

BOM.Qty

Commodity

BOM.Ref Des

Values

List of components only used for the minimum BoM board 31417

18

Resistor

R9, R160,R161,R174,R176,R204,R212,R213,R214,R215,

R216,R218,R219,R220,R221,R222,R226,R232,R233

0 ohm

3

Resistor

R5 (bypass)

0 ohm

1

Resistor

R2 (bypass)

0 ohm

1

Resistor

R3 (bypass)

0 ohm

1

Resistor

R7 (bypass)

0 ohm

4

Resistor

R132,R133,R230,R231

4.7K

1

Connector

JP3

FTDI connector

1

Header

J14

SWD connector

1

ceramic antenna

E1

ceramic antenna

1

Bracket, Strap, Clamp

BT1- CR2450

Coin cell support

1

Connector

J4

battery connector

1

Capacitor

C2

12pF

1

Capacitor

C6,C7,C55

0.1uF

1

Capacitor

C70

1.5pF

1

Capacitor

C11

1uF 1 Inductor

L4

1nH

DNP

Inductor

L3 (bypass)

10uH

DNP

Resistor

R1 (bypass)

0 ohm

DNP

Resistor

R4,R6 (bypass)

0 ohm

DNP

Resistor

R64,R120,R121

1K

DNP

LED

D2,D3,D4

Leds

DNP

Resistor

R10, R67,R68,R112,R119,R183, R234

0 ohm

DNP

Resistor

R98,R99,R134

10K

DNP=Do Not Populate

Revision history

FRDM-KW36 Minimum BoM Development Board User’s Guide, User’s Guide, Rev. 0, 09/20187

NXP Semiconductors 27

11 References

The following references are available on KW36 Minimum BoM Board:

• KW36 Minimum BoM Board Design Package

12 Revision history

Rev.

Date

Substantive change(s)

0

09/2018

Initial revision.

Document Number: MiniBoMKW36UG

Rev. 0

09/20187

How to Reach Us:
Home Page:

nxp.com

Web Support:

nxp.com/support

Information in this document is provided solely to enable system and software implementers
to use NXP products. There are no express or implied copyright licenses granted hereunder to
design or fabricate any integrated circuits based on the information in this document. NXP
reserves the right to make changes without further notice to any products herein.

NXP makes no warranty, representation, or guarantee regarding the suitability of its products
for any particular purpose, nor does NXP assume any liability arising out of the application or
use of any product or circuit, and specifically disclaims any and all liability, including without

limitation consequential or incidental damages. “Typical” parameters that may be provided in

NXP data sheets and/or specifications can and do vary in different applications, and actual

performance may vary over time. All operating parameters, including “typicals,” must be

validated for each customer application by customer's technical experts. NXP does not convey
any license under its patent rights nor the rights of others. NXP sells products pursuant to
standard terms and conditions of sale, which can be found at the following address:

nxp.com/SalesTermsandConditions.

While NXP has implemented advanced security features, all products may be subject to
unidentified vulnerabilities. Customers are responsible for the design and operation of their
applications and products to reduce the effect of these vulnerabilities on customer’s
applications and products, and NXP accepts no liability for any vulnerability that is discovered.
Customers should implement appropriate design and operating safeguards to minimize the
risks associated with their applications and products.

NXP, the NXP logo, NXP SECURE CONNECTIONS FOR A SMARTER WORLD,
COOLFLUX, EMBRACE, GREENCHIP, HITAG, I2C BUS, ICODE, JCOP, LIFE VIBES,
MIFARE, MIFARE CLASSIC, MIFARE DESFire, MIFARE PLUS, MIFARE FLEX, MANTIS,
MIFARE ULTRALIGHT, MIFARE4MOBILE, MIGLO, NTAG, ROADLINK, SMARTLX,
SMARTMX, STARPLUG, TOPFET, TRENCHMOS, UCODE, Freescale, the Freescale logo,
AltiVec, C 5, CodeTEST, CodeWarrior, ColdFire, ColdFire+, C Ware, the Energy Efficient
Solutions logo, Kinetis, Layerscape, MagniV, mobileGT, PEG, PowerQUICC, Processor
Expert, QorIQ, QorIQ Qonverge, Ready Play, SafeAssure, the SafeAssure logo, StarCore,
Symphony, VortiQa, Vybrid, Airfast, BeeKit, BeeStack, CoreNet, Flexis, MXC, Platform in a
Package, QUICC Engine, SMARTMOS, Tower, TurboLink, and UMEMS are trademarks of
NXP B.V. All other product or service names are the property of their respective owners. Arm,
AMBA, Arm Powered, Artisan, Cortex, Jazelle, Keil, SecurCore, Thumb, TrustZone, and
μVision are registered trademarks of Arm Limited (or its subsidiaries) in the EU and/or
elsewhere. Arm7, Arm9, Arm11, big.LITTLE, CoreLink, CoreSight, DesignStart, Mali, Mbed,
NEON, POP, Sensinode, Socrates, ULINK and Versatile are trademarks of Arm Limited (or its
subsidiaries) in the EU and/or elsewhere. All rights reserved. Oracle and Java are registered
trademarks of Oracle and/or its affiliates. The Power Architecture and Power.org word marks
and the Power and Power.org logos and related marks are trademarks and service marks
licensed by Power.org.

© 2018 NXP B.V.