The PCA9533 is a 4-bit I2C-bus and SMBus I/O expander optimized for dimming LEDs in
256 discrete steps for Red/Green/Blue (RGB) color mixing and back light applications.
The PCA9533 contains an internal oscillator with two user programmable blink rates and
duty cycles coupled to the output PWM. The LED brightness is controlled by setting the
blink rate high enough(> 100 Hz) that the blinking cannot be seen and then using the duty
cycle to vary the amount of time the LED is on and thus the average current through the
LED.
The initial setup sequence programs the two blink rates/duty cycles for each individual
PWM. From then on, only one command from the bus master is required to turn individual
LEDs ON, OFF, BLINK RATE 1 or BLINK RATE 2. Based on the programmed frequency
and duty cycle, BLINK RATE 1 and BLINK RATE 2 will cause the LEDs to appear at a
different brightness or blink at periods up to 1.69 second. The open-drain outputs directly
drive the LEDs with maximum output sink current of 25 mA per bit and 100 mA per
package.
2.Features
To blink LEDs at periods greater than 1.69 second the bus master (MCU, MPU, DSP,
chip set, etc.) must send repeated commands to turn the LED on and off as is currently
done when using normal I/O expanders like the NXP Semiconductors PCF8574 or
PCA9554. Any bits not used for controlling the LEDs can be used for General Purpose
parallel Input/Output (GPIO) expansion, which provides a simple solution when additional
I/O is needed for ACPI power switches, sensors, push-buttons, alarm monitoring, fans,
etc.
The Power-On Reset (POR) initializes the registers to their default state, causing the bits
to be set HIGH (LED off).
Due to pin limitations, the PCA9533 is not featured with hardware address pins. The
PCA9533/01 and the PCA9533/02 have different fixed I2C-bus addresses allowing
operation of both on the same bus.
n 4 LED drivers (on, off, flashing at a programmable rate)
n Two selectable, fully programmable blink rates (frequency and duty cycle) between
0.591 Hz and 152 Hz (1.69 second and 6.58 milliseconds)
n 256 brightness steps
n Input/outputs not used as LED drivers can be used as regular GPIOs
n Internal oscillator requires no external components
n I2C-bus interface logic compatible with SMBus
NXP Semiconductors
n Internal power-on reset
n Noise filter on SCL/SDA inputs
n 4 open-drain outputs directly drive LEDs to 25 mA
n Edge rate control on outputs
n No glitch on power-up
n Supports hot insertion
n Low standby current
n Operating power supply voltage range of 2.3 V to 5.5 V
n 0 Hz to 400 kHz clock frequency
n ESD protection exceeds 2000 V HBM per JESD22-A114, 150 V MM per
JESD22-A115 and 1000 V CDM per JESD22-C101
n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
n Packages offered: SO8, TSSOP8 (MSOP8)
3.Ordering information
Table 1.Ordering information
Type numberPackage
PCA9533D/01SO8plastic small outline package; 8 leads;
PCA9533D/02
PCA9533DP/01TSSOP8plastic thin shrink small outline package; 8 leads;
PCA9533DP/02
Following a START condition, the bus master must output the address of the slave it is
accessing. The address of the PCA9533/01 is shown in Figure 4 and the address of
PCA9533/02 is shown in Figure 5.
The last bit of the address byte defines the operation to be performed. When set to logic 1
a read is selected, while a logic 0 selects a write operation.
6.2 Control register
Followingthe successful acknowledgement of the slave address, the bus master will send
a byte to the PCA9533, which will be stored in the Control register.
000AI0B2 B1
register address
Reset state: 00h
Fig 6.Control register
Auto-Increment
flag
The lowest 3 bits are used as a pointer to determine which register will be accessed.
If the Auto-Increment (AI) flag is set, the three low order bits of the Control register are
automatically incremented after a read or write. This allows the user to program the
registers sequentially. The contents of these bits will rolloverto ‘000’ after the last register
is accessed.
When Auto-Increment flag is set (AI = 1) and a read sequence is initiated, the sequence
must start by reading a register different from the INPUT register (B2 B1 B0 ≠ 0 0 0).
B0
002aad744
Only the 3 least significant bits are affected by the AI flag. Unused bits must be
programmed with zeroes.
The PWM0 register determines the duty cycle of BLINK0. The outputs are LOW (LED on)
when the count is less than the value in PWM0 and HIGH (LED off) when it is greater. If
PWM0 is programmed with 00h, then the PWM0 output is always HIGH (LED off).
The PWM1 register determines the duty cycle of BLINK1. The outputs are LOW (LED on)
when the count is less than the value in PWM1 and HIGH (LED off) when it is greater. If
PWM1 is programmed with 00h, then the PWM1 output is always HIGH (LED off).
LEDn pins not used to control LEDs can be used as General Purpose I/Os (GPIOs).
For use as input, set LEDn to high-impedance (00) and then read the pin state via the
INPUT register.
For use as output, connect external pull-up resistor to the pin and size it according to the
DC recommended operating characteristics. LEDn output pin is HIGH when the output is
programmed as high-impedance, and LOW when the output is programmedLOW through
the ‘LED selector’ register. The output can be pulse-width controlled when PWM0 or
PWM1 are used.
6.5 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9533 in
a reset condition until VDDhas reached V
and the PCA9533 registers are initialized to their default states, all the outputs in the
OFF state. Thereafter, VDD must be lowered below 0.2 V to reset the device.
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
7.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 7).
SDA
SCL
PCA9533
4-bit I2C-bus LED dimmer
Fig 7.Bit transfer
7.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HIGH is defined as the START condition (S).
A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see Figure 8).
SDA
SCL
S
START condition
Fig 8.Definition of START and STOP conditions
7.2 System configuration
data line
stable;
data valid
change
of data
allowed
mba607
P
STOP condition
mba608
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The
device that controls the message is the ‘master’ and the devices which are controlled by
the master are the ‘slaves’ (see Figure 9).
The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slavereceiver which is addressed must generate an acknowledge after the reception of
each byte. Also a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold
times must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
8.1 Minimizing IDD when the I/Os are used to control LEDs
When the I/Os are used to control LEDs, they are normally connected to VDD through a
resistor as shown in Figure 14. Since the LED acts as a diode, when the LED is off the
I/O VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes
lower than VDD and is specified as ∆IDD in Table 13 “Static characteristics”.
Designs needing to minimize current consumption, such as battery power applications,
should consider maintaining the I/O pins greater than or equal to VDDwhen the LED is off.
Figure 15 shows a high value resistor in parallel with the LED. Figure 16 shows VDD less
than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O V
at or above VDD and prevents additional supply current consumption when the LED is off.
The followingexample will show how to set LED0 and LED1 off. It will set LED2 to blink at
1 Hz at a 50 % duty cycle. LED3 will be set to be dimmed at 25 % of their maximum
brightness (duty cycle = 25 %). PCA9533/01 is used in this example.
Table 11. Programming PCA9533
Program sequenceI2C-bus
STARTS
PCA9533 addressC4h
PSC0 subaddress + Auto-Increment11h
Set prescaler PSC0 to achieve a period of 1 second:
Blink period1
PSC0 = 151
Set PWM0 duty cycle to 50 %:
PWM0
-----------------
PWM0 = 128
Set prescaler PCS1 to dim at maximum frequency:
256
0.5=
PSC0 1+
==
----------------------- -
PCA9533
4-bit I2C-bus LED dimmer
97h
152
80h
00h
Blink periodmax=
PSC1 = 0
Set PWM1 output duty cycle to 25 %:
PWM1
-----------------
PWM1 = 64
Set LED0 on, LED1 off; LED2 set to blink at PSC0, PWM0; LED3 set to blink at
PSC1, PWM1
STOPP
9.Limiting values
Table 12. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
SymbolParameterConditionsMinMaxUnit
V
DD
V
I/O
I
O(LEDn)
I
SS
P
tot
T
stg
T
amb
256
40h
0.25=
E1h
supply voltage−0.5+6.0V
voltage on an input/output pinVSS− 0.55.5V
output current on pin LEDn-25mA
ground supply current-100mA
total power dissipation-400mW
storage temperature−65+150°C
ambient temperatureoperating−40+85°C
input leakage currentVDD= 3.6 V; VI= 0 V or V
input/output capacitance-2.15pF
=−40°C to +85°C; unless otherwise specified.
amb
V
V
I=VDD
I=VDD
or VSS; f
or VSS; f
= 100 kHz
SCL
= 0 kHz
SCL
Standby mode; VDD= 5.5 V;
every LED I/O at V
f
= 0 kHz
SCL
SS
= 2.3 V
V
DD
= 3.0 V
V
DD
= 5.0 V
V
DD
= 0.7 V
V
OL
= 2.3 V
V
DD
= 3.0 V
V
DD
= 5.0 V
V
DD
SS
= 4.3 V;
I
SS
DD
-350550µA
-1.93.0µA
--325µA
[2]
-1.72.2V
-5.5V
DD
−1- +1 µA
-3.75pF
[3]
9-- mA
[3]
12--mA
[3]
15--mA
[3]
15--mA
[3]
20--mA
[3]
25--mA
−1- +1 µA
PCA9533
[1]
MaxUnit
DD
V
[1] Typical limits at VDD= 3.3 V, T
[2] VDD must be lowered to 0.2 V in order to reset part.
[3] Each I/O must be externally limited to a maximum of 25 mA and the device must be limited to a maximum current of 100 mA.
SCL clock frequency01000400kHz
bus free time between a STOP and
START condition
t
HD;STA
t
SU;STA
hold time (repeated) START condition4.0-0.6-µs
set-up time for a repeated START
condition
t
SU;STO
t
HD;DAT
t
VD;ACK
t
VD;DAT
t
SU;DAT
t
LOW
t
HIGH
t
r
t
f
t
SP
set-up time for STOP condition4.0-0.6-µs
data hold time0-0-ns
data valid acknowledge time
data valid timeLOW-level
HIGH-level
[1]
[2]
[2]
data set-up time250-100-ns
LOW period of the SCL clock4.7-1.3-µs
HIGH period of the SCL clock4.0-0.6-µs
rise time of both SDA and SCL signals-100020 + 0.1C
fall time of both SDA and SCL signals-30020 + 0.1C
pulse width of spikes that must be
suppressed by the input filter
Port timing
t
v(Q)
t
su(D)
t
h(D)
data output valid time-200-200ns
data input set-up time100-100-ns
data input hold time1-1-µs
2
I
C-bus
MinMaxMinMax
4.7-1.3-µs
4.7-0.6-µs
-600-600ns
-600-600ns
-1500-600ns
-50-50ns
PCA9533
4-bit I2C-bus LED dimmer
Fast-mode I2C-busUnit
[3]
300ns
b
[3]
300ns
b
[1] t
[2] t
[3] Cb= total capacitance of one bus line in pF.
= time for Acknowledgement signal from SCL LOW to SDA (out) LOW.
VD;ACK
= minimum time for SDA data output to be valid following SCL LOW.
VD;DAT
NXP Semiconductors
SDA
PCA9533
4-bit I2C-bus LED dimmer
t
BUF
SCL
t
Fig 19. Definition of timing
t
LOW
HD;STA
protocol
SCL
SDA
t
r
t
HD;DAT
condition
t
SU;STA
t
BUF
START
(S)
t
HIGH
bit 7
MSB
(A7)
t
LOWtHIGH
t
r
t
f
t
SU;DAT
(A)
t
SP
t
SU;STO
STOP
condition
PPS
002aaa986
(P)
t
HD;STA
t
SU;STA
Sr
bit 6
(A6)
1
/f
SCL
t
f
bit 0
(R/W)
acknowledge
Fig 20. I2C-bus timing diagram
12. Test information
Fig 21. Test circuitry for switching times
t
HD;STA
t
SU;DAT
t
HD;DAT
t
VD;DAT
t
VD;ACK
t
SU;STO
002aab175
Rise and fall times refer to VIL and VIH.
V
DD
open
V
L
002aab880
SS
PULSE
GENERATOR
V
DD
V
I
V
O
R
500 Ω
DUT
C
R
T
L
50 pF
RL = load resistor for LEDn. RL for SDA and SCL > 1kΩ (3 mA or less current).
CL = load capacitance includes jig and probe capacitance.
RT = termination resistance should be equal to the output impedance Zo of the pulse generators.
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in
JESD625-A
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
soldering description”
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
.
PCA9533
4-bit I2C-bus LED dimmer
or equivalent standards.
AN10365 “Surface mount reflow
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• Process issues, such as application of adhesive and flux, clinching of leads, board
• Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-freeversusSnPb soldering; note that a lead-free reflow process usually leads to
• Solder paste printing issues including smearing, release, and adjusting the process
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
PCA9533
4-bit I2C-bus LED dimmer
transport, the solder wave parameters, and the time during which components are
exposed to the wave
higher minimum peak temperatures (see Figure 24) than a SnPb process, thus
reducing the process window
window for a mix of large and small components on one board
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough forthe solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 15 and 16
Table 15. SnPb eutectic process (from J-STD-020C)
Package thickness (mm)Package reflow temperature (°C)
Volume (mm3)
< 350≥ 350
< 2.5235220
≥ 2.5220220
Table 16. Lead-free process (from J-STD-020C)
Package thickness (mm)Package reflow temperature (°C)
Volume (mm3)
< 350350 to 2000> 2000
< 1.6260260260
1.6 to 2.5260250245
> 2.5250245245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 24.
Fig 24. Temperature profiles for large and small components
maximum peak temperature
temperature
MSL: Moisture Sensitivity Level
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
PCA9533
4-bit I2C-bus LED dimmer
peak
temperature
time
001aac844
For further information on temperature profiles, refer to Application Note
“Surface mount reflow soldering description”
16. Abbreviations
Table 17. Abbreviations
AcronymDescription
ACPIAdvanced Configuration and Power Interface
CDMCharged Device Model
DSPDigital Signal Processor
DUTDevice Under Test
ESDElectroStatic Discharge
GPIOGeneral Purpose Input/Output
HBMHuman Body Model
2
C-busInter-Integrated Circuit bus
I
LEDLight Emitting Diode
MCUMicroController Unit
MMMachine Model
MPUMicroProcessor Unit
PORPower-On Reset
RCResistor-Capacitor network
SMBusSystem Management Bus
Objective [short] data sheetDevelopmentThis document contains data from the objective specification for product development.
Preliminary [short] data sheet QualificationThis document contains data from the preliminary specification.
Product [short] data sheetProductionThis document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] Theproduct status of device(s) describedin this documentmay havechanged since thisdocument was publishedand maydiffer in caseof multiple devices. The latestproduct status
information is available on the Internet at URL
[1][2]
Product status
18.2Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information includedherein and shall haveno liability fortheconsequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with thesame product type number(s) andtitle. A short data sheetis intended
for quickreference only and should not be reliedupon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
18.3Disclaimers
General — Information in this document is believed to be accurate and
reliable. However,NXPSemiconductors does not give any representationsor
warranties, expressedor implied, as to the accuracyor completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This documentsupersedesand replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
[3]
http://www.nxp.com.
Definition
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute MaximumRatings System of IEC 60134) may cause permanent
damage to thedevice. Limiting valuesarestress ratings only and operationof
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at
http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license underanycopyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
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18.4Trademarks
Notice: Allreferenced brands, productnames, service names andtrademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
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For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Please be aware that important notices concerning this document and the product(s)
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