NXP Semiconductors FRDM-HB2000FEVM User Manual

KTFRDMHB2000FEVMUG

FRDM-HB2000FEVM evaluation board

Rev. 1.0 — 5 July 2016 User guide

1 FRDM-HB2000FEVM

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User guide Rev. 1.0 — 5 July 2016

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2 Important notice

NXP provides the enclosed product(s) under the following conditions: This evaluation kit is intended for use of ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a printed circuit board to make it easier to access inputs, outputs, and supply terminals. This evaluation board may be used with any development system or other source of I/O signals by simply connecting it to the host MCU or computer board via off-the-shelf cables. This evaluation board is not a Reference Design and is not intended to represent a final design recommendation for any particular application. Final device in an application will be heavily dependent on proper printed circuit board layout and heat sinking design as well as attention to supply filtering, transient suppression, and I/O signal quality.

The goods provided may not be complete in terms of required design, marketing, and or manufacturing related protective considerations, including product safety measures typically found in the end product incorporating the goods. Due to the open construction of the product, it is the user's responsibility to take any and all appropriate precautions with regard to electrostatic discharge. In order to minimize risks associated with the customers applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. For any safety concerns, contact NXP sales and technical support services.

Should this evaluation kit not meet the specifications indicated in the kit, it may be returned within 30 days from the date of delivery and will be replaced by a new kit.

NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typical”, must be validated for each customer application by customer’s technical experts.

NXP does not convey any license under its patent rights nor the rights of others. NXP products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the NXP product could create a situation where personal injury or death may occur.

Should the Buyer purchase or use NXP products for any such unintended or unauthorized application, the Buyer shall indemnify and hold NXP and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges NXP was negligent regarding the design or manufacture of the part. NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. © 2016 NXP B.V.

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User guide Rev. 1.0 — 5 July 2016

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3 Getting started

3.1 Kit contents/packing list

The FRDM-HB2000FEVM contents include:

• Assembled and tested evaluation board/module in anti-static bag

• FRDM-KL25Z

• Quick start guide

3.2 Jump start

NXP’s analog product development boards provide an easy-to-use platform for evaluating NXP products. The boards support a range of analog, mixed-signal and power solutions. They incorporate monolithic ICs and system-in-package devices that use proven high-volume SMARTMOS technology. NXP products offer longer battery life, a smaller form factor, reduced component counts, lower cost and improved performance in powering state of the art systems.

1. Go to www.nxp.com/FRDM-HB2000FEVM.

2. Review your Tools Summary Page.

3. Locate and click:

4. Download the documents, software and other information.

Once the files are downloaded, review the user guide in the bundle. The user guide includes setup instructions, BOM and schematics. Jump start bundles are available on each tool summary page with the most relevant and current information. The information includes everything needed for design.

3.3 Required equipment

This kit requires the following items:

• 3/16” blade screwdriver for connecting the cables

• DC Power supply: 5.0 V to 40 V with up to 20 A current handling capability, depending

on motor requirements

• USB Standard A (male) to mini-B (male) cable

• Typical loads (brushed DC motor, power resistors or inductive load with up to 5.0 A and

28 V operation)

• Function generator (optional)

• FRDM-KL25Z Freedom Development Platform for SPI communication (included in KIT)

• SPIGen software (for using FRDM-KL25Z based SPI Dongle)

3.4 System requirements

The kit requires the following to function properly with the software:

• USB enabled computer with Windows XP or newer

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4 Getting to know the hardware

4.1 Board overview

The FRDM-HB2000FEVM evaluation kit exercises all the functions of the MC33HB2000 H-Bridge device. The parallel input can be easily controlled by lab equipment or any MCU with GPIOs.

The board can be used in conjunction with a FRDM-KL25Z board connected to a PC’s USB port. Configure, control and monitor the status of MC33HB2000 by using the board’s SPI communication capabilities.

4.2 Board features

The FRDM-HB2000FEVM board evaluates the NXP part MC33HB2000, including all functions. The board features the following:

• Built-in reverse battery protection

• Test points that allow signal probing

• Built-in voltage regulator to supply logic level circuitry

• LEDs to indicate the supply status and the direction of the motor

• Low Equivalent Series Resistance (ESR) capacitor to reduce ripple in the power supply

• Transient voltage suppressor to handle system level transients

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4.3 Block diagram

MC33HB2000

Power Supply

Reverse

Battery and

Transient

Protection

5V Voltage

Regulator

VPWR

LED

VDD LED

Charge Pump Capacitor

VPWR

CCP

IN1

IN2

ENBL

MOSI

CFB

OUT2

OUT1

FS_B

All Grounds

FS_B LED

FWD LED

REV LED

Load

From MCU GPIO

To MCU

ADC inpu

To MCU

GPIO

Optional 5.0 V Supply to FRDM

Optional 3.3 V Supply from FRDM

DIS

MISO

SCLK

CSB

MCU SPI

Shunt Resistor

VDDQ

Figure 1. Block diagram

4.3.1 Device features

This evaluation board features the following NXP product:

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Table 1. Device features

Device Description Features

MC33HB2000 The 33HB2000 is a monolithic H-Bridge

Power IC, enhanced with SPI configurability and diagnostic capabilities.

• Advanced diagnostic reporting via a serial peripheral

interface (SPI): charge pump undervoltage on VPWR, short to ground and short to VPWR for each output, open load, temperature warning and overtemperature shutdown

• Thermal management: excellent thermal resistance of

< 1.0 °C/W between junction and case (exposed pad)

• Eight selectable slew rates via the SPI: 0.25 V/μs to

more than 16 V/μs for EMI and thermal performance optimization

• Four selectable current limits via the SPI:

5.4/7.0/8.8/10.7 A, covering a wide range of applications

• Can be operated without the SPI with a default slew

rate of 2.0 V/μs and a 7.0 A current limit threshold

• Highly accurate real-time current feedback through a

current mirror output signal with less than 5.0 % error

• Drives inductive loads in a full H-Bridge or Half-bridge

configuration

• Overvoltage protection places the load in high-side

recirculation (braking) mode with notification in HBridge mode

• Wide operating range: 5.0 V to 28 V operation

• Low R

DS(on)

integrated MOSFETs: Maximum of

235 mΩ (TJ = 150 °C) for each MOSFET

• Internal protection for overtemperature, undervoltage

and short-circuit by signaling the error condition and disabling the outputs

• I/0 pins can withstand up to 36 V

4.3.2 Modes of operation

LOAD

PWR

Load

current

OFF

OUT1

OUT2

Forward

LOAD

PWR

Load

current

OFF

OUT1

OUT2

Free-wheel high

(Forward)

LOAD

PWR

Load

current

OFF

OUT1

OUT2

Reverse

LOAD

PWR

Load

current

OFF

OUT1

OUT2

Free-wheel low

(Forward)

PGND

PGND PGND PGND

PGND

Figure 2. Modes of operation

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4.3.3 Architecture

Figure 3. Architecture

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4.3.4 Thermal management

Figure 4. Thermal management

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4.4 Board description

Figure 5 describes the main elements on the FRDM-HB2000FEVM.

Figure 5. Board description

Table 2. Board description

Number Name Description

1 MC33HB2000 Monolithic H-Bridge Power IC in a robust thermally enhanced 32 lead PQFN package

2 Power and ground

inputs

Power supply terminal to connect the battery/power supply with the board

3 Reverse battery

protection

MOSFET for protecting MC33HB2000 in reverse battery condition

4 5.0 V regulator 5.0 V regulator for VDD and supply

5 Jumpers Jumpers for configuring the board for different modes of operation

6 Test points Test points to probe different signals

7 Output terminal Output connector to connect a load to the MC33HB2000 output

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4.5 LED display

The following LEDs serve as visual output devices for the evaluation board:

FWD

VDD

REV

FS_B

VBAT

Figure 6. LED locations

Table 3. LED locations

LED ID Description

VBAT Green LED, indicates when main/battery supply is connected

VDD Green LED, indicates when +5.0 V supply is connected

FS_B Red LED, illuminates when the H-Bridge detects a fault

FWD Green LED, indicates current flowing in forward direction

REV Red LED, indicates current flowing in reverse direction

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4.6 Jumper definitions

Figure 7 illustrates the evaluation board jumper locations. Table 4 explains the function

of each position. Bold fonts in the jumper position column indicate the default settings for use with the FRDM-KL25Z.

DIS

VDD

CFB

ENBL

IN2 IN1 EX_IN

CFB_R

VDD_REG

MOSI

SCLK

MISO

CS_B

VDDQFS_B

Figure 7. Jumper definitions

Table 4. Jumper locations

Name Signal Jumper

position

Connection

1−2 IN1 control through MCU parallel output on J10 Pin 1 (DATA0)

J1 IN1

2−3 IN1 control through MCU parallel output on J10 Pin 1 (DATA0)

1−2 DIS control through MCU parallel output on J10 Pin 13 (CTRL1)

J2 DIS

2−3 DIS connected to GND to keep the outputs enabled

1−2 IN2 control through MCU parallel output on J10 Pin 3 (DATA1)

J3 IN2

2−3 IN2 control through external input on J15 Pin 2

1−2 CS_B control through MCU SPI output J10 Pin 6 (SPI_CS_B)

J4 CS_B

2−3 CS_B pulled up to VDD for operation without SPI

1−2 ENBL control through MCU parallel output J10 Pin 11 (CTRL0)

J5 ENBL

2−3 ENBL pulled up to VDD to keep the outputs enabled

1−2 SPI clock SCLK from MCU J10 Pin 12 (SPI_SCLK)

J6 SCLK

2−3 SCLK connected to GND for operation without SPI

1−2 MOSI control through MCU SPI output J10 Pin 8 (SPI_MOSI)

J7 MOSI

2−3 MOSI connected to GND for operation without SPI

J8 MISO

1−2 MISO control through MCU SPI output J10 Pin 10 (SPI_MISO)

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Name Signal Jumper

position

Connection

2−3 MISO not connected for operation without SPI

J11 CFB 1−2 CFB connected to 200 Ω resistor

1−2 VDD connected to VDDQ

J14 VDDQ

2−3 VDDQ not connected

1−2 VDD supply from regulator U2

J17 VDD

2−3 VDD supply from FRDM board

J18 CFB_R 1−2 CFB connected to MCU ADC input J10 Pin 17 (CFB_READ)

J19 FS_B 1−2 FS_B connected to the pull-up resistor

J26 VDD_REG 1−2 VDD to FRDM board

J15 EX_IN Open IN1 and IN2 external inputs

The FRDM-HB2000FEVM, in conjunction with a FRDM-KL25Z board (shipped with the kit), can evaluate the design by means of a GUI, any MCU with GPIO or with simple lab equipment. A FRDM-KL25Z-compatible GUI and MCU program are available online at the following link: http://www.nxp.com/FRDM-HB2000FEVM.

The FRDM-HB2000FEVM is compatible with any Arduino™ platform board. However, if a board other than the FRDM-KL25Z is used, MCU code must be written to work with the board.

4.7 Input signal definitions

The following input signals control the outputs or functions inside the circuit.

Table 5. Input signal definitions

Input name Description

DIS Disable signal to tri-state the outputs

ENBL Disable signal to tri-state the output and put the part in Sleep mode

IN1 Logic input to control OUT1

IN2 Logic input to control OUT2

MOSI Master out slave input for the SPI

CS_B Chip select bar input for the SPI

SCLK Clock for the SPI

4.8 Output signal definitions

The FRDM-HB2000FEVM uses the following output signals to drive a load such as a brushed DC motor. The board provides an analog output for real time load current monitoring. This signal allows closed-loop control of the load.

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NXP Semiconductors FRDM-HB2000FEVM User Manual

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