PCA9551
8-bit I2C-bus LED driver with programmable blink rates
Rev. 08 — 31 July 2008 Product data sheet
1. General description
The PCA9551 LED blinker blinks LEDs in I2C-bus and SMBus applications where it is
necessary to limit bus traffic or free up the I2C-bus master's (MCU, MPU, DSP, chip set,
etc.) timer. The uniqueness of this device is the internal oscillator with two programmable
blink rates. To blink LEDs using normal I/O expanders like the PCF8574 or PCA9554, the
bus master must send repeated commands to turn the LED on and off. This greatly
increases the amount of traffic on the I2C-bus and uses up one of the master's timers.
The PCA9551 LED blinker instead requires only the initial set-up command to program
BLINK RATE 1 and BLINK RATE 2 (i.e., the frequency and duty cycle) for each individual
output. From then on, only one command from the bus master is required to turn each
individual open-drain output on, off, or to cycle at BLINK RATE 1 or BLINK RATE 2.
Maximum output sink current is 25 mA per bit and 100 mA per package.
Any bits not used for controlling the LEDs can be used for General Purpose parallel
Input/Output (GPIO) expansion.
2. Features
The active LOW hardware reset pin (RESET) and Power-On Reset (POR) initializes the
registers to their default state, all zeroes, causing the bits to be set HIGH (LED off).
Three hardwareaddress pins on the PCA9551 allow eight devicesto operateon the same
bus.
The newer Fast-mode Plus PCA9634 8-bit LED controller offers an individual PWM
dimming control for each channel for better color mixing capabilities with a global PWM for
dimming or blinking all channels at the same time. There are 126 possible address
combinations and the maximum output sink current is 25 mA per bit and 200 mA per
package.
n 8 LED drivers (on, off, flashing at a programmable rate)
n 2 selectable, fully programmable blink rates (frequency and duty cycle) between
0.148 Hz and 38 Hz (6.74 seconds and 0.026 seconds)
n Input/outputs not used as LED drivers can be used as regular GPIOs
n Internal oscillator requires no external components
n I2C-bus interface logic compatible with SMBus
n Internal power-on reset
n Noise filter on SCL/SDA inputs
n Active LOW reset input
n 8 open-drain outputs directly drive LEDs to 25 mA
n Edge rate control on outputs
NXP Semiconductors
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
n No glitch on power-up
n Supports hot insertion
n Low standby current
n Operating power supply voltage range of 2.3 V to 5.5 V
n 0 Hz to 400 kHz clock frequency
n ESD protection exceeds 2000 V HBM per JESD22-A114, 150 V MM per
JESD22-A115 and 1000 V CDM per JESD22-C101
n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
n Packages offered: SO16, TSSOP16, HVQFN16
3. Ordering information
Table 1. Ordering information
T
=−40°C to +85°C.
amb
Type number Topside
mark
PCA9551D PCA9551D SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
PCA9551PW PCA9551 TSSOP16 plastic thin shrink small outline package; 16 leads;
PCA9551BS 9551 HVQFN16 plastic thermal enhanced very thin quad flat package;
Package
Name Description Version
SOT403-1
body width 4.4 mm
SOT629-1
no leads; 16 terminals; body 4 × 4 × 0.85 mm
4. Block diagram
PCA9551
SCL
SDA
V
DD
RESET
V
SS
Only one I/O shown for clarity.
Fig 1. Block diagram of PCA9551
INPUT
FILTERS
POWER-ON
RESET
OSCILLATOR
A0 A1 A2
I2C-BUS
CONTROL
PRESCALER 0
REGISTER
PRESCALER 1
REGISTER
PWM0
REGISTER
PWM1
REGISTER
REGISTER
LED SELECT (LSn)
REGISTER
0
1
BLINK0
BLINK1
INPUT
LEDn
002aac504
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 2 of 26
NXP Semiconductors
5. Pinning information
5.1 Pinning
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
A0
A1
A2
LED0
LED1
LED2
LED3
V
SS
1
2
3
4
5
6
7
8
PCA9551D
002aac500
16
15
14
13
12
11
10
9
V
DD
SDA
SCL
RESET
LED7
LED6
LED5
LED4
A0
A1
A2
LED0
LED1
LED2
LED3
V
SS
1
2
3
4
5
6
7
8
PCA9551PW
002aac501
16
15
14
13
12
11
10
9
V
DD
SDA
SCL
RESET
LED7
LED6
LED5
LED4
Fig 2. Pin configuration for SO16 Fig 3. Pin configuration for TSSOP16
terminal 1
index area
A2 SCL
LED0 RESET
LED1 LED7
LED2
A1
16
1 12
2 11
PCA9551BS
3 10
4 9
5
LED3
Transparent top view
A0
15
6
V
SS
DD
V
14
7
LED4
SDA
13
LED6
8
002aac502
LED5
Fig 4. Pin configuration for HVQFN16
5.2 Pin description
Table 2. Pin description
Symbol Pin Description
SO16, TSSOP16 HVQFN16
A0 1 15 address input 0
A1 2 16 address input 1
A2 3 1 address input 2
LED0 4 2 LED driver 0
LED1 5 3 LED driver 1
LED2 6 4 LED driver 2
LED3 7 5 LED driver 3
V
SS
86
LED4 9 7 LED driver 4
LED5 10 8 LED driver 5
LED6 11 9 LED driver 6
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 3 of 26
[1]
supply ground
NXP Semiconductors
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
Table 2. Pin description
Symbol Pin Description
SO16, TSSOP16 HVQFN16
LED7 12 10 LED driver 7
RESET 13 11 reset input (active LOW)
SCL 14 12 serial clock line
SDA 15 13 serial data line
V
DD
[1] HVQFN16 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must
16 14 supply voltage
be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board
level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad
on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the
PCB in the thermal pad region.
6. Functional description
Refer to Figure 1 “Block diagram of PCA9551”.
6.1 Device address
Following a START condition, the bus master must output the address of the slave it is
accessing. The address of the PCA9551 is shown in Figure 5. To conserve power, no
internal pull-up resistors are incorporated on the hardware selectable address pins and
they must be pulled HIGH or LOW.
…continued
slave address
1 1 0 0 A2 A1 A0 R/W
fixed
Fig 5. PCA9551 slave address
hardware
selectable
002aac505
The last bit of the address byte defines the operation to be performed. When set to logic 1
a read is selected, while a logic 0 selects a write operation.
6.2 Control register
Followingthe successful acknowledgement of the slave address, the bus master will send
a byte to the PCA9551, which will be stored in the Control register.
0 0 0 AI 0 B2 B1 B0
Auto-Increment flag
Reset state: 00h
Fig 6. Control register
register address
002aac506
The lowest 3 bits are used as a pointer to determine which register will be accessed.
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 4 of 26
NXP Semiconductors
If the Auto-Increment (AI) flag is set, the three low order bits of the Control register are
automatically incremented after a read or write. This allows the user to program the
registers sequentially. The contents of these bits will rollover to ‘000’ after the last register
is accessed.
When the Auto-Increment flag is set (AI = 1) and a read sequence is initiated, the
sequence must start by reading a register different from ‘0' (B2 B1 B0 ≠ 000).
Only the 3 least significant bits are affected by the AI flag. Unused bits must be
programmed with zeroes.
6.2.1 Control register definition
Table 3. Register summary
B2 B1 B0 Symbol Access Description
0 0 0 INPUT read only input register
0 0 1 PSC0 read/write frequency prescaler 0
0 1 0 PWM0 read/write PWM register 0
0 1 1 PSC1 read/write frequency prescaler 1
1 0 0 PWM1 read/write PWM register 1
1 0 1 LS0 read/write LED0 to LED3 selector
1 1 0 LS1 read/write LED4 to LED7 selector
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
6.3 Register descriptions
6.3.1 INPUT - Input register
The INPUT register reflects the state of the device pins. Writes to this register will be
acknowledged but will have no effect.
Table 4. INPUT - Input register description
Bit 7 6 5 4 3 2 1 0
Symbol LED7 LED6 LED5 LED4 LED3 LED2 LED1 LED0
Default XXXXXXXX
Remark: The default value ‘X’ is determined by the externally applied logic level (normally
logic 1) when used for directly driving LED with pull-up to VDD.
6.3.2 PSC0 - Frequency Prescaler 0
PSC0 is used to program the period of the PWM output.
The period of BLINK0 = (PSC0 + 1) / 38.
Remark: Prescaler calculation is different between the PCA9551 and other PCA955x
LED blinkers.A divider ratio of 38 instead of 44 is used. This different divider ratio causes
the blinking frequency to be 13 % (1 − 38 / 44) lower when the same 8-bit word is used.
The programmed value of FrequencyPrescaler 0 must be adjusted to compensate for this
difference in applications where the PCA9551 is used in conjunction with other PCA955x
LED blinkers and the observed blinking frequencies need to be the same.
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 5 of 26
NXP Semiconductors
Table 5. PSC0 - Frequency Prescaler 0 register description
Bit 7 6 5 4 3 2 1 0
Symbol PSC0[7] PSC0[6] PSC0[5] PSC0[4] PSC0[3] PSC0[2] PSC0[1] PSC0[0]
Default 11111111
6.3.3 PWM0 - Pulse Width Modulation 0
The PWM0 register determines the duty cycle of BLINK0. The outputs are LOW (LED off)
when the count is less than the value in PWM0 and HIGH when it is greater. If PWM0 is
programmed with 00h, then the PWM0 output is always LOW.
The duty cycle of BLINK0 = (256 − PWM0) / 256.
Table 6. PWM0 - Pulse Width Modulation 0 register description
Bit 7 6 5 4 3 2 1 0
Symbol PWM0
Default 10000000
[7]
PWM0
[6]
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
PWM0
[5]
PWM0
[4]
PWM0
[3]
PWM0
[2]
PWM0
[1]
PWM0
[0]
6.3.4 PSC1 - Frequency Prescaler 1
PSC1 is used to program the period of the PWM output.
The period of BLINK1 = (PSC1 + 1) / 38.
Remark: Prescaler calculation is different between the PCA9551 and other PCA955x
LED blinkers.A divider ratio of 38 instead of 44 is used. This different divider ratio causes
the blinking frequency to be 13 % (1 − 38 / 44) lower when the same 8-bit word is used.
The programmed value of FrequencyPrescaler 1 must be adjusted to compensate for this
difference in applications where the PCA9551 is used in conjunction with other PCA955x
LED blinkers and the observed blinking frequencies need to be the same.
Table 7. PSC1 - Frequency Prescaler 1 register description
Bit 7 6 5 4 3 2 1 0
Symbol PSC1[7] PSC1[6] PSC1[5] PSC1[4] PSC1[3] PSC1[2] PSC1[1] PSC1[0]
Default 11111111
6.3.5 PWM1 - Pulse Width Modulation 1
The PWM1 register determines the duty cycle of BLINK1. The outputs are LOW (LED off)
when the count is less than the value in PWM1 and HIGH when it is greater. If PWM1 is
programmed with 00h, then the PWM1 output is always LOW (LED off).
The duty cycle of BLINK1 = (256 − PWM1) / 256.
Table 8. PWM1 - Pulse Width Modulation 1 register description
Bit 7 6 5 4 3 2 1 0
Symbol PWM1
[7]
Default 10000000
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 6 of 26
PWM1
[6]
PWM1
[5]
PWM1
[4]
PWM1
[3]
PWM1
[2]
PWM1
[1]
PWM1
[0]
NXP Semiconductors
6.3.6 LS0 to LS1 - LED selector registers
The LSn LED select registers determine the source of the LED data.
00 = output is set LOW (LED on)
01 = output is set high-impedance (LED off; default)
10 = output blinks at PWM0 rate
11 = output blinks at PWM1 rate
Table 9. LS0 to LS1 - LED selector registers bit description
Legend: * default value.
Register Bit Value Description
LS0 - LED0 to LED3 selector
LS0 7:6 01* LED3 selected
LS1 - LED4 to LED7 selector
LS1 7:6 01* LED7 selected
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
5:4 01* LED2 selected
3:2 01* LED1 selected
1:0 01* LED0 selected
5:4 01* LED6 selected
3:2 01* LED5 selected
1:0 01* LED4 selected
6.4 Pins used as GPIOs
LED pins not used to control LEDs can be used as general purpose I/Os (GPIOs).
For use as input, set LEDn to high-impedance (01) and then read the pin state via the
Input register.
For use as output, connect external pull-up resistor to the pin and size it according to the
DC recommended operating characteristics. LEDn output pin is HIGH when the output is
programmed as high-impedance, and LOW when the output is programmed LOW through
the ‘LED selector’ register. The output can be pulse-width controlled when PWM0 or
PWM1 are used.
6.5 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9551 in
a reset condition until VDDhas reached V
. At that point, the reset condition is released
POR
and the PCA9551 registers are initialized to their default states, all the outputs in the
OFF state. Thereafter, VDD must be lowered below 0.2 V to reset the device.
6.6 External RESET
A reset can be accomplished by holding the RESET pin LOW for a minimum of t
PCA9551 registers and I2C-bus state machine will be held in their default states until the
RESET input is once again HIGH.
w(rst)
. The
This input requires a pull-up resistor to VDD if no active connection is used.
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 7 of 26
NXP Semiconductors
7. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
7.1 Bit transfer
One data bit is transferredduring each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 7).
SDA
SCL
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
Fig 7. Bit transfer
7.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HIGH is defined as the START condition (S). A
LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see Figure 8).
SDA
SCL
S
START condition
Fig 8. Definition of START and STOP conditions
7.2 System configuration
data line
stable;
data valid
change
of data
allowed
mba607
SDA
SCL
P
STOP condition
mba608
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The
device that controls the message is the ‘master’ and the devices which are controlled by
the master are the ‘slaves’ (see Figure 9).
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 8 of 26
NXP Semiconductors
SDA
SCL
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
MASTER
TRANSMITTER/
RECEIVER
Fig 9. System configuration
7.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slavereceiver which is addressed must generate an acknowledgeafter the reception of
each byte. Also a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold
times must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
SLAVE
I2C-BUS
MULTIPLEXER
002aaa966
data output
by transmitter
not acknowledge
data output
by receiver
acknowledge
SCL from master
S
START
condition
clock pulse for
acknowledgement
9821
002aaa987
Fig 10. Acknowledgement on the I2C-bus
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 9 of 26
NXP Semiconductors
7.4 Bus transactions
12345678SCL 9
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
slave address
SDA DATA 1 A
write to register
data out from port
1 0 0 A2 A1 A01
START condition R/W acknowledge
Fig 11. Write to register
slave address
SDA
(cont.)
1 0 0 A2 A1 A0 0 AS1
START condition R/W
slave address
S
1 0 0 A2 A1 A01
(repeated)
START condition
0 AS
acknowledge
from slave
R/W
acknowledge
from slave
command byte
0 0 AI 0 B2B1B00
from slave
command byte
0 0 AI 0 B2 B10B0
acknowledge
from slave
data from register
1 A
DATA (first byte)
Auto-Increment
register address
if AI = 1
at this moment master-transmitter becomes master-receiver
and slave-receiver becomes slave-transmitter
A
acknowledge
from slave
A
A P
acknowledge
from master
(cont.)
data to register
data from register
DATA (last byte)
acknowledge
from slave
t
v(Q)
DATA 1 VALID
no acknowledge
from master
002aac507
NA
STOP
condition
002aac508
Fig 12. Read from register
no acknowledge
from master
slave address
SDA NA
read from
port
data into
port
1 0 0 A2 A1 A0 1 AS1
START condition R/W acknowledge
t
from slave
h(D)
data from port
t
su(D)
A
acknowledge
from master
DATA 1
DATA 2 DATA 3 DATA 4
data from port
DATA 4
P
STOP
condition
002aac509
Remark: This figure assumes the command byte has previously been programmed with 00h.
Fig 13. Read Input Port register
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 10 of 26
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
8. Application design-in information
PCA9551
5 V
2
C-BUS/SMBus
I
MASTER
SDA
SCL
10 kΩ
10 kΩ10 kΩ
V
DD
PCA9551
SDA
SCL
RESET
A2
A1
A0
V
SS
LED0
LED1
LED2
LED3
LED4
LED5
LED6
LED7
002aac510
5 V
LED0 to LED5 are used as LED drivers.
LED6 and LED7 are used as regular GPIOs.
Fig 14. Typical application
8.1 Minimizing IDD when the I/Os are used to control LEDs
GPIOs
When the I/Os are used to control LEDs, they are normally connected to VDD through a
resistor as shown in Figure 14. Since the LED acts as a diode, when the LED is off the
I/O VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes
lower than VDD and is specified as ∆IDD in Table 12 “Static characteristics”.
Designs needing to minimize current consumption, such as battery power applications,
should consider maintaining the I/O pins greater than or equal to VDDwhen the LED is off.
Figure 15 shows a high value resistor in parallel with the LED. Figure 16 shows VDD less
than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O V
at or above VDD and prevents additional supply current consumption when the LED is off.
V
DD
V
DD
LEDn
LED
100 kΩ
002aac189
Fig 15. High value resistor in parallel with
the LED
Fig 16. Device supplied by a lower voltage
3.3 V 5 V
V
DD
LEDn
002aac190
LED
I
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 11 of 26
NXP Semiconductors
8.2 Programming example
The following example will show how to set LED0 to LED3 on. It will then set LED4 and
LED5 to blink at 1 Hz at a 50 % duty cycle. LED6 and LED7 will be set to blink at 4 Hz and
at a 25 % duty cycle.
Table 10. Programming PCA9551
Program sequence I2C-bus
START S
PCA9551 address with A0 to A2 = LOW C0h
PSC0 subaddress + Auto-Increment 11h
Set prescaler PSC0 to achieve a period of 1 second:
Blink period 1
PSC0 = 37
Set PWM0 duty cycle to 50 %:
256 PWM0–
--------------------------------
PWM0 = 128
Set prescaler PSC1 to achieve a period of 0.25 seconds:
Blink period 0.25
PSC1 = 9
Set PWM1 output duty cycle to 25 %:
256 PWM1–
--------------------------------
PWM1 = 192
Set LED0 to LED3 on 00h
Set LED4 and LED5 to PWM0, and LED6 or LED7 to PWM1 FAh
STOP P
256
256
PSC0 1+
==
----------------------- -
38
0.5=
==
0.25=
PSC1 1+
----------------------- -
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
25h
80h
09h
38
C0h
9. Limiting values
Table 11. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DD
V
I/O
I
O(LEDn)
I
SS
P
tot
T
stg
T
amb
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 12 of 26
supply voltage −0.5 +6.0 V
voltage on an input/output pin VSS− 0.5 5.5 V
output current on pin LEDn - ±25 mA
ground supply current - 100 mA
total power dissipation - 400 mW
storage temperature −65 +150 °C
ambient temperature operating −40 +85 °C
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
10. Static characteristics
Table 12. Static characteristics
VDD= 2.3 V to 5.5 V; VSS=0V; T
Symbol Parameter Conditions Min Typ
Supplies
V
I
I
∆I
DD
DD
stb
DD
supply voltage 2.3 - 5.5 V
supply current operating mode; VDD= 5.5 V;
standby current Standby mode; VDD= 5.5 V;
additional quiescent supply
current
V
POR
power-on reset voltage no load; VI=VDD or V
Input SCL; input/output SDA
V
IL
V
IH
I
OL
I
L
C
i
LOW-level input voltage −0.5 - +0.3V
HIGH-level input voltage 0.7V
LOW-level output current VOL= 0.4 V 3 6.5 - mA
leakage current VI=VDD=V
input capacitance VI=V
I/Os
V
IL
V
IH
I
OL
I
LI
C
io
Select inputs A0, A1, A2;
V
IL
V
IH
I
LI
C
i
LOW-level input voltage −0.5 - +0.8 V
HIGH-level input voltage 2.0 - 5.5 V
LOW-level output current VOL= 0.4 V
input leakage current VDD= 3.6 V; VI= 0 V or V
input/output capacitance - 2.1 5 pF
RESET
LOW-level input voltage −0.5 - +0.8 V
HIGH-level input voltage A0; RESET 2.0 - 5.5 V
input leakage current −1- +1 µA
input capacitance - 2.3 5 pF
=−40°C to +85°C; unless otherwise specified.
amb
- 350 500 µA
V
I=VDD
or VSS; f
= 100 kHz
SCL
- 1.9 3.0 µA
V
Standby mode; VDD= 5.5 V;
every LED I/O at V
f
SCL
V
I=VDD
= 0 kHz
SS
V
DD
V
DD
V
DD
= 0.7 V
OL
V
DD
V
DD
V
DD
or VSS; f
= 2.3 V
= 3.0 V
= 5.0 V
= 2.3 V
= 3.0 V
= 5.0 V
SS
SCL
= 4.3 V;
I
= 0 kHz
SS
DD
- - 800 µA
[2]
- 1.7 2.2 V
DD
−1- +1 µA
- 3.7 5 pF
[3]
69- mA
[3]
811- mA
[3]
10 14 - mA
[3]
11 14 - mA
[3]
14 18 - mA
[3]
17 24 - mA
−1- +1 µA
A1; A2 2.0 - V
- 5.5 V
PCA9551
[1]
Max Unit
DD
+ 0.5 V
DD
V
[1] Typical limits at VDD= 3.3 V, T
[2] VDD must be lowered to 0.2 V in order to reset part.
[3] Each I/O must be externally limited to a maximum of 25 mA and the device must be limited to a maximum current of 100 mA.
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 13 of 26
amb
=25°C.
NXP Semiconductors
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
20 %
percent
variation
0 %
−20 %
−40 %
(1)
(2)
(3)
−40 100−20
0 20406080
002aac191
T
amb
(°C)
(1) maximum
(2) average
(3) minimum
Fig 17. Typical frequency variation over process at
V
= 2.3 V to 3.0 V
DD
20 %
percent
variation
0 %
−20 %
−40 %
(1)
(2)
(3)
−40 100−20
0 20406080
002aac192
T
(°C)
amb
(1) maximum
(2) average
(3) minimum
Fig 18. Typical frequency variation over process at
VDD= 3.0 V to 5.5 V
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 14 of 26
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
11. Dynamic characteristics
Table 13. Dynamic characteristics
Symbol Parameter Conditions Standard-mode
f
SCL
t
BUF
SCL clock frequency 0 100 0 400 kHz
bus free time between a STOP and
START condition
t
HD;STA
t
SU;STA
hold time (repeated) START condition 4.0 - 0.6 - µs
set-up time for a repeated START
condition
t
SU;STO
t
HD;DAT
t
VD;ACK
t
VD;DAT
t
SU;DAT
t
LOW
t
HIGH
t
r
t
f
t
SP
set-up time for STOP condition 4.0 - 0.6 - µs
data hold time 0 - 0 - ns
data valid acknowledge time
data valid time LOW-level
HIGH-level
[1]
[2]
[2]
data set-up time 250 - 100 - ns
LOW period of the SCL clock 4.7 - 1.3 - µs
HIGH period of the SCL clock 4.0 - 0.6 - µs
rise time of both SDA and SCL signals - 1000 20 + 0.1C
fall time of both SDA and SCL signals - 300 20 + 0.1C
pulse width of spikes that must be
suppressed by the input filter
Port timing
t
v(Q)
t
su(D)
t
h(D)
data output valid time - 200 - 200 ns
data input set-up time 100 - 100 - ns
data input hold time 1 - 1 - µs
Reset timing
t
w(rst)
t
rec(rst)
t
rst
reset pulse width 8 - 8 - ns
reset recovery time 0 - 0 - ns
reset time
[4][5]
2
I
C-bus
Min Max Min Max
4.7 - 1.3 - µs
4.7 - 0.6 - µs
- 600 - 600 ns
- 600 - 600 ns
- 1500 - 600 ns
- 50 - 50 ns
400 - 400 - ns
PCA9551
Fast-mode I2C-bus Unit
[3]
300 ns
b
[3]
300 ns
b
[1] t
[2] t
[3] Cb= total capacitance of one bus line in pF.
[4] Resetting the device while actively communicating on the bus may cause glitches or errant STOP conditions.
[5] Upon reset, the full delay will be the sum of t
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 15 of 26
= time for Acknowledgement signal from SCL LOW to SDA (out) LOW.
VD;ACK
= minimum time for SDA data output to be valid following SCL LOW.
VD;DAT
and the RC time constant of the SDA bus.
rst
NXP Semiconductors
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
START
SCL
SDA
RESET
LEDn
50 %
30 %
t
rec(rst)
Fig 19. Definition of RESET timing
SDA
t
BUF
t
LOW
ACK or read cycle
t
rst
50 % 50 %
t
w(rst)
t
r
t
f
t
rst
t
HD;STA
50 %
t
SP
LED off
002aac193
SCL
t
Fig 20. Definition of timing
HD;STA
t
HD;DAT
t
HIGH
t
SU;DAT
t
SU;STA
Sr
t
SU;STO
PP S
002aaa986
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 16 of 26
NXP Semiconductors
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
protocol
SCL
SDA
Fig 21. I2C-bus timing diagram
12. Test information
condition
t
SU;STA
t
BUF
START
(S)
t
HD;STA
bit 7
MSB
(A7)
t
LOWtHIGH
t
r
1
t
f
t
SU;DAT
Rise and fall times refer to VIL and VIH.
V
PULSE
GENERATOR
I
bit 6
(A6)
/f
SCL
t
V
DD
open
V
SS
condition
VD;ACK
STOP
(P)
t
SU;STO
002aab175
acknowledge
bit 0
(R/W)
t
HD;DAT
V
DD
V
DUT
R
T
O
t
VD;DAT
C
L
50 pF
(A)
R
L
500 Ω
002aab880
RL = load resistor for LEDn. RL for SDA and SCL > 1kΩ (3 mA or less current).
CL = load capacitance includes jig and probe capacitance.
RT = termination resistance should be equal to the output impedance Zo of the pulse generators.
Fig 22. Test circuitry for switching times
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 17 of 26
NXP Semiconductors
13. Package outline
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
SO16: plastic small outline package; 16 leads; body width 3.9 mm
D
c
y
Z
16
pin 1 index
1
e
9
8
w M
b
p
SOT109-1
E
H
E
A
2
A
1
detail X
A
X
v M
A
Q
(A )
L
p
L
A
3
θ
0 2.5 5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
OUTLINE
VERSION
SOT109-1
A
A1A2A3b
max.
0.25
1.75
0.10
0.010
0.069
0.004
p
1.45
1.25
0.057
0.049
IEC JEDEC JEITA
076E07 MS-012
0.25
0.01
0.49
0.36
0.019
0.014
0.25
0.19
0.0100
0.0075
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
(1)E(1) (1)
cD
10.0
9.8
0.39
0.38
REFERENCES
eHELLpQZywv θ
4.0
3.8
0.16
0.15
1.27
0.05
6.2
5.8
0.244
0.228
1.05
0.041
1.0
0.4
0.039
0.016
0.7
0.25
0.6
0.028
0.01 0.004
0.020
EUROPEAN
PROJECTION
0.25 0.1
0.01
0.7
0.3
0.028
0.012
ISSUE DATE
99-12-27
03-02-19
o
8
o
0
Fig 23. Package outline SOT109-1 (SO16)
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 18 of 26
NXP Semiconductors
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
D
c
y
Z
16
pin 1 index
9
A
2
18
w M
b
e
p
A
1
E
H
E
L
detail X
SOT403-1
A
X
v M
A
Q
(A )
3
A
θ
L
p
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A1A2A3b
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
A
max.
0.15
mm
1.1
OUTLINE
VERSION
SOT403-1 MO-153
0.05
0.95
0.25
0.80
IEC JEDEC JEITA
p
0.30
0.19
(1)E(2) (1)
cD
0.2
5.1
0.1
4.9
REFERENCES
eHELLpQZywv θ
4.5
4.3
0.65
6.6
6.2
0.75
0.50
0.4
0.3
EUROPEAN
PROJECTION
0.13 0.10.21
0.40
0.06
ISSUE DATE
99-12-27
03-02-18
o
8
o
0
Fig 24. Package outline SOT403-1 (TSSOP16)
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 19 of 26
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
HVQFN16: plastic thermal enhanced very thin quad flat package; no leads;
16 terminals; body 4 x 4 x 0.85 mm
A
D
terminal 1
index area
B
E
PCA9551
SOT629-1
A
A
1
c
detail X
e
1
1/2 e
e
58
L
4
E
h
1
terminal 1
index area
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
(1)
A
UNIT
mm
OUTLINE
VERSION
SOT629-1 MO-220 - - -- - -
max.
A
0.05
0.00
1
b
0.38
0.23
16
c
0.2
IEC JEDEC JEITA
D
0 2.5 5 mm
(1)
D
D
4.1
2.25
3.9
1.95
h
E
h
4.1
3.9
b
13
(1)
E
h
2.25
0.651
1.95
REFERENCES
9
e
12
scale
1.95
v
w
1/2 e
e
C
y
X
y
1
ISSUE DATE
01-08-08
02-10-22
L
y
C
1
w
0.1v0.05
ye
0.05 0.1
EUROPEAN
PROJECTION
M
ACCB
M
e
2
e
1
2
0.75
1.95
0.50
Fig 25. Package outline SOT629-1 (HVQFN16)
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 20 of 26
NXP Semiconductors
14. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
soldering description”
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
.
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
AN10365 “Surface mount reflow
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 21 of 26
NXP Semiconductors
• Process issues, such as application of adhesive and flux, clinching of leads, board
• Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versusSnPb soldering; note that a lead-free reflow process usually leads to
• Solder paste printing issues including smearing, release, and adjusting the process
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
transport, the solder wave parameters, and the time during which components are
exposed to the wave
higher minimum peak temperatures (see Figure 26) than a SnPb process, thus
reducing the process window
window for a mix of large and small components on one board
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough forthe solder to makereliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 14 and 15
Table 14. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350 ≥ 350
< 2.5 235 220
≥ 2.5 220 220
Table 15. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 26.
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 22 of 26
NXP Semiconductors
Fig 26. Temperature profiles for large and small components
8-bit I2C-bus LED driver with programmable blink rates
maximum peak temperature
temperature
MSL: Moisture Sensitivity Level
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
PCA9551
peak
temperature
time
001aac844
For further information on temperature profiles, refer to Application Note
“Surface mount reflow soldering description”
16. Abbreviations
Table 16. Abbreviations
Acronym Description
CDM Charged-Device Model
DSP Digital Signal Processor
DUT Device Under Test
ESD ElectroStatic Discharge
GPIO General Purpose Input/Output
HBM Human Body Model
2
C-bus Inter-Integrated Circuit bus
I
I/O Input/Output
IC Integrated Circuit
LED Light Emitting Diode
MCU MicroController Unit
MM Machine Model
MPU MicroProcessor Unit
POR Power-On Reset
PWM Pulse Width Modulation; Pulse Width Modulator
RC Resistor-Capacitor network
SMBus System Management Bus
AN10365
.
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 23 of 26
NXP Semiconductors
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
17. Revision history
Table 17. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PCA9551_8 20080731 Product data sheet - PCA9551_7
Modifications:
• Section 1 “General description”: added (new) 5
• Table 12 “Static characteristics”, sub-section “I/Os”: changed symbol “I
current)
• Table 13 “Dynamic characteristics”, sub-section “Reset timing”: changed Min value for t
from “6 ns” to “8 ns” (for both Standard-mode and Fast-mode)
• updated soldering information
PCA9551_7 20070223 Product data sheet - PCA9551_6
PCA9551_6 20061107 Product data sheet - PCA9551_5
PCA9551_5
(9397 750 13726)
PCA9551_4
(9397 750 11462)
PCA9551_3
(9397 750 11155)
PCA9551_2
(9397 750 10328)
PCA9551_1
(9397 750 10104)
20041001 Product data sheet - PCA9551_4
20030505 Product data 853-2343 29858
20030220 Product data 853-2343 29331
20020927 Product data 853-2343 28878
20020513 Product data - -
th
paragraph
(20030424)
(20021220)
(20020909)
” to “ILI” (input leakage
L
PCA9551_3
PCA9551_2
PCA9551_1
w(rst)
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 24 of 26
NXP Semiconductors
18. Legal information
18.1 Data sheet status
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
Document status
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product statusof device(s) described inthis document mayhave changedsince this documentwas published and may differin case of multiple devices.The latest productstatus
information is available on the Internet at URL
[1][2]
Product status
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information includedherein and shall haveno liability for theconsequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with thesame product type number(s) andtitle. A short data sheet isintended
for quickreference only and should not be relied upon tocontain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
18.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXPSemiconductors does not give any representations or
warranties, expressedor implied, as to the accuracy orcompleteness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedesand replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
[3]
http://www.nxp.com.
Definition
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute MaximumRatings System of IEC 60134) may cause permanent
damage to thedevice. Limiting values arestress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at
http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights,patents
or other industrial or intellectual property rights.
18.4 Trademarks
Notice: Allreferenced brands, productnames, service names andtrademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PCA9551_8 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 08 — 31 July 2008 25 of 26
NXP Semiconductors
20. Contents
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Functional description . . . . . . . . . . . . . . . . . . . 4
6.1 Device address. . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2 Control register. . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2.1 Control register definition . . . . . . . . . . . . . . . . . 5
6.3 Register descriptions . . . . . . . . . . . . . . . . . . . . 5
6.3.1 INPUT - Input register. . . . . . . . . . . . . . . . . . . . 5
6.3.2 PSC0 - Frequency Prescaler 0 . . . . . . . . . . . . . 5
6.3.3 PWM0 - Pulse Width Modulation 0. . . . . . . . . . 6
6.3.4 PSC1 - Frequency Prescaler 1 . . . . . . . . . . . . . 6
6.3.5 PWM1 - Pulse Width Modulation 1. . . . . . . . . . 6
6.3.6 LS0 to LS1 - LED selector registers . . . . . . . . . 7
6.4 Pins used as GPIOs . . . . . . . . . . . . . . . . . . . . . 7
6.5 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 7
6.6 External
7 Characteristics of the I
RESET . . . . . . . . . . . . . . . . . . . . . . . . 7
2
C-bus. . . . . . . . . . . . . . 8
7.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
7.1.1 START and STOP conditions . . . . . . . . . . . . . . 8
7.2 System configuration . . . . . . . . . . . . . . . . . . . . 8
7.3 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.4 Bus transactions. . . . . . . . . . . . . . . . . . . . . . . 10
8 Application design-in information . . . . . . . . . 11
8.1 Minimizing I
when the I/Os are used to
DD
control LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . 11
8.2 Programming example . . . . . . . . . . . . . . . . . . 12
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
10 Static characteristics. . . . . . . . . . . . . . . . . . . . 13
11 Dynamic characteristics . . . . . . . . . . . . . . . . . 15
12 Test information. . . . . . . . . . . . . . . . . . . . . . . . 17
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
14 Handling information. . . . . . . . . . . . . . . . . . . . 21
15 Soldering of SMD packages . . . . . . . . . . . . . . 21
15.1 Introduction to soldering . . . . . . . . . . . . . . . . . 21
15.2 Wave and reflow soldering . . . . . . . . . . . . . . . 21
15.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 21
15.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 23
17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24
18 Legal information . . . . . . . . . . . . . . . . . . . . . . 25
18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25
18.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
18.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 25
18.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 25
19 Contact information . . . . . . . . . . . . . . . . . . . . 25
20 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 31 July 2008
Document identifier: PCA9551_8
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