NXP Semiconductors FRDM-HB2000FEVM User Manual

KTFRDMHB2000FEVMUG

FRDM-HB2000FEVM evaluation board

Rev. 1.0 — 5 July 2016 User guide

1 FRDM-HB2000FEVM

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2 Important notice

NXP provides the enclosed product(s) under the following conditions: This evaluation kit
is intended for use of ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES
ONLY. It is provided as a sample IC pre-soldered to a printed circuit board to make it
easier to access inputs, outputs, and supply terminals. This evaluation board may be
used with any development system or other source of I/O signals by simply connecting
it to the host MCU or computer board via off-the-shelf cables. This evaluation board is
not a Reference Design and is not intended to represent a final design recommendation
for any particular application. Final device in an application will be heavily dependent on
proper printed circuit board layout and heat sinking design as well as attention to supply
filtering, transient suppression, and I/O signal quality.

The goods provided may not be complete in terms of required design, marketing, and
or manufacturing related protective considerations, including product safety measures
typically found in the end product incorporating the goods. Due to the open construction
of the product, it is the user's responsibility to take any and all appropriate precautions
with regard to electrostatic discharge. In order to minimize risks associated with the
customers applications, adequate design and operating safeguards must be provided
by the customer to minimize inherent or procedural hazards. For any safety concerns,
contact NXP sales and technical support services.

Should this evaluation kit not meet the specifications indicated in the kit, it may be
returned within 30 days from the date of delivery and will be replaced by a new kit.

NXP reserves the right to make changes without further notice to any products herein.
NXP makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does NXP assume any liability arising out of the
application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation consequential or incidental damages. “Typical” parameters
can and do vary in different applications and actual performance may vary over time.
All operating parameters, including “Typical”, must be validated for each customer
application by customer’s technical experts.

NXP does not convey any license under its patent rights nor the rights of others. NXP
products are not designed, intended, or authorized for use as components in systems
intended for surgical implant into the body, or other applications intended to support or
sustain life, or for any other application in which the failure of the NXP product could
create a situation where personal injury or death may occur.

Should the Buyer purchase or use NXP products for any such unintended or
unauthorized application, the Buyer shall indemnify and hold NXP and its officers,
employees, subsidiaries, affiliates, and distributors harmless against all claims, costs,
damages, and expenses, and reasonable attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or
unauthorized use, even if such claim alleges NXP was negligent regarding the design
or manufacture of the part. NXP and the NXP logo are trademarks of NXP B.V. All other
product or service names are the property of their respective owners. © 2016 NXP B.V.

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3 Getting started

3.1 Kit contents/packing list

The FRDM-HB2000FEVM contents include:

• Assembled and tested evaluation board/module in anti-static bag

• FRDM-KL25Z

• Quick start guide

3.2 Jump start

NXP’s analog product development boards provide an easy-to-use platform for
evaluating NXP products. The boards support a range of analog, mixed-signal and power
solutions. They incorporate monolithic ICs and system-in-package devices that use
proven high-volume SMARTMOS technology. NXP products offer longer battery life, a
smaller form factor, reduced component counts, lower cost and improved performance in
powering state of the art systems.

1. Go to www.nxp.com/FRDM-HB2000FEVM.

2. Review your Tools Summary Page.

3. Locate and click:

4. Download the documents, software and other information.

Once the files are downloaded, review the user guide in the bundle. The user guide
includes setup instructions, BOM and schematics. Jump start bundles are available on
each tool summary page with the most relevant and current information. The information
includes everything needed for design.

3.3 Required equipment

This kit requires the following items:

• 3/16” blade screwdriver for connecting the cables

• DC Power supply: 5.0 V to 40 V with up to 20 A current handling capability, depending

on motor requirements

• USB Standard A (male) to mini-B (male) cable

• Typical loads (brushed DC motor, power resistors or inductive load with up to 5.0 A and

28 V operation)

• Function generator (optional)

• FRDM-KL25Z Freedom Development Platform for SPI communication (included in KIT)

• SPIGen software (for using FRDM-KL25Z based SPI Dongle)

3.4 System requirements

The kit requires the following to function properly with the software:

• USB enabled computer with Windows XP or newer

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4 Getting to know the hardware

4.1 Board overview

The FRDM-HB2000FEVM evaluation kit exercises all the functions of the MC33HB2000
H-Bridge device. The parallel input can be easily controlled by lab equipment or any
MCU with GPIOs.

The board can be used in conjunction with a FRDM-KL25Z board connected to a PC’s
USB port. Configure, control and monitor the status of MC33HB2000 by using the
board’s SPI communication capabilities.

4.2 Board features

The FRDM-HB2000FEVM board evaluates the NXP part MC33HB2000, including all
functions. The board features the following:

• Built-in reverse battery protection

• Test points that allow signal probing

• Built-in voltage regulator to supply logic level circuitry

• LEDs to indicate the supply status and the direction of the motor

• Low Equivalent Series Resistance (ESR) capacitor to reduce ripple in the power supply

• Transient voltage suppressor to handle system level transients

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4.3 Block diagram

MC33HB2000

Power Supply

Reverse

Battery and

Transient

Protection

5V Voltage

Regulator

VPWR

LED

VDD LED

Charge Pump Capacitor

VPWR

CCP

IN1

IN2

ENBL

MOSI

CFB

OUT2

OUT1

FS_B

All Grounds

FS_B LED

FWD LED

REV LED

Load

From
MCU
GPIO

To MCU

ADC inpu

t

To MCU

GPIO

Optional 5.0 V Supply to FRDM

Optional 3.3 V Supply from FRDM

DIS

MISO

SCLK

CSB

MCU
SPI

Shunt
Resistor

VDDQ

Figure 1. Block diagram

4.3.1 Device features

This evaluation board features the following NXP product:

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Table 1. Device features

Device Description Features

MC33HB2000 The 33HB2000 is a monolithic H-Bridge

Power IC, enhanced with SPI configurability
and diagnostic capabilities.

• Advanced diagnostic reporting via a serial peripheral

interface (SPI): charge pump undervoltage on VPWR,
short to ground and short to VPWR for each output,
open load, temperature warning and overtemperature
shutdown

• Thermal management: excellent thermal resistance of

< 1.0 °C/W between junction and case (exposed pad)

• Eight selectable slew rates via the SPI: 0.25 V/μs to

more than 16 V/μs for EMI and thermal performance
optimization

• Four selectable current limits via the SPI:

5.4/7.0/8.8/10.7 A, covering a wide range of
applications

• Can be operated without the SPI with a default slew

rate of 2.0 V/μs and a 7.0 A current limit threshold

• Highly accurate real-time current feedback through a

current mirror output signal with less than 5.0 % error

• Drives inductive loads in a full H-Bridge or Half-bridge

configuration

• Overvoltage protection places the load in high-side

recirculation (braking) mode with notification in H­Bridge mode

• Wide operating range: 5.0 V to 28 V operation

• Low R

DS(on)

integrated MOSFETs: Maximum of

235 mΩ (TJ = 150 °C) for each MOSFET

• Internal protection for overtemperature, undervoltage

and short-circuit by signaling the error condition and
disabling the outputs

• I/0 pins can withstand up to 36 V

4.3.2 Modes of operation

LOAD

V

PWR

V

PWR

Load

current

ON

OFF

OFF

ON

OUT1

OUT2

Forward

LOAD

V

PWR

V

PWR

Load

current

ON

OFF

ON

OFF

OUT1

OUT2

Free-wheel high

(Forward)

LOAD

V

PWR

V

PWR

Load

current

OFF

ON

ON

OFF

OUT1

OUT2

Reverse

LOAD

V

PWR

V

PWR

Load

current

OFF

ON

OFF

ON

OUT1

OUT2

Free-wheel low

(Forward)

PGND

PGND PGND PGND

PGND

PGND

PGND

PGND

Figure 2. Modes of operation

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4.3.3 Architecture

Figure 3. Architecture

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4.3.4 Thermal management

Figure 4. Thermal management

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4.4 Board description

Figure 5 describes the main elements on the FRDM-HB2000FEVM.

1

4

6

2

3

5

7

Figure 5. Board description

Table 2. Board description

Number Name Description

1 MC33HB2000 Monolithic H-Bridge Power IC in a robust thermally enhanced 32 lead PQFN package

2 Power and ground

inputs

Power supply terminal to connect the battery/power supply with the board

3 Reverse battery

protection

MOSFET for protecting MC33HB2000 in reverse battery condition

4 5.0 V regulator 5.0 V regulator for VDD and supply

5 Jumpers Jumpers for configuring the board for different modes of operation

6 Test points Test points to probe different signals

7 Output terminal Output connector to connect a load to the MC33HB2000 output

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4.5 LED display

The following LEDs serve as visual output devices for the evaluation board:

FWD

VDD

REV

FS_B

VBAT

Figure 6. LED locations

Table 3. LED locations

LED ID Description

VBAT Green LED, indicates when main/battery supply is connected

VDD Green LED, indicates when +5.0 V supply is connected

FS_B Red LED, illuminates when the H-Bridge detects a fault

FWD Green LED, indicates current flowing in forward direction

REV Red LED, indicates current flowing in reverse direction

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4.6 Jumper definitions

Figure 7 illustrates the evaluation board jumper locations. Table 4 explains the function

of each position. Bold fonts in the jumper position column indicate the default settings for
use with the FRDM-KL25Z.

DIS

VDD

CFB

ENBL

IN2 IN1 EX_IN

CFB_R

VDD_REG

MOSI

SCLK

MISO

CS_B

VDDQFS_B

Figure 7. Jumper definitions

Table 4. Jumper locations

Name Signal Jumper

position

Connection

1−2 IN1 control through MCU parallel output on J10 Pin 1 (DATA0)

J1 IN1

2−3 IN1 control through MCU parallel output on J10 Pin 1 (DATA0)

1−2 DIS control through MCU parallel output on J10 Pin 13 (CTRL1)

J2 DIS

2−3 DIS connected to GND to keep the outputs enabled

1−2 IN2 control through MCU parallel output on J10 Pin 3 (DATA1)

J3 IN2

2−3 IN2 control through external input on J15 Pin 2

1−2 CS_B control through MCU SPI output J10 Pin 6 (SPI_CS_B)

J4 CS_B

2−3 CS_B pulled up to VDD for operation without SPI

1−2 ENBL control through MCU parallel output J10 Pin 11 (CTRL0)

J5 ENBL

2−3 ENBL pulled up to VDD to keep the outputs enabled

1−2 SPI clock SCLK from MCU J10 Pin 12 (SPI_SCLK)

J6 SCLK

2−3 SCLK connected to GND for operation without SPI

1−2 MOSI control through MCU SPI output J10 Pin 8 (SPI_MOSI)

J7 MOSI

2−3 MOSI connected to GND for operation without SPI

J8 MISO

1−2 MISO control through MCU SPI output J10 Pin 10 (SPI_MISO)

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Name Signal Jumper

position

Connection

2−3 MISO not connected for operation without SPI

J11 CFB 1−2 CFB connected to 200 Ω resistor

1−2 VDD connected to VDDQ

J14 VDDQ

2−3 VDDQ not connected

1−2 VDD supply from regulator U2

J17 VDD

2−3 VDD supply from FRDM board

J18 CFB_R 1−2 CFB connected to MCU ADC input J10 Pin 17 (CFB_READ)

J19 FS_B 1−2 FS_B connected to the pull-up resistor

J26 VDD_REG 1−2 VDD to FRDM board

J15 EX_IN Open IN1 and IN2 external inputs

The FRDM-HB2000FEVM, in conjunction with a FRDM-KL25Z board (shipped with the
kit), can evaluate the design by means of a GUI, any MCU with GPIO or with simple lab
equipment. A FRDM-KL25Z-compatible GUI and MCU program are available online at
the following link: http://www.nxp.com/FRDM-HB2000FEVM.

The FRDM-HB2000FEVM is compatible with any Arduino™ platform board. However, if
a board other than the FRDM-KL25Z is used, MCU code must be written to work with the
board.

4.7 Input signal definitions

The following input signals control the outputs or functions inside the circuit.

Table 5. Input signal definitions

Input name Description

DIS Disable signal to tri-state the outputs

ENBL Disable signal to tri-state the output and put the part in Sleep mode

IN1 Logic input to control OUT1

IN2 Logic input to control OUT2

MOSI Master out slave input for the SPI

CS_B Chip select bar input for the SPI

SCLK Clock for the SPI

4.8 Output signal definitions

The FRDM-HB2000FEVM uses the following output signals to drive a load such as
a brushed DC motor. The board provides an analog output for real time load current
monitoring. This signal allows closed-loop control of the load.

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Table 6. Output signal definitions

Output name Description

OUT1 Output 1 of H-Bridge

OUT2 Output 2 of H-Bridge

FS_B Open drain Active Low status flag output to indicate fault

CFB Current mirror output for real time load current monitoring

MISO Master input slave output for SPI

4.9 Test point definitions

The following test points provide access to various signals to and from the board.

GND1

ENBL1

CCP

MISO1

CFB_V

VDD1

GND

IN_2 DIS1 IN_1

FS_B1

MOSI1

VPWR

SCLK1

GND2

CS_B1
GND3

VDDQ1

Figure 8. Test point locations

Table 7. Test point definitions

Test point name Signal name Description

CFB_V CFB_READ CFB pin voltage going to ADC

CCP CCP Charge pump voltage

ENBL1 ENBL Enable/disable signal to activate/tri-

state the outputs and put the device to
Sleep mode

DIS1 DIS Enable/disable signal to activate/tri-

state the outputs

IN_1 IN1 Direction control in H-Bridge mode and

OUT1 control in Half-Bridge mode

IN_2 IN2 PWM control in H-Bridge mode and

OUT2 control in Half-Bridge mode

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Test point name Signal name Description

VPWR VPWR System voltage

VDDQ1 VDDQ VDDQ digital output supply voltage

FSB1 FSB Fault status monitoring pin

VDD1 VDD VDD supply for the part

CS_B1 CS_B Chip select bar

SCLK1 SCLK Clock for SPI

MOSI1 MOSI Master output slave input signal

MISO1 MISO Master input slave output signal

GND GND Ground signal

GND1 GND Ground signal

GND2 GND Ground signal

GND3 GND Ground signal

4.10 Screw terminal connections

The board has the following screw terminal connections to connect the power supply and
the load.

J21

J20

Figure 9. Screw terminal locations

Table 8. Screw terminal connections

Screw

terminal name

Description

J20 Power supply connector for the MC33HB2000

J21 Output connector to connect load

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5 FRDM-KL25Z Freedom SPI dongle

The NXP Freedom development platform is a set of software and hardware tools
supporting evaluation and development. It is ideal for rapid prototyping of microcontroller­based applications. The NXP Freedom KL25Z hardware, FRDM-KL25Z, is a simple,
yet sophisticated design featuring a Kinetis L series microcontroller, the industry's first
microcontroller built on the ARM® Cortex™-M0+ core.

J10 I/O

Header

J9 I/O

Header

J1 I/O

Header

J2 I/O

Header

KL25Z

USB

Reset OpenSDA

USB

RGB

LED

Figure 10. FRDM-KL25Z

5.1 Connecting the FRDM-KL25Z to the board

The FRDM-KL25Z evaluation board was chosen specifically to work with the FRDM­HB2000FEVM kit because of its low cost and features. The FRDM-KL25Z board makes
use of the USB, built in LEDs and I/O ports available with NXP’s Kinetis KL2x family of
microcontrollers.

The FRDM-KL25Z connects to a PC through a USB port, which permits the user
to control a DC brushed motor and to drive the evaluation board inputs in order to
operate the motor via the GPIOs and SPI pins. The FRDM-KL25Z also monitors the SPI
registers, thereby facilitating the use of safety and advanced diagnostic functions.

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The FRDM-HB2000FEVM connects to the FRDM-KL25Z using the four dual row
Arduino™ R3 connectors on the bottom of the board (see Table 9, Figure 11 and Figure

12).

Figure 11. Connecting the FRDM-HB2000FEVM to the FRDM-KL25Z

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Figure 12. FRDM-KL25Z to FRDM-HB2000FEVM connections

Table 9. FRDM-HB2000FEVM to FRDM-KL25Z connections

FRDM-HB2000FEVM FRDM-KL25Z Pin hardware name

Header Pin Header Pin FRDM-HB2000FEVM FRDM-KL25Z

Description

J24 1 J1 1 N/C PTC7 No Connection

J24 2 J1 2 N/C PTA1 No Connection

J24 3 J1 3 N/C PTC0 No Connection

J24 4 J1 4 N/C PTA2 No Connection

J24 5 J1 5 N/C PTC3 No Connection

J24 6 J1 6 N/C PTD4 No Connection

J24 7 J1 7 N/C PTC4 No Connection

J24 8 J1 8 N/C PTA12 No Connection

J24 9 J1 9 N/C PTC5 No Connection

J24 10 J1 10 N/C PTA4 No Connection

J24 11 J1 11 N/C PTC6 No Connection

J24 12 J1 12 N/C PTA5 No Connection

J24 13 J1 13 N/C PTC10 Not Connected

J24 14 J1 14 N/C PTC8 No Connection

J24 15 J1 15 N/C PTC11 Not Connected

J24 16 J1 16 N/C PTC9 No Connection

J10 1 J2 1 DATA0/IN1 PTC12 IN1 signal for the H-

Bridge

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FRDM-HB2000FEVM FRDM-KL25Z Pin hardware name

Header Pin Header Pin FRDM-HB2000FEVM FRDM-KL25Z

Description

J10 2 J2 2 N/C PTA13 No Connection

J10 3 J2 3 DATA1/IN2 PTC13 IN2 signal for the H-

Bridge

J10 4 J2 4 N/C PTD5 No Connection

J10 5 J2 5 FS_B PTC16 Fault status pin to

report fault

J10 6 J2 6 CS_B PTD0 Chip select bar pin

J10 7 J2 7 N/C PTC17 No Connection

J10 8 J2 8 MOSI PTD2 Master output serial

input

J10 9 J2 9 N/C PTA16 No Connection

J10 10 J2 10 MISO PTD3 Master input serial

output

J10 11 J2 11 N/C PTA17 No Connection

J10 12 J2 12 SCLK PTD1 Clock for SPI

J10 13 J2 13 N/C PTE31 No Connection

J10 14 J2 14 GND GND No Connection

J10 15 J2 15 N/C N/C No Connection

J10 16 J2 16 N/C VREFH No Connection

J10 17 J2 17 CFB_READ PTD6 ADC input for

monitoring the CFB
pin

J10 18 J2 18 N/C PTE0 Disable signal to tri-

state the output and
put the part in Sleep
mode (Active Low)

J10 19 J2 19 N/C PTD7 No Connection

J10 20 J2 20 FRDM_VDD PTE1 No Connection

J23 1 J10 1 N/C PTE20 No Connection

J23 2 J10 2 N/C PTB0 No Connection

J23 3 J10 3 N/C PTE21 No Connection

J23 4 J10 4 N/C PTB1 No Connection

J23 5 J10 5 N/C PTE22 No Connection

J23 6 J10 6 N/C PTB2 No Connection

J23 7 J10 7 N/C PTE23 No Connection

J23 8 J10 8 N/C PTB3 No Connection

J23 9 J10 9 N/C PTE29 No Connection

J23 10 J10 10 N/C PTC2 No Connection

J23 11 J10 11 N/C PTE30 No Connection

J23 12 J10 12 N/C PTC1 No Connection

J25 1 J9 1 N/C PTB8 No Connection

J25 2 J9 2 N/C SDA_PTD5 No Connection

J25 3 J9 3 N/C PTB9 No Connection

J25 4 J9 4 N/C P3V3 No Connection

J25 5 J9 5 N/C PTB10 No Connection

J25 6 J9 6 N/C RESET/PTA20 No Connection

J25 7 J9 7 N/C PTB11 No Connection

J25 8 J9 8 N/C P3V3 No Connection

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FRDM-HB2000FEVM FRDM-KL25Z Pin hardware name

Header Pin Header Pin FRDM-HB2000FEVM FRDM-KL25Z

Description

J25 9 J9 9 N/C PTE2 No Connection

J25 10 J9 10 N/C P5V_USB No Connection

J25 11 J9 11 N/C PTE3 No Connection

J25 12 J9 12 GND GND Ground

J25 13 J9 13 N/C PTE4 No Connection

J25 14 J9 14 GND GND No Connection

J25 15 J9 15 N/C PTE5 No Connection

J25 16 J9 16 VDD_REG P5-9V_VIN 5.0 V logic input

to FRDM-KL25Z
board from FRDM­HB2001FEVM

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6 Installing the software and setting up the hardware

6.1 Configuring the hardware

The FRDM-HB2000FEVM consists of an H-Bridge, a parallel and SPI interface, power
conditioning circuitry and an FRDM-KL25Z board. The board can be configured for use in
conjunction with a FRDM-KL25Z board or a function generator.

Caution

When using the FRDM-HB2000FEVM, make sure that the maximum motor supply voltage (VPWR) stays
within the 5.0 V to 40 V range. Operating outside this range may cause damage to the board.

6.1.1 Step-by-step instructions for setting up the hardware for use with a FRDM­KL25Z

To configure the FRDM-HB2000FEVM for use with the FRDM-KL25Z do the following:

1. Connect the FRDM-HB2000FEVM to the FRDM-KL25Z using the Arduino

™

connectors on each board.

2. Connect the USB cable (not supplied with the kit) between the PC and the KL25Z

USB port on the FRDM-KL25Z board.

3. With the power switched off, attach the DC power supply to the VBAT and GND screw

connector terminal (J20) on the evaluation board.

4. Connect the load to the screw terminal (J21).

Figure 13 illustrates the hardware configuration using a FRDM-KL25Z.

FRDM-KL25Z Board

FRDM-HB2000FEVM

Brushed DC Motor

5 - 40 V Power Supply, 20 A

Workstation

Standard A to Mini-B

USB Cable

USB

Figure 13. FRDM-HB2000FEVM configured for use with an FRDM-KL25Z board

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6.1.2 Step-by-step instructions for setting up the hardware for use with a
function generator

This section describes how to configure the FRDM-HB2000FEVM for use with a
function generator. The same connections apply if the board is connected to a
microcontroller instead of a function generator. See the board description Section 4.4

"Board description", the schematic Section 7 "Schematic" and the MC33HB2000 data

sheet, to configure the board for use in a specific environment.

1. Connect the function generator to the EX_IN jumper, with one channel attached to

each pin.

2. Change the board jumper connections, as shown in Figure 14.

3. With the power switched off, attach the DC power supply to the VBAT and GND screw

connector terminal (J20) on the evaluation board.

4. Connect the load to the screw terminal (J21).

Figure 14 illustrates the hardware configuration.

Channel 1

Channel 2

Refresh

Setting 2

Setting 1

Setting 1

Setting 2

Setting 3

Setting 4

Setting 5

Setting 6

Setting 7

Setting 8

Setting 1

Setting 2

Setting 3

Setting 4

Setting 5

Setting 1

Setting 5

123
456
789

*

0

#

Input 1

Input 2

Input 3

High

Low

High

Setting 2

Setting 2

Setting 2

High

Low

Medium

Low

Medium

Low

High

Select
All

De-Select

All

In 1

In 2

In 2

PWR

Line Out

Aux Power

Brushed DC Motor

Function Generator (or MCU)

5 - 40 V Power Supply, 20 A

Figure 14. FRDM-HB2000FEVM configured for use with a function generator

6.2 Installing and using SPIGen

The latest version of SPIGen supports the MC33HB2000 and is designed to run on any
Windows 8, Windows 7, Vista, or XP-based operating system. To install the software, do
the following:

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1. Go to www.nxp.com/SPIGen and click Download.

2. When the SPIGEN: SPI Generator (SPIGen) Software page appears, go to the

Device Drivers section and click Download associated with the description of the
selected environment. A wizard guides the user through the process.

3. If instructed for the SPIGen wizard to create a shortcut, a SPIGen icon appears on

the desktop. By default, the SPIGen executable file is installed at C:Program Files
\SPIGen.
Installing the device drivers overwrites any previous SPIGen installation and replaces
it with a current version containing the MC33HB2000 drivers. However, configuration
files (.spi) from the previous version remain intact.

4. Launch SPIGen. The HB2000/HB2001 device appears in the Device View panel.

5. To access the HB2000/HB2001 tab in the SPIGen window, expand the HB2000/

HB2001 folder in the Device View. Then click Registers icon.

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If the pre-programmed code on FRDM-KL25Z is accidentally erased, download
"UsbSpiDongleKL25Z_SPIDrive_v512.srec" from the following link: www.nxp.com/

Usb-Spi-Dongle-firmware-KL25Z-HB2000-1.

6. Reading all the SPI Registers displays the following default status.

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6.2.1 SPI control

Figure 15. SPI control description

Table 10. SPI control description

Name Description

Read

Click the read button on top of each register to read the
content of each register.

Write

Click individual bits of any register and then press the
corresponding write button to write into the register.

SPI Control

This section is designed for ease of use. Each dropdown
menu sets or resets appropriate bits in the registers for
a selected configuration. However, after configuration
selection, press the write button of the corresponding
register to be able to configure the part.

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6.2.2 Parallel control

Figure 16. Parallel control description

Direction:

• Forward: Current flowing through OUT1 to OUT2

• Reverse: Current flowing through OUT2 to OUT1

Recirculation:

• High-side: Freewheel-High (both high-side FETs turned on) during PWMing

• Low-side: Freewheel-Low (both low-side FETs turned on) during PWMing (only valid

for Half-Bridge mode)

ENBL:

• Yes: ENBL is logic HIGH, the H-Bridge is operational

• No: ENBL is logic LOW, the H-Bridge outputs are tri-stated and placed in Sleep mode

DIS:

• DIS is logic HIGH, both OUT1 and OUT2 are tri-stated

• DIS is logic LOW, both OUT1 and OUT2 are enabled

PWM Freq:

• Enter PWM frequency up to 20000 Hz

Duty Cycle:

• Select PWM duty cycle from 10 to 90 %

Start:

• After selection of parallel control configuration, press Start to activate the outputs

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Stop:

• Press Stop to deactivate the outputs

Current Feedback:

• Shows current through the high-side FET using the current recopy feature

Status Fault:

• Shows any fault condition in Sleep mode

Table 11. Logic behind direction control with High-side versus Low-side recirculation

Half-Bridge Mode

Forward - High-side Recirculation

1

IN1 = 1
IN2 = PWM signal with selected duty cycle and frequency

Reverse - High-side Recirculation

2

IN1 = PWM signal with selected duty cycle and frequency
IN2 = 1

Forward - Low-side Recirculation

3

IN1 = PWM signal with selected duty cycle and frequency
IN2 = 0

Reverse - Low-side Recirculation4

IN1 = 0
IN2 = PWM signal with selected duty cycle and frequency

H-Bridge Mode

Forward - High-side Recirculation

1

IN1 = 1
IN2 = PWM signal with selected duty cycle and frequency

Reverse - High-side Recirculation

2

IN1 = 0
IN2 = PWM signal with selected duty cycle and frequency

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7 Schematic

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A

A

Power Supply

Jumpers

Main Circuit

Main Signal Test Points

Outputs

FRDM connectors

IN1 (Option for

input with and

without SPI)

IN2 (Option for

input with and

without SPI)

ENBL (Option for

input with and

without SPI)

DIS (Option for

input with and

without SPI)

CS_B (Option for

input with and

without SPI)

SCLK (Option for

input with and

without SPI)

MOSI (Option for

input with and

without SPI)

MISO (Option for

input with and

without SPI)

IN1 and IN2

External Inputs

VDDQ Supply

from the

regulator

Current Feedback

FRDM_VDD

provides 3.3V

instead of 5V

All settings jumper position

1-2 for operation with MCU and

2-3 for manual operation.

Jumper setting 1-2 for VDD

through regulator and 2-3

for VDD supply through

FRDM board.

FRDM-HB2000FEVM

VPWR

VPWR

VPWR

VDD

VDD

VDD

VDD

VDD

VPWR

Drawing Title:

Size Document Nu mber

Rev

Date: Sheet of

Page Title:

ICAP Classification: CP: IUO: PUBI:

SCH-28930 PDF: SP F-28930 A

FRDM-HB2000FEVM

C

Friday, May 06, 2016

Board Schemat ic

1 1

_

_

_

_

_

_

X

Drawing Title:

Size Document Nu mber Rev

Date:

Sheet of

Page Title:

ICAP Classification: CP: IUO: PUBI:

SCH-28930 PDF: SP F-28930 A

FRDM-HB2000FEVM

C

Friday, May 06, 2016

Board Schemat ic

1 1

_

_

_

_

_

_

X

Drawing Title:

Size Document Nu mber Rev

Date:

Sheet of

Page Title:

ICAP Classification: CP: IUO: PUBI:

SCH-28930 PDF: SP F-28930 A

FRDM-HB2000FEVM

C

Friday, May 06, 2016

Board Schemat ic

1 1

_

_

_

_

_

_

X

VBAT

GREEN

AC

CFB_R

HDR_1X2

1

2

C1

0.1 UF

Q3

SMMBTA06LT1G

2 3

1

R207

4.70K

EX_IN

HDR_1X2

1

2

FWD

GREEN

AC

GND3

J10

HDR_10X2

1

234

6

5

78

9

101112

131 4

151 6

171 8

19

20

SCLK1

OUT

CON 1X2 TB TH

1

2

IN1

HDR_1X3

1

2

3

C3

0.1 UF

D58

1N4148WS

A

C

R203

1K

VDD

GREEN

AC

0R192

DIS

HDR_1X3

1

2

3

GND1

IN2

HDR_1X3

123

R210 0

CFB_V

R204

1K

CS_B

HDR_1X3

1

2

3

D57

BAS70TW-7-F

213 4

5

6

CCP

J25

HDR_2X8

1 2

3

4

65

7 8

9

10

11 12

13 14

15

16

ENBL1

ENBL

HDR_1X3

1

2

3

C5

0.033UF

SCLK

HDR_1X3

1

2

3

VDD_REG

HDR_1X2

1

2

U2

MC7805ABD2TG

OUT

3

IN

1

GND

4

R211

200

VDDQ1

IN_1

MOSI

HDR_1X3

1

2

3

C9

0.047UF

R209

4.70K

MOSI1

J24

HDR_2X8

12

34

6 5

78

910

11

12

131 4

151 6

R206

4.70K

MISO

HDR_1X3

1

2

3

VPWR

Q1

IPD30N06S2-15

1

3

4

IN_2

J20

CON 1X2 TB TH

1
2

FS_B_

1

2

GND2

R10

10K

CS_B1

CFB

HDR_1X2

1

2

R2

47K

R208

4.70K

FS_B1

VDD_

HDR_1X3

1

2

3

R1

1M

C7

0.33UF

DIS1

D59

SMBJ40

A C

J23

HDR_2X6

1

2

3 4

65

7 8

9 10

11 12

C8

0.1uF

REV

RED

A C

FS_B

RED

AC

R187 0

+

C2

100UF

R193 0

GND

VDDQ

HDR_1X3

123

U3

MC33HB2000FK

AGND1

6

ENBL

7

DIS

8

IN2

9

IN1

10

CFB

11

FS

18

VPWR1

12

VPWR2

13

OUT1_10

14

OUT1_11

15

NC_1216NC_13

17

NC_14

19

PGND1

20

PGND2

21

PGND3

22

PGND4

23

AGND2

24

NC_20

25

NC_21

26

OUT2_22

27

OUT2_23

28

VPWR3

29

VPWR4

30

CCP

31

CS

32

VDDQ

1

MISO2SCLK3MOSI

4

DGND

5

EP

33

R188 0

C4

0.033UF

MISO1

VDD1

ENBL

IN2

IN1

VPWR

VDDQ

GND

GND

GND

GND

VBATT

FS_B

VDD_REG

VDD

DATA0

IN1

EX_IN1

SPI_CS_B

SPI_MOSI

SPI_MISO

SPI_SCLK

DATA1

IN2

EX_IN2

CTRL0

ENBL

DATA0

DATA1

CTRL0

CTRL1

CTRL1

DIS

CS_B

SPI_CS_B

SPI_SCLK

SCLK

SPI_MOSI

MOSI

SPI_MISO

MISO

CFB

OUT1

OUT2

VDDQ

EX_IN1

EX_IN2

CFB_READ

FRDM_VDD

FRDM_VDD

CFB_READ

DIS

VDD_REG

CCP

CFB_READ

FS_B

CCP

CFB

OUT1

OUT2

CCP

VPWR

FS_B

CS_B

DIS

ENBL

SCLK

MOSI

MISO

VDDQ

IN2

IN1

Figure 17. FRDM-HB2000FEVM schematic

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8 Board layout

Figure 18. Silkscreen

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9 Bill of materials

Table 12. Bill of materials

Item Qty Schematic

label

Value Description Part number Assy opt

Active components

[1]

1 1 U1 IC DRV H-BRIDGE MOTOR 3.0 A 5.0 to 28 V

SOIC32 – NXP

MC33HB2000FK

[2]

2 1 U2 IC VREG 5.0 V 1.0 A 5.0 to 18 V D2PAK – ON

Semiconductor

MC7805ABD2TG

[2]

Diodes

[1]

3 1 D2 24 V DIODE TVS UNIDIR 600 W 24 V AEC–Q101

SMB

SMBJ24AHE3/52

4 1 D57 70 V DIODE SCH TRIPLE 70 mA 70 V / 200 MW

SOT363

BAS70TW-7-F

5 1 D58 75 V DIODE SW 150 mA 75 V SOD–323 1N4148WS-7-F

6 2 D59, D64 150 mA LED RED SGL 25 mA 0805 598-8110-107F

7 3 D60, D61,

D63

25 mA LED RED SGL 25 mA 0805 598-8110-107F

Capacitors

[1]

8 2 C1, C13 0.1 µF CAP CER 0.1 μF 50 V 10 % X7R 0805 C0805C104K5RAC

9 1 C2 100 µF CAP ALEL 100 μF 50 V 20 % AEC–Q200

RADIAL SMT

MAL214699104E3

10 2 C4, C5 0.033µFCAP CER 0.033 μF 50 V 10 % X7R 0805 08055C333KAT2A

11 1 C7 0.33 µF CAP CER 0.33 μF 50 V 10 % X7R 0603 C1608X7R1H334K080AC

12 1 C8 0.1 µF CAP CER 0.1 μF 16 V 10 % X7R AEC–Q200

0603

GCM188R71C104KA37D

13 1 C9 0.047µFCAP CER 0.047 μF 25 V 10 % X7R 0603 C0603X7R250-473KNE

Resistors

[1]

14 1 R1 1.0 MΩ RES 1 MΩ 1/4 W 1 % AEC–Q200 0603 CRCW06031M00FKEAHP

15 1 R2 47 kΩ RES MF 47 kΩ 1/10 W 1.0 % AEC–Q200

0603

CRCW060347K0FKEA

16 1 R10 10 kΩ RES MF 10 kΩ 1/10 W 5 % AEC–Q200 0603 ERJ-3GEYJ103V

17 4 R18, R188,

R192, R193

0 Ω RES MF 0 Ω 1/10 W – 0603 CRCW06030000Z0EA

18 1 R211 200 Ω RES MF 200 Ω 1/10 W 1 % 0603 RK73H1JTTD2000F

19 2 R203, R204 1.0 kΩ RES MF 1.0 KΩ 1/10 W 1 % 0603 AR03FTNX1001

20 4 R206, R207,

R208, R209

4.70 kΩ RES MF 4.70 KΩ 1/10 W 1 % 0603 RK73H1JTTD4701F

Switches, connectors, jumpers and test points

[1]

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Item Qty Schematic

label

Value Description Part number Assy opt

21 16 IN1,

GND1,IN2,
GND2, GND3,
VPWR,
VDDQ, VDD,
SCLK, MOSI,
MISO, GND,
FS_B, ENBL,
DIS, CS_B

TEST POINT BLACK 40 MIL DRILL 180 MIL
TH 109L

5001

22 11 J1, J2, J3, J4,

J5, J6, J7, J8,
J14, J17

HDR 1X3 TH 100 MIL SP 374H AU 826629-3

23 1 J10 HDR 2X10 TH 100 MIL CTR 330H AU 100L TSW-110-07-S-D

24 4 J11, J15, J18,

J19, J26

HDR 1X2 TH 100 MIL SP 378H AU 130L 826629-2

25 2 J20, J21 CON 1X2 TB TH 5.08 MM 543H SN 138L 20020316-H021B01LF

26 1 J23 HDR 2X6 TH 100 MIL CTR 330H AU TSW-106-07-S-D

27 2 J24, J25 HDR 2X8 TH 100 MIL CTR 330H AU TSW-108-07-G-D

28 1 Q1 TRAN NMOS PWR 30 A 55 V AEC-Q101

TO252

IPD30N06S2-15

29 1 Q3 TRAN NPN DRIVER 500 mA 80 V AEC-Q101

SOT23

SMMBTA06LT1G

[1] NXP does not assume liability, endorse, or warrant components from external manufacturers are referenced in circuit drawings or tables. While NXP

offers component recommendations in this configuration, it is the customer’s responsibility to validate their application.

[2] Critical components. For critical components, it is vital to use the manufacturer listed.

10 Accessory item bill of materials

Table 13. Accessory item bill of materials

Item Qty Part Number Description

1 1 FRDM-KL25Z

[1]

NXP Freedom Development
Platform for Kinetis
KL14/15/24/25 MCUs

[1] NXP does not assume liability, endorse, or warrant components from external manufacturers are referenced in circuit drawings or tables. While NXP

offers component recommendations in this configuration, it is the customer’s responsibility to validate their application.

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11 References

Following are URLs where you can obtain information on related NXP products and
application solutions:

NXP.com support pages Description URL

FRDM-HB2000FEVM Tool summary page http://www.nxp.com/FRDM-

HB2000FEVM

MC33HB2000 Product summary page http://www.nxp.com/MC33HB2000

FRDM-KL25Z Tool summary page http://www.nxp.com/FRDM-KL25Z

SPIGen SPI generator software http://www.nxp.com/SPIGEN

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12 Revision history

Revision Date Description of changes

1.0 7/2016 Initial release

13 Contact information

Visit http://www.nxp.com/support for a list of phone numbers within your region.
Visit http://www.nxp.com/warranty to submit a request for tool warranty.

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14 Legal information

14.1 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.

14.2 Disclaimers

Information in this document is provided solely to enable system and
software implementers to use NXP products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any
integrated circuits based on the information in this document. NXP reserves
the right to make changes without further notice to any products herein.

NXP makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does NXP assume
any liability arising out of the application or use of any product or circuit,

and specifically disclaims any and all liability, including without limitation
consequential or incidental damages. “Typical” parameters that may be
provided in NXP data sheets and/ or specifications can and do vary in
different applications, and actual performance may vary over time. All
operating parameters, including “typicals,” must be validated for each
customer application by customer's technical experts. NXP does not
convey any license under its patent rights nor the rights of others. NXP sells
products pursuant to standard terms and conditions of sale, which can be
found at the following address: nxp.com/salestermsandconditions.

14.3 Trademarks

Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.

NXP — is a trademark of NXP B.V.

the NXP logo — is a trademark of NXP B.V.

Freescale — is a trademark of NXP B.V.

the Freescale logo — is a trademark of NXP B.V.

SMARTMOS — is a trademark of NXP B.V.

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Tables

Tab. 1. Device features ................................................. 6

Tab. 2. Board description .............................................. 9

Tab. 3. LED locations .................................................. 10

Tab. 4. Jumper locations ............................................. 11

Tab. 5. Input signal definitions .....................................12

Tab. 6. Output signal definitions ..................................13

Tab. 7. Test point definitions ....................................... 13

Tab. 8. Screw terminal connections ............................ 14

Tab. 9. FRDM-HB2000FEVM to FRDM-KL25Z

connections ..................................................... 17

Tab. 10. SPI control description .................................... 24

Tab. 11. Logic behind direction control with High-side

versus Low-side recirculation .......................... 26

Tab. 12. Bill of materials ................................................29

Tab. 13. Accessory item bill of materials .......................30

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Figures

Fig. 1. Block diagram ................................................... 5

Fig. 2. Modes of operation ........................................... 6

Fig. 3. Architecture ....................................................... 7

Fig. 4. Thermal management ....................................... 8

Fig. 5. Board description .............................................. 9

Fig. 6. LED locations .................................................. 10

Fig. 7. Jumper definitions ........................................... 11

Fig. 8. Test point locations ......................................... 13

Fig. 9. Screw terminal locations ................................. 14

Fig. 10. FRDM-KL25Z .................................................. 15

Fig. 11. Connecting the FRDM-HB2000FEVM to the

FRDM-KL25Z .................................................. 16

Fig. 12. FRDM-KL25Z to FRDM-HB2000FEVM

connections ..................................................... 17

Fig. 13. FRDM-HB2000FEVM configured for use

with an FRDM-KL25Z board ........................... 20

Fig. 14. FRDM-HB2000FEVM configured for use

with a function generator .................................21

Fig. 15. SPI control description .................................... 24

Fig. 16. Parallel control description .............................. 25

Fig. 17. FRDM-HB2000FEVM schematic .....................27

Fig. 18. Silkscreen ........................................................ 28

NXP Semiconductors

KTFRDMHB2000FEVMUG

FRDM-HB2000FEVM evaluation board

Contents

1 FRDM-HB2000FEVM ............................................1

2 Important notice .................................................. 2

3 Getting started .................................................... 3

3.1 Kit contents/packing list ..................................... 3

3.2 Jump start .......................................................... 3

3.3 Required equipment .......................................... 3

3.4 System requirements ......................................... 3

4 Getting to know the hardware ........................... 4

4.1 Board overview .................................................. 4

4.2 Board features ................................................... 4

4.3 Block diagram .................................................... 5

4.3.1 Device features ..................................................5

4.3.2 Modes of operation ............................................6

4.3.3 Architecture ........................................................7

4.3.4 Thermal management ........................................8

4.4 Board description ...............................................9

4.5 LED display ..................................................... 10

4.6 Jumper definitions ............................................11

4.7 Input signal definitions ..................................... 12

4.8 Output signal definitions .................................. 12

4.9 Test point definitions ........................................13

4.10 Screw terminal connections .............................14

5 FRDM-KL25Z Freedom SPI dongle ..................15

5.1 Connecting the FRDM-KL25Z to the board ......15

6 Installing the software and setting up the

hardware ............................................................ 20

6.1 Configuring the hardware ................................ 20

6.1.1 Step-by-step instructions for setting up the

hardware for use with a FRDM-KL25Z ............ 20

6.1.2 Step-by-step instructions for setting up the

hardware for use with a function generator ......21

6.2 Installing and using SPIGen ............................ 21

6.2.1 SPI control ....................................................... 24

6.2.2 Parallel control ................................................. 25

7 Schematic .......................................................... 27

8 Board layout ...................................................... 28

9 Bill of materials ................................................. 29

10 Accessory item bill of materials ...................... 30

11 References ......................................................... 31

12 Revision history ................................................ 32

13 Contact information .......................................... 32

14 Legal information .............................................. 33

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For sales office addresses, please send an email to: [e-mail]

Released on 5 July 2016

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NXP:
FRDM-HB2000FEVM