NXP Semiconductors FRDM33664BEVB, MC33664ATL1EG User Manual
FRDM33664BEVB
Featuring the MC33664ATL1EG isolated communication
network high-speed transceiver IC
Rev. 1.0 — 22 June 2018 User guide
1 FRDM33664BEVB
NXP Semiconductors
Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC
2 Important notice
NXP provides the enclosed product(s) under the following conditions:
This evaluation kit is intended for use of ENGINEERING DEVELOPMENT OR
EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a
printed circuit board to make it easier to access inputs, outputs, and supply terminals.
This evaluation board may be used with any development system or other source of
I/O signals by simply connecting it to the host MCU or computer board via off-theshelf cables. This evaluation board is not a Reference Design and is not intended to
represent a final design recommendation for any particular application. Final device in
an application will be heavily dependent on proper printed circuit board layout and heat
sinking design as well as attention to supply filtering, transient suppression, and I/O
signal quality.
The goods provided may not be complete in terms of required design, marketing, and
or manufacturing related protective considerations, including product safety measures
typically found in the end product incorporating the goods. Due to the open construction
of the product, it is the user’s responsibility to take any and all appropriate precautions
with regard to electrostatic discharge. In order to minimize risks associated with the
customers applications, adequate design and operating safeguards must be provided
by the customer to minimize inherent or procedural hazards. For any safety concerns,
contact NXP sales and technical support services.
FRDM33664BEVB
Should this evaluation kit not meet the specifications indicated in the kit, it may be
returned within 30 days from the date of delivery and will be replaced by a new kit.
NXP reserves the right to make changes without further notice to any products herein.
NXP makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does NXP assume any liability arising out of the
application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation consequential or incidental damages. “Typical” parameters
can and do vary in different applications and actual performance may vary over time.
All operating parameters, including “Typical”, must be validated for each customer
application by customer’s technical experts.
NXP does not convey any license under its patent rights nor the rights of others. NXP
products are not designed, intended, or authorized for use as components in systems
intended for surgical implant into the body, or other applications intended to support or
sustain life, or for any other application in which the failure of the NXP product could
create a situation where personal injury or death may occur.
Should the Buyer purchase or use NXP products for any such unintended or
unauthorized application, the Buyer shall indemnify and hold NXP and its officers,
employees, subsidiaries, affiliates, and distributors harmless against all claims, costs,
damages, and expenses, and reasonable attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or
unauthorized use, even if such claim alleges NXP was negligent regarding the design
or manufacture of the part. NXP and the NXP logo are trademarks of NXP B.V. All other
product or service names are the property of their respective owners. © 2018 NXP B.V.
FRDM33664BEVBUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 1.0 — 22 June 2018
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NXP Semiconductors
Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC
3 Getting started
The NXP analog product development boards provide an easy-to-use platform for
evaluating NXP products. The boards support a range of analog, mixed-signal and
power solutions. They incorporate monolithic integrated circuits and system-in-package
devices that use proven high-volume technology. NXP products offer longer battery life, a
smaller form factor, reduced component counts, lower cost and improved performance in
powering state-of-the-art systems.
The tool summary page for is located at http://www.nxp.com/FRDM33664BEVB. The
overview tab provides an overview of the device, product features, a description of the
kit contents, a list of (and links to) supported devices, list of (and links to) any related
products and a Get Started section.
The Get Started section provides links to everything needed to start using the
device and contains the most relevant, current information applicable to the
FRDM33771BTPLEVB.
• Go to http://www.nxp.com/FRDM33664BEVB.
• On the Overview tab, locate the Jump To navigation feature on the left side of the
window.
• Select the Get Started link.
FRDM33664BEVB
• Review each entry in the Get Started section and download an entry by clicking on the
title.
• After reviewing the Overview tab, visit the other product related tabs for additional
information:
– Documentation: download current documentation
– Software & Tools: download current hardware and software tools
– Buy/Parametrics: purchase the product and view the product parametrics
After downloading files, review each file, including the user guide which includes setup
instructions. If applicable, the Bill of Materials (BOM), suporting schematics, and layout
are available via NXP DocStore. [4]
3.1 Kit contents/packing list
The kit contents include:
• Assembled and tested evaluation board/module in anti-static bag
• Quick-start guide
• Four connectors to be mounted on the MCU board
3.2 Required equipment and software
To use this kit, you need:
• 5.0 V power supply, 50 mA capability
• 3.3 V power supply, 50 mA capability (optional: Depends if the application requires
3.3 V logic threshold)
• NXP Microcontroller Development Platform (optional)
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User guide Rev. 1.0 — 22 June 2018
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NXP Semiconductors
LED INDICATOR
EN/FLT
POWER SUPPLY
CONNECTOR
VCC5/VIO/GND
ISOLATED NETWORK
HIGH SPEED
TRANSCEIVER
MC33664TL
16-PIN SOICN
RDTX_P
FAULT FAULT_IN
TRANSFORMER
SPI
CONNECTOR
SIGNAL
TRANSCEIVER
PHYSICAL
LAYER
CONNECTOR
RDTX_N
SPI_TX
SPI_RX
+
-
aaa-030301
Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC
4 Getting to know the hardware
4.1 Board overview
The FRDM33664BEVB is a hardware tool for evaluation and development and is ideal
for rapid prototyping of an Isolated Network High Speed Transceiver. It can be used
to evaluate the features of the MC33664ATL1EG device. The EVB allows the user to
connect SPI signals from the MCU to the device SPI_TX and be able to create bit pulses
transmission to the bus through the transformer. The messages received by the device
can be converted bit by bit and transferred to the MCU by SPI.
4.2 Board features
The board features are as follows:
• MC33664ATL1EG Isolated Communication Transceiver in a 16-pin SOICN package
• SPI interface
• LED indicators
• Fault detection report
• Isolated Communication by transformers with connector
FRDM33664BEVB
4.3 Block diagram
Figure 1. Block diagram
4.3.1 Device features
This evaluation board features the following product:
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NXP Semiconductors
Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC
Table 1. Device features
Device Description Features
MC33664ATL1EG The MC33664ATL1EG is
an Isolated Communication
Network High Speed
Transceiver IC intended to
provide a simple method
for isolated high speed
differential communication.
• 2.0 Mbps isolated network communication rate
• Dual SPI architecture for message confirmation
• Robust conducted and radiated immunity with wake-up
• 3.3 V and 5.0 V compatible logic thresholds
• Low sleep mode current with automatic bus wake-up
• Ultra-low radiated emissions
4.4 Board description
The FRDM33664BEVB allows the user to exercise all the functions of the
MC33664ATL1EG.
FRDM33664BEVB
Figure 2. Board description
Table 2. Board description
Name Description
LED EN Indicates when EN pin is set to high level (VIO) by MCU
LED FAULT Indicates when Fault pin is set to high level (VIO) by MCU
Transformer Bus Isolator Transformer
TPL BUS
Connector
Fault Connector
MC33664ATL1EG Isolated Network High Speed Transceiver
FRDM33664BEVBUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 1.0 — 22 June 2018
The two bus cables must be placed inside the connector
The fault cable to report the error to the MCU must be placed inside the
connector
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NXP Semiconductors
FRDM33664BEVB
Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC
The modes of operation followed by MC33664ATL1EG for the VIO and EN pins are
shown in Table 3.
Table 3. Modes of operation
Device mode EN pin VIO pin LED EN Comment
Normal 1 1 On The MC33664 operates as a full transceiver. MCU messages
Sleep 0 1 Off In Sleep mode, the transceiver activates the INTB pin when a valid
Reset x 0 Off The RDTX± outputs are in high impedance and the device is not able to
transmitted on the SPI_TX emerge on the SPI_RX for the MCU to read.
wake-up sequence is detected. The INTB pin remains low until the
rising edge of the EN pin places the device in Normal mode.
transmit, receive, or report bus wake-up events.
4.5 Test-point definitions
Figure 3. Test points
The following test points provide access to various signals to and from the board.
Table 4. Test points
Test-point name Signal name Description
RTDX_P RDTX+
RDTX_N RDTX–
GND_SIGNAL GND Ground reference of the device
VCC VCC5 5 V Input supply
VCCIO VIO digital 3.3 V / 5.0 V power to the IC
Measures the isolated pulse communication sent to
the device
4.6 Connectors
Figure 4 shows the location of connectors on the board. Table 4, Table 5, and Table 6 list
the pinouts for each connector.
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